JP2004153267A5 - - Google Patents

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Publication number
JP2004153267A5
JP2004153267A5 JP2003359658A JP2003359658A JP2004153267A5 JP 2004153267 A5 JP2004153267 A5 JP 2004153267A5 JP 2003359658 A JP2003359658 A JP 2003359658A JP 2003359658 A JP2003359658 A JP 2003359658A JP 2004153267 A5 JP2004153267 A5 JP 2004153267A5
Authority
JP
Japan
Prior art keywords
thermal interface
interface plate
plate assembly
spring
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003359658A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004153267A (ja
Filing date
Publication date
Priority claimed from US10/283,907 external-priority patent/US6910271B2/en
Application filed filed Critical
Publication of JP2004153267A publication Critical patent/JP2004153267A/ja
Publication of JP2004153267A5 publication Critical patent/JP2004153267A5/ja
Withdrawn legal-status Critical Current

Links

JP2003359658A 2002-10-29 2003-10-20 機械的に充分可撓性のあるサーマルインターフェース・パッド Withdrawn JP2004153267A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/283,907 US6910271B2 (en) 2002-10-29 2002-10-29 Mechanical highly compliant thermal interface pad

Publications (2)

Publication Number Publication Date
JP2004153267A JP2004153267A (ja) 2004-05-27
JP2004153267A5 true JP2004153267A5 (enExample) 2006-09-07

Family

ID=32107567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003359658A Withdrawn JP2004153267A (ja) 2002-10-29 2003-10-20 機械的に充分可撓性のあるサーマルインターフェース・パッド

Country Status (2)

Country Link
US (2) US6910271B2 (enExample)
JP (1) JP2004153267A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6910271B2 (en) * 2002-10-29 2005-06-28 Hewlett-Packard Development Company, L.P. Mechanical highly compliant thermal interface pad
US20090208722A1 (en) * 2008-02-18 2009-08-20 John Francis Timmerman Oriented Members for Thermally Conductive Interface Structures
US9791501B2 (en) * 2012-09-24 2017-10-17 Intel Corporation Compliant thermal contact device and method
US12322898B2 (en) * 2019-05-22 2025-06-03 Te Connectivity Solutions Gmbh Heat sink assembly for an electrical connector assembly
US11486661B2 (en) * 2020-05-28 2022-11-01 Te Connectivity Solutions Gmbh Thermal bridge for an electrical component
US11240934B1 (en) * 2020-07-22 2022-02-01 TE Connectivity Services Gmbh Thermal bridge for an electrical component

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4263965A (en) * 1980-01-21 1981-04-28 International Business Machines Corporation Leaved thermal cooling module
US4498530A (en) * 1981-08-03 1985-02-12 International Business Machines Corporation Flexible thermal conduction element for cooling semiconductor devices
US4535841A (en) * 1983-10-24 1985-08-20 International Business Machines Corporation High power chip cooling device and method of manufacturing same
USRE35721E (en) * 1983-12-14 1998-02-03 Hitachi, Ltd. Cooling device of semiconductor chips
US5052481A (en) * 1988-05-26 1991-10-01 International Business Machines Corporation High conduction cooling module having internal fins and compliant interfaces for vlsi chip technology
JP2675173B2 (ja) * 1990-03-02 1997-11-12 株式会社日立製作所 電子デバイスの冷却装置
US5014117A (en) * 1990-03-30 1991-05-07 International Business Machines Corporation High conduction flexible fin cooling module
US5201866A (en) * 1992-02-03 1993-04-13 International Business Machines Corporation Structure for dissipation of heat having slidably engaged fins for conformal disposition against a heat generating surface
JPH0786471A (ja) * 1993-09-20 1995-03-31 Hitachi Ltd 半導体モジュ−ル
JP2926537B2 (ja) * 1994-12-15 1999-07-28 株式会社日立製作所 マルチチップモジュ−ルの冷却装置
US6910271B2 (en) * 2002-10-29 2005-06-28 Hewlett-Packard Development Company, L.P. Mechanical highly compliant thermal interface pad

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