JP2004179662A - 封止を形成するための方法及びそのシステム - Google Patents

封止を形成するための方法及びそのシステム Download PDF

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Publication number
JP2004179662A
JP2004179662A JP2003396517A JP2003396517A JP2004179662A JP 2004179662 A JP2004179662 A JP 2004179662A JP 2003396517 A JP2003396517 A JP 2003396517A JP 2003396517 A JP2003396517 A JP 2003396517A JP 2004179662 A JP2004179662 A JP 2004179662A
Authority
JP
Japan
Prior art keywords
pressure
members
solder
seal
differential pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003396517A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004179662A5 (enExample
Inventor
George M Clifford
ジョージ・エム・クリフォード
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/306,463 external-priority patent/US20040099715A1/en
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JP2004179662A publication Critical patent/JP2004179662A/ja
Publication of JP2004179662A5 publication Critical patent/JP2004179662A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/14—Soldering, e.g. brazing, or unsoldering specially adapted for soldering seams
    • B23K1/18—Soldering, e.g. brazing, or unsoldering specially adapted for soldering seams circumferential seams, e.g. of shells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Measuring Fluid Pressure (AREA)
  • Wire Bonding (AREA)
JP2003396517A 2002-11-27 2003-11-27 封止を形成するための方法及びそのシステム Pending JP2004179662A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/306,463 US20040099715A1 (en) 2002-11-27 2002-11-27 System and method for seal formation
US10/352,287 US6820797B2 (en) 2002-11-27 2003-01-27 System and method for seal formation

Publications (2)

Publication Number Publication Date
JP2004179662A true JP2004179662A (ja) 2004-06-24
JP2004179662A5 JP2004179662A5 (enExample) 2007-01-18

Family

ID=32716824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003396517A Pending JP2004179662A (ja) 2002-11-27 2003-11-27 封止を形成するための方法及びそのシステム

Country Status (2)

Country Link
US (1) US6820797B2 (enExample)
JP (1) JP2004179662A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105612038A (zh) * 2013-08-29 2016-05-25 简易制造欧洲有限公司 用于生产三维物品的模具

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7469987B2 (en) * 2005-01-10 2008-12-30 Silverbrook Research Pty Ltd MST device for attachment to an adhesive surface
KR100681534B1 (ko) * 2005-07-25 2007-02-09 한국항공우주연구원 다중 금속판재의 확산접합용 치구와 이를 이용한 구조물제조방법 및 이에 의하여 제조된 구조물
US7686203B2 (en) * 2007-02-09 2010-03-30 Zimmer Technology, Inc. Direct application of pressure for bonding porous coatings to substrate materials used in orthopaedic implants
EP3040178B1 (en) * 2013-08-29 2018-04-25 Simplicity Works Europe S.L. Mold for producing three-dimensional items
CN116000401B (zh) * 2023-02-24 2023-09-12 芯朋半导体科技(如东)有限公司 一种锡焊真空炉

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01293636A (ja) * 1988-05-23 1989-11-27 Hitachi Ltd 気密封止チツプキヤリア
JP2000141300A (ja) * 1998-04-17 2000-05-23 Cp Clare Corp 内部空洞を有する微小構造体の作製方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4159075A (en) * 1977-12-02 1979-06-26 The Singer Company Hermetic bonded seal
US4659899A (en) * 1984-10-24 1987-04-21 The Perkin-Elmer Corporation Vacuum-compatible air-cooled plasma device
US5012479A (en) * 1988-01-11 1991-04-30 Hug William F Ultraviolet metal vapor laser having hard sealed internal mirrors
US5508833A (en) * 1992-07-10 1996-04-16 Kabushiki Kaisha Topcon Display apparatus sealed with a solvent-soluble fluorocarbon or fluorine-containing resin having an adhesive covalent bond-forming functional group
US5497727A (en) * 1993-09-07 1996-03-12 Lsi Logic Corporation Cooling element for a semiconductor fabrication chamber
US6388203B1 (en) * 1995-04-04 2002-05-14 Unitive International Limited Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby
US5799860A (en) * 1995-08-07 1998-09-01 Applied Materials, Inc. Preparation and bonding of workpieces to form sputtering targets and other assemblies
US5781258A (en) * 1996-06-13 1998-07-14 Rainbow Displays, Inc. Assembling and sealing large, hermetic and semi-hermetic, h-tiled, flat-paneled displays
JPH10158829A (ja) * 1996-12-04 1998-06-16 Sony Corp スパッタリングターゲット組立体の製造方法
US6528909B1 (en) * 1998-01-14 2003-03-04 International Business Machines Corporation Motor shaft having an integral heat pipe
US6122033A (en) * 1998-04-06 2000-09-19 National Semiconductor Corporation Fusible seal for LCD devices and methods for making same
US6521477B1 (en) * 2000-02-02 2003-02-18 Raytheon Company Vacuum package fabrication of integrated circuit components
JP2001176999A (ja) * 2000-11-27 2001-06-29 Tanaka Kikinzoku Kogyo Kk 電子部品の気密封止方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01293636A (ja) * 1988-05-23 1989-11-27 Hitachi Ltd 気密封止チツプキヤリア
JP2000141300A (ja) * 1998-04-17 2000-05-23 Cp Clare Corp 内部空洞を有する微小構造体の作製方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105612038A (zh) * 2013-08-29 2016-05-25 简易制造欧洲有限公司 用于生产三维物品的模具
JP2016529140A (ja) * 2013-08-29 2016-09-23 シンプリシティー ワークス ユーロップ，エセ．エレ．Ｓｉｍｐｌｉｃｉｔｙ Ｗｏｒｋｓ Ｅｕｒｏｐｅ，Ｓ．Ｌ． ３次元の品物を製造するための型

Also Published As

Publication number Publication date
US20040144835A1 (en) 2004-07-29
US6820797B2 (en) 2004-11-23

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