JP2004179662A - 封止を形成するための方法及びそのシステム - Google Patents
封止を形成するための方法及びそのシステム Download PDFInfo
- Publication number
- JP2004179662A JP2004179662A JP2003396517A JP2003396517A JP2004179662A JP 2004179662 A JP2004179662 A JP 2004179662A JP 2003396517 A JP2003396517 A JP 2003396517A JP 2003396517 A JP2003396517 A JP 2003396517A JP 2004179662 A JP2004179662 A JP 2004179662A
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- JP
- Japan
- Prior art keywords
- members
- pressure
- solder
- seal
- arranging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 229910000679 solder Inorganic materials 0.000 claims abstract description 44
- 239000000565 sealant Substances 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 8
- 239000003990 capacitor Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/14—Soldering, e.g. brazing, or unsoldering specially adapted for soldering seams
- B23K1/18—Soldering, e.g. brazing, or unsoldering specially adapted for soldering seams circumferential seams, e.g. of shells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Measuring Fluid Pressure (AREA)
- Wire Bonding (AREA)
Abstract
【解決手段】 上部部材11と下部部材12との間にはんだリング21を配置するステップと、上部部材11及び下部部材12を係合関係に配置することにより両部材間に画定された容量302を作るステップと、該容量302の外側の周囲圧力と容量302内の圧力との間に差圧を設けるステップとを有し、これにより上部部材11と下部部材12との間に封止を形成する。
【選択図】 図4
Description
12 下部部材(第二の部材)
21 はんだリング(封止部材、シーラント)
22 通気孔(開口)
31 上部保持具(第一の部材を配置するための装置)
32 下部保持具(第二の部材を配置するための装置)
33 トンネル
35 脱気装置
36、102 はんだパッド
301 チューブ
302 空洞(容量)
303 組立部品
310 容器
311 圧力装置
Claims (10)
- 第一の部材と第二の部材との間に封止を形成するための方法であって、
前記第一の部材と前記第二の部材との間に封止部材を配置するステップと、
前記第一及び第二の部材を係合関係に配置することにより前記部材間に画定された容量を作るステップと、
該容量の外側の周囲圧力と前記容量内に圧力装置で形成された圧力との間に差圧を設けるステップと
を有する方法。 - 前記封止部材に熱を印加するステップを更に有する請求項1に記載の方法。
- 前記封止部材を配置するステップが、前記第一の部材と前記第二の部材のうちの少なくとも一方に機械的アライメント手段を適用するステップであることを特徴とする請求項1に記載の方法。
- 前記差圧を維持しつつ、前記機械的アライメント手段を除去するステップを更に有する請求項3に記載の方法。
- 前記差圧を除去するステップを更に有する請求項4に記載の方法。
- 前記差圧を設けるステップが、前記第一の部材と前記第二の部材のうちの少なくとも一方に形成された少なくとも1つの開口を通じて前記容量内の領域を脱気するステップを有することを特徴とする請求項1に記載の方法。
- 前記封止部材がはんだ部材であることを特徴とする請求項1に記載の方法。
- シーラントを第一の部材と第二の部材との間に挟んだ状態で前記第一の部材を前記第二の部材と係合関係に配置するための装置と、
前記第一の部材と第二の部材との間に、前記部材間に封止を形成するに充分な圧力を作り出すために、前記封止された組立部品内部に周囲圧力よりも低い圧力の領域を作る脱気装置と
を具備した封止形成システム。 - 前記第一及び第二の部材の側面が18mm以下の直径であることを特徴とする請求項8に記載のシステム。
- 前記装置が、前記第一の部材及び前記第二の部材を機械的に配置するための保持具を備え、前記低い圧力の領域を維持しつつ前記保持具を除去する手段を更に有することを特徴とする請求項8に記載のシステム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/306,463 US20040099715A1 (en) | 2002-11-27 | 2002-11-27 | System and method for seal formation |
US10/352,287 US6820797B2 (en) | 2002-11-27 | 2003-01-27 | System and method for seal formation |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004179662A true JP2004179662A (ja) | 2004-06-24 |
JP2004179662A5 JP2004179662A5 (ja) | 2007-01-18 |
Family
ID=32716824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003396517A Pending JP2004179662A (ja) | 2002-11-27 | 2003-11-27 | 封止を形成するための方法及びそのシステム |
Country Status (2)
Country | Link |
---|---|
US (1) | US6820797B2 (ja) |
JP (1) | JP2004179662A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105612038A (zh) * | 2013-08-29 | 2016-05-25 | 简易制造欧洲有限公司 | 用于生产三维物品的模具 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2591951C (en) * | 2005-01-10 | 2011-10-11 | Silverbrook Research Pty Ltd | Inkjet printhead production method |
KR100681534B1 (ko) * | 2005-07-25 | 2007-02-09 | 한국항공우주연구원 | 다중 금속판재의 확산접합용 치구와 이를 이용한 구조물제조방법 및 이에 의하여 제조된 구조물 |
US7686203B2 (en) * | 2007-02-09 | 2010-03-30 | Zimmer Technology, Inc. | Direct application of pressure for bonding porous coatings to substrate materials used in orthopaedic implants |
EP3040178B1 (en) * | 2013-08-29 | 2018-04-25 | Simplicity Works Europe S.L. | Mold for producing three-dimensional items |
CN116000401B (zh) * | 2023-02-24 | 2023-09-12 | 芯朋半导体科技(如东)有限公司 | 一种锡焊真空炉 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01293636A (ja) * | 1988-05-23 | 1989-11-27 | Hitachi Ltd | 気密封止チツプキヤリア |
JP2000141300A (ja) * | 1998-04-17 | 2000-05-23 | Cp Clare Corp | 内部空洞を有する微小構造体の作製方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4159075A (en) * | 1977-12-02 | 1979-06-26 | The Singer Company | Hermetic bonded seal |
US4659899A (en) * | 1984-10-24 | 1987-04-21 | The Perkin-Elmer Corporation | Vacuum-compatible air-cooled plasma device |
US5012479A (en) * | 1988-01-11 | 1991-04-30 | Hug William F | Ultraviolet metal vapor laser having hard sealed internal mirrors |
US5508833A (en) * | 1992-07-10 | 1996-04-16 | Kabushiki Kaisha Topcon | Display apparatus sealed with a solvent-soluble fluorocarbon or fluorine-containing resin having an adhesive covalent bond-forming functional group |
US5497727A (en) * | 1993-09-07 | 1996-03-12 | Lsi Logic Corporation | Cooling element for a semiconductor fabrication chamber |
US6388203B1 (en) * | 1995-04-04 | 2002-05-14 | Unitive International Limited | Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby |
US5799860A (en) * | 1995-08-07 | 1998-09-01 | Applied Materials, Inc. | Preparation and bonding of workpieces to form sputtering targets and other assemblies |
US5781258A (en) * | 1996-06-13 | 1998-07-14 | Rainbow Displays, Inc. | Assembling and sealing large, hermetic and semi-hermetic, h-tiled, flat-paneled displays |
JPH10158829A (ja) * | 1996-12-04 | 1998-06-16 | Sony Corp | スパッタリングターゲット組立体の製造方法 |
US6528909B1 (en) * | 1998-01-14 | 2003-03-04 | International Business Machines Corporation | Motor shaft having an integral heat pipe |
US6122033A (en) * | 1998-04-06 | 2000-09-19 | National Semiconductor Corporation | Fusible seal for LCD devices and methods for making same |
US6521477B1 (en) * | 2000-02-02 | 2003-02-18 | Raytheon Company | Vacuum package fabrication of integrated circuit components |
JP2001176999A (ja) * | 2000-11-27 | 2001-06-29 | Tanaka Kikinzoku Kogyo Kk | 電子部品の気密封止方法 |
-
2003
- 2003-01-27 US US10/352,287 patent/US6820797B2/en not_active Expired - Fee Related
- 2003-11-27 JP JP2003396517A patent/JP2004179662A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01293636A (ja) * | 1988-05-23 | 1989-11-27 | Hitachi Ltd | 気密封止チツプキヤリア |
JP2000141300A (ja) * | 1998-04-17 | 2000-05-23 | Cp Clare Corp | 内部空洞を有する微小構造体の作製方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105612038A (zh) * | 2013-08-29 | 2016-05-25 | 简易制造欧洲有限公司 | 用于生产三维物品的模具 |
JP2016529140A (ja) * | 2013-08-29 | 2016-09-23 | シンプリシティー ワークス ユーロップ,エセ.エレ.Simplicity Works Europe,S.L. | 3次元の品物を製造するための型 |
Also Published As
Publication number | Publication date |
---|---|
US6820797B2 (en) | 2004-11-23 |
US20040144835A1 (en) | 2004-07-29 |
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