JP2004197220A - 電解処理装置及びその方法 - Google Patents

電解処理装置及びその方法 Download PDF

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Publication number
JP2004197220A
JP2004197220A JP2003399443A JP2003399443A JP2004197220A JP 2004197220 A JP2004197220 A JP 2004197220A JP 2003399443 A JP2003399443 A JP 2003399443A JP 2003399443 A JP2003399443 A JP 2003399443A JP 2004197220 A JP2004197220 A JP 2004197220A
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JP
Japan
Prior art keywords
substrate
electrode
electrolytic
plating
processed
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Pending
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JP2003399443A
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English (en)
Japanese (ja)
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JP2004197220A5 (enExample
Inventor
Natsuki Makino
夏木 牧野
Junji Kunisawa
淳次 國澤
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Ebara Corp
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Ebara Corp
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Priority to JP2003399443A priority Critical patent/JP2004197220A/ja
Publication of JP2004197220A publication Critical patent/JP2004197220A/ja
Publication of JP2004197220A5 publication Critical patent/JP2004197220A5/ja
Pending legal-status Critical Current

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JP2003399443A 2002-12-02 2003-11-28 電解処理装置及びその方法 Pending JP2004197220A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003399443A JP2004197220A (ja) 2002-12-02 2003-11-28 電解処理装置及びその方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002350529 2002-12-02
JP2003399443A JP2004197220A (ja) 2002-12-02 2003-11-28 電解処理装置及びその方法

Publications (2)

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JP2004197220A true JP2004197220A (ja) 2004-07-15
JP2004197220A5 JP2004197220A5 (enExample) 2007-01-18

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JP2003399443A Pending JP2004197220A (ja) 2002-12-02 2003-11-28 電解処理装置及びその方法

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JP (1) JP2004197220A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010084235A (ja) * 2010-01-18 2010-04-15 Ebara Corp めっき装置
CN101909813B (zh) * 2007-12-31 2015-03-18 康宁股份有限公司 用于形成软膏抛光垫的方法和装置
KR101805779B1 (ko) * 2010-12-28 2017-12-07 가부시키가이샤 에바라 세이사꾸쇼 전기도금방법
CN111383962A (zh) * 2018-12-28 2020-07-07 东京毅力科创株式会社 基板处理装置和基板处理装置的运转方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101909813B (zh) * 2007-12-31 2015-03-18 康宁股份有限公司 用于形成软膏抛光垫的方法和装置
JP2010084235A (ja) * 2010-01-18 2010-04-15 Ebara Corp めっき装置
KR101805779B1 (ko) * 2010-12-28 2017-12-07 가부시키가이샤 에바라 세이사꾸쇼 전기도금방법
CN111383962A (zh) * 2018-12-28 2020-07-07 东京毅力科创株式会社 基板处理装置和基板处理装置的运转方法

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