JP2004176031A5 - - Google Patents
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- Publication number
- JP2004176031A5 JP2004176031A5 JP2003026331A JP2003026331A JP2004176031A5 JP 2004176031 A5 JP2004176031 A5 JP 2004176031A5 JP 2003026331 A JP2003026331 A JP 2003026331A JP 2003026331 A JP2003026331 A JP 2003026331A JP 2004176031 A5 JP2004176031 A5 JP 2004176031A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- composition according
- resin
- less
- linear expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000011342 resin composition Substances 0.000 claims 44
- 229920005989 resin Polymers 0.000 claims 18
- 239000011347 resin Substances 0.000 claims 18
- 230000009477 glass transition Effects 0.000 claims 12
- 229920001187 thermosetting polymer Polymers 0.000 claims 8
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims 4
- 238000010521 absorption reaction Methods 0.000 claims 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 3
- 239000003822 epoxy resin Substances 0.000 claims 2
- 150000002484 inorganic compounds Chemical class 0.000 claims 2
- 229910010272 inorganic material Inorganic materials 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims 1
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000004640 Melamine resin Substances 0.000 claims 1
- 229920000877 Melamine resin Polymers 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 125000005210 alkyl ammonium group Chemical group 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims 1
- 239000003063 flame retardant Substances 0.000 claims 1
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 claims 1
- 229910000271 hectorite Inorganic materials 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 239000011229 interlayer Substances 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 238000000691 measurement method Methods 0.000 claims 1
- 239000010445 mica Substances 0.000 claims 1
- 229910052618 mica group Inorganic materials 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910052901 montmorillonite Inorganic materials 0.000 claims 1
- 239000012299 nitrogen atmosphere Substances 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000009719 polyimide resin Substances 0.000 claims 1
- 229920001955 polyphenylene ether Polymers 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 230000008961 swelling Effects 0.000 claims 1
- 229910052902 vermiculite Inorganic materials 0.000 claims 1
- 239000010455 vermiculite Substances 0.000 claims 1
- 235000019354 vermiculite Nutrition 0.000 claims 1
- 239000013585 weight reducing agent Substances 0.000 claims 1
- 238000004736 wide-angle X-ray diffraction Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003026331A JP3854931B2 (ja) | 2002-02-06 | 2003-02-03 | 樹脂組成物 |
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002029783 | 2002-02-06 | ||
| JP2002139090 | 2002-05-14 | ||
| JP2002158211 | 2002-05-30 | ||
| JP2002158210 | 2002-05-30 | ||
| JP2002287005 | 2002-09-30 | ||
| JP2003026331A JP3854931B2 (ja) | 2002-02-06 | 2003-02-03 | 樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004176031A JP2004176031A (ja) | 2004-06-24 |
| JP2004176031A5 true JP2004176031A5 (enExample) | 2005-09-22 |
| JP3854931B2 JP3854931B2 (ja) | 2006-12-06 |
Family
ID=32719678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003026331A Expired - Fee Related JP3854931B2 (ja) | 2002-02-06 | 2003-02-03 | 樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3854931B2 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1473329A4 (en) | 2002-02-06 | 2006-05-31 | Sekisui Chemical Co Ltd | Resin composition |
| DE60336980D1 (de) | 2002-02-06 | 2011-06-16 | Sekisui Chemical Co Ltd | Harzzusammensetzung |
| EP1693395A4 (en) | 2003-12-08 | 2007-04-25 | Sekisui Chemical Co Ltd | HOT-RESISTANT RESIN COMPOSITION, RESIN SURFACES AND RESIN SURFACES FOR ISOLATED SUBSTRATE |
| JP4476646B2 (ja) * | 2004-03-03 | 2010-06-09 | 株式会社東芝 | 高電圧機器用の絶縁樹脂組成物、絶縁材料とその製造方法、および絶縁構造体 |
| JP2006100463A (ja) * | 2004-09-29 | 2006-04-13 | Ibiden Co Ltd | プリント配線板用層間絶縁層、プリント配線板およびその製造方法 |
| CN101268146B (zh) * | 2005-09-15 | 2012-01-25 | 积水化学工业株式会社 | 树脂组合物、片状成型体、预浸料、固化体、层叠板及多层层叠板 |
| JP2007099945A (ja) * | 2005-10-05 | 2007-04-19 | Nikko Kasei Kk | 熱硬化性オルガノポリシロキサン組成物、並びにそれを用いて製造される熱硬化性オルガノポリシロキサン積層板およびその製造方法 |
| US8415706B2 (en) | 2007-12-14 | 2013-04-09 | Sony Chemical & Information Device Corporation | Optical semiconductor package sealing resin material |
| JP5821190B2 (ja) * | 2008-11-14 | 2015-11-24 | 日清紡ホールディングス株式会社 | 樹脂組成物とそれを用いた透明な樹脂成形体および塗膜 |
| JP5799490B2 (ja) * | 2009-08-27 | 2015-10-28 | 住友化学株式会社 | 膨張抑制用組成物、多層構造体および基材の膨張の抑制方法 |
| CN105602247B (zh) | 2012-01-20 | 2018-05-08 | 旭化成株式会社 | 树脂组合物、层积体、多层印刷线路板和多层柔性线路板及其制造方法 |
| JP2015163684A (ja) * | 2014-01-29 | 2015-09-10 | 日本合成化学工業株式会社 | 樹脂成形体、及びその用途 |
| JP6311399B2 (ja) * | 2014-03-28 | 2018-04-18 | 三菱ケミカル株式会社 | 熱硬化性樹脂組成物、およびその成形体 |
-
2003
- 2003-02-03 JP JP2003026331A patent/JP3854931B2/ja not_active Expired - Fee Related
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