JP4019395B2 - 光相互接続モジュール用のシリコン・キャリア - Google Patents
光相互接続モジュール用のシリコン・キャリア Download PDFInfo
- Publication number
- JP4019395B2 JP4019395B2 JP2004365320A JP2004365320A JP4019395B2 JP 4019395 B2 JP4019395 B2 JP 4019395B2 JP 2004365320 A JP2004365320 A JP 2004365320A JP 2004365320 A JP2004365320 A JP 2004365320A JP 4019395 B2 JP4019395 B2 JP 4019395B2
- Authority
- JP
- Japan
- Prior art keywords
- optical
- silicon
- silicon carrier
- integrated circuit
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
- Optical Integrated Circuits (AREA)
Description
208および210の間の電気接続を行うための多層ワイヤリング502(たとえば、酸化ベリリウム)を含む。IC206、208および210は、電気相互接続部503(たとえば、マイクロ・ボール・グリッド・アレイ)を介してシリコン・キャリア202上の電気経路と接触する。フレーム506は、ICを密封し、光相互接続モジュール200用の耐密容器になる。熱スプレッダ508は、フレーム506上に取り付けられ、IC206、208および210と熱的に接触する。このことによって、高速IC208の面全体が熱スプレッダと熱的に接触することが可能になる。光ビア504は、シリコン・キャリア202中に形成され、シリコン・マイクロ・レンズ505を備える通路を含むことができる。ガラス・レンズまたはポリマー・レンズを使用する場合、光トランスミッタ210および光レシーバ212は、約850nmの波長で動作することができる。
102 基板
104 相互接続部
106 集積回路、IC
200 光相互接続モジュール
202 キャリア、シリコン・キャリア
204 相互接続部
206 集積回路、IC
208 通信IC、SiGeドライバIC
210 光トランスミッタIC、光トランスミッタ、VCSELアレイ
212 光レシーバIC、光レシーバ
214 光リンク
302、304 V字型溝
306 光ファイバまたはレンズ
308 電気スルービア、導電性ビア
310 電気経路および光路
402 光路
404 光ビア
502 多層ワイヤリング
503 電気相互接続部
504 光ビア
505 シリコン・マイクロ・レンズ
506 フレーム
507 位置合せ機構
508 熱スプレッダ
509 導波路
510 光路層
602 ガラス層
604 レンズ・アレイ
702 屈折率整合層
704 開口部
706 電気相互接続部
802 開口部
804 ポスト
806 屈折率整合アンダーフィル
902 電気ビア
1002 エッジ発光型マイクロ共振器
Claims (11)
- 埋め込まれた電気経路と、電気ビアとを有し、前記電気ビアを介して基板に電気的に接続されるシリコン・キャリアと、
前記シリコン・キャリアの上面上に搭載された、シリコン・ゲルマニウム集積回路と、
前記シリコン・キャリアの上面上に搭載された、半導体レーザ素子と、
前記シリコン・キャリア上面上に搭載された、CMOS集積回路と、
前記シリコン・キャリアの上面上に取り付けられたフレームと、
前記フレーム上に取り付けられた熱スプレッダと、
を含み、
前記半導体レーザ素子が、前記シリコン・キャリア中の前記電気経路によって前記シリコン・ゲルマニウム集積回路に電気的に接続され、及び、前記シリコン・ゲルマニウム集積回路からの信号によって駆動されて、光トランスミッタとして作用し、
前記CMOS集積回路が信号処理を行い、
前記シリコン・ゲルマニウム集積回路、前記半導体レーザ素子、及び前記CMOS集積回路の上面が前記熱スプレッダと熱的に接触している、光相互接続モジュール。 - 前記シリコン・ゲルマニウム集積回路が、多重化回路、多重化解除回路、クロッキング回路、及び増幅回路から選ばれる少なくとも1つをさらに含む、請求項1に記載の光相互接続モジュール。
- 前記半導体レーザ素子が、III−V族化合物の面発光型半導体レーザアレイである、請求項6に記載の光相互接続モジュール。
- 前記シリコン・キャリアが光ビアをさらに含み、前記半導体レーザ素子が前記光ビアによって前記基板上に形成された光導波路に光学的に接続される、請求項1〜3のいずれか1項記載の光相互接続モジュール。
- 前記半導体レーザ素子が1000nmより長い波長の光を放出し、放出された前記光が前記シリコン・キャリアを通過して、前記基板上に形成された光導波路に到達する、請求項1〜3のいずれか1項記載の光相互接続モジュール。
- 前記シリコン・キャリア上面上に備えられた、前記シリコン・ゲルマニウム集積回路に電気的に接続され、光レシーバとして作用する、フォトダイオード・アレイをさらに含む請求項2〜5のいずれか1項に記載の光相互接続モジュール。
- 前記シリコン・キャリアが、前記光導波路と位置合せするためのV字型溝を含む、請求項1〜6のいずれか1項に記載の光相互接続モジュール。
- 前記光ビアが、シリコン・レンズを備える、請求項4に記載の光相互接続モジュール。
- 前記光ビアが、ガラス・レンズを備える、請求項4に記載の光相互接続モジュール。
- 前記光ビアが、ポリマー・レンズを備える、請求項4に記載の光相互接続モジュール。
- 前記シリコン・キャリアの、前記光ビアが形成されている部分の底面上に備えられたガラス層をさらに含み、前記ガラス層中に、前記光ビアの端部と接して、レンズ・アレイが備えられている、請求項4に記載の光相互接続モジュール。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/738,064 US7058247B2 (en) | 2003-12-17 | 2003-12-17 | Silicon carrier for optical interconnect modules |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005182033A JP2005182033A (ja) | 2005-07-07 |
JP4019395B2 true JP4019395B2 (ja) | 2007-12-12 |
Family
ID=34677309
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004365320A Expired - Fee Related JP4019395B2 (ja) | 2003-12-17 | 2004-12-17 | 光相互接続モジュール用のシリコン・キャリア |
Country Status (4)
Country | Link |
---|---|
US (1) | US7058247B2 (ja) |
JP (1) | JP4019395B2 (ja) |
KR (1) | KR100633837B1 (ja) |
CN (1) | CN1333279C (ja) |
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2003
- 2003-12-17 US US10/738,064 patent/US7058247B2/en not_active Expired - Lifetime
-
2004
- 2004-11-10 CN CNB2004100909434A patent/CN1333279C/zh active Active
- 2004-11-16 KR KR1020040093391A patent/KR100633837B1/ko not_active IP Right Cessation
- 2004-12-17 JP JP2004365320A patent/JP4019395B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7058247B2 (en) | 2006-06-06 |
KR100633837B1 (ko) | 2006-10-16 |
KR20050061289A (ko) | 2005-06-22 |
CN1629671A (zh) | 2005-06-22 |
JP2005182033A (ja) | 2005-07-07 |
CN1333279C (zh) | 2007-08-22 |
US20050135732A1 (en) | 2005-06-23 |
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