JP2004158831A - 信号通信構造体およびその製作方法 - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title description 7
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- 230000008054 signal transmission Effects 0.000 claims description 3
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- 229910052710 silicon Inorganic materials 0.000 description 1
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Abstract
【解決手段】 信号通信素子の一面118が集積回路チップの一面110に物理的に結合しており、該集積回路チップの他の面112が基板へと通信可能な状態で結合しており、前記信号通信素子の信号通信面116のサイズが、前記集積回路チップの前記信号通信素子を物理的に結合した前記面よりも大きいものである、信号通信素子106と集積回路チップ104と基板102とを含む信号通信構造体100を提供する。
【選択図】 図1
Description
102 基板
104 集積回路チップ
106 信号通信素子(信号受信機)
108 信号通信素子を集積回路チップへと結合するための手段
110 集積回路チップの信号通信素子側の面
112 集積回路チップの基板側の面
116 信号通信素子の信号通信面
118 信号通信素子の集積回路チップ側の面
126、128、130 信号通信素子を基板へと通信可能な状態で結合するための手段
132、210、300 本体
134、212、302 一体型レンズ
202 他の信号通信素子(信号発信機)
Claims (30)
- 信号通信素子と、
集積回路チップと、
基板と
を含む信号通信構造体であって、信号通信素子の一面が集積回路チップの一面に物理的に結合しており、該集積回路チップの他の面が基板へと通信可能な状態で結合しており、前記信号通信素子の信号通信面のサイズが、前記集積回路チップの前記信号通信素子を物理的に結合した前記面よりも大きいものである信号通信構造体。 - 前記基板がプリント回路基板である請求項1に記載の構造体。
- 前記集積回路チップが前記基板にフリップチップボンディングされている請求項1に記載の構造体。
- 前記信号通信素子が、前記基板に通信可能な状態で結合されている請求項1に記載の構造体。
- 前記信号通信素子が、ワイヤボンディングにより前記基板に通信可能な状態で結合されている請求項4に記載の構造体。
- 前記信号通信素子が信号受信機を含み、前記信号通信面が信号収集面を含むものである請求項1に記載の構造体。
- 前記信号通信素子が赤外線受信機を含み、前記信号通信面が赤外線集光面を含むものである請求項6に記載の構造体。
- 前記集積回路チップが、前記信号受信機により生成された信号を処理するための回路を含むものである請求項6に記載の構造体。
- 前記基板に通信可能な状態で結合された信号発信機を更に含む請求項6に記載の構造体。
- 前記集積回路チップが前記信号発信機を駆動するための回路を含むものである請求項9に記載の構造体。
- 前記信号発信機が前記信号受信機上にスタックされている請求項6に記載の構造体。
- 前記信号通信素子が信号発信機を含み、前記信号通信面が信号発信面を含むものである請求項1に記載の構造体。
- 前記信号発信機が赤外線信号発信機を含み、前記信号発信面が赤外線信号発光面を含むものである請求項12に記載の構造体。
- 少なくとも前記信号通信素子と前記集積回路チップとを封入する本体を更に含む請求項1に記載の構造体。
- 前記本体が、前記信号通信素子にアライメントされた一体型レンズを含む請求項14に記載の構造体。
- 前記本体が前記構造体の他の信号通信素子(202)を更に封入しており、前記一体型レンズ(212)が前記他の信号通信素子に対してもアライメントされている請求項15に記載の構造体。
- 集積回路チップの一面を基板に通信可能な状態で結合するステップと、
信号通信素子の一面を前記集積回路チップの他方の面に物理的に結合するステップであって、該信号通信素子の信号通信面のサイズが前記集積回路チップの前記他方の面よりも大きいものであるステップと、
前記信号通信素子を前記基板に通信可能な状態で結合するステップと
を含んでなる信号通信構造体の製造方法。 - 前記基板がプリント回路基板である請求項17に記載の方法。
- 前記信号通信素子が信号受信機を含み、前記信号通信面が集光面を含むものである請求項17に記載の方法。
- 前記集積回路チップが前記信号受信機により生成された信号を処理する回路を含むものである請求項19に記載の方法。
- 信号発信機を前記基板に通信可能な状態で結合するステップを更に含む請求項20に記載の方法。
- 前記集積回路チップが前記信号発信機を駆動するための回路を更に含むものである請求項21に記載の方法。
- 前記集積回路チップと前記信号受信機と前記信号発信機とを封入するステップを更に含む請求項21に記載の方法。
- 前記封入するステップが、前記信号受信機および前記信号発信機に対してアライメントされたレンズを形成するステップを含むものである請求項23に記載の方法。
- 基板と、
信号通信素子と、
集積回路チップと、
該集積回路チップの一つの面に前記信号通信素子を物理的に結合するための手段と、
前記集積回路チップの他の面を前記基板に通信可能な状態で結合するための手段と
を含んでなり、該通信可能な状態での結合によって、前記信号通信素子の信号通信面のサイズを前記集積回路チップの前記面のサイズよりも大きくすることができるものである信号通信構造体。 - 前記信号通信素子を前記基板に通信可能な状態で結合するための手段を更に含む請求項25に記載の構造体。
- 前記信号通信素子が信号受信機を含み、前記信号通信面が信号収集面を含むものである請求項25に記載の構造体。
- 前記集積回路チップが、前記信号受信機により生成される信号を処理するための回路を含むものである請求項27に記載の構造体。
- 信号発信機を更に含む請求項27に記載の構造体。
- 前記集積回路チップと前記信号受信機と前記信号発信機とを封入する本体を更に含み、前記本体が、前記信号受信機と前記信号発信機とに対してアライメントされた一体型レンズを含むものである請求項29に記載の構造体。
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US10/233,125 US6762472B2 (en) | 2002-08-30 | 2002-08-30 | Signal communication structures |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006261380A (ja) * | 2005-03-17 | 2006-09-28 | Rohm Co Ltd | 光通信モジュール |
JP2007311395A (ja) * | 2006-05-16 | 2007-11-29 | Toppan Printing Co Ltd | 半導体装置及び半導体装置の製造方法 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003244077A (ja) * | 2002-02-18 | 2003-08-29 | Sharp Corp | リモコン送信機能付き赤外線通信用モジュール |
US6906416B2 (en) * | 2002-10-08 | 2005-06-14 | Chippac, Inc. | Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package |
US7034387B2 (en) | 2003-04-04 | 2006-04-25 | Chippac, Inc. | Semiconductor multipackage module including processor and memory package assemblies |
US20040094695A1 (en) * | 2002-11-18 | 2004-05-20 | Chen Wen Ching | Digital CMOS sensor |
US7253397B2 (en) * | 2004-02-23 | 2007-08-07 | Micron Technology, Inc. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US20060033217A1 (en) * | 2004-08-10 | 2006-02-16 | Brian Taggart | Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same |
US20060060955A1 (en) * | 2004-09-22 | 2006-03-23 | Texas Instruments Incorporated | Stacked die infrared transceiver bus |
US20060219862A1 (en) * | 2005-03-31 | 2006-10-05 | Kai-Kuang Ho | Compact camera module with reduced thickness |
US7605476B2 (en) * | 2005-09-27 | 2009-10-20 | Stmicroelectronics S.R.L. | Stacked die semiconductor package |
FR2898218B1 (fr) * | 2006-03-02 | 2009-12-11 | Higher Way Electronic Co Ltd | Structure de boitier pour une puce solaire |
JP5806994B2 (ja) | 2012-09-21 | 2015-11-10 | 株式会社東芝 | 光結合装置 |
JP2014158015A (ja) * | 2013-01-15 | 2014-08-28 | Rohm Co Ltd | 半導体装置 |
JP6371725B2 (ja) * | 2015-03-13 | 2018-08-08 | 株式会社東芝 | 半導体モジュール |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5422435A (en) | 1992-05-22 | 1995-06-06 | National Semiconductor Corporation | Stacked multi-chip modules and method of manufacturing |
JP2843464B2 (ja) * | 1992-09-01 | 1999-01-06 | シャープ株式会社 | 固体撮像装置 |
US5506445A (en) | 1994-06-24 | 1996-04-09 | Hewlett-Packard Company | Optical transceiver module |
DE4440088A1 (de) | 1994-11-10 | 1996-05-15 | Telefunken Microelectron | Halbleiterbaugruppe für die bidirektionale, leitungsungebundene, optische Datenübertragung |
US5696031A (en) | 1996-11-20 | 1997-12-09 | Micron Technology, Inc. | Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
US6169295B1 (en) | 1998-05-29 | 2001-01-02 | Maxim Integrated Products, Inc. | Infrared transceiver module and method for making same |
-
2002
- 2002-08-30 US US10/233,125 patent/US6762472B2/en not_active Expired - Fee Related
-
2003
- 2003-09-01 JP JP2003308804A patent/JP2004158831A/ja not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006261380A (ja) * | 2005-03-17 | 2006-09-28 | Rohm Co Ltd | 光通信モジュール |
JP2007311395A (ja) * | 2006-05-16 | 2007-11-29 | Toppan Printing Co Ltd | 半導体装置及び半導体装置の製造方法 |
Also Published As
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US20040041246A1 (en) | 2004-03-04 |
US6762472B2 (en) | 2004-07-13 |
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