JP2004126509A - 溶媒及び１９３ｎｍイメージング用フォトレジスト組成物 - Google Patents

溶媒及び１９３ｎｍイメージング用フォトレジスト組成物 Download PDF

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Publication number
JP2004126509A
JP2004126509A JP2003112577A JP2003112577A JP2004126509A JP 2004126509 A JP2004126509 A JP 2004126509A JP 2003112577 A JP2003112577 A JP 2003112577A JP 2003112577 A JP2003112577 A JP 2003112577A JP 2004126509 A JP2004126509 A JP 2004126509A
Authority
JP
Japan
Prior art keywords
photoresist
methyl
photoresist composition
ethylene glycol
ketone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003112577A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004126509A5 (enExample
Inventor
Robert J Kavanagh
ロバート・ジェー・カバナー
W Thackeray James
ジェームズ・ダブリュー・サッカレー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
Shipley Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co LLC filed Critical Shipley Co LLC
Publication of JP2004126509A publication Critical patent/JP2004126509A/ja
Publication of JP2004126509A5 publication Critical patent/JP2004126509A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2003112577A 2002-04-18 2003-04-17 溶媒及び１９３ｎｍイメージング用フォトレジスト組成物 Pending JP2004126509A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US37351702P 2002-04-18 2002-04-18

Publications (2)

Publication Number Publication Date
JP2004126509A true JP2004126509A (ja) 2004-04-22
JP2004126509A5 JP2004126509A5 (enExample) 2009-03-19

Family

ID=32298177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003112577A Pending JP2004126509A (ja) 2002-04-18 2003-04-17 溶媒及び１９３ｎｍイメージング用フォトレジスト組成物

Country Status (2)

Country Link
US (1) US7205087B2 (enExample)
JP (1) JP2004126509A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7338737B2 (en) 2004-12-16 2008-03-04 Samsung Electronics Co., Ltd. Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200634448A (en) * 2005-02-09 2006-10-01 Showa Denko Kk Photosensitive composition removing liquid
JP4762630B2 (ja) * 2005-08-03 2011-08-31 東京応化工業株式会社 レジスト組成物およびレジストパターン形成方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002030118A (ja) * 2000-07-14 2002-01-31 Tokyo Ohka Kogyo Co Ltd 新規コポリマー、ホトレジスト組成物、および高アスペクト比のレジストパターン形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7338737B2 (en) 2004-12-16 2008-03-04 Samsung Electronics Co., Ltd. Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel

Also Published As

Publication number Publication date
US7205087B2 (en) 2007-04-17
US20040029036A1 (en) 2004-02-12

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