JP2004363617A - ウエハーベーキングプレートの冷却装置 - Google Patents
ウエハーベーキングプレートの冷却装置 Download PDFInfo
- Publication number
- JP2004363617A JP2004363617A JP2004167688A JP2004167688A JP2004363617A JP 2004363617 A JP2004363617 A JP 2004363617A JP 2004167688 A JP2004167688 A JP 2004167688A JP 2004167688 A JP2004167688 A JP 2004167688A JP 2004363617 A JP2004363617 A JP 2004363617A
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- Prior art keywords
- cooling
- plate
- wafer
- baking plate
- heat transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001816 cooling Methods 0.000 title claims abstract description 79
- 239000002826 coolant Substances 0.000 claims abstract description 18
- 239000012530 fluid Substances 0.000 claims abstract description 13
- 239000007788 liquid Substances 0.000 claims abstract description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
- A01K61/00—Culture of aquatic animals
- A01K61/70—Artificial fishing banks or reefs
- A01K61/73—Artificial fishing banks or reefs assembled of components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02B—HYDRAULIC ENGINEERING
- E02B3/00—Engineering works in connection with control or use of streams, rivers, coasts, or other marine sites; Sealings or joints for engineering works in general
- E02B3/04—Structures or apparatus for, or methods of, protecting banks, coasts, or harbours
- E02B3/043—Artificial seaweed
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02B—HYDRAULIC ENGINEERING
- E02B3/00—Engineering works in connection with control or use of streams, rivers, coasts, or other marine sites; Sealings or joints for engineering works in general
- E02B3/04—Structures or apparatus for, or methods of, protecting banks, coasts, or harbours
- E02B3/046—Artificial reefs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Ocean & Marine Engineering (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Sustainable Development (AREA)
- Environmental Sciences (AREA)
- Animal Husbandry (AREA)
- Biodiversity & Conservation Biology (AREA)
- Zoology (AREA)
- Marine Sciences & Fisheries (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
【解決手段】ウエハーを支持する支持プレート、前記支持プレートの下部に位置するヒーター、及び前記支持プレートとヒーターとの間に介在されて熱を伝達する熱伝達プレートを備えるウエハーベーキングプレートの冷却装置を提供する。前記冷却装置はにおいて、中空は、前記熱伝達プレート内部に形成され、内部の一部が液体状態の作動流体で充填される。冷却パイプは、前記熱伝達プレート内部に配管され、内部に冷却媒体が循環される。
【選択図】図4
Description
105 冷却パイプ
131 中空
133 隔膜
Claims (6)
- ウエハーを支持する支持プレート、前記支持プレートの下部に位置するヒーター、及び前記支持プレートとヒーターとの間に介在されて熱を伝達する熱伝達プレートを備えるウエハーベーキングプレートの冷却装置において、
前記熱伝達プレート内部に形成され、内部の一部が液体状態の作動流体で充填された中空と
前記熱伝達プレート内部に配管され、内部に冷却媒体が循環される冷却パイプと、
を含むことを特徴とするウエハーベーキングプレートの冷却装置。 - 前記冷却パイプは、前記熱伝達プレートの中空内に配管され、常温で液体状態である前記作動流体内に配置される請求項1に記載のウエハーベーキングプレートの冷却装置。
- 前記冷却パイプの配管に沿って前記中空の底面に所定の溝が形成され、前記冷却パイプは、前記溝内に配管される請求項1に記載のウエハーベーキングプレートの冷却装置。
- 前記冷却パイプは、前記中空の外側に配管される請求項1に記載のウエハーベーキングプレートの冷却装置。
- 前記冷却パイプは、前記中空内に配管される第1パイプと、前記中空の外側に配管される第2パイプとを含む請求項1に記載のウエハーベーキングプレートの冷却装置。
- 前記冷却パイプの断面は、円形、楕円形、または多角形のいずれか1つである請求項1に記載のウエハーベーキングプレートの冷却装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-0036021A KR100532322B1 (ko) | 2003-06-04 | 2003-06-04 | 웨이퍼 베이킹 플레이트의 냉각 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2004363617A true JP2004363617A (ja) | 2004-12-24 |
Family
ID=33487881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004167688A Pending JP2004363617A (ja) | 2003-06-04 | 2004-06-04 | ウエハーベーキングプレートの冷却装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20040244945A1 (ja) |
JP (1) | JP2004363617A (ja) |
KR (1) | KR100532322B1 (ja) |
CN (1) | CN100346450C (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006222214A (ja) * | 2005-02-09 | 2006-08-24 | Dainippon Screen Mfg Co Ltd | 熱処理装置 |
JP2007318120A (ja) * | 2006-05-15 | 2007-12-06 | Asml Netherlands Bv | リソグラフィ装置およびデバイス製造方法 |
KR100841340B1 (ko) * | 2007-01-26 | 2008-06-26 | 세메스 주식회사 | 기판 베이크 장치 |
JP2015159292A (ja) * | 2008-09-10 | 2015-09-03 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 冷却が改善されたラピッドサーマルプロセシングランプヘッド |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7196768B2 (en) * | 2004-10-26 | 2007-03-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR100764627B1 (ko) * | 2006-02-01 | 2007-10-08 | 주식회사 에스에프에이 | 평면디스플레이용 화학 기상 증착장치 |
US7652227B2 (en) * | 2006-05-18 | 2010-01-26 | Applied Materials, Inc. | Heating and cooling plate for a vacuum chamber |
CN106925867B (zh) * | 2015-12-30 | 2019-09-17 | 上海微电子装备(集团)股份有限公司 | 一种键合机加热冷却装置及其制作方法 |
US10780447B2 (en) * | 2016-04-26 | 2020-09-22 | Applied Materials, Inc. | Apparatus for controlling temperature uniformity of a showerhead |
JP6918642B2 (ja) * | 2017-08-25 | 2021-08-11 | 東京エレクトロン株式会社 | 冷媒用の流路を有する部材、冷媒用の流路を有する部材の制御方法及び基板処理装置 |
JP6918042B2 (ja) | 2019-03-26 | 2021-08-11 | 日本碍子株式会社 | ウエハ載置装置 |
US20200381271A1 (en) * | 2019-05-28 | 2020-12-03 | Applied Materials, Inc. | System and apparatus for enhanced substrate heating and rapid substrate cooling |
KR102259363B1 (ko) * | 2019-11-22 | 2021-06-01 | (주)광주금형 | 웨이퍼 냉각용 플레이트 |
CN112325251B (zh) * | 2020-06-17 | 2023-02-17 | 深圳市海洋王照明工程有限公司 | 耐高温照明灯 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8809707D0 (en) * | 1988-04-25 | 1988-06-02 | British Aerospace | Cooling apparatus |
US4998584A (en) * | 1990-06-07 | 1991-03-12 | Itt Corporation | Heat exchanger |
JPH08227882A (ja) * | 1995-02-21 | 1996-09-03 | Fujikura Ltd | ウエハの焼付装置 |
US6081414A (en) * | 1998-05-01 | 2000-06-27 | Applied Materials, Inc. | Apparatus for improved biasing and retaining of a workpiece in a workpiece processing system |
JP2000146470A (ja) * | 1998-11-05 | 2000-05-26 | Furukawa Electric Co Ltd:The | 平板型ヒートパイプ及びその製造方法 |
JP2000306824A (ja) * | 1999-02-17 | 2000-11-02 | Komatsu Ltd | 温度制御装置の製造方法および温度制御装置 |
JP2002057092A (ja) * | 2000-08-11 | 2002-02-22 | Furukawa Electric Co Ltd:The | 水冷式非接触型コールドプレート |
JP4153781B2 (ja) * | 2002-01-31 | 2008-09-24 | 大日本スクリーン製造株式会社 | 熱処理装置および基板処理装置 |
-
2003
- 2003-06-04 KR KR10-2003-0036021A patent/KR100532322B1/ko not_active IP Right Cessation
-
2004
- 2004-02-06 US US10/773,615 patent/US20040244945A1/en not_active Abandoned
- 2004-03-09 CN CNB2004100282945A patent/CN100346450C/zh not_active Expired - Fee Related
- 2004-06-04 JP JP2004167688A patent/JP2004363617A/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006222214A (ja) * | 2005-02-09 | 2006-08-24 | Dainippon Screen Mfg Co Ltd | 熱処理装置 |
JP2007318120A (ja) * | 2006-05-15 | 2007-12-06 | Asml Netherlands Bv | リソグラフィ装置およびデバイス製造方法 |
KR100841340B1 (ko) * | 2007-01-26 | 2008-06-26 | 세메스 주식회사 | 기판 베이크 장치 |
JP2015159292A (ja) * | 2008-09-10 | 2015-09-03 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 冷却が改善されたラピッドサーマルプロセシングランプヘッド |
Also Published As
Publication number | Publication date |
---|---|
US20040244945A1 (en) | 2004-12-09 |
KR100532322B1 (ko) | 2005-11-29 |
KR20040104786A (ko) | 2004-12-13 |
CN100346450C (zh) | 2007-10-31 |
CN1574197A (zh) | 2005-02-02 |
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