JP2004182983A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2004182983A5 JP2004182983A5 JP2003389455A JP2003389455A JP2004182983A5 JP 2004182983 A5 JP2004182983 A5 JP 2004182983A5 JP 2003389455 A JP2003389455 A JP 2003389455A JP 2003389455 A JP2003389455 A JP 2003389455A JP 2004182983 A5 JP2004182983 A5 JP 2004182983A5
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- tablet
- volume
- heat
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 12
- 239000000194 fatty acid Substances 0.000 claims description 12
- 229930195729 fatty acid Natural products 0.000 claims description 12
- -1 fatty acid esters Chemical class 0.000 claims description 11
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 8
- 239000011231 conductive filler Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 150000001298 alcohols Chemical class 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 150000005846 sugar alcohols Polymers 0.000 claims description 5
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 4
- 230000001186 cumulative effect Effects 0.000 claims description 4
- 150000004665 fatty acids Chemical class 0.000 claims description 4
- 235000011187 glycerol Nutrition 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 229920000412 polyarylene Polymers 0.000 claims description 4
- 150000007519 polyprotic acids Polymers 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- 125000003368 amide group Chemical group 0.000 claims description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- 150000007973 cyanuric acids Chemical class 0.000 claims description 2
- 238000001746 injection moulding Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 150000002894 organic compounds Chemical class 0.000 claims description 2
- 150000002989 phenols Chemical class 0.000 claims description 2
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 claims description 2
- 229920002545 silicone oil Polymers 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 150000003014 phosphoric acid esters Chemical class 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003389455A JP4407250B2 (ja) | 2002-11-22 | 2003-11-19 | ヒートシンク用錠剤、それから得られるヒートシンクおよび製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002339869 | 2002-11-22 | ||
| JP2003389455A JP4407250B2 (ja) | 2002-11-22 | 2003-11-19 | ヒートシンク用錠剤、それから得られるヒートシンクおよび製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004182983A JP2004182983A (ja) | 2004-07-02 |
| JP2004182983A5 true JP2004182983A5 (enExample) | 2007-01-11 |
| JP4407250B2 JP4407250B2 (ja) | 2010-02-03 |
Family
ID=32774711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003389455A Expired - Fee Related JP4407250B2 (ja) | 2002-11-22 | 2003-11-19 | ヒートシンク用錠剤、それから得られるヒートシンクおよび製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4407250B2 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4701645B2 (ja) * | 2003-07-09 | 2011-06-15 | 東レ株式会社 | 樹脂組成物、錠剤、成形品およびシャーシまたは筐体 |
| JP4691931B2 (ja) * | 2004-09-14 | 2011-06-01 | 東レ株式会社 | 色光合成光学系部品 |
| JP4973114B2 (ja) * | 2005-11-07 | 2012-07-11 | 東レ株式会社 | 樹脂組成物、それからなる錠剤の製造方法、および成形品 |
| JP5098384B2 (ja) * | 2007-03-16 | 2012-12-12 | 東レ株式会社 | フィラー高充填樹脂組成物、錠剤の製造方法およびそれからなる成形品 |
| JP5098385B2 (ja) * | 2007-03-16 | 2012-12-12 | 東レ株式会社 | 高誘電性樹脂組成物、錠剤の製造方法およびそれからなる成形品 |
| JP2010285581A (ja) * | 2009-06-15 | 2010-12-24 | Toyota Motor Corp | 絶縁樹脂組成物 |
| KR101380841B1 (ko) | 2012-04-19 | 2014-04-04 | 한국화학연구원 | 열전도성 및 내열성을 갖는 고분자 조성물의 성형품 제조방법 및 이에 의해 제조되는 열전도성 및 내열성을 갖는 고분자 조성물의 성형품 |
| KR20150118094A (ko) | 2013-02-13 | 2015-10-21 | 가부시키가이샤 도쿠야마 | 수지 조성물 및 그의 제조 방법, 고열전도성 수지 성형체 |
| US11905412B2 (en) * | 2019-04-03 | 2024-02-20 | Resonac Corporation | Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package |
| CN115678209B (zh) * | 2022-11-15 | 2024-07-30 | 九牧厨卫股份有限公司 | 一种用于制造高压模具的树脂组合物及其使用方法 |
| WO2024225391A1 (ja) * | 2023-04-28 | 2024-10-31 | 積水化学工業株式会社 | 熱伝導性シート |
-
2003
- 2003-11-19 JP JP2003389455A patent/JP4407250B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104726069B (zh) | 一种新型相变材料组合物 | |
| JP2004182983A5 (enExample) | ||
| JP6092806B2 (ja) | 酸化亜鉛粉体、放熱性フィラー、樹脂組成物、放熱性グリース及び放熱性塗料組成物 | |
| JP5814688B2 (ja) | 熱伝導性樹脂組成物およびそれを含む放熱材 | |
| JP2013089718A (ja) | 高熱伝導性樹脂を用いたヒートシンク及びｌｅｄ光源 | |
| JP2021513503A (ja) | グラフェンの変性方法、変性グラフェン及びグラフェンを含有する組成物 | |
| CA2468065A1 (en) | Optimised use of pcms in cooling devices | |
| TW200833758A (en) | Heat-dissipating resin composition, substrate for LED mounting, reflector, and substrate for LED mounting having reflector portion | |
| KR20010111034A (ko) | 전자 부품용 흡열부에서의 피씨엠의 용도 | |
| CN105482435A (zh) | 三维褶皱状石墨烯散热浆料、其制备方法及应用 | |
| US10093842B2 (en) | Moldable mass containing graphite and phase change material, process for producing a molding from the mass, and production methods of using the molding | |
| CN103435847A (zh) | 用于led灯具的高导热性复合材料、导热填料及生产设备 | |
| JP2004339290A (ja) | 樹脂組成物、成形品及び記録用光ピックアップベース | |
| CN105023892B (zh) | 芯片散热器 | |
| JP2010043229A (ja) | 伝熱性樹脂組成物およびその樹脂成形体 | |
| JP4407250B2 (ja) | ヒートシンク用錠剤、それから得られるヒートシンクおよび製造方法 | |
| CN104672911B (zh) | 一种基于碳纳米管掺杂的耐候型led用导热硅脂的制备方法 | |
| JP5846503B2 (ja) | Ｌｅｄ照明装置 | |
| CN104900794A (zh) | Led灯散热结构 | |
| JP2008133416A (ja) | 液晶ポリエステル樹脂組成物およびコネクター | |
| Heinle et al. | Potential of thermally conductive polymers for the cooling of mechatronic parts | |
| KR101967856B1 (ko) | 고열전도성 필름 및 그 제조 방법 | |
| JP2001214158A (ja) | 蓄熱材組成物 | |
| Ramesh et al. | Experimental investigation of carbon nanotube coated heat sink for LED thermal management | |
| TWI667338B (zh) | 用於高導熱材料之組成物 |