JP2004153267A - 機械的に充分可撓性のあるサーマルインターフェース・パッド - Google Patents

機械的に充分可撓性のあるサーマルインターフェース・パッド Download PDF

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Publication number
JP2004153267A
JP2004153267A JP2003359658A JP2003359658A JP2004153267A JP 2004153267 A JP2004153267 A JP 2004153267A JP 2003359658 A JP2003359658 A JP 2003359658A JP 2003359658 A JP2003359658 A JP 2003359658A JP 2004153267 A JP2004153267 A JP 2004153267A
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JP
Japan
Prior art keywords
thermal interface
interface plate
plate assembly
thermal
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003359658A
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English (en)
Japanese (ja)
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JP2004153267A5 (enExample
Inventor
Eric C Peterson
シー． ピーターソン エリック
Brent A Boudreaux
エイ． ブードロゥ ブレント
Christian L Belady
エル． ベラディ クリスチャン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
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Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of JP2004153267A publication Critical patent/JP2004153267A/ja
Publication of JP2004153267A5 publication Critical patent/JP2004153267A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F23/00—Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003359658A 2002-10-29 2003-10-20 機械的に充分可撓性のあるサーマルインターフェース・パッド Withdrawn JP2004153267A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/283,907 US6910271B2 (en) 2002-10-29 2002-10-29 Mechanical highly compliant thermal interface pad

Publications (2)

Publication Number Publication Date
JP2004153267A true JP2004153267A (ja) 2004-05-27
JP2004153267A5 JP2004153267A5 (enExample) 2006-09-07

Family

ID=32107567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003359658A Withdrawn JP2004153267A (ja) 2002-10-29 2003-10-20 機械的に充分可撓性のあるサーマルインターフェース・パッド

Country Status (2)

Country Link
US (2) US6910271B2 (enExample)
JP (1) JP2004153267A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6910271B2 (en) * 2002-10-29 2005-06-28 Hewlett-Packard Development Company, L.P. Mechanical highly compliant thermal interface pad
US20090208722A1 (en) * 2008-02-18 2009-08-20 John Francis Timmerman Oriented Members for Thermally Conductive Interface Structures
US9791501B2 (en) * 2012-09-24 2017-10-17 Intel Corporation Compliant thermal contact device and method
US12322898B2 (en) * 2019-05-22 2025-06-03 Te Connectivity Solutions Gmbh Heat sink assembly for an electrical connector assembly
US11486661B2 (en) * 2020-05-28 2022-11-01 Te Connectivity Solutions Gmbh Thermal bridge for an electrical component
US11240934B1 (en) * 2020-07-22 2022-02-01 TE Connectivity Services Gmbh Thermal bridge for an electrical component

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4263965A (en) * 1980-01-21 1981-04-28 International Business Machines Corporation Leaved thermal cooling module
US4498530A (en) * 1981-08-03 1985-02-12 International Business Machines Corporation Flexible thermal conduction element for cooling semiconductor devices
US4535841A (en) * 1983-10-24 1985-08-20 International Business Machines Corporation High power chip cooling device and method of manufacturing same
USRE35721E (en) * 1983-12-14 1998-02-03 Hitachi, Ltd. Cooling device of semiconductor chips
US5052481A (en) * 1988-05-26 1991-10-01 International Business Machines Corporation High conduction cooling module having internal fins and compliant interfaces for vlsi chip technology
JP2675173B2 (ja) * 1990-03-02 1997-11-12 株式会社日立製作所 電子デバイスの冷却装置
US5014117A (en) * 1990-03-30 1991-05-07 International Business Machines Corporation High conduction flexible fin cooling module
US5201866A (en) * 1992-02-03 1993-04-13 International Business Machines Corporation Structure for dissipation of heat having slidably engaged fins for conformal disposition against a heat generating surface
JPH0786471A (ja) * 1993-09-20 1995-03-31 Hitachi Ltd 半導体モジュ−ル
JP2926537B2 (ja) * 1994-12-15 1999-07-28 株式会社日立製作所 マルチチップモジュ−ルの冷却装置
US6910271B2 (en) * 2002-10-29 2005-06-28 Hewlett-Packard Development Company, L.P. Mechanical highly compliant thermal interface pad

Also Published As

Publication number Publication date
US6910271B2 (en) 2005-06-28
US20040079519A1 (en) 2004-04-29
US7131199B2 (en) 2006-11-07
US20050132571A1 (en) 2005-06-23

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