JP2004358653A5 - - Google Patents

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Publication number
JP2004358653A5
JP2004358653A5 JP2004130737A JP2004130737A JP2004358653A5 JP 2004358653 A5 JP2004358653 A5 JP 2004358653A5 JP 2004130737 A JP2004130737 A JP 2004130737A JP 2004130737 A JP2004130737 A JP 2004130737A JP 2004358653 A5 JP2004358653 A5 JP 2004358653A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2004130737A
Other versions
JP2004358653A (ja
JP4568015B2 (ja
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Priority claimed from US10/425,689 external-priority patent/US6783436B1/en
Application filed filed Critical
Publication of JP2004358653A publication Critical patent/JP2004358653A/ja
Publication of JP2004358653A5 publication Critical patent/JP2004358653A5/ja
Application granted granted Critical
Publication of JP4568015B2 publication Critical patent/JP4568015B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2004130737A 2003-04-29 2004-04-27 最適化された溝を有する研磨パッド及び同パッドを形成する方法 Expired - Lifetime JP4568015B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/425,689 US6783436B1 (en) 2003-04-29 2003-04-29 Polishing pad with optimized grooves and method of forming same

Publications (3)

Publication Number Publication Date
JP2004358653A JP2004358653A (ja) 2004-12-24
JP2004358653A5 true JP2004358653A5 (ja) 2007-04-26
JP4568015B2 JP4568015B2 (ja) 2010-10-27

Family

ID=32908378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004130737A Expired - Lifetime JP4568015B2 (ja) 2003-04-29 2004-04-27 最適化された溝を有する研磨パッド及び同パッドを形成する方法

Country Status (5)

Country Link
US (1) US6783436B1 (ja)
JP (1) JP4568015B2 (ja)
KR (1) KR101093059B1 (ja)
CN (1) CN100341666C (ja)
TW (1) TWI317674B (ja)

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US8980749B1 (en) 2013-10-24 2015-03-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing silicon wafers
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