JPH02208545A - Inspection of coating of cream-like solder - Google Patents
Inspection of coating of cream-like solderInfo
- Publication number
- JPH02208545A JPH02208545A JP3059089A JP3059089A JPH02208545A JP H02208545 A JPH02208545 A JP H02208545A JP 3059089 A JP3059089 A JP 3059089A JP 3059089 A JP3059089 A JP 3059089A JP H02208545 A JPH02208545 A JP H02208545A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- printed circuit
- conductor
- discharge lamp
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 22
- 238000000576 coating method Methods 0.000 title claims description 5
- 239000011248 coating agent Substances 0.000 title claims description 4
- 238000007689 inspection Methods 0.000 title abstract description 7
- 238000001228 spectrum Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 10
- 238000003384 imaging method Methods 0.000 claims description 9
- 238000005286 illumination Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000006071 cream Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（イ）産業上の利用分野
本発明は、プリント基板へのクリーム状はんだの塗付状
態の良否検査方法に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a method for inspecting the quality of cream solder applied to a printed circuit board.
（ロ）従来技術
従来、チップ型電子部品をプリント基板へ実装する工程
において、そのチップ型電子部品の搭載に先たち、その
プリント基板上の回路導体上にクリーム状はんだを塗付
する必要がある。(B) Prior Art Conventionally, in the process of mounting chip-type electronic components onto a printed circuit board, it is necessary to apply creamy solder onto the circuit conductor on the printed circuit board prior to mounting the chip-type electronic component. .
この場合、はんだを均一に薄く塗付するのにスクリーン
印刷方式が用いられている。In this case, a screen printing method is used to uniformly and thinly apply the solder.
（ハ）発明が解決しようとする問題点
このような塗付工程では、プリント基板の表面の油水分
の有無、その他の状態によりクリーム状はんだが回路導
体上に転写されず、塗付ムラが生ずることがあるため、
その塗付状態の良否を検査して不完全な基板を取り除く
必要がある。そのためにはクリーム状はんだを印刷処理
されたプリント基板を全て目視検査しなければならず極
めて不能率であった。(c) Problems to be solved by the invention In such a coating process, creamy solder may not be transferred onto the circuit conductor due to the presence of oil or moisture on the surface of the printed circuit board or other conditions, resulting in uneven coating. Because of this,
It is necessary to inspect the coating condition and remove defective substrates. To do this, all printed circuit boards printed with creamy solder had to be visually inspected, which was extremely difficult.
また、このような目視検査に代えて、撮像装置によって
得た画像データを利用してその良否を判別することも考
えられるが、レジストコーティングされたプリント基板
上の導体と印刷処理されたクリーム状はんだは互いに極
く近似した反射率と色調のために撮像装置によって光学
的に判別する手掛かりが得られていなかった。In addition, instead of such visual inspection, it is possible to use image data obtained by an imaging device to determine the quality of the product. Since the reflectance and color tone are very similar to each other, it has not been possible to obtain a clue to optically distinguish them using an imaging device.
（ニ）問題点を解決するための手段
本発明はこのような問題を解決するために、特定のスペ
クトルと照射角度をもつ照明手段を備え、撮像装置によ
って得た画像データを利用できるようにした。(d) Means for Solving the Problems In order to solve these problems, the present invention is equipped with an illumination means having a specific spectrum and irradiation angle, so that image data obtained by an imaging device can be used. .
以下、本発明の実施例につき図面を参照して説明する。Embodiments of the present invention will be described below with reference to the drawings.
第１図は本発明による、クリーム状はんだの塗付状態検
査方法の実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the method for inspecting the application state of creamy solder according to the present invention.
１はプリント基板、２はそのプリント基板１の上に予め
形成された印刷回路の導体（銅箔）、３はその上にスク
リーン印刷されたクリーム状はんだである。印刷回路の
導体２″の表面にクリーム状はんだが塗付されていない
のは何らかの阻害要因による。1 is a printed circuit board, 2 is a printed circuit conductor (copper foil) previously formed on the printed circuit board 1, and 3 is a creamy solder screen-printed thereon. The reason why creamy solder is not applied to the surface of the conductor 2'' of the printed circuit is due to some inhibiting factor.
４はイメージセンサを内蔵した撮像装置、５はそのレン
ズである。６は波長６００ｎｍ（ナノメートル）の近傍
にピークスペクトルを有する蛍光放電灯であって、可視
光の中でも波長が大である（第２図）。また、その放電
灯６は検査目的物を所定の角度θで照明するように配置
されている。その角度θは２０°以下が望ましい。その
放電灯６は環状型のものであるが、直管型の放電灯であ
ってもよい。4 is an imaging device with a built-in image sensor, and 5 is its lens. 6 is a fluorescent discharge lamp having a peak spectrum near a wavelength of 600 nm (nanometers), which has a large wavelength among visible light (FIG. 2). Further, the discharge lamp 6 is arranged so as to illuminate the object to be inspected at a predetermined angle θ. The angle θ is preferably 20° or less. Although the discharge lamp 6 is of an annular type, it may be a straight tube type discharge lamp.
なお、プリント基板２は公知の手段で同一平面上を移動
されて、検査目的物が順次レンズ５の視野内に入るよう
になっている。The printed circuit board 2 is moved on the same plane by known means so that the objects to be inspected are successively brought into the field of view of the lens 5.
上記構成において、蛍光放電灯６によって検査対象物で
あるプリント基板２を照明すると、その反射光がレンズ
５に達するが、その反射光によって撮像装置４が出力す
る電圧は、その最大出力が１０１００Ｏであるのに対し
、
印刷回路の導体（銅箔）２のとき、４００ｍＶ、クリー
ム状はんだ３のとき、８００ｍＶ、の出力が得られる。In the above configuration, when the printed circuit board 2, which is the object to be inspected, is illuminated by the fluorescent discharge lamp 6, the reflected light reaches the lens 5, but the voltage output by the imaging device 4 due to the reflected light has a maximum output of 10100O. On the other hand, when using printed circuit conductor (copper foil) 2, an output of 400 mV is obtained, and when using cream solder 3, an output of 800 mV is obtained.
したがって前記撮像装置に接続された画像処理装置（図
示されていない）によってその出力を処理し、印刷回路
の導体２とクリーム状はんだ３とを完全に識別した検査
結果を得ることができる。Therefore, the output can be processed by an image processing device (not shown) connected to the image pickup device, and an inspection result can be obtained in which the conductor 2 of the printed circuit and the creamy solder 3 are completely distinguished.
これに対して、放電灯のスペクトルが波長６００ｎｍ（
ナノメートル）未満のものでは、印刷回路の導体（銅箔
）２とクリーム状はんだ３の出力電圧はほぼ同等であっ
て、識別できる程の差異が得られない。In contrast, the spectrum of a discharge lamp has a wavelength of 600 nm (
If the voltage is less than nanometers, the output voltages of the printed circuit conductor (copper foil) 2 and the cream solder 3 are almost the same, and there is no discernible difference.
なお、前記画像処理装置によって得られな検査結果億シ
よんだのクリーン印刷スキージの速度等にフィードバッ
クしてその品質を自動的に制御することも可能である。It is also possible to automatically control the quality by feeding back the speed of the clean printing squeegee, etc. of the inspection results obtained by the image processing device.
（ホ）効果
本発明のクリーム状はんだの塗付状態検査方法は、可視
光の中でも長い波長のスペクトルと小さな照射角度をも
つ照明手段を備え、撮像装置によって得た画像データを
利用するものであるので、印刷回路の導体と、クリーム
状はんだとに対応した出力が得られる。したがって撮像
装置に接続された画像処理装置によってその出力を処理
し、印刷回路の導体とクリーム状はんだとを完全に識別
した検査結果を迅速に得ることができ、能率の向上を図
れる効果がある。(E) Effect The method for inspecting the application state of creamy solder of the present invention is equipped with an illumination means having a long wavelength spectrum among visible light and a small irradiation angle, and utilizes image data obtained by an imaging device. Therefore, an output corresponding to the printed circuit conductor and creamy solder can be obtained. Therefore, the output is processed by the image processing device connected to the imaging device, and inspection results that completely distinguish between the conductor of the printed circuit and the creamy solder can be quickly obtained, which has the effect of improving efficiency.
第１図は本発明による、クリーム状はんだの塗付状態検
査方法の実施例を示す断面図、第２図は蛍光放電灯のス
ペクトルを示す。
１ニブリント基板
２：印刷回路の導体（銅箔）、
３：クリーム状はんだ
４：撮像装置
５：レンズ
６：蛍光放電灯
特許出願人 シーケーディ株式会社
第 １ Ｎ
手続有１１正書（方式）
％式％
クリーム状はんだの塗付状態検査方法
３、補正をする者
事件との関係FIG. 1 is a sectional view showing an embodiment of the method for inspecting the application state of creamy solder according to the present invention, and FIG. 2 shows a spectrum of a fluorescent discharge lamp. 1 Niblint board 2: Printed circuit conductor (copper foil), 3: Cream solder 4: Imaging device 5: Lens 6: Fluorescent discharge lamp Patent applicant: CKD Co., Ltd. No. 1 N Procedures 11 Regular Book (Method) % Formula % Creamy solder application condition inspection method 3, relationship with the case of the person making the correction
Claims (1)
角度をもつ照明手段を備え、撮像装置によって得た画像
データを利用するクリーム状はんだの塗付状態検査方法
。1. A method for inspecting the coating condition of creamy solder that uses image data obtained by an imaging device and is equipped with an illumination device that has a long wavelength spectrum among visible light and a small irradiation angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3059089A JPH02208545A (en) | 1989-02-09 | 1989-02-09 | Inspection of coating of cream-like solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3059089A JPH02208545A (en) | 1989-02-09 | 1989-02-09 | Inspection of coating of cream-like solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02208545A true JPH02208545A (en) | 1990-08-20 |
Family
ID=12308081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3059089A Pending JPH02208545A (en) | 1989-02-09 | 1989-02-09 | Inspection of coating of cream-like solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02208545A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004264025A (en) * | 2003-01-09 | 2004-09-24 | Matsushita Electric Ind Co Ltd | Image recognition device and method |
| JP2004264026A (en) * | 2003-01-09 | 2004-09-24 | Matsushita Electric Ind Co Ltd | Image recognition device and method |
| US7551768B2 (en) | 2003-01-09 | 2009-06-23 | Panasonic Corporation | Image recognition apparatus and method for surface discrimination using reflected light |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57199945A (en) * | 1981-06-03 | 1982-12-08 | Toshiba Corp | Measuring and evaluating device for solder wettability |
-
1989
- 1989-02-09 JP JP3059089A patent/JPH02208545A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57199945A (en) * | 1981-06-03 | 1982-12-08 | Toshiba Corp | Measuring and evaluating device for solder wettability |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004264025A (en) * | 2003-01-09 | 2004-09-24 | Matsushita Electric Ind Co Ltd | Image recognition device and method |
| JP2004264026A (en) * | 2003-01-09 | 2004-09-24 | Matsushita Electric Ind Co Ltd | Image recognition device and method |
| US7551768B2 (en) | 2003-01-09 | 2009-06-23 | Panasonic Corporation | Image recognition apparatus and method for surface discrimination using reflected light |
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