CN1692685A - Module comprising built-in electronic components - Google Patents

Module comprising built-in electronic components Download PDF

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Publication number
CN1692685A
CN1692685A CNA2003801001779A CN200380100177A CN1692685A CN 1692685 A CN1692685 A CN 1692685A CN A2003801001779 A CNA2003801001779 A CN A2003801001779A CN 200380100177 A CN200380100177 A CN 200380100177A CN 1692685 A CN1692685 A CN 1692685A
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CN
China
Prior art keywords
electronic unit
assembly
insulating resin
electrode
substrate
Prior art date
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Granted
Application number
CNA2003801001779A
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Chinese (zh)
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CN1692685B (en
Inventor
川本英司
叶山雅昭
胜又雅昭
矢部裕城
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
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Publication date
Priority claimed from JP2003199254A external-priority patent/JP4341321B2/en
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority claimed from PCT/JP2003/016427 external-priority patent/WO2004060034A1/en
Publication of CN1692685A publication Critical patent/CN1692685A/en
Application granted granted Critical
Publication of CN1692685B publication Critical patent/CN1692685B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

A module includes an electronic component having at least two electrodes, a board having electrodes on its surface to be connected to the electrodes of the electronic component, respectively, solders for connecting the electrodes of the electronic component to the electrodes of the board, respectively, an insulating resin covering the electronic component, the surface of the board, the solder, and the electrodes, and solder resists provided on the surface of the board and around the electrodes of the board, respectively. One of the solder resists is separated from the other electrode at a portion between the electronic component and the board. When this module is mounted on a motherboard, the solder does not flow out of the electrodes even when the solder in the insulating resin melts.

Description

The assembly of interior electronic parts
Technical field
The present invention relates to be contained in the electronic unit of component internal, particularly relate to have circuit board, configuration in the above electronic unit and cover the assembly of the insulating resin of this electronic unit.
Background technology
In recent years, the miniature electric machine of the assembly of electronic parts is sharply popularized in using, and this electronic unit has substrate and a plurality of electronic units mounted thereto and covers the resin moulded parts of this electronic unit.Figure 17 adorns the sectional view of the assembly 101 of the resin molded electronic unit of existing usefulness in being.Wiring figure 111 and electrode 103 form on the surface of circuit board 102, and its surface covers with solder protective film 106.Form inner gateways (innervia) 110 at circuit board 102 internal layers, inner gateway 110 and wiring figure 112 and be electrically connected in the backplate 113 of the back side of circuit board 102 formation.Electrode 113 is provided with and is used for the scolder 114 that is connected with the main substrate (not shown) overleaf.After connecting electronic unit 104 and electrode 103 with scolder 105, utilize insulating resin 107 to cover the surface of circuit board 102, make electronic unit 104 is wrapped.On the surface of assembly 101, be provided with the electromagnetic-field-shielded layer 115 that forms by metal plating.
In existing assembly 101, utilize scolder or closing line (bonding wire) that electronic unit 104 is installed and be connected on the circuit board 102.
Utilize the installation of closing line, owing to will use wire-bonds, therefore the area that installation need be also bigger than the area of electronic unit 104 is unfavorable for the miniaturization of e-machine.
The installation that utilizes scolder to carry out though must there be chamfering the end of electrode 103, can use the area that almost completely equates with electronic unit that electronic unit is installed, and is therefore, favourable to the miniaturization of e-machine.But, for the short circuit that prevents that scolder from causing, the essential electrode part in addition that covers circuit board 102 surfaces with solder protective film 106.The short circuit that interelectrode scolder causes in order to prevent to install, the amount of solder of use is considerably less.Therefore; gap 107A between electronic unit 104 after the installation and the circuit board 102 that covers with solder protective film 106 approximately has only about 10 microns (μ m); when with the molded electronic unit 104 of insulating resin 107, insulating resin 107 can not enter among the 107A of gap fully, forms the space.
Utilize scolder to engage with main substrate in case will have the assembly 101 in the space that forms in the 107A of gap, once more during fusion, the scolder 105 of fusion just flows out gap 107A to scolder 105 in assembly 101.As a result, between electrode 103, cause short trouble, the function of infringement assembly 101.
For insulating resin being filled among the gap 107A between electronic unit 104 and the circuit board 102, the Vacuum printing method has been proposed.Usually, particle diameter is the SiO of tens of μ m 2Cooperate with insulating resin Deng inorganic filler.Therefore, even use the Vacuum printing method, that the gap 107A about insulating resin filling 10 μ m is still very difficult.
As between electronic unit 104 and photoresist 106, use the underfilling (underfill) of particle diameter below 10 μ m, then can bury gap 107A, but because this underfilling has used the inorganic filler of segmentation, so cost an arm and a leg.
Figure 18 is the sectional view of interior dress with another existing assembly of the molded electronic unit of insulating resin.Wiring figure 1111 and electrode 1103 are formed on the surface of circuit board 1102, and its surface covers with solder protective film 1116.Be provided with inner gateway 1110 and wiring figure 1112 in the inside of circuit board 1102.Be provided with backplate 1113 and scolder 1114 at the back side of circuit board 1102.The electrode 1106 of electronic unit 1104 and the electrode 1103 of circuit board 1102 utilize scolder 1105 to connect, and cover the surface of circuit board 1102 then with insulating resin 1107, and electronic unit 1104 is surrounded.On the surface of assembly 1110, be provided with the electromagnetic-field-shielded layer made from metal plating 1115.
Assembly 1100 utilizes scolder to be installed on the main substrate by refluxing.At this moment, scolder 1105 fusion once more in the assembly 1100, volumetric expansion.Because the volumetric expansion of scolder 1105, sometimes on the direction that a part of 1107A that makes electronic unit 1104 from the insulating resin 1107 that exists between electronic unit 1104 and the circuit board 1102 peels off stress application to electronic unit 1104.Therefore, scolder 1105 may short circuit between the electrode 1103 easily from flowing out between electronic unit 1104 and the insulating resin 1107.
In addition, open the 2001-24312 communique the spy, the spy opens and discloses in flat 11-163583 communique and the Te Kai 2001-168493 communique and assembly like the above-mentioned existing component class.
Summary of the invention
Assembly comprises: the electronic unit with at least two electrodes; The substrate that has the electrode that is connected with the electrode of electronic unit respectively on the surface; The scolder that the electrode of electronic unit is connected with the electrode of substrate; The insulating resin of overlay electronic parts, substrate surface, scolder and electrode; Be located at respectively on the substrate surface and also be located at solder protective film around the electrode of substrate.A scolder protection mould between electronic unit and substrate, separates with another solder protective film at least.
When this assembly was installed on the main substrate, even the melt solder in the insulating resin, scolder can not flow out to outside the electrode yet.
Description of drawings
The sectional view of the assembly of Figure 1A embodiments of the present invention 1.
Figure 1B represents the assembly of execution mode 1 and its main substrate is installed.
Fig. 2 is the vertical view of circuit board of the assembly of execution mode 1.
Fig. 3 is the vertical view of circuit board of the assembly of execution mode 1.
Fig. 4 is the sectional view of circuit board of the assembly of embodiment of the present invention 2.
Fig. 5 is the sectional view of circuit board of the assembly of embodiment of the present invention 3.
Fig. 6 is the vertical view of circuit board of the assembly of execution mode 3.
Fig. 7 is the sectional view of the assembly of execution mode 3.
Fig. 8 is the vertical view of circuit board of the assembly of execution mode 3.
Fig. 9 is the sectional view of the assembly of embodiment of the present invention 4.
Figure 10 is the vertical view of circuit board of the assembly of execution mode 4.
Figure 11 is the sectional view of the assembly of execution mode 4.
Figure 12 is the vertical view of circuit board of the assembly of execution mode 4.
Figure 13 A is the assembly sectional view of embodiments of the present invention 5.
Figure 13 B represents the assembly of execution mode 5 and its main substrate is installed.
Figure 14 A is the front view of electronic unit of the assembly of enforcement 5～7 of the present invention.
Figure 14 B is the sectional view of circuit board of the assembly of execution mode 5～7.
Figure 15 is the sectional view of the assembly of execution mode 6.
Figure 16 is the sectional view of the assembly of execution mode 7.
Figure 17 is the sectional view of existing assembly.
Figure 18 is the sectional view of existing another assembly.
Embodiment
(execution mode 1)
Figure 1A is the sectional view of assembly 1 of the electronic unit 4 of interior dress embodiments of the present invention 1.The circuit board 2 of multilayer has electrode 3 and wiring figure 11 on surperficial 2A, have wiring figure 12 and inner gateway 10 in inside, and 2B forms backplate 13 and solder protective film 6 overleaf.
Fig. 2 is two electrodes 3 being connected with an electronic unit 4 of circuit board 2 and the vertical view of peripheral part thereof.Electrode 3 on the surperficial 2A of circuit board 2 is surrounded by solder protective film 6.6 of solder protective films form around electrode 3, and the solder protective film 6 around two adjacent electrodes 3 leaves mutually, does not connect below electronic unit 4.Like this, between electronic unit 4 and circuit board 2, form the very gap of large-spacing.And a part of 7A of the insulating resin 7 of conduct first insulating resin in the gap is fills up between electronic unit 4 and the circuit board 2 easily.In addition, insulating resin 7 and a part of 7A thereof and circuit board 2 direct driving fits.Therefore, the area of the insulating resin 7 that the weak solder protective film 6 of the resin material of resin 7,7A and closing force joins just can diminish, and insulating resin 7 and circuit board 2 will firm engagement.
Fig. 3 is the electrode 3 that is connected with a plurality of electronic units 4 of circuit board 2 and the vertical view of peripheral part thereof.Because resin 7 easy fillings beyond below electronic unit 4, therefore the solder protective film 6 on every side of the electrode 3 that is connected with the electronic unit 4 of mutual vicinity respectively also can connect.
Wiring figure 11,12 usefulness Cu paper tinsels are made, but are also availablely made by other materials that constitute, that have conductivity such as electroconductive resin constituents.
Inner gateway 10 is made by thermosetting conductive material.As this conductive material, for example can use the constituent of the electroconductive resin that metallic and thermosetting resin are mixed.As this metallic, can use Au, Ag or Cu.Because the conductivity height, Au, Ag or Cu become preferably, preferred especially Cu, and its conductivity height, migration (migration) is little, low price.As thermosetting resin, can use epoxy resin, phenolic resins or cyanate ester resin, but special preferred epoxy are because its thermal endurance height.
Electronic unit 4 utilizes scolder 5 to be installed on the assigned position of circuit board 2.Electronic unit 4 is shaped like chips parts or surface-mounted passive blocks such as ticker, filter such as resistance, electric capacity or inductance.
Figure 1B represents assembly 1 and installs its main substrate 90, and the scolder 14 of assembly 1 is connected with electrode 91 on the main substrate 90.In scolder 5, can use the eutectic solder of Pb-Sn system or the scolder that does not have Pb that for example Sn-Ag-Cu is, Au-Sn is or Sn-Zn is.Be used to that the scolder 5 of electronic unit 4 is installed and be used for assembly 1 is installed in scolder 14 on the main substrate 90, can constitute identical material, also can be different materials.In recent years, consider, wish all to adopt the scolder that does not have Pb from problem of environment.
Insulating resin 7 complete overlay electronic parts 4, insulating resin 7 is made of the mixture that comprises inorganic filler and thermosetting resin.In inorganic filler, can use for example Al 2O 3, MgO, BN, AlN, SiO 2And BaTiO 3Preferably, inorganic filler cooperates with resin 7 in 50 weight %-95 weight % scopes.In this scope, insulating resin 7 can form the above wall thickness (for example 1mm) of height of electronic unit 4.When inorganic filler than 50 weight % after a little while, insulating resin 7 mobile big can not form the above wall thickness of height of electronic unit 4.In addition; contain mobile little more than the insulating resin 7 of the inorganic filler of 95 weight %; can not overlay electronic parts 4; the particle diameter of inorganic filler; littler than the interval of removing circuit board 2 beyond the solder protective film 6 and electronic unit 4; by reducing particle diameter, insulating resin is filled between electronic unit 4 and the circuit board 2.The thermosetting resin that comprises in insulating resin 7 can use epoxy resin, phenolic resins or cyanate ester resin.But special preferred epoxy is because its thermal endurance height.
On the surface of insulating resin 7, formed the metal film 15 of electromagnetic-field-shielded effect.Metal film 15 uses at least a above in the metal materials such as Au, Ag, Cu, Ni, Cr, Zn, Ti, Al, Sn and forms.
Shown in Figure 1A, utilize the thickness of solder protective film 6 and the floating of the electronic unit 4 that when electronic units 4 being installed, produces with scolder 5, between electronic unit 4 and circuit board 2, form the space that highly is about 50 μ m.The size ratio electronic unit 4 by making the inorganic filler that contains in the insulating resin 7 and the gap 50 μ m of circuit board 2 are little, and insulating resin 7 is filled between electronic unit 4 and the circuit board 2 easily.In addition, owing to do not need to use the little inorganic filler of particle diameter below 10 μ m, therefore can on the thickness more than electronic unit 4 height (for example 1mm), form insulating resin 7.Particle diameter is the inorganic filler low price about 50 μ m.
Because insulating resin 7 and circuit board 2 direct driving fits, thus can reduce with closing force a little less than the area of part of insulating resin 7 of solder protective film 6 driving fits, can engage insulating resin 7 and circuit board 2 securely.
Utilize above structure, filling insulating resin 7 between electronic unit 4 and circuit board 2 easily, like this, when being installed in assembly 1 on the main substrate 90, even scolder 5 fusions, insulating resin 7 also become the wall that prevents that scolder 5 from flowing out, can prevent the short circuit between electrode 3.
The crooked elastic rate of preferred insulating resin 7 is below 20Gpa.Under the crooked elastic rate of insulating resin 7 situation bigger than 20Gpa, when the volumetric expansion when the fusion again of scolder 5 caused stress on insulating resin 7, the stress that suppresses the volumetric expansion of scolder 5 played a role.These stress are uneven mutually, and the result cracks on insulating resin 7, and the scolder 5 of fusion can make the characteristic degradation of assembly 1 from this crackle outflow.Because resin 7 has the following crooked elastic rate of 20Gpa, the volumetric expansion when following scolder 5 fusions, insulating resin 7 can be out of shape.Like this, in insulating resin 7, can not crack, can prevent that the scolder 5 of fusion from flowing out.As a result, can not produce the short circuit that causes because of scolder, the characteristic of assembly 1 can not worsen.
(execution mode 2)
Fig. 4 is the sectional view of assembly 1B of the electronic unit 4 of interior dress embodiments of the present invention 2.The structure identical with execution mode 1 is with identical symbolic representation, and it illustrates omission.Around electronic unit 4, form the insulating resin 7B that makes by the material identical with the insulating resin 7 of the execution mode shown in Figure 1A.As shown in Figure 4, same with execution mode 1, only around electrode 3, form solder protective film 6, the interval of electronic unit 4 and circuit board 2 is big.Filling insulating resin 8 between electronic unit 4 and circuit board 2.In addition, form the insulating resin 7B of overlay electronic parts 4, insulating resin 8 and circuit board 2.Then, on insulating resin 7B surface, formed the metal film 15 of electromagnetic-field-shielded function.
Insulating resin 8 is made of the mixture that contains inorganic filler and thermosetting resin.Can use Al in the inorganic filler 2O 3, MgO, BN, AlN, SiO 2And BaTiO 3Inorganic filler cooperates with insulating resin 8 in 10 weight %-70 weight % scopes.Insulating resin 8 is in order to be filled between electronic unit 4 and the circuit board 2, and is essential mobile big.Insulating resin 8 need not to resemble and forms heavy wall the insulating resin 7B on the outer surface of electronic unit 4.Therefore, the cooperation ratio of inorganic filler is lower than insulating resin 7B.That is, in the assembly 1B of execution mode shown in Figure 42, first insulating resin of the assembly 1 of execution mode 1 shown in Figure 1 is by constituting as the insulating resin 8 of second insulating resin with as the insulating resin 7B of the 3rd insulating resin.Insulating resin 7B is positioned on the electronic unit 4 of substrate 2 opposition sides.
Insulating resin 8 can play between electronic unit 4 and circuit board 2, the effect of the wall that scolder flows out when preventing scolder 5 fusions.Do not contain fully 8 li of insulating resins under the situation of inorganic filler, its common flowability is very big, so scolder 5 flows out easily, can not play wall.Therefore, insulating resin 8 must contain inorganic filler.Be considered as the function and the flowability of wall, should comprise the inorganic filler of 10 weight %～70 weight % in the insulating resin 8.Like this, easily insulating resin 8 is filled between electronic unit 4 and the circuit board 2.
Same with execution mode 1, because insulating resin 8 and circuit board 2 direct driving fits, so they can engage mutually securely.
7B is same with insulating resin, and insulating resin 8 preferably has the following crooked elastic rate of 20Gpa.Insulating resin 8 by crooked elastic rate under the situation that the material more than the 20Gpa is made, on insulating resin 8, stress that volumetric expansion during scolder 5 fusions produces and the stress that suppresses the volumetric expansion of scolder 5 play a role.These unequal power distributions cause the result to crack in insulating resin 8, and the scolder 5 of fusion flows out from this crackle, makes the characteristic degradation of assembly 1A.Crooked elastic rate by making insulating resin 8 below 20Gpa, the volumetric expansion when insulating resin 8 can be followed scolder 5 fusions and being out of shape.Therefore insulating resin 8 does not crack, and can prevent that the scolder 5 of fusion from flowing out.Like this, can not produce the short circuit that causes because of scolder, the characteristic of assembly 1A can not worsen.
(execution mode 3)
Fig. 5 is the sectional view of assembly 1C of the electronic unit of interior dress embodiments of the present invention 3.Fig. 6 is the vertical view of circuit board 2C of the assembly 1C of execution mode 3.Fig. 7 is the sectional view of another assembly 1D of execution mode 3, and Fig. 8 is the vertical view of circuit board 2D of the assembly 1D of execution mode 3.The structure identical with execution mode 1, with identical symbolic representation, it illustrates omission.
As shown in Figure 5 and Figure 6, same with execution mode 1, on assembly 1C, also only around the electrode 3 on the surface of circuit board 2C, form solder protective film 6,6C, utilize scolder 5 that electronic units 4 are installed.Also can utilize scolder 25 that electronic unit 24 is installed.
Electronic unit 24 for example be transistor, IC, LSI etc. surface installing types such as semiconductor element at source block.Same with execution mode 1, between electronic unit 24 and circuit board 2, form the insulating resin 7 of the height of electronic unit 4,24 with wall thickness.The interval of electronic unit 24 and circuit board 2 compared with the interval as the electronic unit 4 and the circuit board 2 of passive component, is set greatly.The electrode 23 of electronic unit 24 is present on the face relative with the substrate 2C of electronic unit 24, does not form the chamfering of the such scolder 5 of electronic unit 4.Therefore, scolder 25 broadens the interval of electronic unit 24 and circuit board 2 as pillar.Like this, the surface of the circuit board 2 of the position of installation electronic unit 24, the part beyond the available solder protective film 6C coated electrode 3.In addition, in Fig. 7 and another assembly 1D shown in Figure 8, the part that electronic unit 24 is installed only forms solder protective film 6D around electrode 3.
Utilize above structure, assembly 1C, 1D inside are equipped with source block 24 and passive component 4, can realize multiple function.
(execution mode 4)
Fig. 9 is the sectional view of the assembly 1E of the inner electronic unit that embodiments of the present invention 4 are installed.Figure 10 is the vertical view of the circuit board 2E of assembly 1E.Figure 11 is the sectional view of another assembly 1F of execution mode 4.Figure 12 is the vertical view of the circuit board 2F of assembly 1F.The structure identical with execution mode 1～3, with identical symbolic representation, it illustrates omission.
Because the area as the electronic unit 24 of active parts is bigger with respect to electronic unit 4, therefore, the difference of the thermal coefficient of expansion of electronic unit 24 and circuit board 2 causes bad connection easily.As shown in Figure 9, in order to relax the difference of thermal coefficient of expansion, between electronic unit 24 and circuit board 2, the insulating resin 9 that the filling thermal coefficient of expansion is bigger than electronic unit 24 and circuit board 2.
Because electronic unit 4 has the scolder chamfering, so when the insulating resin that thermal coefficient of expansion is big 9 is filled between electronic unit 4 and the circuit board 2, in the anti-stream operation of assembly 1E on being installed in main substrate, in case reach the above temperature of melting point of scolder, will cause scolder 5 to be peeled off owing to the expansion of insulating resin 9 from the electrode 3 on the circuit board 2.Then, scolder 5 is cooled to it below melting point, volume contraction, but because the volumetric expansion of insulating resin 9 is still bigger, and scolder 5 is solidification under the state of peeling off with electrode 3 just.That is,, cause broken string between scolder 5 and the electrode 3 through anti-stream operation.Therefore, not filling between electronic unit 4 and circuit board 2 of insulating resin 9.
As Fig. 9 and shown in Figure 10, utilize the thermal coefficient of expansion insulating resin 7 littler, overlay electronic parts 4 than insulating resin 9.In addition, in order to control the coating scope of insulating resin 9, between electronic unit 24 and electronic unit 4, form solder protective film 26 and become the wall that prevents that insulating resin 9 from flowing out.
In execution mode 4, also same with execution mode 3, the part beyond the surperficial top electrode 3 of the locational circuit board 2 that electronic unit 24 is installed, available solder protective film 6E covers.In Figure 11 and assembly 1F shown in Figure 12, on the surface of the locational circuit board 2F that electronic unit 24 is installed, only around electrode 3, form solder protective film 6F.
Utilize above structure, assembly 1E, 1F can be equipped with source block 24 and passive component 4 in inside, realize multiple function.
(execution mode 5)
Figure 13 A is the sectional view of the assembly 1001 of the inner electronic unit 1004 that embodiments of the present invention 5 are installed.Figure 14 A represents electronic unit 1004.Figure 14 B represents to be installed in the electrode 1003 of the circuit board 1002 of assembly 1001 inside.
Multi-layer wire substrate 1002 has electrode 1003 and the wiring figure 1012 on its surperficial 1002A; The inner gateway 1010 of internal layer; With the backplate 1013 on the 1002B of the back side.Electrode 1013 is provided with scolder 1014 overleaf, is provided with the solder protective film 1016 that surrounds scolder 1014 on the 1002B of the back side of circuit board 1002.Electrode 1003,1013 and wiring figure 1012 are made by the Cu paper tinsel, but also available other materials with conductivity of electroconductive resin constituent etc. are made.Inner gateway 1010 is made by the thermosetting conductive material of electroconductive resin constituent of hybrid metal particle and thermosetting resin etc.So the Au of metallic, Ag or Cu be because conductivity is high preferred, Cu is because the conductivity height, move little, low price, therefore special in preferably.As thermosetting resin, can use epoxy resin, phenolic resins or cyanate ester resin.Epoxy resin is owing to the thermal endurance height, so special in preferred.
Utilize scolder 1005, the electronic unit 1004 that will be provided with electrode 1006 at two ends is installed on the circuit board 1002.Electronic unit 1004 is by active parts such as semiconductor element such as transistor, IC, LSI, or surface installing type passive components such as resistance, electric capacity, inductance, ticker and filter constitute.
Figure 13 B represents assembly 1001 and its main substrate 1090 is installed.The scolder 1014 of assembly 1001 is connected with electrode 1091 on the main substrate 1090.Can use the eutectic solder of Pb-Sn system in scolder 1005, perhaps for example Sn-Ag-Cu system, Au-Sn are or the scolder that does not have Pb of Sn-Zn system, but any one melting point is all below 230 ℃, even electronic unit 1004 also can use for nonrefractory property.The scolder 1005 of installation electronic unit 1004 usefulness is installed in the scolder of using on the main substrate 1,090 1014 with the assembly 1001 with interior electronic parts can be identical material, also can be different materials.In recent years, when considering environmental problem, wish that scolder 1005,1004 all uses the scolder that does not have Pb.
Insulating resin 1007 complete overlay electronic parts 1004, and enter fully between electronic unit 1004 and the circuit board 1002.Insulating resin 1007 is made by the mixture that comprises inorganic filler and thermosetting resin.Can use Al in the inorganic filler 2O 3, MgO, BN, AlN, SiO 2And BaTiO 3Deng.Inorganic filler cooperates with insulating resin 1007 in 50 weight %-95 weight % scopes.In this scope, insulating resin 1007 can form with the wall thickness more than the height of electronic unit 1004 (for example 1mm).When being less than 50 weight %, the flowability of insulating resin 1007 is big, can not keep the shape with above-mentioned wall thickness.Formation contains more than the insulating resin 1007 of the inorganic filler of 95 weight % difficult.The size ratio circuit board 1002 of inorganic filler and the interval L1 of electronic unit 1004 are little.By reducing particle diameter, insulating resin 1007 is filled between electronic unit 1004 and the circuit board 1002.In the thermosetting resin that in insulating resin 1007, contains, preferred epoxy, phenolic resins or cyanate ester resin.Because it is epoxy resin thermal endurance height, so special as preferred.
On the surface of insulating resin 1007, formed the metal film 1015 of electromagnetic-field-shielded effect.Metal film 1015 is made more than using at least a in the metal materials such as Au, Ag, Cu, Ni, Cr, Zn, Ti, Al, Sn.
Shown in Figure 14 A and Figure 14 B, in assembly 1001, the interval S of the electrode 1006 of electronic unit 1004 CAnd the interval S of the electrode 1003 of circuit board 1002 SSatisfy S C〉=S SRelation.When assembly 1001 is installed on the main substrate, during scolder 1005 fusions, the stress that the volumetric expansion that is caused by scolder 1005 fusions produces according to above-mentioned relation, is pressed on the electronic unit 1004 a part of 1007A of the insulating resin 1007 between electronic unit 1004 and the circuit board 1002.Like this, scolder 1005 is not from flowing out between electronic unit 1004 and the insulating resin 1007.Can not produce the inter-electrode short-circuit that causes by scolder 1005 fusions.
In addition, the folded angle [alpha] of the outline 1005A of the below of the electronic unit 1004 of the lower surface of the electronic unit 1004 of scolder 1005 and scolder 1005 is the obtuse angle more than 90 °.The angle beta that the exterior contour of scolder 1005 and electrode 1003 form is the acute angle below 90 °.That is to say that the exterior contour 1005A of scolder 1005 along with near circuit board 1002, extends to approaching mutually direction separately from electronic unit 1004.Like this, scolder 1005 demi-inflations below electronic unit 1004 existence are pressed on the electronic unit 1004 a part of 1007A of the insulating resin 1007 between electronic unit 1004 and the circuit board 1002.Therefore, the interface driving fit reliably of electronic unit 1004 and insulating resin 1007A, scolder 1005 can not flow out.Like this, because insulating resin 1007 and circuit board 1002 all are resin, when sclerosis insulating resin 1007, circuit board 1002 and insulating resin 1007 are engaged securely.So even for the stress that is produced by the expansion of scolder 1005, circuit board 1002 and insulating resin 1007 also can very engage securely, scolder 1005 does not flow out to these interfaces.
Make the lower surface of electronic unit 1004, that is, the angle [alpha] that forms with the outline of scolder 1005 facing surfaces and scolder 1005 is not that acute angle is very important.
In addition, for the influence of the expansion that relaxes scolder 1005, insulating resin 1007 is made of the material with the low crooked elastic rate below the 20Gpa.
(execution mode 6)
Figure 15 is the sectional view of assembly 1001A of the electronic unit 1006 of interior dress embodiments of the present invention 6, and the structure identical with execution mode 5 is with identical symbolic representation, and it illustrates omission.
As shown in figure 15, same with execution mode 5, the interval S of the electrode 1006 of electronic unit 1004 CInterval S with the electrode 1003 of circuit board 1002 SSatisfy S C〉=S SRelation.In addition, the exterior contour angulation α of face relative with the scolder 1005 of electronic unit 1004 and scolder 1005 is more than 90 °.On the upper surface of circuit board 1002, make solder protective film 1017.But on the part of the circuit board 1002 relative, do not make solder protective film 1017 with electronic unit 1004.Like this, can form big space between electronic unit 1004 and circuit board 1002, because this space, insulating resin 1007 can be filled between electronic unit 1004 and the circuit board 1002 reliably.
The face angulation β of the outline of scolder 1005 and electrode 1003 is the acute angle less than 90 °, even therefore scolder 1005 fusions are expanded scolder 1005, solder protective film 1017 also can play the effect of the wall that prevents that scolder 1005 from flowing out.
Scolder 1005 melting expansions as mentioned above, utilize solder protective film 1017, even can prevent that also it from from flowing out between electronic unit 1004 and the circuit board 1002, can prevent the short circuit of electrode 1003,1006.
(execution mode 7)
Figure 16 is the sectional view of assembly 1001B of the electronic unit 1004 of interior dress embodiments of the present invention 7.The structure identical with execution mode 5, with identical symbolic representation, it illustrates omission.
Same with execution mode 5, in assembly 1001B, the interval S of the electrode 1006 of electronic unit 1004 CInterval S with the electrode 1003 of circuit board 1002 S, the satisfied S that concerns C〉=S SIn addition, the angle [alpha] that forms of the outline of face relative with the circuit board 1002 of electronic unit 1004 and scolder 1005 is more than 90 °.
Only around electrode 1003, form solder protective film 27.When being installed in electronic unit 1004 on the circuit board 1002 with scolder 1005, solder protective film 27 can prevent to flow out because of scolder 1005 poor short circuit of the electrode 1003,1006 that causes.Because 27 of solder protective films form around electrode 1003, therefore, the space between electronic unit 1004 and the circuit board 1002 is roomy again.Utilize this space, can reliably insulating resin 1007 be filled between electronic unit 1004 and the circuit board 1002.
In addition; the face that the electrode 1006 of circuit board 1002 and electronic unit 1004 are relative; with the outline angulation β of scolder 1005 be acute angle less than 90 °, even scolder 1005 melting expansions, solder protective film 27 also can play the effect of the wall that prevents that scolder 1005 from flowing out.
As mentioned above, utilize solder protective film 27, even expand during scolder 1005 fusions, also can prevent because of scolder 1005 from flowing out the poor short circuit of the electrode 1003,1006 that causes between electronic unit 1004 and the circuit board 1002.
In addition, the shape of the scolder 1005 of the assembly of execution mode 5～7 also is applicable to the scolder 5 of the assembly of execution mode 1～4, has effect same.
The possibility of utilizing on the industry
Utilize the assembly of interior electronic parts of the present invention, insulating resin can be filled between electronic unit and the circuit board reliably.Like this, when being installed in assembly on the main substrate, can prevent that the scolder of fusion from flowing out to outside the electrode.

Claims (24)

1. assembly is characterized in that having:
First electronic unit with first and second electrodes;
The substrate that on first surface, has third and fourth electrode that is connected with described first and second electrodes of described first electronic unit respectively;
First and second scolders that are connected with described third and fourth electrode of described first and second electrodes of described first electronic unit and described substrate respectively;
Cover first insulating resin of described first electronic unit, described substrate described first, described first and second scolders and described first to the 4th electrode;
Be located on described first of described substrate, and be located at first solder protective film around the described third electrode; With
Being located on described first of described substrate, and being located at around described the 4th electrode, is at least between described first electronic unit and described substrate, second solder protective film that separates with described first solder protective film.
2. assembly as claimed in claim 1 is characterized in that,
Described first and second solder protective films only be located at respectively described third and fourth electrode around.
3. assembly as claimed in claim 1 is characterized in that,
Described first insulating resin contains:
Thermosetting resin; With
Have the inorganic fillers particle diameter littler, 50 weight %～95 weight % than the interval of described substrate and described first electronic unit.
4. assembly as claimed in claim 1 is characterized in that,
Described first insulating resin has:
Be located at second insulating resin between described first electronic unit and described substrate and described first and second scolders; With
Different the 3rd insulating resins with the composition of described second insulating resin,
Described first electronic unit is between described the 3rd insulating resin and described substrate.
5. assembly as claimed in claim 4 is characterized in that,
Described second insulating resin has:
Thermosetting resin; With
Have the inorganic fillers particle diameter littler, 10 weight %～70 weight % than the interval of described substrate and described first electronic unit.
6. assembly as claimed in claim 4 is characterized in that,
Described second insulating resin has the following crooked elastic rate of 20GPa.
7. assembly as claimed in claim 4 is characterized in that,
The metal film that also has the full surface that covers described the 3rd insulating resin.
8. assembly as claimed in claim 1 is characterized in that,
Described first insulating resin has the following crooked elastic rate of 20GPa.
9. assembly as claimed in claim 1 is characterized in that, also comprises:
Second electronic unit with the 5th and the 6th electrode;
Be located on described first of described substrate, respectively the 7th and the 8th electrode that is connected with the 6th electrode with the described the 5th of described second electronic unit;
Respectively with described second electronic unit the described the 5th with the described the 7th third and fourth scolder that is connected with the 8th electrode of the 6th electrode and described substrate; With
Be located at second insulating resin between described second electronic unit and the described substrate,
Described first resin covers described first and second electronic units, described substrate described first, described first to the 4th scolder and described first to the 8th electrode.
10. assembly as claimed in claim 9 is characterized in that,
Described first resin has:
Be located between described second parts and the described substrate, cover second insulating resin of described third and fourth scolder; With
Different with the composition of described second insulating resin, cover the 3rd insulating resin of described second insulating resin,
Described first and second electronic units are between described the 3rd insulating resin and described substrate.
11. assembly as claimed in claim 10 is characterized in that,
Also have, be located on described first of described substrate, and be located at described second and the wall of the borderline solder protective film of the 3rd insulating resin.
12. assembly as claimed in claim 10 is characterized in that,
Also have, be located on described first of described substrate, be located at third and fourth solder protective film around the described the 7th and the 8th electrode respectively.
13. assembly as claimed in claim 12 is characterized in that,
Described third and fourth solder protective film is disconnected from each other between described second electronic unit and described substrate at least.
14. assembly as claimed in claim 12 is characterized in that,
Described third and fourth solder protective film connects between described second electronic unit and described substrate at least.
15. assembly as claimed in claim 10 is characterized in that,
The thermal coefficient of expansion of described second insulating resin is bigger than the thermal coefficient of expansion of described the 3rd insulating resin.
16. assembly as claimed in claim 9 is characterized in that,
The described the 7th and the interval of the 8th electrode, the described the 5th with below the interval of the 6th electrode.
17. assembly as claimed in claim 1 is characterized in that,
The interval of described third and fourth electrode is below the interval of described first and second electrodes.
18. assembly as claimed in claim 1 is characterized in that,
The metal film that also has the full surface that covers described first insulating resin.
19. an assembly is characterized in that, comprising:
Electronic unit with first and second electrodes;
At the substrate that has third and fourth electrode that is connected with described first and second electrodes of described electronic unit respectively, be provided with the interval below the interval of described first and second electrodes on first;
Respectively with described first and second scolders that first is connected with second electrode and described third and fourth electrode of described electronic unit; With
Cover the insulating resin of described first and described first and two scolder of described electronic unit, described substrate.
20. the assembly of electronic parts is characterized in that in as claimed in claim 19,
First and second outlines of described first and second scolders between described electronic unit and described substrate along with near described circuit board, from described electronic unit, extend to approaching mutually direction.
21. assembly as claimed in claim 19 is characterized in that, also has:
Be located on described first of described substrate, be located at first solder protective film around the described third electrode; With
Be located on described first of described substrate, between described electronic unit and described substrate, separate at least, be located at second solder protective film around described the 4th electrode with described first solder protective film.
22. assembly as claimed in claim 21 is characterized in that,
Described first and second solder protective films only are located at around described third and fourth electrode.
23. assembly as claimed in claim 19 is characterized in that,
Also have, be located on second of described substrate, the 5th electrode that combines with described third electrode electricity.
24. assembly as claimed in claim 19 is characterized in that,
The metal film that also has the full surface that covers described insulating resin.
CN2003801001779A 2002-12-24 2003-12-22 Module comprising built-in electronic components Expired - Lifetime CN1692685B (en)

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