JP2004504424A5 - - Google Patents
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- Publication number
- JP2004504424A5 JP2004504424A5 JP2002512266A JP2002512266A JP2004504424A5 JP 2004504424 A5 JP2004504424 A5 JP 2004504424A5 JP 2002512266 A JP2002512266 A JP 2002512266A JP 2002512266 A JP2002512266 A JP 2002512266A JP 2004504424 A5 JP2004504424 A5 JP 2004504424A5
- Authority
- JP
- Japan
- Prior art keywords
- handbook
- reaction
- engineering plastics
- tranyl
- polyarylethers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- UEXCJVNBTNXOEH-UHFFFAOYSA-N Ethynylbenzene Chemical group C#CC1=CC=CC=C1 UEXCJVNBTNXOEH-UHFFFAOYSA-N 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229920000090 poly(aryl ether) Polymers 0.000 description 2
- 102100029290 Transthyretin Human genes 0.000 description 1
- 108050000089 Transthyretin Proteins 0.000 description 1
- 238000007080 aromatic substitution reaction Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/619,237 US6423811B1 (en) | 2000-07-19 | 2000-07-19 | Low dielectric constant materials with polymeric networks |
| PCT/US2001/022213 WO2002006366A1 (en) | 2000-07-19 | 2001-07-12 | Low dielectric constant materials with polymeric networks |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004504424A JP2004504424A (ja) | 2004-02-12 |
| JP2004504424A5 true JP2004504424A5 (enExample) | 2005-03-03 |
Family
ID=24481046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002512266A Withdrawn JP2004504424A (ja) | 2000-07-19 | 2001-07-12 | ポリマーネットワークを有する低誘電率材料 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US6423811B1 (enExample) |
| EP (1) | EP1303550A4 (enExample) |
| JP (1) | JP2004504424A (enExample) |
| KR (1) | KR20030022291A (enExample) |
| CN (1) | CN1455789A (enExample) |
| AU (1) | AU2001273464A1 (enExample) |
| TW (1) | TW553967B (enExample) |
| WO (1) | WO2002006366A1 (enExample) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020022708A1 (en) * | 2000-07-19 | 2002-02-21 | Honeywell International Inc. | Compositions and methods for thermosetting molecules in organic compositions |
| US6423811B1 (en) * | 2000-07-19 | 2002-07-23 | Honeywell International Inc. | Low dielectric constant materials with polymeric networks |
| US6783589B2 (en) * | 2001-01-19 | 2004-08-31 | Chevron U.S.A. Inc. | Diamondoid-containing materials in microelectronics |
| US7141188B2 (en) * | 2001-05-30 | 2006-11-28 | Honeywell International Inc. | Organic compositions |
| US6740685B2 (en) * | 2001-05-30 | 2004-05-25 | Honeywell International Inc. | Organic compositions |
| CA2443846A1 (en) * | 2001-12-31 | 2003-07-17 | Honeywell International Inc. | Organic compositions |
| US20030143332A1 (en) * | 2002-01-31 | 2003-07-31 | Sumitomo Chemical Company, Limited | Coating solution for forming insulating film |
| JP2003268101A (ja) | 2002-03-15 | 2003-09-25 | Sumitomo Chem Co Ltd | ポリエーテル樹脂及びその製造方法 |
| US7060204B2 (en) * | 2002-04-29 | 2006-06-13 | Honeywell International Inc. | Organic compositions |
| TW200416131A (en) * | 2002-06-03 | 2004-09-01 | Honeywell Int Inc | Layered components, materials, methods of production and uses thereof |
| US7368483B2 (en) * | 2002-12-31 | 2008-05-06 | International Business Machines Corporation | Porous composition of matter, and method of making same |
| JP2004307828A (ja) * | 2003-03-27 | 2004-11-04 | Sumitomo Chem Co Ltd | 絶縁膜形成用塗布液、絶縁膜の製造方法および絶縁膜 |
| JP2006104375A (ja) * | 2004-10-07 | 2006-04-20 | Sumitomo Chemical Co Ltd | 絶縁膜形成用塗布液、絶縁膜の製造方法および絶縁膜 |
| US7732496B1 (en) | 2004-11-03 | 2010-06-08 | Ohio Aerospace Institute | Highly porous and mechanically strong ceramic oxide aerogels |
| US7531209B2 (en) * | 2005-02-24 | 2009-05-12 | Michael Raymond Ayers | Porous films and bodies with enhanced mechanical strength |
| US7432133B2 (en) * | 2005-10-24 | 2008-10-07 | Freescale Semiconductor, Inc. | Plastic packaged device with die interface layer |
| US7435625B2 (en) * | 2005-10-24 | 2008-10-14 | Freescale Semiconductor, Inc. | Semiconductor device with reduced package cross-talk and loss |
| US20070090545A1 (en) * | 2005-10-24 | 2007-04-26 | Condie Brian W | Semiconductor device with improved encapsulation |
| WO2007143028A2 (en) | 2006-05-31 | 2007-12-13 | Roskilde Semiconductor Llc | Low dielectric constant materials prepared from soluble fullerene clusters |
| US7883742B2 (en) * | 2006-05-31 | 2011-02-08 | Roskilde Semiconductor Llc | Porous materials derived from polymer composites |
| US7875315B2 (en) * | 2006-05-31 | 2011-01-25 | Roskilde Semiconductor Llc | Porous inorganic solids for use as low dielectric constant materials |
| WO2007143026A2 (en) | 2006-05-31 | 2007-12-13 | Roskilde Semiconductor Llc | Linked periodic networks of alternating carbon and inorganic clusters for use as low dielectric constant materials |
| US7811499B2 (en) * | 2006-06-26 | 2010-10-12 | International Business Machines Corporation | Method for high density data storage and read-back |
| KR100819760B1 (ko) | 2006-11-06 | 2008-04-07 | (주)파인켐 | 테트라키스페닐계 유기발광화합물 및 이를 이용한유기전계발광소자 |
| US7558186B2 (en) * | 2007-01-02 | 2009-07-07 | International Business Machines Corporation | High density data storage medium, method and device |
| US20080159114A1 (en) * | 2007-01-02 | 2008-07-03 | Dipietro Richard Anthony | High density data storage medium, method and device |
| US20080173541A1 (en) * | 2007-01-22 | 2008-07-24 | Eal Lee | Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling |
| US8702919B2 (en) * | 2007-08-13 | 2014-04-22 | Honeywell International Inc. | Target designs and related methods for coupled target assemblies, methods of production and uses thereof |
| US8258251B2 (en) * | 2007-11-30 | 2012-09-04 | The United States Of America, As Represented By The Administrator Of The National Aeronautics And Space Administration | Highly porous ceramic oxide aerogels having improved flexibility |
| US8314201B2 (en) | 2007-11-30 | 2012-11-20 | The United States Of America As Represented By The Administration Of The National Aeronautics And Space Administration | Highly porous ceramic oxide aerogels having improved flexibility |
| CA2733682C (en) * | 2008-08-12 | 2014-10-14 | Air Products And Chemicals, Inc. | Polymeric compositions comprising per(phenylethynyl) arene derivatives |
| US9006353B2 (en) | 2011-11-18 | 2015-04-14 | Delsper LP | Crosslinking compounds for high glass transition temperature polymers |
| CN102848642B (zh) * | 2012-09-11 | 2016-01-13 | 广东生益科技股份有限公司 | 二层法双面挠性覆铜板及其制作方法 |
| WO2014208324A1 (ja) * | 2013-06-24 | 2014-12-31 | Jsr株式会社 | 膜形成用組成物、レジスト下層膜及びその形成方法、パターン形成方法並びに化合物 |
| EP3740188A1 (en) * | 2017-12-18 | 2020-11-25 | Tris Pharma, Inc. | Pharmaceutical compositions comprising a floating interpenetrating polymer network forming system |
| US11337920B2 (en) | 2017-12-18 | 2022-05-24 | Tris Pharma, Inc. | Pharmaceutical composition comprising GHB gastro-retentive raft forming systems having trigger pulse drug release |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2906282B2 (ja) | 1990-09-20 | 1999-06-14 | 富士通株式会社 | ガラスセラミック・グリーンシートと多層基板、及び、その製造方法 |
| JPH04314394A (ja) | 1991-04-12 | 1992-11-05 | Fujitsu Ltd | ガラスセラミック回路基板とその製造方法 |
| JP2531906B2 (ja) | 1991-09-13 | 1996-09-04 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 発泡重合体 |
| US5177176A (en) | 1991-10-29 | 1993-01-05 | E. I. Du Pont De Nemours And Company | Soluble pseudo rod-like polyimides having low coefficient of thermal expansion |
| US5629353A (en) | 1995-05-22 | 1997-05-13 | The Regents Of The University Of California | Highly cross-linked nanoporous polymers |
| US5744399A (en) | 1995-11-13 | 1998-04-28 | Lsi Logic Corporation | Process for forming low dielectric constant layers using fullerenes |
| US6423811B1 (en) * | 2000-07-19 | 2002-07-23 | Honeywell International Inc. | Low dielectric constant materials with polymeric networks |
| US6451712B1 (en) | 2000-12-18 | 2002-09-17 | International Business Machines Corporation | Method for forming a porous dielectric material layer in a semiconductor device and device formed |
-
2000
- 2000-07-19 US US09/619,237 patent/US6423811B1/en not_active Expired - Fee Related
-
2001
- 2001-07-12 JP JP2002512266A patent/JP2004504424A/ja not_active Withdrawn
- 2001-07-12 EP EP01952741A patent/EP1303550A4/en not_active Withdrawn
- 2001-07-12 CN CN01815352A patent/CN1455789A/zh active Pending
- 2001-07-12 WO PCT/US2001/022213 patent/WO2002006366A1/en not_active Ceased
- 2001-07-12 KR KR10-2003-7000741A patent/KR20030022291A/ko not_active Withdrawn
- 2001-07-12 AU AU2001273464A patent/AU2001273464A1/en not_active Abandoned
- 2001-07-19 TW TW090117700A patent/TW553967B/zh not_active IP Right Cessation
- 2001-12-03 US US10/004,584 patent/US6713590B2/en not_active Expired - Fee Related
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