JP2004207352A - Module comprising built-in electronic components - Google Patents

Module comprising built-in electronic components Download PDF

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Publication number
JP2004207352A
JP2004207352A JP2002372227A JP2002372227A JP2004207352A JP 2004207352 A JP2004207352 A JP 2004207352A JP 2002372227 A JP2002372227 A JP 2002372227A JP 2002372227 A JP2002372227 A JP 2002372227A JP 2004207352 A JP2004207352 A JP 2004207352A
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Japan
Prior art keywords
electronic component
insulating resin
wiring board
solder
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002372227A
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Japanese (ja)
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JP4350366B2 (en
Inventor
Eiji Kawamoto
英司 川本
Masaaki Hayama
雅昭 葉山
Masaaki Katsumata
雅昭 勝又
Hiroki Yabe
裕城 矢部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2002372227A priority Critical patent/JP4350366B2/en
Priority to CN2003801001779A priority patent/CN1692685B/en
Priority to US10/500,539 priority patent/US6998532B2/en
Priority to PCT/JP2003/016427 priority patent/WO2004060034A1/en
Publication of JP2004207352A publication Critical patent/JP2004207352A/en
Application granted granted Critical
Publication of JP4350366B2 publication Critical patent/JP4350366B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem that solder is re-fused and electrodes are shorted during reflow connection with a mother substrate in a module comprising built-in electronic components which has a structure of resin mold by mounting electronic components using the existing solder. <P>SOLUTION: In a module comprising built-in electronic components wherein at least one or more electronic components 4, a wiring substrate 2 including at least one or more wiring layers and electronic components 4 are connected with an electrode 3 of the wiring substrate 2 and solder 5, these elements are covered with a first insulation resin 7, and an electromagnetic shield layer of metal film 15 is provided at the surface layer of the first insulation resin 7, only the electrode 3 of the wiring substrate 2 is surrounded by solder resist 6. Accordingly, while the areas just under the electronic components are surely filled with the insulation resin, thick insulation resin can be formed covering the electronic components by forming the solder resist only in the periphery of the electrode at the surface layer of the wiring substrate to form a constant space between the electronic components and wiring substrate, setting the contents of inorganic filler included in the first insulation resin to 50wt.% to 95wt.%, and setting the particle size to a value smaller than the interval between the wiring substrate not including the solder resist and electronic components. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は電子部品内蔵モジュールに関し、特に、配線基板の上部に電子部品が配置され、これを絶縁樹脂で覆った電子部品内蔵モジュールに関するものである。
【０００２】
【従来の技術】
近年、基板上に複数の電子部品を搭載しその電子部品を樹脂モールドして構成した電子部品内蔵モジュールを用いる小型の電子機器が急激に普及してきた。図１３に従来の樹脂モールドされた電子部品内蔵モジュール１０１を示す。
【０００３】
図１３の断面図に示すように配線パターン１１１や電極１０３を配線基板１０２の表面に形成し、その表面をソルダーレジスト１０６で覆っている。
【０００４】
この配線基板１０２の内層にはインナービア１１０を形成し、このインナービア１１０により配線パターン１１２や前記配線基板１０２の裏面に形成した裏面電極１１３を電気的に接続している。この裏面電極１１３にはマザー基板（図示せず）と接続するためのはんだ１１４を設けている。
【０００５】
そして、電子部品１０４と電極１０３とをはんだ１０５で接続した後、電子部品１０４を包み込むように配線基板１０２の表面上を絶縁樹脂１０７で覆い、表層に金属めっき電磁界シールド層１１５を設けた電子部品内蔵モジュールである。
【０００６】
なお、この出願の発明に関する先行技術文献情報としては、例えば、特許文献１が知られている。
【０００７】
【特許文献１】
特開２００１−２４３１２号公報
【０００８】
【発明が解決しようとする課題】
しかしながら、従来の樹脂モールドされた電子部品内蔵モジュールでは、電子部品を配線基板上に実装する材料として、はんだやワイヤボンドが用いられている。
【０００９】
ワイヤボンド方式はワイヤで接合するために電子部品の面積以上の広い面積が必要となり、電子機器の小型化には不向きである。それに対してはだんだで接合する場合は一部電極端部のフィレットは必要であるが、殆ど電子部品と同等の面積で電子部品を実装することが可能で電子機器の小型化には有利である。しかし、電子部品をはんだで実装する場合はんだショート防止のため配線基板の表面の電極以外の部分をソルダーレジストで覆っている。
【００１０】
また、実装時の電極間のはんだショート防止のため、使用するはんだ量は非常に少ない。それ故、実装後の電子部品とソルダーレジストで覆われた配線基板との隙間が約１０μｍ程度しかなく絶縁樹脂で電子部品をモールドする場合、電子部品と配線基板との隙間部分に絶縁樹脂が十分入りきらずに空間ができる。
【００１１】
この電子部品と配線基板との隙間部分に空間ができた状態の電子部品内蔵モジュールをマザー基板とはんだ接合を行うと上記はんだが電子部品内蔵モジュール内で再溶融した時に、溶融したはんだが電子部品と配線基板の隙間部分へ流出する。その結果、電極間でショート不良を起こし電子部品内蔵モジュールの機能を害するものとなっていた。
【００１２】
また、この電子部品と配線基板の隙間に絶縁樹脂を充填する方法として、真空印刷工法を用いることが提案されている。しかしんながら、通常絶縁樹脂にはＳｉＯ2等の無機フィラーが配合されており、これらの無機フィラーの粒径は数十μｍの大きさで、仮に真空印刷工法を用いた場合でも、ソルダーレジストで覆われた配線基板と電子部品の間隔は１０μｍ程度しかないため、物理的に電子部品と配線基板の隙間に絶縁樹脂を充填することは不可能である。
【００１３】
また、１０μｍ以下のフィラー径を有するアンダーフィルを用いることで電子部品と配線基板の隙間を埋めることは可能であるが、これらのアンダーフィルは細かく分級した無機フィラーを用いているため、非常に高価でコストアップにつながるという問題点を有していた。
【００１４】
本発明は上記従来の問題を解決し、接続信頼性及び量産性に優れた電子部品内蔵モジュールを提供することを目的としている。
【００１５】
【課題を解決するための手段】
上記課題を解決するために本発明の請求項１に記載の発明は、少なくとも１つ以上の電子部品と、少なくとも一層以上の配線層を有する配線基板と、前記電子部品をこの配線基板の電極にはんだで接続し、これらを第１の絶縁樹脂で覆い、この第１の絶縁樹脂の表層に金属膜による電磁界シールド層を設けた電子部品内蔵モジュールにおいて、前記配線基板に前記電子部品をはんだで接続する電極の周囲のみにソルダーレジストの囲いを形成した電子部品内蔵モジュールとしたものであり、電子部品を配線基板上に実装する際に、電極外へのはんだの流出を防止するとともに、電子部品と配線基板との隙間をソルダーレジストの厚み分だけ大きく開けることが可能となり、その隙間に第１の絶縁樹脂を良好に充填することができる。また、第１の絶縁樹脂の多くが配線基板のソルダーレジスト以外の樹脂部分と密着できるため、配線基板と第１の絶縁樹脂との密着強度を高くすることができる。以上により、電子部品内蔵モジュールをマザー基板へ実装する際に起こるはんだの再溶融時にも、第１の絶縁樹脂が防護壁となり、はんだの電極外への流出を防止することができるという作用を有する。
【００１６】
請求項２に記載の発明は、ソルダーレジストの囲い部分が１つの電子部品の電極間でそれぞれ独立する構成とした請求項１記載の電子部品内蔵モジュールとしたものであり、電子部品と配線基板の間隔を確実に大きく形成することができるため、第１の絶縁樹脂または第２の絶縁樹脂を容易に電子部品と配線基板の間に充填することが可能となる。そのため、電子部品内蔵モジュールをマザー基板へ実装する際に起こるはんだの再溶融時にも、第１の絶縁樹脂または第２の絶縁樹脂が防護壁となり、はんだの電極外への流出を確実に防止することができるという作用を有する。
【００１７】
請求項３に記載の発明は、前記電子部品と前記配線基板の間に第２の絶縁樹脂が存在する請求項１記載の電子部品内蔵モジュールとしたものであり、電子部品と配線基板との隙間に樹脂を充填することのみを目的に第２の絶縁樹脂を形成できるので、さらに良好に電子部品と配線基板の間に樹脂を充填することが可能となる。そのため、電子部品内蔵モジュールをマザー基板へ実装する際に起こるはんだの再溶融時にも、第２の絶縁樹脂が防護壁となり、はんだの電極外への流出を確実に防止することができるという作用を有する。
【００１８】
請求項４に記載の発明は、複数個の電子部品と少なくとも一層以上の配線層を有する配線基板と、前記電子部品をこの配線基板の電極にはんだで接続し、これらを第１の絶縁樹脂で覆い、この第１の絶縁樹脂の表層に金属めっきによる電磁界シールド層を設けた電子部品内蔵モジュールにおいて、能動部品からなる電子部品と前記配線基板の間に第３の絶縁樹脂を形成した請求項２記載の電子部品内蔵モジュールとしたものであり、能動部品からなる電子部品と配線基板との熱膨張係数を緩和し電気的接続の信頼性を確保する作用を有する。
【００１９】
請求項５に記載の発明は、能動部品からなる電子部品とそれ以外の電子部品の間にソルダーレジストの壁を形成した請求項４記載の電子部品内蔵モジュールとしたものであり、ソルダーレジストの壁により第２の絶縁樹脂を必要としない電子部品への塗布を制御することが可能であるという作用を有する。
【００２０】
請求項６に記載の発明は、前記一部の電子部品が実装される配線基板の表面の電極以外の部分をソルダーレジストで覆われている請求項４記載の電子部品内蔵モジュールとしたものであり、配線基板の表層に電極以外に配線パターンが形成されている構造においても、電極と配線パターンのショートを防止することができるという作用を有する。
【００２１】
請求項７に記載の発明は、第１の絶縁樹脂が熱硬化性樹脂及び無機フィラーを含む混合物からなり、無機フィラーの配合比率が５０重量％〜９５重量％、無機フィラーの粒径が前記ソルダーレジストを除く配線基板と前記電子部品の間隔より小さい粒径とした請求項１記載の電子部品内蔵モジュールとしたものであり、電子部品と配線基板との間に第１の絶縁樹脂を確実に充填できるとともに、第１の絶縁樹脂の厚さを内蔵する電子部品の高さより肉厚に形成することが容易であるという作用を有する。
【００２２】
請求項８に記載の発明は、第２の絶縁樹脂が熱硬化性樹脂及び無機フィラーを含む混合物からなり、無機フィラーの配合比率が１０重量％〜７０重量％、無機フィラーの粒径が前記ソルダーレジストを含む配線基板と前記電子部品の間隔より小さい粒径とした請求項２記載の電子部品内蔵モジュールとしたものであり、電子部品と配線基板との間に第２の絶縁樹脂を確実に充填できるという作用を有する。
【００２３】
請求項９に記載の発明は、第１の絶縁樹脂の曲げ弾性率が２０ＧＰａ以下とした請求項１または２記載の電子部品内蔵モジュールとしたものであり、柔軟性のある樹脂を用いることではんだの再溶融時の体積膨張を吸収緩和して電子部品の電極外へのはんだの流出を防止することが可能であるという作用を有する。
【００２４】
請求項１０に記載の発明は、第２の絶縁樹脂の曲げ弾性率が２０ＧＰａ以下とした請求項２記載の電子部品内蔵モジュールとしたものであり、柔軟性のある樹脂を用いることではんだの再溶融時の体積膨張を吸収緩和して電子部品の電極外へのはんだの流出を防止することが可能であるという作用を有する。
【００２５】
請求項１１に記載の発明は、第３の絶縁樹脂の熱膨張係数が第１の絶縁樹脂の熱膨張係数より大きくした請求項４記載の電子部品内蔵モジュールであり、電子部品の接続信頼性を確保するという作用を有する。
【００２６】
【発明の実施の形態】
以下、本発明の実施の形態について説明する。
【００２７】
（実施の形態１）
図１は本発明の実施の形態１による電子部品内蔵モジュールの断面図、図２は本発明の実施の形態１による配線基板の上面図、図３は本発明の実施の形態１による複数個の電子部品を内蔵する場合の配線基板の上面図を示す。
【００２８】
図１において、配線基板２は表面の電極３や配線パターン１１、内部の配線パターン１２やインナービア１０、裏面に裏面電極１３、ソルダーレジスト６が形成された多層配線基板である。
【００２９】
配線基板２の表面の電極３の周囲にソルダーレジスト６の囲いを形成している。ソルダーレジスト６は電極３の周囲にのみ形成され、２つの電極３の周囲に形成しているソルダーレジスト６はそれぞれ独立しており、電子部品４の下部で連結していない。ただし、複数の電子部品４の電極３の間ではソルダーレジスト６が連結している。このように必ず電子部品４と配線基板２の間に十分な間隔を形成することが重要である。そして、この十分な間隔を確保することにより第１の絶縁樹脂７が容易に電子部品４と配線基板２の間に充填されるのである。
【００３０】
更に、第１の絶縁樹脂７と配線基板２の基材部分とが直接密着することで密着力の弱いソルダーレジスト６の表面と密着する第１の絶縁樹脂７の面積を小さくでき、第１の絶縁樹脂７と配線基板２との密着をより強固にすることが可能となる。
【００３１】
配線パターン１１、１２はたとえば、Ｃｕ箔や導電性樹脂組成物などからなる電気導電性を有する物質で構成している。本発明において配線パターン１１、１２はＣｕ箔を用いている。
【００３２】
インナービア１０は、たとえば、熱硬化性の導電性物質からなる。熱硬化性の導電性物質としては、たとえば、金属粒子と熱硬化性樹脂とを混合した導電性樹脂組成物を用いることができる。金属粒子としては、Ａｕ、ＡｇまたはＣｕなどを用いることができる。Ａｕ、ＡｇまたはＣｕは導電性が高いために好ましく、Ｃｕは導電性が高くマイグレーションも少なく、また、低コストであるため特に好ましい。熱硬化性樹脂としては、たとえば、エポキシ樹脂、フェノール樹脂またはシアネート樹脂を用いることができる。エポキシ樹脂は耐熱性が高いために特に好ましい。
【００３３】
この配線基板２上の所定の位置にはんだ５を用いて電子部品４を実装している。
【００３４】
電子部品４は、面実装タイプの受動部品からなる。受動部品としては、抵抗、コンデンサまたはインダクタなどのチップ状部品や振動子、フィルタ等が用いられる。
【００３５】
はんだ５にはＰｂ−Ｓｎ系の共晶はんだやＰｂフリーはんだ（例えばＳｎ−Ａｇ−Ｃｕ系、Ａｕ−Ｓｎ系またはＳｎ−Ｚｎ系）を用いることができる。また、電子部品４を実装するためのはんだ５と電子部品内蔵モジュール１をマザー基板（図示せず）へ実装するためのはんだ１４は同一材料であってもかまわないし、異なる材料を用いてもかまわない。しかしながら、近年の環境問題への配慮を考えるとＰｂフリーはんだを用いる方が望ましい。
【００３６】
次に、第１の絶縁樹脂７は電子部品４を完全に覆うように形成している。第１の絶縁樹脂７は、無機フィラーと熱硬化性樹脂とを含む混合物からなる。無機フィラーには、たとえば、Ａｌ2Ｏ3、ＭｇＯ、ＢＮ、ＡｌＮ、ＳｉＯ2およびＢａＴｉＯ3などを用いることができる。無機フィラーの配合比率は、５０重量％〜９５重量％の範囲内であることが重要である。この範囲内において第１の絶縁樹脂７を電子部品４の高さ以上に肉厚（本発明では１ｍｍ）に形成することができるのであるが、この範囲以下になると第１の絶縁樹脂７の流動性が大きくなり電子部品４の高さ以上に肉厚を形成することができない。
【００３７】
また、９５重量％以上の無機フィラーを含有した第１の絶縁樹脂７を用いた場合は流動性が悪く図１に示すように電子部品４を覆うことができない。また、無機フィラーの粒径はソルダーレジスト６を除く配線基板２と電子部品４の間隔より小さい粒径とすることが重要である。粒径を小さくすることで電子部品４と配線基板２の間に容易に第１の絶縁樹脂を充填することが可能となる。また、第１の絶縁樹脂に含有する熱硬化性樹脂は、エポキシ樹脂、フェノール樹脂、またはシアネート樹脂が好ましい。エポキシ樹脂は、耐熱性が高いために特に好ましい。
【００３８】
次に、第１の絶縁樹脂７の表層にめっきによる金属膜１５を形成し、電磁界シールド層として作用させている。めっきによる金属膜１５は、Ａｕ、Ａｇ、Ｃｕ、Ｎｉ、Ｃｒ、Ｚｎ、Ｔｉ、Ａｌ等の材料を少なくとも１種類以上用いて形成している。
【００３９】
また、図２、図３において、配線基板２上の電極３の周囲に形成したソルダーレジスト６の構造を示している。
【００４０】
図１〜３に示すように、本発明の電子部品内蔵モジュール１においては、電極３の周囲にのみソルダーレジスト６を形成している。
【００４１】
このソルダーレジスト６は、電子部品４を配線基板２上にはんだ５で実装する際に、はんだ流出によるショート不良を防止する効果を有するとともに、電極３の周囲にのみ存在しているため、電子部品４と配線基板２との空間を広くすることが可能となる。
【００４２】
すなわちソルダーレジスト６の厚みと電子部品４がはんだ５で実装されたときに生じる電子部品４の浮き量により約５０μｍの空間ができる。そして、第１の絶縁樹脂７に含有される無機フィラーの粒径を、電子部品４と配線基板２の間隔より小さく（本実施の形態の場合、５０μｍ以下）することで、容易に電子部品４と配線基板２との間に第１の絶縁樹脂７を充填することが可能とともに、１０μｍ以下の粒径に限定した無機フィラーを用いる必要がないため、第１の絶縁樹脂７を電子部品４の高さ以上の肉厚（例えば１ｍｍ）にすることが可能となる。
【００４３】
また、５０μｍ程度まで大きな粒径の無機フィラーを使用できるのでコスト増になることは無い。
【００４４】
更に第１の絶縁樹脂７と配線基板２の基材部分とが直接密着するため、密着力の弱いソルダーレジスト６の表面と密着する第１の絶縁樹脂７の面積を小さくでき、第１の絶縁樹脂７と配線基板２との密着をより強固にすることが可能である。
【００４５】
以上の構造により、従来、はんだ再溶融時のはんだ流出によるショート不良という問題点を有していた電子部品内蔵モジュールに対して、第１の絶縁樹脂７を充填することが困難であった電子部品４と配線基板２の隙間に、容易に第１の絶縁樹脂７を充填することが可能となり、そのため電子部品内蔵モジュール１をマザー基板（図示せず）へ実装する際に起こるはんだ５の再溶融に際しても、電極３間に第１の絶縁樹脂７が充填されているため、はんだ５の流出防止壁となり電極３間でのショートを防止することができる。
【００４６】
また、この時、第１の絶縁樹脂７の曲げ弾性率は２０ＧＰａ以下とすることが重要である。第１の絶縁樹脂７に２０ＧＰａ以上の曲げ弾性率を持つ材料を用いた場合、はんだ５の再溶融時の体積膨張により第１の絶縁樹脂７に応力が働くが曲げ弾性率が高いため、はんだ５の体積膨張を押さえつけようとする応力も働く。この応力は釣り合いをとることができず、結果的に第１の絶縁樹脂７にクラックが発生し、このクラック部へ溶融したはんだ５が流出して特性劣化を招くことになる。しかしながら、曲げ弾性率を２０ＧＰａ以下とすることで、はんだ５の溶融時の体積膨張に対して、第１の絶縁樹脂７が変形して追従することができる。そのため第１の絶縁樹脂７にクラックを発生することがなく、溶融したはんだ５の流出を防止することができる。その結果、はんだショートを起こすことがなく、電子部品内蔵モジュール１の特性を劣化させることがない。
【００４７】
以上に示すように、本発明の実施の形態１においては、配線基板２上の電子部品４を実装する電極３の周囲にのみソルダーレジスト６を形成し、電子部品４と配線基板２との空間を広げ、電子部品４と配線基板２の間隔以下の粒径を有する無機フィラーを含有した第１の絶縁樹脂７を用いることで、容易に電子部品４と配線基板２との間へ第１の絶縁樹脂７を充填することが可能となる。この第１の絶縁樹脂７を確実に電子部品４と配線基板２との間に存在させることで、電子部品内蔵モジュール１をマザー基板へ実装する際に再溶融したはんだ５が所定の電極外へ流出することを防止することができる。また、第１の絶縁樹脂７には２０ＧＰａ以下の曲げ弾性率を有する材料を用いることで再溶融したはんだの体積膨張に追従することができ、第１の絶縁樹脂７にクラックを発生させることなくはんだの流出を防止することが可能となる。
【００４８】
（実施の形態２）
図４は本発明の実施の形態２による電子部品内蔵モジュールの断面図を示し、実施の形態１と同一の構造については、同一番号を付与して説明を省略する。
【００４９】
図４に示すように、実施の形態１と同様に電極３の周囲にのみソルダーレジスト６を形成し、電子部品４と配線基板２との間を大きくする。そして、この電子部品４と配線基板２との間に第２の絶縁樹脂８を充填し、電子部品４、第２の絶縁樹脂８及び配線基板２を覆うように第１の絶縁樹脂７を形成する。その後、第１の絶縁樹脂７の表層にはめっきによる金属膜１５を形成し、電磁界シールド層として作用させている。
【００５０】
第２の絶縁樹脂８は、無機フィラーと熱硬化性樹脂とを含む混合物からなる。無機フィラーには、たとえば、Ａｌ2Ｏ3、ＭｇＯ、ＢＮ、ＡｌＮ、ＳｉＯ2およびＢａＴｉＯ3などを用いることができる。無機フィラーの配合比率は、１０重量％〜７０重量％の範囲内であることが重要である。第２の絶縁樹脂８は、電子部品４と配線基板２との間に充填することが目的であるため、できるだけ流動性の良いものでなければならない。また、第１の絶縁樹脂７のように肉厚にする必要もない。それ故、第１の絶縁樹脂７より無機フィラーの配合比率が低く設定されている。
【００５１】
しかしながら、第２の絶縁樹脂８は、電子部品４と配線基板２との間に存在して、はんだ再溶融時のはんだ流出防止壁としての役割を果たさなければならない。そのため、第２の絶縁樹脂８内に無機フィラーが全く含有されていない状態では、その流動性は非常に高いのではあるが、容易にはんだ流出が起こり防止壁としての効果を得ることができない。そのため必ず無機フィラーの含有は必要であり、流動性及びはんだ流出防止壁としての両方の効果を満足するために、無機フィラーの含有量が１０重量％〜７０重量％に設定されている。その結果、電子部品４と配線基板２との間に、容易に第２の絶縁樹脂８を充填することが可能となる。
【００５２】
また、実施の形態１と同様に第２の絶縁樹脂８と配線基板２の基材部分が直接密着するため、強固な密着力を得ることが可能である。
【００５３】
更に、第１の絶縁樹脂７と同様に第２の絶縁樹脂８も曲げ弾性率が２０ＧＰａ以下であることが重要である。実施の形態１と同様に、第２の絶縁樹脂８に２０ＧＰａ以上の曲げ弾性率を持つ材料を用いた場合、はんだ５の再溶融時の体積膨張により第２の絶縁樹脂８に応力が働くが、曲げ弾性率が高いため、はんだ５の体積膨張を押さえつけようとする応力も働く。この応力は釣り合いをとることができず、結果的に第２の絶縁樹脂８にクラックが発生し、このクラック部へ溶融したはんだ５が流出して特性劣化を招くことになる。
【００５４】
しかしながら、曲げ弾性率を２０ＧＰａ以下とすることで、はんだ５の溶融時の体積膨張に対して、第２の絶縁樹脂８が変形して追従することができる。そのため第２の絶縁樹脂８にクラックを発生することがなく、溶融したはんだ５の流出を防止することができるため、はんだショートを起こすことがなく、電子部品内蔵モジュール１の特性を劣化させることがない。
【００５５】
以上に示すように、本発明の実施の形態２においては、電子部品４と配線基板２との間に充填する樹脂材料と、電子部品４全体を覆う樹脂材料とを分けることで、電子部品４と配線基板２との間への充填性をより確実に行うことができ、若干流動性を低くしている第１の絶縁樹脂７を電子部品４を覆うための封止材料としてのみ作用させることができる。そのため、より信頼性の高い電子部品内蔵モジュールとすることができる。
【００５６】
（実施の形態３）
図５は本発明の実施の形態３による電子部品内蔵モジュールの断面図、図６は本発明の実施の形態３による配線基板の上面図、図７は本発明の実施の形態３による他の電子部品内蔵モジュールの断面図、図８は本発明の実施の形態３による他の配線基板の上面図を示し、実施の形態１と同一の構造については、同一番号を付与して説明を省略する。
【００５７】
図５、図６に示すように、実施の形態１と同様に、配線基板２の表面の電極３の周囲にのみソルダーレジスト６を形成し、はんだ５により電子部品４が実装されており、更に、はんだ２５により電子部品２４が実装されている電子部品内蔵モジュール１である。
【００５８】
電子部品２４は、面実装型の能動部品からなる。能動部品としては、たとえば、トランジスタ、ＩＣ、ＬＳＩなどの半導体素子が用いられる。この電子部品２４と配線基板２との間に、実施の形態１と同様に第１の絶縁樹脂７を充填するとともに、電子部品４、２４の高さ以上に肉厚に第１の絶縁樹脂７を形成している。電子部品２４と配線基板２との間隔は、受動部品である電子部品４と配線基板２との間隔に比べて、元々広く形成されている。電子部品２４の電極２３は電子部品２４の面内に存在し、電子部品４のようにはんだ５のフィレットが形成されない。そのため、はんだ２５があたかも柱のように存在して電子部品２４と配線基板２との間隔を広くしている。従って、電子部品２４が実装される位置の配線基板２の表面は、電極３以外の部分をソルダーレジスト６で覆っていても良い。また、図７、図８に示すように電子部品２４が実装される位置においても、電極３の周囲にのみソルダーレジスト６を形成する構造としても良い。
【００５９】
以上の構成により、能動部品及び受動部品を備えた電子部品内蔵モジュール１とすることができ、１つのシステムを兼ね備えた装置とすることが可能となる。
【００６０】
（実施の形態４）
図９は本発明の実施の形態４による電子部品内蔵モジュールの断面図、図１０は本発明の実施の形態４による配線基板の上面図、図１１は本発明の実施の形態４による電子部品内蔵モジュールの断面図、図１２は本発明の実施の形態４による配線基板の上面図を示し、実施の形態１〜３と同一の構造については、同一番号を付与して説明を省略する。
【００６１】
本実施の形態４は、実施の形態３の特性安定化を目的とするものである。能動部品である電子部品２４の実装に対しては、受動部品である電子部品４に比べて注意を払う必要がある。それは、電子部品２４の面積が電子部品４に対して非常に大きいものであり、この大面積が影響して特に熱膨張係数差による接続不良が起こりやすい。そこで、図９に示すように、熱膨張係数差緩和のために電子部品２４と配線基板２との間に電子部品２４や配線基板２より熱膨張係数を大きくした第３の絶縁樹脂９を充填している。
【００６２】
しかしながら、電子部品４ははんだフィレットを有しているため、熱膨張係数の大きい第３の絶縁樹脂９を電子部品４と配線基板２との間に充填した場合、電子部品内蔵モジュール１をマザー基板に実装するリフロー工程時にはんだの融点以上の温度に達すると、第３の絶縁樹脂９の大きな熱膨張係数によりはんだ５が配線基板２上の電極３と引き剥がされる。
【００６３】
次に、はんだ５は融点以下の温度に冷却され体積収縮するが第３の絶縁樹脂９の体積膨張は大きいままであるために、はんだ５は電極３と引き剥がされたまま固体化する。すなわち、リフロー工程を経ることではんだ５と電極３間で断線が起こることになる。従って、第３の絶縁樹脂９を電子部品４と配線基板２との間に充填してはならない。
【００６４】
そこで、図９、図１０に示すように熱膨張係数が第３の絶縁樹脂９より小さい第１の絶縁樹脂７を用いて電子部品４を覆っている。さらに第３の絶縁樹脂９の塗布範囲を制御するために、電子部品２４と電子部品４との間に第３の絶縁樹脂９の流出を防止するソルダーレジスト２６の壁を形成し、ソルダーレジスト６の段差部分で第３の絶縁樹脂９の流出を防止している。
【００６５】
また、実施の形態４においても実施の形態３と同様に、電子部品２４が実装される位置の配線基板２の表面は、電極３以外の部分をソルダーレジスト６で覆っていても良い。また、図１１、図１２に示すように電子部品２４が実装される位置においても、電極３の周囲にのみソルダーレジスト６を形成する構造としても良い。
【００６６】
以上の構造により、能動部品及び受動部品を備えた電子部品内蔵モジュール１とすることができ、１つのシステムを兼ね備えた装置とすることが可能となる。
【００６７】
【発明の効果】
以上のように本発明によれば、配線基板の表層にある電極の周囲にのみソルダーレジストを形成して電子部品と配線基板間に一定の空間を形成し、第１の絶縁樹脂に含有される無機フィラーの含有率を５０重量％〜９５重量％、粒径をソルダーレジストを除く配線基板と電子部品との間隔より小さくすることで、電子部品の真下に確実に絶縁樹脂を充填しながら、電子部品を覆いかぶるように絶縁樹脂を肉厚に形成することができる。この絶縁樹脂を確実に電子部品と配線基板間へ存在させることで、電子部品内蔵モジュールをマザー基板へ実装する際に再溶融したはんだが、所定の電極外へ流出することを防止することができる。また、絶縁樹脂には２０ＧＰａ以下の曲げ弾性率を有する材料を用いることが重要であり、こうすることで、再溶融したはんだの体積膨張に追従することができ、絶縁樹脂にクラックを発生させることなく、はんだの流出を防止することが可能となる。
【００６８】
また、含有率が１０重量％〜７０重量％、粒径がソルダーレジストを含む配線基板と電子部品との間隔より小さい無機フィラーを含有する第２の絶縁樹脂を用いることで、電子部品と配線基板との間に、より確実に絶縁樹脂を充填することが可能となり、高信頼性を得ることができる。
【００６９】
また、能動部品と受動部品を配置した電子部品内蔵モジュールを形成することが可能となり、接続信頼性も安定化させることができるものである。
【図面の簡単な説明】
【図１】本発明の実施の形態１による電子部品内蔵モジュールの断面図
【図２】本発明の実施の形態１による配線基板の要部の上面図
【図３】本発明の実施の形態１による配線基板の要部の上面図
【図４】本発明の実施の形態２による電子部品内蔵モジュールの断面図
【図５】本発明の実施の形態３による電子部品内蔵モジュールの断面図
【図６】本発明の実施の形態３による配線基板の上面図
【図７】本発明の実施の形態３による電子部品内蔵モジュールの断面図
【図８】本発明の実施の形態３による配線基板の上面図
【図９】本発明の実施の形態４による電子部品内蔵モジュールの断面図
【図１０】本発明の実施の形態４による配線基板の上面図
【図１１】本発明の実施の形態４による電子部品内蔵モジュールの断面図
【図１２】本発明の実施の形態４による配線基板の上面図
【図１３】従来の電子部品内蔵モジュールの断面図
【符号の説明】
１ 電子部品内蔵モジュール
２ 配線基板
３ 電極
４ 電子部品
５ はんだ
６ ソルダーレジスト
７ 第１の絶縁樹脂
８ 第２の絶縁樹脂
９ 第３の絶縁樹脂
１０ インナービア
１１ 配線パターン
１２ 配線パターン
１３ 裏面電極
１４ はんだ
１５ 金属膜
２３ 電極
２４ 電子部品
２５ はんだ
２６ ソルダーレジスト[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a module with a built-in electronic component, and more particularly to a module with a built-in electronic component in which an electronic component is disposed on an upper portion of a wiring board and is covered with an insulating resin.
[0002]
[Prior art]
In recent years, small electronic devices using an electronic component built-in module in which a plurality of electronic components are mounted on a substrate and the electronic components are resin-molded have rapidly become widespread. FIG. 13 shows a conventional resin-molded electronic component built-in module 101.
[0003]
As shown in the cross-sectional view of FIG. 13, a wiring pattern 111 and an electrode 103 are formed on the surface of a wiring substrate 102, and the surface is covered with a solder resist 106.
[0004]
An inner via 110 is formed in an inner layer of the wiring board 102, and the wiring pattern 112 and a back electrode 113 formed on the back surface of the wiring board 102 are electrically connected by the inner via 110. This back electrode 113 is provided with solder 114 for connecting to a mother substrate (not shown).
[0005]
After connecting the electronic component 104 and the electrode 103 with the solder 105, the surface of the wiring board 102 is covered with an insulating resin 107 so as to surround the electronic component 104, and the metal plating electromagnetic shielding layer 115 is provided on the surface. This is a component built-in module.
[0006]
As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
[0007]
[Patent Document 1]
JP 2001-24312 A
[0008]
[Problems to be solved by the invention]
However, in a conventional resin-molded electronic component built-in module, solder or wire bond is used as a material for mounting an electronic component on a wiring board.
[0009]
The wire bonding method requires an area larger than the area of the electronic component in order to join with a wire, and is not suitable for miniaturization of an electronic device. On the other hand, in the case of jointing, it is necessary to partially fillet the end of the electrode, but it is possible to mount the electronic component with almost the same area as the electronic component, which is advantageous for miniaturization of electronic equipment. is there. However, when electronic components are mounted with solder, portions other than the electrodes on the surface of the wiring board are covered with a solder resist in order to prevent solder shorts.
[0010]
Also, the amount of solder used is very small in order to prevent solder shorts between the electrodes during mounting. Therefore, when the gap between the electronic component after mounting and the wiring board covered with the solder resist is only about 10 μm and the electronic component is molded with the insulating resin, the gap between the electronic component and the wiring board is sufficiently filled with the insulating resin. Space is created without entering.
[0011]
When the electronic component built-in module with a space in the gap between the electronic component and the wiring board is soldered to the mother board, when the solder is re-melted in the electronic component built-in module, the molten solder And flows out into the gap between the wiring boards. As a result, short-circuit failure occurs between the electrodes, impairing the function of the electronic component built-in module.
[0012]
In addition, as a method for filling the gap between the electronic component and the wiring board with an insulating resin, use of a vacuum printing method has been proposed. However, usually the insulating resin is SiO Two These inorganic fillers are compounded, and the particle size of these inorganic fillers is several tens of μm.Even if the vacuum printing method is used, the distance between the wiring board covered with the solder resist and the electronic component is still small. Since it is only about 10 μm, it is impossible to physically fill the gap between the electronic component and the wiring board with the insulating resin.
[0013]
Although it is possible to fill the gap between the electronic component and the wiring board by using an underfill having a filler diameter of 10 μm or less, these underfills use finely classified inorganic fillers, which is very expensive. This leads to an increase in cost.
[0014]
An object of the present invention is to solve the above-mentioned conventional problems and to provide an electronic component built-in module excellent in connection reliability and mass productivity.
[0015]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the invention according to claim 1 of the present invention provides at least one or more electronic components, a wiring board having at least one or more wiring layers, and the electronic component is formed on an electrode of the wiring board. In the electronic component built-in module, which is connected with solder, covered with a first insulating resin, and provided with an electromagnetic field shield layer of a metal film on the surface of the first insulating resin, the electronic component is soldered on the wiring board. It is a module with built-in electronic components that has a solder resist enclosure formed only around the electrodes to be connected.When mounting electronic components on a wiring board, it prevents solder from flowing out of the electrodes and It is possible to make a gap between the substrate and the wiring board as large as the thickness of the solder resist, and the gap can be filled with the first insulating resin satisfactorily. Further, since most of the first insulating resin can adhere to the resin portion of the wiring board other than the solder resist, the adhesive strength between the wiring board and the first insulating resin can be increased. As described above, even when the solder is re-melted when the electronic component built-in module is mounted on the motherboard, the first insulating resin serves as a protective wall, and the solder can be prevented from flowing out of the electrode. .
[0016]
According to a second aspect of the present invention, there is provided the electronic component built-in module according to the first aspect, wherein the surrounding portions of the solder resist are independent of each other between electrodes of one electronic component. Since the large gap can be reliably formed, the first insulating resin or the second insulating resin can be easily filled between the electronic component and the wiring board. Therefore, even when the solder is re-melted when the electronic component built-in module is mounted on the mother board, the first insulating resin or the second insulating resin serves as a protective wall, and reliably prevents the solder from flowing out of the electrode. It has the effect of being able to.
[0017]
According to a third aspect of the present invention, there is provided the electronic component built-in module according to the first aspect, wherein a second insulating resin exists between the electronic component and the wiring board, and a gap between the electronic component and the wiring board is provided. Since the second insulating resin can be formed only for the purpose of filling the resin, the resin can be more preferably filled between the electronic component and the wiring board. Therefore, even when the solder is re-melted when the electronic component built-in module is mounted on the motherboard, the second insulating resin serves as a protective wall, and the solder can be reliably prevented from flowing out of the electrode. Have.
[0018]
According to a fourth aspect of the present invention, there is provided a wiring board having a plurality of electronic components and at least one or more wiring layers, and the electronic components are connected to electrodes of the wiring board by soldering, and these are connected with a first insulating resin. The third insulating resin is formed between the electronic component comprising an active component and the wiring board in the electronic component built-in module having an electromagnetic field shield layer formed by metal plating on a surface layer of the first insulating resin. 2. The electronic component built-in module according to item 2, wherein the module has a function of reducing the coefficient of thermal expansion between the electronic component including the active component and the wiring board to ensure the reliability of the electrical connection.
[0019]
According to a fifth aspect of the present invention, there is provided the electronic component built-in module according to the fourth aspect, wherein a wall of a solder resist is formed between an electronic component comprising an active component and another electronic component. Accordingly, it is possible to control application to an electronic component that does not require the second insulating resin.
[0020]
According to a sixth aspect of the present invention, there is provided the electronic component built-in module according to the fourth aspect, wherein portions other than the electrodes on the surface of the wiring board on which the part of the electronic components are mounted are covered with a solder resist. Also, even in a structure in which a wiring pattern other than the electrode is formed on the surface layer of the wiring board, the short circuit between the electrode and the wiring pattern can be prevented.
[0021]
The invention according to claim 7, wherein the first insulating resin comprises a mixture containing a thermosetting resin and an inorganic filler, the compounding ratio of the inorganic filler is 50% by weight to 95% by weight, and the particle size of the inorganic filler is the solder. 2. The electronic component built-in module according to claim 1, wherein the particle size is smaller than the distance between the wiring board and the electronic component excluding the resist, and the first insulating resin is reliably filled between the electronic component and the wiring substrate. In addition to this, it has an effect that the thickness of the first insulating resin can be easily formed to be thicker than the height of the built-in electronic component.
[0022]
The invention according to claim 8, wherein the second insulating resin is composed of a mixture containing a thermosetting resin and an inorganic filler, the compounding ratio of the inorganic filler is 10% by weight to 70% by weight, and the particle size of the inorganic filler is the solder. 3. The electronic component built-in module according to claim 2, wherein the particle size is smaller than the distance between the wiring board including the resist and the electronic component, and the second insulating resin is reliably filled between the electronic component and the wiring board. Has the effect of being able to.
[0023]
According to a ninth aspect of the present invention, there is provided the electronic component built-in module according to the first or second aspect, wherein the flexural modulus of the first insulating resin is 20 GPa or less. Has the effect of absorbing and mitigating the volume expansion during remelting to prevent solder from flowing out of the electrodes of the electronic component.
[0024]
According to a tenth aspect of the present invention, there is provided the electronic component built-in module according to the second aspect, wherein a bending elastic modulus of the second insulating resin is set to 20 GPa or less. It has the effect of absorbing and mitigating volume expansion during melting to prevent solder from flowing out of the electrodes of the electronic component.
[0025]
An eleventh aspect of the present invention is the electronic component built-in module according to the fourth aspect, wherein a thermal expansion coefficient of the third insulating resin is larger than a thermal expansion coefficient of the first insulating resin. It has the effect of securing.
[0026]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described.
[0027]
(Embodiment 1)
FIG. 1 is a cross-sectional view of an electronic component built-in module according to Embodiment 1 of the present invention, FIG. 2 is a top view of a wiring board according to Embodiment 1 of the present invention, and FIG. FIG. 3 shows a top view of a wiring board in which electronic components are incorporated.
[0028]
In FIG. 1, a wiring board 2 is a multilayer wiring board in which electrodes 3 and wiring patterns 11 on the surface, wiring patterns 12 and inner vias 10 on the inside, a back electrode 13 and a solder resist 6 on the back surface are formed.
[0029]
An enclosure of the solder resist 6 is formed around the electrode 3 on the surface of the wiring board 2. The solder resist 6 is formed only around the electrode 3, and the solder resists 6 formed around the two electrodes 3 are independent of each other and are not connected below the electronic component 4. However, the solder resist 6 is connected between the electrodes 3 of the plurality of electronic components 4. It is important to always form a sufficient space between the electronic component 4 and the wiring board 2 as described above. Then, by securing this sufficient space, the first insulating resin 7 is easily filled between the electronic component 4 and the wiring board 2.
[0030]
Further, since the first insulating resin 7 and the substrate portion of the wiring board 2 are directly in close contact with each other, the area of the first insulating resin 7 which is in close contact with the surface of the solder resist 6 having a weak adhesive force can be reduced. The adhesion between the insulating resin 7 and the wiring board 2 can be further strengthened.
[0031]
The wiring patterns 11 and 12 are made of, for example, a material having electrical conductivity such as a Cu foil or a conductive resin composition. In the present invention, the wiring patterns 11 and 12 use Cu foil.
[0032]
The inner via 10 is made of, for example, a thermosetting conductive material. As the thermosetting conductive material, for example, a conductive resin composition obtained by mixing metal particles and a thermosetting resin can be used. Au, Ag, Cu, or the like can be used as the metal particles. Au, Ag or Cu is preferable because of high conductivity, and Cu is particularly preferable because of high conductivity and low migration and low cost. As the thermosetting resin, for example, an epoxy resin, a phenol resin, or a cyanate resin can be used. Epoxy resins are particularly preferred because of their high heat resistance.
[0033]
The electronic component 4 is mounted at a predetermined position on the wiring board 2 using the solder 5.
[0034]
The electronic component 4 is made of a surface-mounted passive component. As the passive component, a chip component such as a resistor, a capacitor or an inductor, a vibrator, a filter, or the like is used.
[0035]
As the solder 5, a Pb-Sn-based eutectic solder or a Pb-free solder (for example, Sn-Ag-Cu-based, Au-Sn-based or Sn-Zn-based) can be used. The solder 5 for mounting the electronic component 4 and the solder 14 for mounting the electronic component built-in module 1 on a motherboard (not shown) may be the same material or different materials. Absent. However, in consideration of recent environmental issues, it is desirable to use Pb-free solder.
[0036]
Next, the first insulating resin 7 is formed so as to completely cover the electronic component 4. The first insulating resin 7 is made of a mixture containing an inorganic filler and a thermosetting resin. As the inorganic filler, for example, Al Two O Three , MgO, BN, AlN, SiO Two And BaTiO Three Etc. can be used. It is important that the compounding ratio of the inorganic filler is in the range of 50% by weight to 95% by weight. Within this range, the first insulating resin 7 can be formed to be thicker than the height of the electronic component 4 (1 mm in the present invention). Therefore, the thickness of the electronic component 4 cannot be increased beyond the height of the electronic component 4.
[0037]
When the first insulating resin 7 containing 95% by weight or more of the inorganic filler is used, the flowability is poor and the electronic component 4 cannot be covered as shown in FIG. It is important that the particle size of the inorganic filler be smaller than the distance between the wiring board 2 and the electronic component 4 excluding the solder resist 6. By reducing the particle size, the space between the electronic component 4 and the wiring board 2 can be easily filled with the first insulating resin. Further, the thermosetting resin contained in the first insulating resin is preferably an epoxy resin, a phenol resin, or a cyanate resin. Epoxy resins are particularly preferred because of their high heat resistance.
[0038]
Next, a metal film 15 is formed on the surface layer of the first insulating resin 7 by plating and serves as an electromagnetic field shield layer. The metal film 15 by plating is formed using at least one kind of material such as Au, Ag, Cu, Ni, Cr, Zn, Ti, and Al.
[0039]
2 and 3, the structure of the solder resist 6 formed around the electrode 3 on the wiring board 2 is shown.
[0040]
As shown in FIGS. 1 to 3, in the electronic component built-in module 1 of the present invention, the solder resist 6 is formed only around the electrodes 3.
[0041]
When the electronic component 4 is mounted on the wiring board 2 with the solder 5, the solder resist 6 has an effect of preventing short-circuit failure due to solder outflow, and exists only around the electrode 3. 4 and the wiring board 2 can be widened.
[0042]
That is, a space of about 50 μm is formed by the thickness of the solder resist 6 and the floating amount of the electronic component 4 generated when the electronic component 4 is mounted with the solder 5. By making the particle size of the inorganic filler contained in the first insulating resin 7 smaller than the distance between the electronic component 4 and the wiring board 2 (50 μm or less in the present embodiment), the electronic component 4 can be easily formed. And the wiring board 2 can be filled with the first insulating resin 7 and there is no need to use an inorganic filler limited to a particle size of 10 μm or less. It is possible to make the thickness greater than the height (for example, 1 mm).
[0043]
Further, since an inorganic filler having a large particle size up to about 50 μm can be used, there is no increase in cost.
[0044]
Further, since the first insulating resin 7 and the base portion of the wiring board 2 are directly in close contact with each other, the area of the first insulating resin 7 which is in close contact with the surface of the solder resist 6 having low adhesion can be reduced, and the first insulating resin It is possible to further strengthen the adhesion between the resin 7 and the wiring board 2.
[0045]
With the above structure, it has been difficult to fill the first insulating resin 7 into the electronic component built-in module, which has conventionally had a problem of short-circuit failure due to solder outflow during remelting of the solder. The gap between the wiring board 2 and the wiring board 2 can be easily filled with the first insulating resin 7, so that the solder 5 remelted when the electronic component built-in module 1 is mounted on a mother board (not shown). In this case, since the first insulating resin 7 is filled between the electrodes 3, the first insulating resin 7 serves as a wall for preventing the outflow of the solder 5, and a short circuit between the electrodes 3 can be prevented.
[0046]
At this time, it is important that the flexural modulus of the first insulating resin 7 is 20 GPa or less. When a material having a bending elastic modulus of 20 GPa or more is used for the first insulating resin 7, stress acts on the first insulating resin 7 due to volume expansion at the time of remelting the solder 5, but the bending elastic modulus is high. 5 also acts to suppress the volume expansion. This stress cannot be balanced, and as a result, cracks occur in the first insulating resin 7, and the melted solder 5 flows out into the cracks to cause characteristic deterioration. However, by setting the flexural modulus to 20 GPa or less, the first insulating resin 7 can deform and follow the volume expansion of the solder 5 at the time of melting. Therefore, cracks do not occur in the first insulating resin 7 and the outflow of the molten solder 5 can be prevented. As a result, a solder short circuit does not occur, and the characteristics of the electronic component built-in module 1 do not deteriorate.
[0047]
As described above, in the first embodiment of the present invention, the solder resist 6 is formed only around the electrode 3 on which the electronic component 4 is mounted on the wiring board 2, and the space between the electronic component 4 and the wiring board 2 is formed. And the first insulating resin 7 containing an inorganic filler having a particle size equal to or smaller than the distance between the electronic component 4 and the wiring board 2 is used to easily insert the first insulating resin 7 between the electronic component 4 and the wiring board 2. The insulating resin 7 can be filled. By ensuring that the first insulating resin 7 is present between the electronic component 4 and the wiring board 2, the solder 5 re-melted when the electronic component built-in module 1 is mounted on the motherboard moves out of the predetermined electrode. Outflow can be prevented. Further, by using a material having a bending elastic modulus of 20 GPa or less for the first insulating resin 7, it is possible to follow the volume expansion of the re-melted solder, without causing cracks in the first insulating resin 7. It is possible to prevent the outflow of solder.
[0048]
(Embodiment 2)
FIG. 4 is a cross-sectional view of an electronic component built-in module according to a second embodiment of the present invention. The same structures as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.
[0049]
As shown in FIG. 4, the solder resist 6 is formed only around the electrode 3 as in the first embodiment, and the space between the electronic component 4 and the wiring board 2 is increased. Then, a second insulating resin 8 is filled between the electronic component 4 and the wiring board 2, and a first insulating resin 7 is formed so as to cover the electronic component 4, the second insulating resin 8 and the wiring board 2. I do. Thereafter, a metal film 15 is formed on the surface layer of the first insulating resin 7 by plating, and functions as an electromagnetic field shield layer.
[0050]
The second insulating resin 8 is made of a mixture containing an inorganic filler and a thermosetting resin. As the inorganic filler, for example, Al Two O Three , MgO, BN, AlN, SiO Two And BaTiO Three Etc. can be used. It is important that the mixing ratio of the inorganic filler is in the range of 10% by weight to 70% by weight. The purpose of the second insulating resin 8 is to fill the space between the electronic component 4 and the wiring board 2, and therefore, the second insulating resin 8 must be as fluid as possible. Further, it is not necessary to increase the wall thickness unlike the first insulating resin 7. Therefore, the mixing ratio of the inorganic filler is set lower than that of the first insulating resin 7.
[0051]
However, the second insulating resin 8 must be present between the electronic component 4 and the wiring board 2 and play a role as a solder outflow preventing wall when the solder is re-melted. Therefore, in a state where the inorganic filler is not contained in the second insulating resin 8 at all, although the fluidity thereof is very high, the outflow of the solder easily occurs and the effect as the preventing wall cannot be obtained. Therefore, the content of the inorganic filler is necessarily required, and the content of the inorganic filler is set to 10% by weight to 70% by weight in order to satisfy both the effects of the fluidity and the solder outflow preventing wall. As a result, the space between the electronic component 4 and the wiring board 2 can be easily filled with the second insulating resin 8.
[0052]
Further, as in the first embodiment, since the second insulating resin 8 and the base portion of the wiring board 2 directly adhere to each other, it is possible to obtain a strong adhesive force.
[0053]
Further, it is important that the bending elastic modulus of the second insulating resin 8 is not more than 20 GPa, like the first insulating resin 7. As in the first embodiment, when a material having a bending elastic modulus of 20 GPa or more is used for the second insulating resin 8, stress acts on the second insulating resin 8 due to volume expansion when the solder 5 is remelted. Since the flexural modulus is high, a stress acts to suppress the volume expansion of the solder 5. This stress cannot be balanced, and as a result, cracks are generated in the second insulating resin 8, and the melted solder 5 flows out to the cracks to cause deterioration of characteristics.
[0054]
However, by setting the flexural modulus to 20 GPa or less, the second insulating resin 8 can deform and follow the volume expansion of the solder 5 at the time of melting. Therefore, cracks do not occur in the second insulating resin 8 and the outflow of the molten solder 5 can be prevented, so that a short circuit of the solder does not occur and the characteristics of the electronic component built-in module 1 can be deteriorated. Absent.
[0055]
As described above, in the second embodiment of the present invention, the resin material filled between the electronic component 4 and the wiring board 2 is separated from the resin material covering the entire electronic component 4 so that the electronic component 4 The first insulating resin 7 having a slightly lower fluidity can be used only as a sealing material for covering the electronic component 4, because the filling property between the first insulating resin 7 and the wiring board 2 can be more reliably performed. Can be. Therefore, a more reliable electronic component built-in module can be obtained.
[0056]
(Embodiment 3)
5 is a cross-sectional view of an electronic component built-in module according to Embodiment 3 of the present invention, FIG. 6 is a top view of a wiring board according to Embodiment 3 of the present invention, and FIG. 7 is another electronic device according to Embodiment 3 of the present invention. FIG. 8 is a cross-sectional view of a component built-in module, and FIG. 8 is a top view of another wiring board according to Embodiment 3 of the present invention. The same structures as those in Embodiment 1 are given the same reference numerals and description thereof is omitted.
[0057]
As shown in FIGS. 5 and 6, as in the first embodiment, a solder resist 6 is formed only around the electrodes 3 on the surface of the wiring board 2, and the electronic components 4 are mounted with the solder 5. And the electronic component built-in module 1 on which the electronic component 24 is mounted by the solder 25.
[0058]
The electronic component 24 is made of a surface-mount type active component. As the active component, for example, a semiconductor element such as a transistor, an IC, and an LSI is used. The first insulating resin 7 is filled between the electronic component 24 and the wiring board 2 in the same manner as in the first embodiment, and the first insulating resin 7 is thicker than the height of the electronic components 4 and 24. Is formed. The distance between the electronic component 24 and the wiring board 2 is originally wider than the distance between the electronic component 4 that is a passive component and the wiring board 2. The electrode 23 of the electronic component 24 exists in the plane of the electronic component 24, and the fillet of the solder 5 is not formed unlike the electronic component 4. For this reason, the solder 25 exists as if it were a pillar, thereby increasing the distance between the electronic component 24 and the wiring board 2. Therefore, the surface of the wiring board 2 at the position where the electronic component 24 is mounted may be covered with the solder resist 6 except for the electrode 3. Also, as shown in FIGS. 7 and 8, a structure in which the solder resist 6 is formed only around the electrode 3 at the position where the electronic component 24 is mounted may be adopted.
[0059]
With the above configuration, the electronic component built-in module 1 including the active component and the passive component can be provided, and the device can be provided as a single system.
[0060]
(Embodiment 4)
9 is a cross-sectional view of an electronic component built-in module according to Embodiment 4 of the present invention, FIG. 10 is a top view of a wiring board according to Embodiment 4 of the present invention, and FIG. FIG. 12 is a cross-sectional view of a module, and FIG. 12 is a top view of a wiring board according to a fourth embodiment of the present invention.
[0061]
The fourth embodiment aims at stabilizing the characteristics of the third embodiment. It is necessary to pay more attention to the mounting of the electronic component 24 as the active component than to the electronic component 4 as the passive component. This is because the area of the electronic component 24 is very large with respect to the electronic component 4, and this large area affects the connection failure particularly due to the difference in thermal expansion coefficient. Therefore, as shown in FIG. 9, a third insulating resin 9 having a larger thermal expansion coefficient than that of the electronic component 24 or the wiring board 2 is filled between the electronic component 24 and the wiring board 2 to reduce the difference in thermal expansion coefficient. are doing.
[0062]
However, since the electronic component 4 has a solder fillet, when the third insulating resin 9 having a large coefficient of thermal expansion is filled between the electronic component 4 and the wiring board 2, the electronic component built-in module 1 is mounted on the mother board. When the temperature reaches a temperature equal to or higher than the melting point of the solder during the reflow step of mounting the solder, the solder 5 is peeled off from the electrode 3 on the wiring board 2 due to the large thermal expansion coefficient of the third insulating resin 9.
[0063]
Next, the solder 5 is cooled to a temperature equal to or lower than the melting point and contracts in volume, but since the volume expansion of the third insulating resin 9 remains large, the solder 5 solidifies while being peeled off from the electrode 3. That is, disconnection occurs between the solder 5 and the electrode 3 through the reflow process. Therefore, the third insulating resin 9 must not be filled between the electronic component 4 and the wiring board 2.
[0064]
Therefore, as shown in FIGS. 9 and 10, the electronic component 4 is covered with the first insulating resin 7 having a smaller coefficient of thermal expansion than the third insulating resin 9. Further, in order to control the application range of the third insulating resin 9, a wall of the solder resist 26 for preventing the outflow of the third insulating resin 9 is formed between the electronic component 24 and the electronic component 4, and the solder resist 6 is formed. Of the third insulating resin 9 is prevented from flowing out.
[0065]
Also, in the fourth embodiment, as in the third embodiment, the surface of the wiring board 2 at the position where the electronic component 24 is mounted may be covered with a solder resist 6 except for the electrodes 3. Also, as shown in FIGS. 11 and 12, a structure in which the solder resist 6 is formed only around the electrode 3 even at the position where the electronic component 24 is mounted may be adopted.
[0066]
With the above structure, the electronic component built-in module 1 including the active component and the passive component can be obtained, and the device having one system can be obtained.
[0067]
【The invention's effect】
As described above, according to the present invention, a solder resist is formed only around the electrodes on the surface layer of the wiring board to form a certain space between the electronic component and the wiring board, and is contained in the first insulating resin. By setting the content of the inorganic filler to 50% by weight to 95% by weight and the particle size to be smaller than the distance between the wiring board and the electronic component excluding the solder resist, it is possible to securely fill the insulating resin directly under the electronic component with the electronic resin. The insulating resin can be formed thick so as to cover the component. By ensuring that the insulating resin is present between the electronic component and the wiring board, it is possible to prevent the re-melted solder from flowing out of the predetermined electrode when the electronic component built-in module is mounted on the mother board. . In addition, it is important to use a material having a bending elastic modulus of 20 GPa or less for the insulating resin, and by doing so, it is possible to follow the volume expansion of the re-melted solder and to generate cracks in the insulating resin. Therefore, it is possible to prevent the outflow of solder.
[0068]
In addition, by using the second insulating resin containing inorganic filler having a content of 10% by weight to 70% by weight and a particle size smaller than the distance between the wiring board including the solder resist and the electronic component, the electronic component and the wiring board can be used. In this way, it is possible to more reliably fill the insulating resin, and high reliability can be obtained.
[0069]
In addition, an electronic component built-in module in which active components and passive components are arranged can be formed, and connection reliability can be stabilized.
[Brief description of the drawings]
FIG. 1 is a sectional view of an electronic component built-in module according to a first embodiment of the present invention.
FIG. 2 is a top view of a main part of the wiring board according to the first embodiment of the present invention;
FIG. 3 is a top view of a main part of the wiring board according to the first embodiment of the present invention;
FIG. 4 is a sectional view of an electronic component built-in module according to a second embodiment of the present invention.
FIG. 5 is a sectional view of an electronic component built-in module according to a third embodiment of the present invention.
FIG. 6 is a top view of a wiring board according to a third embodiment of the present invention.
FIG. 7 is a sectional view of an electronic component built-in module according to a third embodiment of the present invention.
FIG. 8 is a top view of the wiring board according to the third embodiment of the present invention;
FIG. 9 is a sectional view of an electronic component built-in module according to a fourth embodiment of the present invention.
FIG. 10 is a top view of a wiring board according to a fourth embodiment of the present invention.
FIG. 11 is a sectional view of an electronic component built-in module according to a fourth embodiment of the present invention.
FIG. 12 is a top view of a wiring board according to a fourth embodiment of the present invention.
FIG. 13 is a cross-sectional view of a conventional electronic component built-in module.
[Explanation of symbols]
1 Electronic component built-in module
2 Wiring board
3 electrodes
4 Electronic components
5 Solder
6 Solder resist
7 First insulating resin
8 Second insulating resin
9 Third insulating resin
10 Inner Via
11 Wiring pattern
12 Wiring pattern
13 Back electrode
14 Solder
15 Metal film
23 electrodes
24 Electronic components
25 Solder
26 Solder resist

Claims (11)

少なくとも１つ以上の電子部品と、少なくとも一層以上の配線層を有する配線基板と、前記電子部品をこの配線基板の電極にはんだで接続し、これらを第１の絶縁樹脂で覆い、この第１の絶縁樹脂の表層に金属膜による電磁界シールド層を設けた電子部品内蔵モジュールにおいて、前記配線基板に前記電子部品をはんだで接続する電極の周囲のみにソルダーレジストの囲いを形成した電子部品内蔵モジュール。At least one or more electronic components, a wiring board having at least one or more wiring layers, and the electronic components are connected to electrodes of the wiring board by solder, and these are covered with a first insulating resin. An electronic component built-in module in which an electromagnetic field shielding layer made of a metal film is provided on a surface layer of an insulating resin, wherein a solder resist enclosure is formed only around electrodes for connecting the electronic component to the wiring board by soldering. ソルダーレジストの囲い部分が１つの電子部品の電極間でそれぞれ独立する構成とした請求項１記載の電子部品内蔵モジュール。2. The electronic component built-in module according to claim 1, wherein the surrounding portions of the solder resist are independent of each other between electrodes of one electronic component. 少なくとも１つ以上の電子部品と配線基板の間に第２の絶縁樹脂を設けた請求項１記載の電子部品内蔵モジュール。The electronic component built-in module according to claim 1, wherein a second insulating resin is provided between at least one or more electronic components and the wiring board. 複数個の電子部品と少なくとも一層以上の配線層を有する配線基板と、前記電子部品をこの配線基板の電極にはんだで接続し、これらを第１の絶縁樹脂で覆い、この第１の絶縁樹脂の表層に金属めっきによる電磁界シールド層を設けた電子部品内蔵モジュールにおいて、能動部品からなる電子部品と前記配線基板の間に第３の絶縁樹脂を形成した請求項２記載の電子部品内蔵モジュール。A wiring board having a plurality of electronic components and at least one or more wiring layers; and connecting the electronic components to electrodes of the wiring board by soldering, covering these with a first insulating resin, 3. The electronic component built-in module according to claim 2, wherein a third insulating resin is formed between the electronic component formed of an active component and the wiring board in the electronic component built-in module having an electromagnetic field shield layer formed by metal plating on a surface layer. 能動部品からなる電子部品とそれ以外の電子部品の間にソルダーレジストの壁を形成した請求項４記載の電子部品内蔵モジュール。5. The electronic component built-in module according to claim 4, wherein a solder resist wall is formed between the electronic component comprising the active component and the other electronic component. 能動部品からなる電子部品が実装される配線基板の表面の電極以外の部分をソルダーレジストで覆った構成とした請求項４記載の電子部品内蔵モジュール。5. The electronic component built-in module according to claim 4, wherein a portion other than the electrodes on the surface of the wiring board on which the electronic component comprising the active component is mounted is covered with a solder resist. 第１の絶縁樹脂が熱硬化性樹脂及び無機フィラーを含む混合物からなり、無機フィラーの配合比率が５０重量％〜９５重量％、無機フィラーの粒径が前記ソルダーレジストを除く配線基板と前記電子部品の間隔より小さい粒径とした請求項１記載の電子部品内蔵モジュール。The first insulating resin is composed of a mixture containing a thermosetting resin and an inorganic filler, the mixing ratio of the inorganic filler is 50% by weight to 95% by weight, and the particle size of the inorganic filler is the wiring board excluding the solder resist and the electronic component. The electronic component built-in module according to claim 1, wherein the particle size is smaller than the interval of: 第２の絶縁樹脂が熱硬化性樹脂及び無機フィラーを含む混合物からなり、無機フィラーの配合比率が１０重量％〜７０重量％、無機フィラーの粒径が前記ソルダーレジストを含む配線基板と前記電子部品の間隔より小さい粒径とした請求項２記載の電子部品内蔵モジュール。The second insulating resin is composed of a mixture containing a thermosetting resin and an inorganic filler, the compounding ratio of the inorganic filler is 10% by weight to 70% by weight, and the particle size of the inorganic filler is the wiring board containing the solder resist; 3. The electronic component built-in module according to claim 2, wherein the particle size is smaller than the interval. 第１の絶縁樹脂の曲げ弾性率が２０ＧＰａ以下とした請求項１または２記載の電子部品内蔵モジュール。3. The electronic component built-in module according to claim 1, wherein the first insulating resin has a flexural modulus of 20 GPa or less. 第２の絶縁樹脂の曲げ弾性率が２０ＧＰａ以下とした請求項２記載の電子部品内蔵モジュール。The electronic component built-in module according to claim 2, wherein the flexural modulus of the second insulating resin is 20 GPa or less. 第３の絶縁樹脂の熱膨張係数が第１の絶縁樹脂の熱膨張係数より大きくした請求項４記載の電子部品内蔵モジュール。5. The electronic component built-in module according to claim 4, wherein a thermal expansion coefficient of the third insulating resin is larger than a thermal expansion coefficient of the first insulating resin.
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