CN103299410B - The electronic component module and the electronic component unit - Google Patents

The electronic component module and the electronic component unit Download PDF

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Publication number
CN103299410B
CN103299410B CN201280005003.3A CN201280005003A CN103299410B CN 103299410 B CN103299410 B CN 103299410B CN 201280005003 A CN201280005003 A CN 201280005003A CN 103299410 B CN103299410 B CN 103299410B
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China
Prior art keywords
electrode
electronic component
substrate
formed
electrodes
Prior art date
Application number
CN201280005003.3A
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Chinese (zh)
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CN103299410A (en
Inventor
南匡晃
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株式会社村田制作所
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Publication date
Priority to JP2011-013711 priority Critical
Priority to JP2011013711 priority
Application filed by 株式会社村田制作所 filed Critical 株式会社村田制作所
Priority to PCT/JP2012/051544 priority patent/WO2012102303A1/en
Publication of CN103299410A publication Critical patent/CN103299410A/en
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Publication of CN103299410B publication Critical patent/CN103299410B/en

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    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/315Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
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    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]

Abstract

提供了一种抑制焊料飞溅的发生的电子元器件模块。 There is provided an electronic component module has a solder splashes is suppressed. 电子元器件模块100具有以下结构:即,形成有多个焊盘电极5的电子元器件单元4与形成有多个基板电极2的基板1相对地配置在其上,基板电极2与焊盘电极5通过焊料凸点相连接,在焊盘电极上形成有柱状电极7,且柱状电极7上设置有焊料凸点,并且在焊盘电极5上以包围柱状电极7的方式形成有环状电极8。 The electronic component module 100 has the structure: i.e., is formed thereon, the electrode substrate 2 has a plurality of electrode pads and the pad electrodes 4 of the electronic component unit 5 is formed with a plurality of board electrodes 2 of the substrate 1 disposed opposite 5 are connected by solder bumps, columnar electrodes are formed on the pad electrodes 7 and solder bumps 7 is provided with a columnar electrode, and to surround the pillar-shaped annular electrode 7 electrode 8 is formed on the pad electrodes 5 .

Description

电子元器件模块及电子元器件单元 The electronic component module and the electronic component unit

技术领域 FIELD

[0001] 本发明涉及将电子元器件元件倒装芯片安装于基板上而得到的电子元器件模块,更具体而言,涉及对基板和电子元器件元件的接合结构上追加了改良后的电子元器件模块。 [0001] The present invention relates to an electronic component element flip-chip mounting the electronic component module on the substrate is obtained, and more particularly, relates to a bonded structure of the substrate and the electronic component element is added to the improved electronic element device module.

[0002] 此外,本发明涉及适用于在所述电子元器件模块中所使用的电子元器件单元。 [0002] Further, the present invention relates to an electronic component unit applied to the electronic component module used.

背景技术 Background technique

[0003] 近年来,伴随着电子机器的小型化、高性能化,要求对半导体等的电子元器件元件的基板进行高密度的安装。 [0003] In recent years, with miniaturization of electronic equipment, high performance requirements of the electronic component element of a semiconductor substrate such as high-density mounting. 作为对应于此要求的方法,倒装芯片安装被广泛使用。 As a method corresponding to this requirement, flip chip mounting has been widely used. 该倒装芯片安装一般是指在电子元器件元件一侧设置焊料凸点,利用回流使电子元器件单元与基板焊料接合,且为了进一步加强接合力,在基板和电子元器件单元之间填充树脂。 The flip-chip mounting refers generally to a side of the solder bump provided in the electronic component element, the electronic component unit reflow solder bonding with the substrate, and in order to further enhance the bonding force between the substrate and the electronic component unit filling resin .

[0004] 由此,对于将电子元器件单元倒装芯片安装于基板上而得到的电子元器件模块,经常能利用回流焊料而被安装到更大的安装基板上。 [0004] Thus, the electronic component unit for flip-chip mounted on the substrate and the electronic component module obtained, often using the reflowed solder is mounted to the mounting substrate larger. 然而,在将电子元器件模块安装到安装基板的情况下,由于回流加热,接合基板和电子元器件单元的焊料会发生再熔融,发生熔融的焊料会沿着电子元器件单元和基板的接合面流出,有可能会与相邻的其他的焊料凸点发生电短路。 However, in the electronic component module mounted to the mounting substrate by heating to reflux, the substrate and solder bonding of the electronic component unit remelting occurs, the molten solder will occur along the joint surface of the substrate and the electronic component unit outflow, there is an electrical short circuit may occur with other adjacent solder bumps.

[0005] 在专利文献1 (日本专利特开2004-47637号公报)中公开了防止上述问题的电子元器件模块。 [0005] In Patent Document 1 (Japanese Patent Laid-Open Publication No. 2004-47637) discloses an electronic component module to prevent the above problems.

[0006] 图8中示出了专利文献1中所公开的电子元器件模块(半导体封装)400。 In [0006] FIG. 8 shows an electronic component module (semiconductor package) 400 in Patent Document 1 disclosed.

[0007] 电子元器件模块400具有基板101。 [0007] The electronic component module 400 having a substrate 101. 在基板101的主面上形成有多个基板电极102。 A plurality of substrate electrode 102 is formed on the main surface of the substrate 101. 此外,除了基板电极102部分以外,在基板101的主面上还形成了焊料抗蚀剂103。 Further, in addition to the substrate electrode portion 102, the main surface of the substrate 101 is also formed of solder resist 103.

[0008] 另外,电子元器件模块400具有电子元器件单元(半导体单元)104。 [0008] Further, the electronic component module 400 has an electronic component unit (semiconductor unit) 104. 在基板104的主面上形成有多个焊盘电极105。 In the main surface of the substrate 104 is formed with a plurality of pad electrodes 105. 此外,除了焊盘电极105部分以外,在基板105的主面上还形成了绝缘膜106。 In addition, except for the pad electrode portion 105, the main surface of the substrate 105 insulating film 106 is also formed. 然后,在绝缘膜106上形成了突起状的焊料坝106a以使其包围住焊盘电极105。 Then, a solder dam-shaped protrusions on the insulating film 106 106a so as to surround the pad electrode 105. 焊料坝106a在将电子元器件模块400安装到安装基板(未图示)时,起到防止熔融后的焊料流出的功能。 Solder dam 106a when the electronic component module 400 is mounted to the mounting substrate (not shown), serves to prevent melted solder flowing out function.

[0009] 然后,通过将设置在焊盘电极105上的焊料凸点109与基板101的基板电极102的相接合,从而将电子元器件单元104倒装芯片安装于基板101上。 [0009] Then, the pad electrode 105 is provided on the solder bumps 109 and the substrate electrode 101 engages substrate 102, so that the electronic component unit 104 is flip-chip mounted on the substrate 101.

[0010] 而且,电子元器件模块400中,为了增大基板101和电子元器件单元104之间的接合强度,在基板101和电子元器件单元104之间填充了树脂110。 [0010] Moreover, the electronic component module 400, in order to increase the bonding strength between the substrate 101 and the electronic component unit 104 between the substrate 101 and the electronic component unit 104 is filled with resin 110.

[0011] 现有技术文献 [0011] The prior art documents

[0012] 专利文献 [0012] Patent Document

[0013] 专利文献1:日本专利特开2004-47637号公报 [0013] Patent Document 1: Japanese Patent Laid-Open Publication No. 2004-47637

发明内容 SUMMARY

[0014] 发明所要解决的技术问题 [0014] The invention solves the technical problem

[0015] 然而,上述的现有的电子元器件模块400中存在以下的问题。 The following problems [0015] However, the presence of the above-described conventional 400 of the electronic component module.

[0016] S卩,由于为了在电子元器件单元104的绝缘膜106上形成用于防止焊料流出的突起状的焊料坝106a,因此,需要一定程度的大面积,在近年来的要求小型化、高密度化的电子元器件模块中,存在如下问题:即,无法确保用于在绝缘膜106上形成焊料坝106a的面积。 [0016] S Jie, since downsizing in order to form a solder dam to prevent the protruding solder flowing 106a, therefore, require some degree of large area, in recent years, demands on the insulating film 106 of the electronic component unit 104, high density electronic component module, there is a problem: That is, the area can not be secured for the solder dam 106a is formed on the insulating film 106.

[0017] 此外,一般较多的情况是在电子元器件单元104上形成的绝缘膜106由SiN等形成,但是,由SiN等所构成的绝缘膜106及焊料坝106a有弹开该焊料的倾向,因此,存在如下问题:即,熔融后的焊料凸点109的焊料不会留在绝缘膜106上,而是很容易越过焊料坝106a而流出。 [0017] Further, more general insulating film 106 is formed on the case of the electronic component unit 104 is formed of SiN or the like, however, the tendency of the insulating film 106 by a solder and solder dams 106a formed of SiN or the like have bounced Therefore, there is a problem: That is, molten solder after the solder bump 109 does not remain on the insulating film 106, but it is easy to flow out over the solder dams 106a. 因而,会产生如下问题:即,会有越过焊料坝106a而流出的焊料与相邻的焊料凸点9发生电短路的情况。 Accordingly, the following problems occur: That is, there will be across the solder flowing out of the solder dams 106a and the solder bump 9 adjacent electrical short.

[0018] 此处,本发明的目的在于提供一种具有即使在狭小的间距中形成焊料凸点、也能够防止焊料流出的结构的电子元器件模块。 [0018] Here, an object of the present invention is to provide a solder bump is formed even in a narrow pitch, it is also possible to prevent the electronic component module configuration of the solder flowing out.

[0019] 解决技术问题所采用的技术方案 [0019] Solution to Problem A

[0020] 作为一种方法,本发明的电子元器件模块具有如下结构:即,在形成有多个基板电极的基板上,具有多个焊盘电极的电子元器件单元以所述基板电极和所述焊盘电极相对的方式进行配置,基板电极和焊盘电极通过焊料凸点进行电连接,在该电子元器件模块中,具有:柱状电极,该柱状电极形成于焊盘电极上;焊盘凸点,该焊盘凸点形成于柱状电极的前端;以及环状电极,该环状电极以包围柱状电极的方式形成于焊盘电极上。 [0020] As a method, an electronic component module according to the present invention has the structure: i.e., is formed in the substrate with a plurality of electrodes on a substrate, the electronic component unit having a plurality of pad electrodes to the electrode and the substrate performed in the manner described pad electrode disposed opposite to the substrate electrode and the pad electrode are electrically connected by solder bumps, the electronic component module, comprising: a columnar electrodes, the columnar electrode is formed on the pad electrode; pad projections point, the bump pads formed at the tip of the columnar electrodes; and ring electrodes, the ring electrode to surround the columnar electrodes are formed on the pad electrode. 利用相关结构,本发明的电子元器件模块能够确实防止焊料的流出。 Utilization-related structure, the electronic component module according to the present invention can reliably prevent the outflow of the solder.

[0021 ] 另外,优选环状电极以从焊盘电极表面突出的方式来形成。 [0021] Further, preferably annular electrode protrudes from the surface of the pad electrode is formed manner. 在此情况下,能够提高防止焊料流出的功能。 In this case, it is possible to improve the function of preventing the flowing of the solder.

[0022] 此外,在基板和电子元器件单元之间,也可填充树脂。 [0022] Further, between the substrate and the electronic component unit, it can be filled with the resin. 在此情况下,能够增强基板和电子元器件单元的接合强度。 In this case, it is possible to enhance the bonding strength of the substrate and the electronic component unit.

[0023] 此外,环状电极的高度比柱状电极的高度要高,环状电极也可与基板电极相抵接。 [0023] Further, the height of the annular electrode is higher than the height of the columnar electrodes, ring electrodes may be brought into contact with the substrate electrode. 在此情况下,柱状电极及焊料凸点被环状电极完全包围,能够完全防止焊料的流出。 In this case, the columnar electrode and the solder bump is completely surrounded by an annular electrode, the solder can be prevented from flowing out completely.

[0024] 此外,在基板电极上,也可另行设置柱状电极及环状电极中的至少一个。 [0024] Further, on the electrode substrate, columnar electrodes may be separately provided and at least one ring electrode. 在此情况下,即使在基板侧发生焊料流出的情况,也能够抑制焊料的流出。 In this case, even if the solder flows occurs at the substrate side, it is possible to suppress outflow of the solder.

[0025] 另外,本发明的电子元器件单元具有如下结构:S卩,具有电子元器件主体,该电子元器件主体具有安装面;多个焊盘电极,该多个焊盘电极形成于安装面上;柱状电极,该柱状电极形成于焊盘电极上;焊料凸点,该焊料凸点形成于柱状电极的前端;以及环状电极,该环状电极以包围柱状电极的方式形成在焊盘电极上。 [0025] Further, the electronic component unit according to the present invention has the following structure: S Jie, the electronic component having a main body, the electronic component body having a mounting surface; a plurality of pad electrodes, the plurality of pad electrodes formed on a mounting surface upper; columnar electrodes, the columnar electrode is formed on the pad electrode; solder bumps, the solder bumps formed on the end of the columnar electrode; and a ring electrode, the ring electrode to surround the columnar electrodes are formed on the pad electrode on. 利用相关结构,本发明的电子元器件单元,制造使用基板上的上述焊料凸点进行倒装芯片安装的电子元器件单元,在将该电子元器件单元安装到安装基板上的情况下,即使因回流加热而使焊料凸点发生再熔融,也能够可靠地防止熔融后的焊料流出。 Utilization-related structure, the electronic component unit according to the present invention, manufactured using the solder bumps on the substrate an electronic component unit flip chip mounting, where the unit is mounted on the mounting substrate in the electronic component, even if the result of was heated at reflux for remelting the solder bumps occurs, it is possible to reliably prevent the outflow of the molten solder.

[0026] 发明效果 [0026] Effect of the Invention

[0027] 本发明的电子元器件单元中,因为在焊盘电极上形成有金属制的环状电极,因此,像专利文献1中所公开的现有技术那样,相比于在SiN等具有弹开焊料的性质的绝缘膜上形成有焊料坝的电子元器件单元相比,能够大大地提高防止焊料流出的功能。 [0027] The electronic component unit according to the present invention, since the ring-shaped electrode made of a metal is formed on the pad electrodes, and therefore, as in the prior art disclosed in Patent Document 1 as compared to SiN or the like having a projectile solder electronic component unit apart insulation film properties as compared solder dam can greatly enhance the function of preventing solder outflow.

[0028] 此外,本发明的电子元器件模块中,因为焊料凸点并非直接设置于焊盘电极上,而是设置在形成于焊盘电极上的柱状电极上,因此,能够更为正确地控制各焊料凸点的配置位置。 [0028] In addition, the electronic component module according to the present invention, since the solder bumps are not provided directly to the pad electrode, but is provided on the columnar electrode is formed on the pad electrode, it is possible to more accurately control the arrangement position of each solder bump. 因此,能够隔开狭小的间隔以相邻地形成多个焊料凸点。 Therefore, the narrow spaced intervals to form a plurality of adjacent solder bumps.

[0029] 而且,本发明的电子元器件模块中,焊料凸点设置在形成于焊盘电极上的柱状电极上,焊料凸点和焊盘电极之间设置有一定的距离。 [0029] Moreover, the electronic component module according to the present invention, the solder bumps provided on the columnar electrode is formed on the pad electrode, a certain distance is provided between the solder bump and the pad electrode. 因此,即使万一发生焊料飞溅,发生熔融的焊料若不经过柱状电极的侧面、焊盘电极的表面、环状电极,也无法到达相邻的焊盘电极、焊料凸点。 Accordingly, even in case of occurrence of splashes of solder, the solder is melted without going through the side surface of the columnar electrodes, the surface of the pad electrode, ring electrode, can not reach the adjacent pad electrode, solder bump. 由此,通过加长焊料的经过路径,也能够大大地提高防止焊料流出的功能。 Thus, by lengthening the path through the solder, it is possible to greatly improve the function of preventing the flowing of the solder.

附图说明 BRIEF DESCRIPTION

[0030]图1是表示本发明的第1实施方式所涉及的电子元器件模块100的主要部分的剖视图。 [0030] FIG. 1 is a sectional view of a main part of the electronic component module of the first embodiment of the present invention embodiment 100 of FIG.

[0031]图2是表示本发明的第1实施方式所涉及的电子元器件模块100的主要部分的剖视图,表示的是图1的箭头AA部分。 [0031] FIG. 2 is a sectional view of a main part of the electronic component module of the first embodiment of the present invention represented by 100, an arrow represents the portion AA of FIG. 1.

[0032] 图3 (a)〜(c)是表示本发明的第1实施方式所涉及的电子元器件模块100的制造方法中所应用的各工序的剖视图。 [0032] FIG. 3 (a) ~ (c) are sectional views of respective steps of manufacturing method of the electronic component module of the first embodiment of the present invention embodiment 100 of FIG applied.

[0033] 图4 (d)〜(f)是图3的后续,表示的是本发明的第1实施方式所涉及的电子元器件模块100的制造方法中所应用的各工序的剖视图。 [0033] FIG. 4 (d) ~ (f) of FIG. 3 is a follow-up, are sectional views showing respective steps of the method of manufacturing the electronic component module of the first embodiment of the present invention embodiment 100 as applied.

[0034] 图5 (g)〜(i)是图4的后续,表示的是本发明的第1实施方式所涉及的电子元器件模块100的制造方法中所应用的各工序的剖视图。 [0034] FIG. 5 (g) ~ (i) is subsequent to FIG. 4, the cross-sectional view showing respective steps of a method for manufacturing the electronic component module of the first embodiment of the present invention embodiment 100 as applied.

[0035] 图6是表示本发明的第2实施方式所涉及的电子元器件模块200的主要部分的剖视图。 [0035] FIG. 6 is a sectional view of a main part of the electronic component module of the second embodiment of the present invention represented by 200.

[0036]图7是表示本发明的第3实施方式所涉及的电子元器件模块300的主要部分的剖视图。 [0036] FIG. 7 is a sectional view of a main part of the electronic component module to a third embodiment of the present invention represented by 300.

[0037] 图8是表示现有的电子元器件模块400的剖视图。 [0037] FIG. 8 is a sectional view of a conventional electronic component module 400 of FIG.

具体实施方式 Detailed ways

[0038] 下面,参照附图对本发明的实施方式进行说明。 [0038] Next, with reference to the accompanying drawings of embodiments of the present invention will be described.

[0039](第1实施方式) [0039] (First Embodiment)

[0040] 图1及图2中,示出了本发明的第1实施方式所涉及的电子元器件模块100中的基板和电子元器件单元的接合状态。 In [0040] FIGS. 1 and 2, shows the engagement state of the substrate and the electronic component unit in the electronic component module 100 of the first embodiment of the present invention. 但是,图2表示的是图1的箭头AA部分的剖面。 However, FIG. 2 is a cross-sectional view showing a portion of the arrows AA in FIG. 1.

[0041] 电子元器件模块100具有基板1。 [0041] The electronic component module 100 having the substrate 1. 基板1的材质中,可使用例如陶瓷、树脂等。 The material of the substrate 1 may be used such as ceramic, resin or the like. 在基板1的主面上形成有多个基板电极2。 There are formed on the main surface of the substrate 2 a plurality of substrate electrodes. 基板2的材质中,可使用例如Cu、Ag等。 The material of the substrate 2 may be used, for example, Cu, Ag and the like.

[0042] 另外,电子元器件模块100具有电子元器件单元4。 [0042] Further, the electronic component module 100 having the electronic component unit 4. 作为电子元器件单元4,例如使用半导体单元等,一般较多的是矩形形状。 As the electronic component unit 4, for example, a semiconductor unit or the like, more generally a rectangular shape. 在电子元器件单元4的主面上形成有多个焊盘电极5。 Forming a main surface of the electronic component unit 4 with a plurality of pad electrodes 5. 虽然焊盘电极5的形状是无所谓的,但在本实施方式中,与电子元器件单元4形状相匹配而使用矩形形状。 Although the shape of the pad electrode 5 does not matter, but in the present embodiment, the shape of the electronic component unit 4 is used to match a rectangular shape. 焊盘电极5的材质中,可使用例如A1等。 5, the pad electrode material may be used, for example, A1 and the like. 此外,在电子元器件单元4的主面上,在焊盘电极5部分设置有开口以形成绝缘膜6。 Further, the main surface of the electronic component unit 4 is provided with an opening to form an insulating film 6 in the portion of the pad electrode 5. 绝缘膜6的材质中,可使用例如SiN等。 The material of the insulating film 6, for example, SiN and the like may be used.

[0043] 然后,在电子元器件单元4的焊盘电极5的中心部上形成了柱状电极7。 [0043] Then, on the central portion of the pad electrode 5 of the electronic component unit 4 is formed a columnar electrodes 7. 在本实施方式中,柱状电极7的形状为圆柱状。 In the present embodiment, the shape of the columnar electrode 7 is cylindrical. 但是,柱状电极7的形状并不仅限于此,也可以是多棱柱形、圆锥台形、多棱锥台形等。 However, the shape of the columnar electrodes 7 is not limited thereto, but may be a polygonal column, truncated cone, truncated pyramid shape, etc. plurality. 柱状电极7的材质中,可使用例如Cu。 Material columnar electrodes 7 may be used, for example, Cu. 但是,也可以是N1、Pt、Pd等Cu以外的金属。 However, it may be a metal other than Cu N1, Pt, Pd and the like.

[0044] 另外,在电子元器件单元4的焊盘电极5上形成有环状电极8以使其包围住柱状电极7。 [0044] Further, a ring-shaped electrode on the electronic component unit 8 of the pad electrode 54 so as to surround the columnar electrodes 7. 在本实施方式中,环状电极8的形状为圆环形。 In the present embodiment, the shape of the annular electrode 8 is circular. 但是,并不仅限定于圆环形,也可以是矩形环形。 However, it is not limited to circular, but may be a rectangular loop. 环状电极8从焊盘电极的表面突出。 8 protruding from the surface of the annular electrode pad electrode. 环状电极8的材质中,可使用例如Cu。 Material annular electrode 8 may be used, for example, Cu. 但是,也可以是N1、Pt、Pd等Cu以外的金属。 However, it may be a metal other than Cu N1, Pt, Pd and the like.

[0045] 然后,在柱状电极7上设置有焊料凸点9。 [0045] Then, the columnar electrode 7 is provided with solder bumps 9.

[0046] 通过将设置在柱状电极7上的焊料凸点9与基板1的基板电极2的相接合,从而将电子元器件单元4倒装芯片安装于基板1上。 [0046] By the columnar electrodes 7 provided on the solder bumps 9 and the electrode substrate 1 of the substrate 2 is engaged, so that the electronic component unit 4 is flip-chip mounted on the substrate 1.

[0047] 而且,电子元器件模块100中,为了增大基板1和电子元器件单元4之间的接合强度,在基板1和电子元器件单元4之间填充了树脂10。 [0047] Moreover, the electronic component module 100, in order to increase the bonding strength between the substrate 4 and the electronic component unit 1, between the substrate 1 and the electronic component unit 4 is filled with the resin 10. 但是,考虑到通过对电子元器件修复而实现的基板再利用等,也有不填充树脂10的情况。 However, considering the substrate through the electronic component repair and reuse achieved, but also there are not filled with the resin 10.

[0048] 在具有上述的结构的本发明的第1实施方式所涉及的电子元器件模块100中,因为在焊盘电极5上形成了包围柱状电极7的环状电极8,因此,在发生焊料飞溅时,熔融后的焊料到达相邻的焊料凸点9的路径变长,由此能够抑制与相邻的焊料凸点之间发生的短路。 [0048] In the electronic component module of the first embodiment of the present invention having the above configuration according to the 100, is formed as an annular electrode surrounding the pillar-shaped electrode 7 electrode 8 on the pad 5, therefore, the occurrence of solder when flying, melted solder reaches the solder bump adjacent the path 9 becomes long, thereby suppressing short circuit between adjacent solder bumps with. 而且,通过利用金属来形成柱状电极7及环状电极8,相比于利用具有弹开现有焊料的作用的SiN等来形成的情况,能够提高防止焊料流失的效果。 Further, the columnar electrode 7 and the annular electrode 8 is formed by using a metal, as compared to the case of using the conventional solder having a bounce effect SiN, or the like, it is possible to improve the effect of preventing the loss of the solder.

[0049] 而且,由于在焊盘电极5上形成有柱状电极7,且将焊料凸点9设置在该柱状电极7上,因此,能正确地控制各焊料凸点9的配置位置。 [0049] Further, since the columnar electrode is formed on the pad electrodes 57, and the solder bumps 9 are provided on the columnar electrode 7, and therefore, can accurately control the arrangement position of each of the solder bumps 9. 因此,能够隔开狭小的间距来相邻地形成多个焊料凸点9。 Accordingly, spaced narrow pitch formed adjacent to the plurality of solder bumps 9.

[0050] 另外,虽未图示出,但基板1由形成有布线用内层导体、电容形成用内层导体的多层基板来构成,在其表面上形成有已形成了的外部端子。 [0050] Further, although not illustrated, the substrate 1 is formed with an inner layer wiring conductor, capacitance forming multilayer substrate constituting the inner layer conductor to form the external terminals have been formed on the surface thereof. 安装有电子元器件单元4的基板电极2和外部端子电极之间通过通孔导体相连接。 The electronic component unit mounted substrate 2 and the electrode 4 are connected through the via hole conductor between the external terminal electrodes.

[0051] 此外,在与基板1的安装有电子元器件单元4的基板电极2不同的其它的基板电极2上,也可以安装贴片电容器等。 [0051] Further, on the substrate 1 is mounted an electronic component unit of the substrate electrode 4 of the substrate 2 different from the other electrode 2, a chip capacitor may be mounted like. 另外,也可以在基板1的内层导体中,芯片电容器等以连接的状态内置于基板中。 Further, the substrate may be an inner conductor 1, the status of the chip capacitor is connected to a built-in the substrate.

[0052] 接着,参照图3 (a)〜图5 (i),说明关于电子元器件模块100的制造方法的一个示例。 [0052] Next, with reference to FIG. 3 (a) ~ FIG. 5 (i), a description example about the method of manufacturing the electronic component module 100.

[0053] 首先,如图3 (a)所示,预先准备形成有由A1等所构成的多个焊盘电极5的半导体单元等的电子元器件单元4。 [0053] First, FIG. 3 (a), the electronic component is prepared in advance by the unit A1 plurality of pad electrodes and the like composed of a semiconductor element 4 is formed like 5.

[0054] 接着,如图3 (b)所示,在电子元器件单元4上,利用蒸镀、溅射法来形成作为形成柱状电极7、环状电极8的基础的片材层11。 [0054] Next, FIG. 3 (b), on the electronic component unit 4, to form a sheet 11 for forming the layer 7, the annular electrode base columnar electrode 8 by vapor deposition, sputtering. 片材层11的材质,可以使用例如T1、Cu。 Sheet material of layer 11 may be used, for example T1, Cu. 然后,在形成片材层11之后,形成用于形成环状电极8的抗蚀剂12。 Then, after the sheet layer 11 is formed, for forming the annular electrode 128 of a resist. 抗蚀剂12的材质中,可使用例如SiN、Si02等。 The resist material 12 may be used, for example, SiN, Si02 and the like. 首先将抗蚀剂12涂布在片材层11的整个表面上。 First, a resist 12 coated on the entire surface of the sheet layer 11. 然后,在抗蚀剂12上覆盖对形成环状电极16的部分进行了穿孔的掩膜(未图示),利用光刻的要领,照射紫外线以进行曝光。 Then, on the resist 12 covers the annular portion is formed on the electrode 16 is a perforated mask (not shown) by photolithography essentials, exposure to ultraviolet irradiation. 接着,去除掩膜,利用显影剂进行显影处理。 Subsequently, the mask is removed, a developing process using a developer. 通过显影处理,在抗蚀剂12上形成经过曝光后的形状、即具有环状电极8的平面形状(例如圆环状)的开口。 By the developing process, the resist 12 is formed after the shape of the exposed, i.e., annular electrode having a planar shape 8 (e.g., annular) opening.

[0055] 接着,如图3 (c)所示,通过实施镀膜处理,在抗蚀剂12的开口部上形成环状电极8。 Subsequently, as shown in [0055] FIG. 3 (c), by performing plating treatment to form the annular electrode 8 on the opening portion of the resist 12.

[0056] 接着,通过剥离去除抗蚀剂12,如图4 (d)所示,在焊盘电极5上隔着片材层11形成了环状电极8。 [0056] Next, the resist 12 is removed by peeling, as shown in FIG 4 (d), the interposed sheet layer 11 is formed on the pad electrodes 5 an annular electrode 8.

[0057] 接着,形成柱状电极7及焊料凸点9。 [0057] Next, a columnar electrode 7 and the solder bumps 9.

[0058] 首先,虽未图示出,但在形成有环状电极8的片材层11上,再次涂布抗蚀剂13。 [0058] First, although not illustrated, but is formed with a sheet layer 8 on the annular electrode 11, resist 13 is coated again. 然后,在抗蚀剂13上覆盖对形成柱状电极7的部分进行了穿孔的掩膜,利用光刻的要领,照射紫外线以进行曝光。 Then, on the resist 13 covers the portion of a columnar electrode 7 made of a perforated mask, by photolithography essentials, exposure to ultraviolet irradiation. 接着,去除掩膜,利用显影剂进行显影处理。 Subsequently, the mask is removed, a developing process using a developer. 通过显影处理,如图4(e)所示,在抗蚀剂13上形成了经过曝光后的形状、即具有柱状电极7的平面形状(例如圆形)的开口。 By a developing process, FIG. 4 (e), the resist 13 is formed in a shape of an opening through the exposed, i.e., has a flat shape (e.g., circular) cylindrical electrode 7.

[0059] 接着,如图4 (f)所示,通过实施镀膜处理,在抗蚀剂13的开口部上,首先形成柱状电极7,然后形成作为焊料凸点9的基础的焊料镀层9'。 [0059] Next, FIG. 4 (f), the plating process by performing, on the opening portion of the resist 13, the first columnar electrodes 7 are formed, and then a solder bump is formed as a solder plating base 9 9 '.

[0060] 接着,如图5 (g)所示,将剩余的抗蚀剂13剥离去除,然后通过刻蚀处理,将剩余的片材层11剥离去除。 [0060] Next, FIG. 5 (g), the remaining resist 13 is peeled and removed, and then through the etching process, the remaining layer 11 of the release sheet is removed.

[0061] 接着,如图5 (h)所示,通过施加回流处理,将焊料层9'形成为大致球状的焊料凸点9。 [0061] Next, FIG. 5 (h), by applying the reflow process, the solder layer 9 'is formed as a substantially spherical solder bump 9.

[0062] 最后,如图5 (i)所示,利用回流将焊料凸点9接合到基板电极2,将电子元器件单元4倒装芯片安装到基板1上,接着,为了提高基板1与电子元器件单元4的接合强度,在基板2和电子元器件单元4之间填充树脂10,由此完成本实施方式所涉及的电子元器件模块100。 [0062] Finally, FIG. 5 (i), the reflow bonding solder bumps 9 to the substrate electrode 2, the electronic component unit 4 is mounted flip-chip on the substrate 1, and then, in order to improve the substrate 1 and the electronic the bonding strength of the component unit 4, between the substrate 2 and the electronic component unit 4 filled with the resin 10, thereby completing the electronic component module according to the present embodiment is 100. 另外,在图5 (g)〜(i冲,图示了柱状电极7及环状电极8的片材层部分,但在表示完成状态的图1中,省略了其图示。 Further, in FIG. 5 (g) ~ (i red, illustrating a portion of the columnar electrode layer sheet 7 and the annular electrode 8, but showing the completion state of FIG. 1, illustration thereof is omitted.

[0063] 以上,对本发明的第1实施方式所涉及的电子元器件模块100的结构及制造方法的一个示例进行了说明。 [0063] above, one example of the structure and method of manufacturing the electronic component module 1 of the first embodiment of the present invention 100 has been described. 然而,本发明并不限于上述内容,只要遵循发明的要点,能够进行各种改变。 However, the present invention is not limited to the above, as long as the gist of the invention to follow, can be variously modified.

[0064]例如,在柱状电极7、环状电极8的形成中也可采用蒸镀、印刷等方法来代替光刻蚀。 [0064] For example, at 7, a columnar electrode is an annular electrode 8 may also be employed vapor deposition, printing or the like instead of photolithography.

[0065] 另外,也可使金属制的电极与焊料之间的界面合金化,以提高接合强度。 [0065] Further, also allows the interface between the electrode and the solder metal alloy, in order to increase the bonding strength.

[0066] 此外,虽然在焊盘电极5上设置了从其表面突出的环状电极8,但即使是在焊盘电极5的表面上形成凹沟那样的环状电极,也能起到防止焊料流出的效果。 [0066] Further, although the projection is provided to prevent the surface from the annular electrode 8, but even as annular grooves formed on the electrode surface of the pad electrode 5, can also play the solder on the pad electrodes 5 the effect of outflows.

[0067](第2实施方式) [0067] (Second Embodiment)

[0068] 图6是表示本发明的第2实施方式所涉及的电子元器件模块200的主要部分的剖视图。 [0068] FIG. 6 is a sectional view of a main part of the electronic component module of the second embodiment of the present invention represented by 200.

[0069] 电子元器件模块200中,在基板1的基板电极2上也形成有柱状电极27及环状电极28。 In [0069] the electronic component module 200, the electrode substrate 1 on the substrate 2 is also formed with a columnar electrode 27 and ring electrode 28. 其它的结构以上述第1实施方式所涉及的电子元器件模块100为准。 Other configurations electronic component module 1 in the first embodiment 100 of the subject.

[0070] 在本实施方式所涉及的电子元器件模块200中,即使在基板2 —侧发生焊料流出的情况下,也能够抑制焊料的流出。 [0070] In the electronic component module according to the present embodiment 200, even if the substrate 2 - the side where the solder outflow occurs, it is possible to suppress outflow of the solder.

[0071](实施方式3) [0071] (Embodiment 3)

[0072]图7是表示本发明的第3实施方式所涉及的电子元器件模块300的主要部分的剖视图。 [0072] FIG. 7 is a sectional view of a main part of the electronic component module to a third embodiment of the present invention represented by 300.

[0073] 在电子元器件模块300中,环状电极18的高度hi比柱状电极7的高度h2要高。 [0073] In the electronic component module 300, the annular electrode height hi 18 is higher than the height h2 7 of columnar electrodes. 其结果是,环状电极18与基板电极2相抵接,利用焊盘电极5和环状电极18和基板电极2来形成空间13,且在空间13内不填充树脂10。 As a result, the annular electrode 18 and substrate electrode 2 comes into contact by the pad electrode 18 and the annular electrode 5 and the electrode substrate 2 is formed a space 13, and is not filled with the resin 10 in the space 13. 电子元器件模块300的其它结构以上述第1实施方式所涉及的电子元器件模块100为准。 The electronic component module 300 to other structure of the electronic component module 1 in the first embodiment 100 of the subject.

[0074] 在电子元器件模块300中,由于柱状电极7及焊料凸点9完全被环状电极18包围,形成了空间13,因此,不会发生焊料飞溅。 [0074] In the electronic component module 300, the solder bumps 7 due to the columnar electrodes 9 and is completely surrounded by an annular electrode 18, a space 13 is formed, and therefore, solder splash does not occur. 即使发生焊料飞溅,由于被环状电极18所包围,因此,熔融后的焊料不会越过环状电极18而漏出到周边。 Even solder splashes, since the electrode 18 is surrounded by an annular, therefore, melted solder does not occur across the ring electrode 18 leaks to the periphery.

[0075] 标号说明 [0075] DESCRIPTION OF REFERENCE NUMERALS

[0076] 1 基板 [0076] 1 substrate

[0077] 2基板电极 [0077] The electrode substrate 2

[0078] 4电子元器件单元(半导体单元等) [0078] The electronic component unit 4 (a semiconductor unit, etc.)

[0079] 5焊盘电极 [0079] The pad electrode 5

[0080] 6绝缘膜 [0080] The insulating film 6

[0081] 7柱状电极 [0081] The columnar electrode 7

[0082] 8、18环状电极 [0082] ring electrodes 8,18

[0083] 9焊料凸点 [0083] The solder bumps 9

[0084] 9'焊料层 [0084] 9 'of the solder layer

[0085] 10 树脂 [0085] Resin 10

[0086] 11片材层 [0086] 11 material layer

[0087] 12、13 抗蚀剂 [0087] The resist 12,13

[0088] 27 (形成于基板电极上的)柱状电极 [0088] 27 (an electrode formed on the substrate) columnar electrode

[0089] 28 (形成于基板电极上的)环状电极 [0089] 28 (electrode formed on the substrate) of the annular electrode

[0090] 100、200、300电子元器件模块 [0090] 100, 200, the electronic component module

Claims (8)

1.一种电子元器件模块,该电子元器件模块具有以下结构:即,在形成有多个基板电极的基板上,具有多个焊盘电极的电子元器件单元以所述基板电极和所述焊盘电极相对的方式进行配置,所述基板电极和焊盘电极通过焊料凸点进行电连接,其特征在于,所述电子元器件模块包括: 柱状电极,该柱状电极形成于所述焊盘电极上; 焊盘凸点,该焊盘凸点形成于所述柱状电极的前端;以及环状电极,该环状电极以包围所述柱状电极的方式形成于所述焊盘电极上, 所述环状电极与所述柱状电极不连接,且所述环状电极与所述焊盘凸点不连接。 An electronic component module, the electronic component module has the following structure: That is, the substrate is formed with a plurality of electrodes on a substrate, the electronic component unit having a plurality of pad electrodes to the electrode and the substrate mode pad electrodes opposing configuration, the pad electrode and the substrate electrode are electrically connected by solder bumps, wherein said electronic component module comprising: a columnar electrode, the columnar electrode is formed on the pad electrode on; bump pads, bump pads formed on the front end of the columnar electrodes; and ring electrodes, the ring electrode to surround the columnar electrodes are formed on the pad electrode, said ring shaped electrode and the columnar electrode are not connected, and the annular electrode and the bump pad is not connected.
2.如权利要求1中所述的电子元器件模块,其特征在于, 所述环状电极以从所述焊盘电极的表面突出的方式来形成。 2. The electronic component module according to claim 1, wherein said annular electrode to protrude from the surface of the pad electrode is formed manner.
3.如权利要求1或者2中所述的电子元器件模块,其特征在于, 在所述基板和所述电子元器件单元之间填充了树脂。 1 or the electronic component module according to claim 2, characterized in that, between the substrate and the electronic component unit is filled with a resin.
4.如权利要求3中所述的电子元器件模块,其特征在于, 所述环状电极的高度比所述柱状电极的高度要高,所述环状电极与所述基板电极相抵接。 4. The electronic component module as in claim 3 as claimed in claim, wherein said annular electrode to a height higher than the height of the columnar electrodes, the annular electrode and the substrate electrode is brought into contact.
5.如权利要求4中所述的电子元器件模块,其特征在于, 除了由所述焊盘电极、所述环状电极、以及所述基板电极所构成的空间以外,在所述基板和所述电子元器件单元之间填充了树脂。 5. The electronic component module according to claim 4, characterized in that, in addition to by the pad electrode, the annular electrode and the substrate electrode space formed in the substrate and the said resin filled between the electronic component unit.
6.如权利要求1至2及4至5中所述的任一电子元器件模块,其特征在于, 在所述基板电极上,至少设置所述柱状电极及所述环状电极之中的一个。 6. 1-2 and 4-5 in any one of the electronic component module according to claim, wherein the electrode on the substrate, at least one among the pillar-shaped electrode and the annular electrode .
7.如权利要求3中所述的电子元器件模块,其特征在于, 在所述基板电极上,至少设置所述柱状电极及所述环状电极之中的一个。 7. The electronic component module as in claim 3 as claimed in claim, wherein the electrode on the substrate, at least one among the pillar-shaped electrode and the annular electrode.
8.一种电子元器件单元,其特征在于,具有电子元器件主体,该电子元器件主体具有安装面; 多个焊盘电极,该多个焊盘电极形成于所述安装面上; 柱状电极,该柱状电极形成于所述焊盘电极上; 焊料凸点,该焊料凸点形成于所述柱状电极的前端;以及环状电极,该环状电极以包围所述柱状电极的方式形成在所述焊盘电极上, 所述环状电极与所述柱状电极不连接,且所述环状电极与所述焊盘凸点不连接。 An electronic component unit, wherein the electronic component having a main body, the electronic component body having a mounting surface; a plurality of pad electrodes, the plurality of pad electrodes formed on the mounting surface; columnar electrode the columnar electrode formed on the pad electrode; solder bumps, the solder bumps formed on the front end of the columnar electrodes; and ring electrodes, the ring electrode to surround the columnar electrodes are formed in the said pad electrodes on the annular electrode and the columnar electrode are not connected, and the annular electrode and the bump pad is not connected.
CN201280005003.3A 2011-01-26 2012-01-25 The electronic component module and the electronic component unit CN103299410B (en)

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