JP2004186261A - Ｉｃチップの製造方法 - Google Patents

Ｉｃチップの製造方法 Download PDF

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Publication number
JP2004186261A
JP2004186261A JP2002349189A JP2002349189A JP2004186261A JP 2004186261 A JP2004186261 A JP 2004186261A JP 2002349189 A JP2002349189 A JP 2002349189A JP 2002349189 A JP2002349189 A JP 2002349189A JP 2004186261 A JP2004186261 A JP 2004186261A
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JP
Japan
Prior art keywords
wafer
double
adhesive tape
support plate
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002349189A
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English (en)
Japanese (ja)
Other versions
JP2004186261A5 (enrdf_load_stackoverflow
Inventor
Munehiro Hatakei
宗宏 畠井
Masateru Fukuoka
正輝 福岡
Satoshi Hayashi
聡史 林
Shigeru Danjo
滋 檀上
Yasuhiko Oyama
康彦 大山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2002349189A priority Critical patent/JP2004186261A/ja
Publication of JP2004186261A publication Critical patent/JP2004186261A/ja
Publication of JP2004186261A5 publication Critical patent/JP2004186261A5/ja
Withdrawn legal-status Critical Current

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Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2002349189A 2002-11-29 2002-11-29 Ｉｃチップの製造方法 Withdrawn JP2004186261A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002349189A JP2004186261A (ja) 2002-11-29 2002-11-29 Ｉｃチップの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002349189A JP2004186261A (ja) 2002-11-29 2002-11-29 Ｉｃチップの製造方法

Publications (2)

Publication Number Publication Date
JP2004186261A true JP2004186261A (ja) 2004-07-02
JP2004186261A5 JP2004186261A5 (enrdf_load_stackoverflow) 2005-02-17

Family

ID=32751813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002349189A Withdrawn JP2004186261A (ja) 2002-11-29 2002-11-29 Ｉｃチップの製造方法

Country Status (1)

Country Link
JP (1) JP2004186261A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008016624A (ja) * 2006-07-05 2008-01-24 Sekisui Chem Co Ltd 半導体の製造方法
JP2009184073A (ja) * 2008-02-06 2009-08-20 Sekisui Chem Co Ltd 研磨布固定用両面粘着テープ及びこれを用いた研磨布積層体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008016624A (ja) * 2006-07-05 2008-01-24 Sekisui Chem Co Ltd 半導体の製造方法
JP2009184073A (ja) * 2008-02-06 2009-08-20 Sekisui Chem Co Ltd 研磨布固定用両面粘着テープ及びこれを用いた研磨布積層体

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