JP2004264025A - Image recognition device and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance recognition precision. <P>SOLUTION: In this image recognition method for discriminating cream solder 9 by picking up an image of the cream solder 9 printed on a rectangular electrode 16 formed with a solder leveler to be recognition-processed, white illumination light is emitted from an irradiation direction having 45° or less of angle θ1 formed with respect to a horizontal face within a vertical face, and having 75° or less of angle θ3 formed with respect to a boundary line of the electrode 16 within the horizontal face, using a lighting unit arranged radially with white light source parts 35W along a direction inclined diagonally by 45°. Regular reflection light from a glossy solder leveler forming face 16a is thereby prevented from being received by an upper side camera, and a solder surface 9a is discriminated precisely from the solder leveler forming face 16a. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an image recognition apparatus and an image recognition method for capturing an image of a recognition target object, acquiring an image, and performing recognition processing on the image.
[0002]
[Prior art]
2. Description of the Related Art In the field of manufacturing electronic components and devices, an image recognition method is widely used in which a recognition target such as an electronic component or a board is imaged with a camera, and the image pickup result is image-recognized to identify the target or detect a position. ing. As an application example of the image recognition, there is a print inspection for a board after solder printing which is performed prior to mounting of an electronic component. In this printing inspection, the print state of cream solder printed on the electrodes of the substrate, that is, the print position, the amount of print solder, and the like are detected by image recognition to determine whether the print state is acceptable (for example, see Patent Document 1).
[0003]
[Patent Document 1]
JP 2000-2667 A
[Problems to be solved by the invention]
By the way, some electrodes on a substrate have a solder leveler in which a solder film is formed on the electrode surface for the purpose of improving the solder jointability. When cream solder printed on an electrode having such a solder leveler is to be recognized, it is difficult to identify the cream solder by image recognition. In other words, in order to identify the cream solder, it is necessary to separate the printed portion of the cream solder from the surface of the solder leveler by a luminance difference. , It was difficult to make a clear difference in luminance, and it was difficult to perform accurate recognition.
[0005]
Therefore, an object of the present invention is to provide an image recognition device and an image recognition method that can improve recognition accuracy.
[0006]
[Means for Solving the Problems]
The image recognition apparatus according to claim 1, wherein the recognition surface includes a background surface, a first surface having gloss, and a second surface having lower gloss than the first surface, and the first surface is provided in the background surface. By recognizing an image obtained by capturing an image of a recognition target whose surface is provided with a rectangular boundary and further provided with a second surface on the first surface, a recognition process is performed on the background surface. An image recognition device for distinguishing a first surface from a second surface, wherein the illumination unit irradiates illumination light to the recognition target at the time of imaging, and receives reflected light of the illumination light from above. A camera that images the object to be recognized, and a recognition processing unit that performs recognition processing on image data acquired by the camera, wherein the illumination unit does not receive specularly reflected light from the first surface by the camera. Irradiate illumination light to recognition target from irradiation direction .
[0007]
The image recognition apparatus according to claim 2, wherein the irradiation direction is such that an angle formed between the irradiation direction on the first surface and the background surface in a vertical plane is 45 degrees. And the angle between the direction of irradiation of the first surface and the boundary line in a horizontal plane is 75 degrees or less.
[0008]
The image recognition device according to claim 3 is the image recognition device according to claim 1 or 2, wherein the object to be recognized is a board for mounting electronic components after solder printing, and the background surface is a surface of the substrate. Wherein the first surface is an electrode for electronic component connection provided on the substrate and having a solder leveler formed on the surface, and the second surface is cream solder printed on the electrode.
[0009]
The image recognition method according to claim 4, wherein the recognition surface includes a background surface, a first surface having glossiness, and a second surface having lower glossiness than the first surface, and the first surface is provided in the background surface. By recognizing an image obtained by capturing an image of a recognition target whose surface is provided with a rectangular boundary and further provided with a second surface on the first surface, a recognition process is performed on the background surface. An image recognition method for identifying a first surface and a second surface in the method, wherein the object to be recognized is irradiated with illumination light by an illumination unit, and reflected light of the illumination light is received from above. When capturing an image of the recognition target, illumination light is applied to the recognition target from an irradiation direction in which the specularly reflected light from the first surface is not received by the camera.
[0010]
The image recognition method according to claim 5 is the image recognition method according to claim 4, wherein an angle formed between the irradiation direction on the first surface and the background surface in a vertical plane is 45 degrees. And the angle between the direction of irradiation of the first surface and the boundary line in a horizontal plane is 75 degrees or less.
[0011]
The image recognition method according to claim 6, wherein the object to be recognized is a board for mounting electronic components after solder printing, and the background surface is a surface of the board. Wherein the first surface is an electrode for electronic component connection provided on the substrate and having a solder leveler formed on the surface, and the second surface is cream solder printed on the electrode.
[0012]
According to the present invention, when the recognition target object is irradiated with illumination light by the illuminating unit and the reflected light of the illumination light is received from above to image the recognition target object, the first surface having glossiness is used. By irradiating the object to be recognized with illumination light from an illumination direction in which specular reflection light from the camera is not received by the camera, the first surface and the second surface having a lower gloss than the first surface can be accurately detected. Can be separated.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of a screen printing apparatus according to one embodiment of the present invention, FIG. 2 is a side view of the screen printing apparatus according to one embodiment of the present invention, and FIG. 3 is a screen printing apparatus according to one embodiment of the present invention. FIG. 4 is a partial plan view of a substrate printing surface by a screen printing apparatus according to one embodiment of the present invention, and FIG. 5A is a substrate to be recognized by an image recognition apparatus according to one embodiment of the present invention. FIG. 5B is a partial cross-sectional view of a substrate to be recognized by the image recognition device according to the embodiment of the present invention, and FIG. 6 is a diagram illustrating an imaging unit of the image recognition device according to the embodiment of the present invention. 7A is a cross-sectional view, FIG. 7A is a configuration explanatory view of an illumination unit of an imaging unit of the image recognition device according to one embodiment of the present invention, and FIG. 7B is an imaging of the image recognition device according to one embodiment of the present invention. FIG. 8 is an illustration of the direction of illumination light irradiation by the unit, and FIG. FIG. 9 is an explanatory diagram of a light source arrangement of an imaging unit of a recognition device, FIG. 9 is an explanatory diagram of an illumination light irradiation direction by an imaging unit of an image recognition device according to an embodiment of the present invention, and FIG. FIG. 11 is an explanatory diagram of the direction of illumination light irradiation by the imaging unit of the image recognition device according to one embodiment of the present invention.
[0014]
First, the structure of the screen printing apparatus will be described with reference to FIGS. This screen printing apparatus has a configuration having not only a printing mechanism for printing cream solder on a substrate on which electronic components are mounted, but also a function as a print inspection apparatus for determining whether a printing state is good or not, as described later. ing.
[0015]
1 and 2, the substrate positioning unit 1 stacks a θ-axis table 4 on a moving table including an X-axis table 2 and a Y-axis table 3 and further arranges a Z-axis table 5 thereon. The Z-axis table 5 is provided with a substrate holder 7 for holding the substrate 6 sandwiched by the clampers 8 from below. The substrate 6 to be printed is carried into the substrate positioning unit 1 by the carry-in conveyor 14 shown in FIGS. By driving the substrate positioning unit 1, the substrate 6 moves in the X and Y directions, and is positioned at a printing position and a substrate recognition position described later. The printed substrate 6 is carried out by the carry-out conveyor 15.
[0016]
A screen mask 10 is provided above the substrate positioning unit 1, and the screen mask 10 is configured by mounting a mask plate 12 on a holder 11. The substrate 6 is positioned with respect to the mask plate 12 by the substrate positioning unit 1 and abuts from below. As shown in FIG. 5A, rectangular electrodes 16 and 17 for connecting electronic components are provided on the circuit forming surface of the substrate 6. Solder levelers are formed on the surfaces of the electrodes 16 and 17, and the solder leveler forming surface 16a is a first surface having gloss.
[0017]
On the screen mask 10, a squeegee head 13 is disposed so as to be able to reciprocate in the horizontal direction. While the substrate 6 is in contact with the lower surface of the mask plate 12, the cream solder 9 is supplied onto the mask plate 12, and the squeegee 13a of the squeegee head 13 is brought into contact with the surface of the mask plate 12 to slide. The cream solder 9 is printed on the printing surface of the substrate 6 through pattern holes provided in the mask plate 12. As a result, as shown in FIG. 5A, the cream solder 9 is printed on the solder leveler forming surface 16a of the electrodes 16, 17. The solder surface 9a of the cream solder 9 in the printed state is a second surface having lower gloss than the solder leveler forming surface 16a.
[0018]
Above the screen mask 10, an imaging unit 20 as an imaging unit is provided. As shown in FIG. 4A, the imaging unit 20 is horizontally moved in the XY directions by the X-axis table 21 and the Y-axis table 22. The X-axis table 21 and the Y-axis table 22 are imaging moving means for moving the imaging unit 20. The imaging unit 20 images an arbitrary position of the mask plate 12 by moving the imaging unit 20 with respect to the mask plate 12 by the imaging moving unit.
[0019]
As shown in FIG. 4B, the substrate positioning unit 1 can be moved in the Y direction from below the screen mask 10 by the Y-axis table 3 to move the held substrate 6 to the substrate recognition position. By moving the imaging unit 20 to the substrate 6 on the substrate positioning unit 1 in this state, an arbitrary position on the substrate 6 can be imaged by the imaging unit 20. The print inspection after screen printing is performed by imaging the substrate 6 after solder printing as an object to be recognized by the imaging unit 20.
[0020]
As shown in FIG. 5B, the substrate 6 to be recognized in the printing inspection has electrodes 16 and 17 separated from the surface of the substrate 6 by a rectangular boundary line, and further projects upward by the thickness of the solder leveler. The cream solder 9 is printed on the solder leveler forming surface 16a. That is, the image captured by the imaging unit 20 is a recognition surface in image recognition for print inspection. The recognition surface includes a background surface, which is the surface of the substrate 6, and a solder leveler formation surface 16 (first surface). ) And the solder surface 9a (second surface) of the cream solder 9 printed on the solder leveler forming surface 16a. In the recognition process for print inspection, the solder print area is determined by identifying the solder leveler forming surface 16a and the solder surface 9a in the background surface. Then, by comparing this solder printing area with a preset inspection threshold value, the quality of the printing state is determined.
[0021]
Next, the configuration of the imaging unit 20 will be described with reference to FIG. As shown in FIG. 6, the imaging unit 20 has a configuration in which a zoom optical system 24 is connected to a camera 23 capable of color imaging, and an illumination unit 25 is provided below the zoom optical system 24. The illumination unit 25 irradiates illumination light to the surface of the substrate 6 which is a recognition target at the time of imaging. The camera 23 receives the reflected light emitted by the illumination unit 25 and reflected by the substrate 6 from above through the zoom optical system 24, and images the recognition target. The image data of the recognition plane acquired by the camera 23 is subjected to recognition processing by the recognition processing unit 30, and the recognition result is sent to the control unit 33.
[0022]
Next, the configuration of the illumination unit 25 will be described. The illuminating unit 25 irradiates the substrate 6 located below with illumination light under various illumination conditions, and therefore includes a lower illuminating unit 26, a middle illuminating unit 27, an upper illuminating unit 28, and a coaxial illuminating unit 29 described below. A plurality of lighting units are provided. These lighting units are controlled by the control unit 33 via the lighting control unit 31.
[0023]
Here, the lower illumination unit 26, the middle illumination unit 27, and the upper illumination unit 28 are annular illumination units each having a light source arranged around a circular imaging range 25a of the camera 23. Of these illumination units, the lower illumination unit 26 can be rotated by a predetermined angle around the imaging range 25a by the lower illumination rotation drive unit 32. The imaging unit 20, the recognition processing unit 30, the illumination control unit 31, and the lower illumination rotation drive unit 32 constitute an image recognition device that performs image recognition of a substrate in a screen printing device and performs recognition processing for print inspection.
[0024]
Next, the lighting function of each lighting unit described above will be described with reference to FIG. The lower illumination unit 26 and the middle illumination unit 27 have a configuration in which light source units 35 each having a plurality of LEDs 36 are radially arranged around the imaging range 25a. Here, as shown in FIG. 7B, the lower illumination unit 26 and the middle illumination unit 27 illuminate the recognition target located in the imaging range 25a with θ1 and θ2 from the directions of arrows a and b, respectively. The illumination light is emitted in an angle (an angle between the irradiation direction of the illumination light and the horizontal direction (the surface of the substrate 6)).
[0025]
The upper illumination unit 28 includes an LED light source unit disposed in a ring shape above the middle illumination unit 27, and irradiates the recognition target located in the imaging range 25a with illumination light from above. The coaxial illumination unit 29 is located on the side of the half mirror 29a disposed below the zoom optical system 24, and reflects the illumination light emitted in the horizontal direction from the light source of the LED downward by the half mirror 29a. Then, the object to be recognized is illuminated from the coaxial direction.
[0026]
Here, the illumination light emitted from each of the illumination units will be described. FIGS. 8A and 8B show the horizontal arrangement of the light source units in the lower lighting unit 26 and the middle lighting unit 27, respectively. Each of the lower illumination unit 26 and the middle illumination unit 27 has a configuration in which eight light sources are radially arranged with the imaging position 25a at the center, and illumination is performed from each of these light sources toward the center of the imaging position 25a. Light is irradiated.
[0027]
As shown in FIG. 8A, among the eight light source units arranged in the lower lighting unit 26, LEDs emitting red light are provided in four directions of 0 °, 90 °, 180 °, and 270 °. A red light source section 35R is disposed, and a white light source section 35W having an LED for emitting white light is disposed in four directions at an angle of 45 ° with the red light source section 35R.
[0028]
Therefore, by turning on the lower illumination unit 26, as shown in FIG. 7B, the irradiation angle θ1 is applied to the electrode 16 formed on the surface of the substrate 6 in a horizontal posture and the cream solder 9 on the electrode 16. (See arrow a), white light and red light are emitted. At this time, as described above, the white light and the red light are radiated only from the directions respectively defined in the horizontal plane. The mounting direction of each light source unit in the lower illumination unit 26 is set so that the irradiation angle θ1 is 45 ° or less.
[0029]
As shown in FIG. 8B, the eight light source units arranged in the middle lighting unit 27 are all red light source units 35 </ b> R having LEDs that emit red light, and turn on the middle lighting unit 27. As a result, as shown in FIG. 7B, the electrode 16 formed on the surface of the substrate 6 in the horizontal posture and the cream solder 9 on the electrode 16 are applied from all directions around the irradiation angle θ2 (see arrow b). ) Red light is emitted.
[0030]
The upper lighting unit 28 and the coaxial lighting unit 29 are each provided with a light source unit having an LED that emits red light. By turning on the upper lighting unit 28, the electrode 16 formed on the surface of the substrate 6 and the cream solder 9 on the electrode 16 are slightly inclined with respect to the vertical direction as shown in FIG. Red light is emitted from the method (see arrow c). By turning on the coaxial illumination unit 29, the red light reflected downward by the half mirror 29a is emitted from the coaxial direction (see arrow d).
[0031]
This image recognition apparatus is configured as described above. Next, an image recognition method performed for the purpose of print inspection on a substrate after cream solder printing will be described. In this image recognition, the solder print area is obtained by distinguishing the solder leveler forming surface 16a from the solder surface 9a in the background of the screen obtained by imaging the surface of the substrate 16. Then, by comparing this solder printing area with a preset inspection threshold value, the quality of the printing state is determined.
[0032]
At the time of printing inspection, the printed substrate 6 is moved to an imaging position, and the imaging unit 20 is aligned with the inspection target position of the substrate 6. At this time, as shown in FIG. 9A, the outlines of the four sides of the rectangular electrode 16 on which the cream solder 9 is printed, that is, the boundaries with the surface of the substrate 6 are 0 °, 90 °, and 180 °, respectively. The alignment is performed so as to substantially coincide with the direction of {270}.
[0033]
At the time of imaging by the camera 23, only the lower illumination unit 26 is used, and only the four white light source units 35W of the eight light source units are turned on to image the inspection target position on the substrate 6. In this imaging, as shown in FIG. 9B, white light is applied to the solder surface 9a and the solder leveler surface 16a of the cream solder 9 from the direction of arrow a (see FIG. 7B). Among these illumination lights, the illumination light (see arrow a1) applied to the solder surface 9a is irregularly reflected by the low-gloss solder surface 9a, and the irregularly reflected light is reflected by the upper camera 23 (see FIG. 6). Received.
[0034]
As shown in FIG. 9C, the illuminating light (see arrow a2) applied to the solder leveler 16a has an irradiation direction (angle θ3) in a horizontal plane substantially corresponding to the glossy solder leveler surface 16a. Is specularly reflected in a specific direction corresponding to At this time, the illumination direction of the illumination light emitted from the white light source unit 35W in the horizontal plane is set at a direction of approximately 45 ° with respect to the boundary line of the electrode 16, so that the regular reflection light in the horizontal plane is set. The reflection direction is deviated as shown by the dashed arrow in FIG. Therefore, this specularly reflected light is not received by the camera 23 above. Then, only the solder leveler forming surface 16 a at the corner of the electrode 16 specularly reflects the illumination light obliquely upward, and the specularly reflected light is received by the camera 23. Although θ3 is set to 45 ° here, the angle may be any angle at which specularly reflected light is not received by the camera 23, and a practical condition is 75 ° or less.
[0035]
FIG. 10A shows a recognition screen obtained by imaging under such illumination conditions. This recognition screen is an image in which the electrode 16 and the cream solder 9 printed on the electrode 16 are included in the background surface indicating the surface of the substrate 6. In FIG. 10A, among the portions corresponding to the solder leveler forming surface 16 a of the electrode 16, the leveler parallel portion 16 c has illumination conditions such that the regular reflection light of white illumination light is not received by the camera 23 as described above. As a result, the brightness on the screen is low, and only the electrode corner 16d is a high brightness portion where the regular reflection light is received as described above.
[0036]
Therefore, the solder portion 9 imaged with a certain level of brightness by receiving diffusely reflected light from the solder surface 9a and the leveler parallel portion 16c having a low brightness can be clearly separated on the image by a brightness difference, and the solder leveler can be separated. The cream solder 9 on the formed electrode 16 can be identified with high accuracy.
[0037]
FIG. 10B shows a comparison between a recognition screen obtained by a conventional image recognition method of irradiating white illumination light from all directions in a case where the electrode 16 on which the cream solder 9 is printed is also a recognition target. Is shown in In this case, since the illumination light enters the solder leveler surface 16a not only from the oblique direction but also from the normal direction, the specularly reflected light from the glossy solder leveler surface 16a enters the camera 23. I was For this reason, the solder leveler surface 16a is almost entirely or partially captured as a high-brightness image, and the brightness difference from the image of the cream solder 9 that has received the irregularly reflected light becomes unclear. Identification was ambiguous.
[0038]
As described above, in the image recognition method according to the present embodiment, the solder leveler forming surface 16a is provided on the substrate surface by being divided by the rectangular boundary line, and the cream solder 9 is printed on the solder leveler forming surface 16a. The substrate 6 that has been set is to be recognized. The upper surface of the substrate 6 as a recognition surface to be imaged by the imaging unit 20 includes an electrode 16 having a solder leveler forming surface 16a as a first surface having glossiness on the surface of the substrate 6 as a background surface, and a solder leveler. The configuration includes a solder surface 9a as a second surface having lower gloss than the formation surface 16a.
[0039]
The upper surface of the substrate 6 is irradiated with illumination light by the illumination unit 25. When the reflected light of the illumination light is received from above and the upper surface of the substrate 6 is imaged, the specularly reflected light from the solder leveler surface 16a is reflected by the camera. The illumination light is applied to the upper surface of the substrate 6 from an irradiation direction that is not received by the light source 23. That is, as shown in FIG. 7B, the irradiation angle θ1 between the irradiation direction to the solder leveler surface 16a and the surface of the substrate 6 in the vertical plane is 45 ° or less, and as shown in FIG. 9C. As described above, the white illumination light is emitted from the angle θ3 between the irradiation direction to the solder leveler 16a and the boundary line between the electrodes 16 in the horizontal plane, which is 75 ° or less.
[0040]
Thereby, the solder leveler surface 16a and the solder surface 9a can be distinguished by a clear luminance difference, and the recognition accuracy can be improved even when the cream solder 9 originally containing the same material is printed on the solder leveler surface 16a. And the solder area can be detected with high accuracy.
[0041]
In the above-described embodiment, an example has been described in which the alignment is performed such that the boundaries of the four sides indicating the outer shape of the electrode 16 substantially coincide with the directions of 0 °, 90 °, 180 °, and 270 °, respectively. As shown in FIG. 11A, when the direction of the electrode 16 on the substrate 6 is inclined by a certain angle α from the state shown in FIG. 9A, the lower illumination rotation drive unit 32 (see FIG. 6) lowers the lower electrode. The lighting unit 26 is rotated by the same angle α. Thus, as shown in FIG. 11B, the white illumination light is irradiated from the same irradiation direction as the example shown in FIG. 9C, and the same result is obtained.
[0042]
In the above embodiment, the substrate 6 on which the cream solder 9 is printed on the electrode 16 having the solder leveler forming surface 16a is used as the recognition target. And a first surface having gloss and a second surface having lower gloss than the first surface are included in the recognition surface, and the first surface is provided in the background surface and is divided by a rectangular boundary. In addition, any object to be recognized having a configuration in which the second surface is provided on the first surface can be applied to the present invention.
[0043]
【The invention's effect】
According to the present invention, when the recognition target object is irradiated with illumination light by the illuminating unit and the reflected light of the illumination light is received from above to image the recognition target object, the first surface having glossiness is used. The object to be recognized is illuminated with illumination light from an illumination direction in which specularly reflected light from the camera is not received by the camera, so that the first surface and the second surface having a lower gloss than the first surface are separated. Separation can be performed with high accuracy.
[Brief description of the drawings]
FIG. 1 is a front view of a screen printing apparatus according to an embodiment of the present invention. FIG. 2 is a side view of the screen printing apparatus according to an embodiment of the present invention. FIG. 3 is screen printing according to an embodiment of the present invention. FIG. 4 is a partial plan view of a substrate printing surface by a screen printing apparatus according to an embodiment of the present invention. FIG. 5A is a recognition target of an image recognition apparatus according to an embodiment of the present invention. Plan view of substrate (b) Partial cross-sectional view of a substrate to be recognized by the image recognition device according to one embodiment of the present invention [FIG. 6] Cross-sectional view of an imaging unit of the image recognition device according to one embodiment of the present invention [ FIG. 7A is a diagram illustrating a configuration of a lighting unit of an imaging unit of the image recognition device according to one embodiment of the present invention; FIG. FIG. 8 is a photograph of an image recognition device according to an embodiment of the present invention. FIG. 9 is an explanatory diagram of a light source arrangement of a unit. FIG. 9 is an explanatory diagram of an illumination light irradiation direction by an imaging unit of the image recognition device according to one embodiment of the present invention. FIG. 11 is an explanatory diagram of an illumination light irradiation direction by an imaging unit of the image recognition device according to one embodiment of the present invention.
6 substrate 9 cream solder 9a solder surface 16, 17 electrode 16a solder leveler forming surface 20 imaging unit 23 camera 25 lighting unit 26 lower lighting unit 27 middle lighting unit 28 upper lighting unit 29 coaxial lighting unit 30 recognition processing unit 31 lighting control unit 33 Control unit

Claims (6)

The recognition surface includes a background surface, a first surface having a glossiness, and a second surface having a lower glossiness than the first surface, and the first surface is divided by a rectangular boundary in the background surface. A first surface and a second surface in the background surface by recognizing an image obtained by imaging a recognition target object provided with the second surface on the first surface. An image recognition device that identifies the recognition target, an illumination unit that irradiates the recognition target object with illumination light at the time of imaging, and a camera that receives reflected light of the illumination light from above and images the recognition target object. A recognition processing unit for recognizing image data acquired by the camera, wherein the illumination unit illuminates the recognition target from an irradiation direction in which specularly reflected light from the first surface is not received by the camera. Image recognition device characterized by irradiating light In the irradiation direction, an angle formed between the irradiation direction on the first surface and the background surface in a vertical plane is 45 degrees or less, and the irradiation direction on the first surface is formed in the horizontal plane with the boundary line. The image recognition device according to claim 1, wherein the angle is 75 degrees or less. The object to be recognized is a board for mounting electronic components after solder printing, the background surface is a surface of the substrate, and the first surface is an electronic component provided on the substrate and having a solder leveler formed on the surface. The image recognition device according to claim 1, wherein the image recognition device is a connection electrode, and the second surface is a cream solder printed on the electrode. The recognition surface includes a background surface, a first surface having a glossiness, and a second surface having a lower glossiness than the first surface, and the first surface is divided by a rectangular boundary in the background surface. A first surface and a second surface in the background surface by recognizing an image obtained by imaging a recognition target object provided with the second surface on the first surface. When illuminating the recognition target object with illumination light by an illumination unit and receiving the reflected light of the illumination light from above to image the recognition target object, An image recognition method, comprising: irradiating illumination light to an object to be recognized from an illumination direction in which specularly reflected light from a first surface is not received by the camera. In the irradiation direction, an angle formed between the irradiation direction on the first surface and the background surface in a vertical plane is 45 degrees or less, and the irradiation direction on the first surface is formed in the horizontal plane with the boundary line. The image recognition device according to claim 4, wherein the angle is 75 degrees or less. The object to be recognized is a board for mounting electronic components after solder printing, the background surface is a surface of the substrate, and the first surface is an electronic component provided on the substrate and having a solder leveler formed on the surface. The image recognition method according to claim 4, wherein the electrode is a connection electrode, and the second surface is cream solder printed on the electrode.

Images