JP2004119015A - 発光装置およびその作製方法 - Google Patents
発光装置およびその作製方法 Download PDFInfo
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- JP2004119015A JP2004119015A JP2002276374A JP2002276374A JP2004119015A JP 2004119015 A JP2004119015 A JP 2004119015A JP 2002276374 A JP2002276374 A JP 2002276374A JP 2002276374 A JP2002276374 A JP 2002276374A JP 2004119015 A JP2004119015 A JP 2004119015A
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- Prior art keywords
- film
- fluorine
- based resin
- light
- insulating film
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- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 229920005989 resin Polymers 0.000 claims abstract description 120
- 239000011347 resin Substances 0.000 claims abstract description 120
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 116
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 116
- 239000011737 fluorine Substances 0.000 claims abstract description 116
- 238000004544 sputter deposition Methods 0.000 claims abstract description 30
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 29
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 27
- 230000015572 biosynthetic process Effects 0.000 claims description 12
- -1 polytetrafluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer Polymers 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 9
- 239000004642 Polyimide Substances 0.000 claims description 7
- 238000009832 plasma treatment Methods 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 229920002620 polyvinyl fluoride Polymers 0.000 claims description 6
- 239000002033 PVDF binder Substances 0.000 claims description 4
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 4
- 239000004962 Polyamide-imide Substances 0.000 claims description 3
- 229920002312 polyamide-imide Polymers 0.000 claims description 3
- 239000007789 gas Substances 0.000 abstract description 27
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 18
- 239000001301 oxygen Substances 0.000 abstract description 18
- 229910052760 oxygen Inorganic materials 0.000 abstract description 18
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- 239000012212 insulator Substances 0.000 description 13
- 229910052814 silicon oxide Inorganic materials 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- 238000007789 sealing Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000001704 evaporation Methods 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
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- 230000001965 increasing effect Effects 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
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- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- YLYPIBBGWLKELC-UHFFFAOYSA-N 4-(dicyanomethylene)-2-methyl-6-(4-(dimethylamino)styryl)-4H-pyran Chemical compound C1=CC(N(C)C)=CC=C1C=CC1=CC(=C(C#N)C#N)C=C(C)O1 YLYPIBBGWLKELC-UHFFFAOYSA-N 0.000 description 3
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- VOFUROIFQGPCGE-UHFFFAOYSA-N nile red Chemical compound C1=CC=C2C3=NC4=CC=C(N(CC)CC)C=C4OC3=CC(=O)C2=C1 VOFUROIFQGPCGE-UHFFFAOYSA-N 0.000 description 3
- 150000002894 organic compounds Chemical class 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 3
- 150000005072 1,3,4-oxadiazoles Chemical class 0.000 description 2
- 229910017073 AlLi Inorganic materials 0.000 description 2
- 229910004261 CaF 2 Inorganic materials 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- 229910017911 MgIn Inorganic materials 0.000 description 2
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- AZWHFTKIBIQKCA-UHFFFAOYSA-N [Sn+2]=O.[O-2].[In+3] Chemical compound [Sn+2]=O.[O-2].[In+3] AZWHFTKIBIQKCA-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- VBVAVBCYMYWNOU-UHFFFAOYSA-N coumarin 6 Chemical compound C1=CC=C2SC(C3=CC4=CC=C(C=C4OC3=O)N(CC)CC)=NC2=C1 VBVAVBCYMYWNOU-UHFFFAOYSA-N 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
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- 239000011152 fibreglass Substances 0.000 description 2
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- 239000002184 metal Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- AHLBNYSZXLDEJQ-FWEHEUNISA-N orlistat Chemical compound CCCCCCCCCCC[C@H](OC(=O)[C@H](CC(C)C)NC=O)C[C@@H]1OC(=O)[C@H]1CCCCCC AHLBNYSZXLDEJQ-FWEHEUNISA-N 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
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- 230000004044 response Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- KLCLIOISYBHYDZ-UHFFFAOYSA-N 1,4,4-triphenylbuta-1,3-dienylbenzene Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)=CC=C(C=1C=CC=CC=1)C1=CC=CC=C1 KLCLIOISYBHYDZ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910016036 BaF 2 Inorganic materials 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 229910008484 TiSi Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010549 co-Evaporation Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
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- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
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- 238000001420 photoelectron spectroscopy Methods 0.000 description 1
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- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002276374A JP2004119015A (ja) | 2002-09-20 | 2002-09-20 | 発光装置およびその作製方法 |
| US10/662,508 US7453094B2 (en) | 2002-09-20 | 2003-09-16 | Light-emitting apparatus and fabrication method of the same |
| CNB031586619A CN100557850C (zh) | 2002-09-20 | 2003-09-19 | 发光装置及其制作方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002276374A JP2004119015A (ja) | 2002-09-20 | 2002-09-20 | 発光装置およびその作製方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004119015A true JP2004119015A (ja) | 2004-04-15 |
| JP2004119015A5 JP2004119015A5 (enExample) | 2005-11-04 |
Family
ID=32104922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002276374A Withdrawn JP2004119015A (ja) | 2002-09-20 | 2002-09-20 | 発光装置およびその作製方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7453094B2 (enExample) |
| JP (1) | JP2004119015A (enExample) |
| CN (1) | CN100557850C (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005317302A (ja) * | 2004-04-28 | 2005-11-10 | Nippon Zeon Co Ltd | 有機el表示素子及びその製造方法 |
| JP2006261058A (ja) * | 2005-03-18 | 2006-09-28 | Sony Corp | 有機el素子、表示装置、有機el素子の製造方法 |
| JP2006278004A (ja) * | 2005-03-28 | 2006-10-12 | Pioneer Electronic Corp | 有機膜製造方法、有機elパネル |
| JP2008010233A (ja) * | 2006-06-28 | 2008-01-17 | Toppan Printing Co Ltd | 有機elパネル |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004119016A (ja) * | 2002-09-20 | 2004-04-15 | Semiconductor Energy Lab Co Ltd | 発光装置 |
| US20040099926A1 (en) * | 2002-11-22 | 2004-05-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display device, and light-emitting device, and methods of manufacturing the same |
| US7652359B2 (en) * | 2002-12-27 | 2010-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Article having display device |
| US7183147B2 (en) * | 2004-03-25 | 2007-02-27 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device, method for manufacturing thereof and electronic appliance |
| US7423373B2 (en) * | 2004-03-26 | 2008-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and manufacturing method thereof |
| US7888702B2 (en) * | 2005-04-15 | 2011-02-15 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method of the display device |
| JP5160754B2 (ja) * | 2006-01-31 | 2013-03-13 | エルジー ディスプレイ カンパニー リミテッド | El装置 |
| JP2010093068A (ja) * | 2008-10-08 | 2010-04-22 | Hitachi Displays Ltd | 有機el表示装置およびその製造方法 |
| GB0912034D0 (en) | 2009-07-10 | 2009-08-19 | Cambridge Entpr Ltd | Patterning |
| GB0913456D0 (en) | 2009-08-03 | 2009-09-16 | Cambridge Entpr Ltd | Printed electronic device |
| FR2955051B1 (fr) * | 2010-01-14 | 2013-03-08 | Arkema France | Film resistant a l'humidite a base de polymere fluore et d'oxyde inorganique pour application photovoltaique |
| KR102080008B1 (ko) * | 2013-07-12 | 2020-02-24 | 삼성디스플레이 주식회사 | 유기발광표시장치 및 그 제조방법 |
| KR102216680B1 (ko) * | 2020-02-12 | 2021-02-18 | 삼성디스플레이 주식회사 | 유기발광표시장치 |
| DE102020128723A1 (de) | 2020-11-02 | 2022-05-05 | Bayerische Motoren Werke Aktiengesellschaft | Faserverbundbauteil mit Leuchtfunktion |
| DE102020128724A1 (de) | 2020-11-02 | 2022-05-05 | Bayerische Motoren Werke Aktiengesellschaft | Sichtbauteil für ein Kraftfahrzeug |
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| JPS5435780B2 (enExample) | 1974-07-23 | 1979-11-05 | ||
| US4417174A (en) * | 1980-10-03 | 1983-11-22 | Alps Electric Co., Ltd. | Electroluminescent cell and method of producing the same |
| JPS60115944A (ja) * | 1983-11-29 | 1985-06-22 | Asahi Chem Ind Co Ltd | 電子写真用感光体 |
| US4580818A (en) | 1984-10-25 | 1986-04-08 | Lyng William E | Locker latching assembly |
| JPH0265895U (enExample) * | 1988-11-07 | 1990-05-17 | ||
| JPH03153859A (ja) * | 1989-11-08 | 1991-07-01 | Sekisui Chem Co Ltd | 表面改質プラスチック |
| US5188876A (en) | 1990-04-12 | 1993-02-23 | Armstrong World Industries, Inc. | Surface covering with inorganic wear layer |
| US5427858A (en) | 1990-11-30 | 1995-06-27 | Idemitsu Kosan Company Limited | Organic electroluminescence device with a fluorine polymer layer |
| JP2597047B2 (ja) | 1990-12-28 | 1997-04-02 | 出光興産株式会社 | 有機エレクトロルミネッセンスデバイス |
| JP2813495B2 (ja) | 1991-07-26 | 1998-10-22 | 出光興産株式会社 | 有機el素子の封止方法 |
| JP2813499B2 (ja) | 1991-09-30 | 1998-10-22 | 出光興産株式会社 | 有機el素子 |
| JPH05101884A (ja) | 1991-10-11 | 1993-04-23 | Idemitsu Kosan Co Ltd | 有機エレクトロルミネツセンス素子の封止方法及びパターン化方法 |
| JPH06306591A (ja) | 1993-04-28 | 1994-11-01 | Sekisui Chem Co Ltd | 撥水性ハードコート皮膜の製造方法 |
| JPH073438A (ja) | 1993-06-18 | 1995-01-06 | Sekisui Chem Co Ltd | 撥水性ハードコート被膜の製造方法 |
| JPH0715049A (ja) | 1993-06-23 | 1995-01-17 | Nec Corp | 超伝導積層薄膜 |
| JPH07169567A (ja) | 1993-12-16 | 1995-07-04 | Idemitsu Kosan Co Ltd | 有機el素子 |
| JPH07292459A (ja) * | 1994-04-21 | 1995-11-07 | Sekisui Chem Co Ltd | 積層体の製造方法 |
| US5834327A (en) | 1995-03-18 | 1998-11-10 | Semiconductor Energy Laboratory Co., Ltd. | Method for producing display device |
| JPH09175837A (ja) | 1995-12-27 | 1997-07-08 | Idemitsu Kosan Co Ltd | 透明導電膜およびその製造方法 |
| US6027958A (en) | 1996-07-11 | 2000-02-22 | Kopin Corporation | Transferred flexible integrated circuit |
| JP3809681B2 (ja) | 1996-08-27 | 2006-08-16 | セイコーエプソン株式会社 | 剥離方法 |
| EP1655633A3 (en) | 1996-08-27 | 2006-06-21 | Seiko Epson Corporation | Exfoliating method, transferring method of thin film device, thin film integrated circuit device, and liquid crystal display device |
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2002
- 2002-09-20 JP JP2002276374A patent/JP2004119015A/ja not_active Withdrawn
-
2003
- 2003-09-16 US US10/662,508 patent/US7453094B2/en not_active Expired - Fee Related
- 2003-09-19 CN CNB031586619A patent/CN100557850C/zh not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005317302A (ja) * | 2004-04-28 | 2005-11-10 | Nippon Zeon Co Ltd | 有機el表示素子及びその製造方法 |
| JP2006261058A (ja) * | 2005-03-18 | 2006-09-28 | Sony Corp | 有機el素子、表示装置、有機el素子の製造方法 |
| JP2006278004A (ja) * | 2005-03-28 | 2006-10-12 | Pioneer Electronic Corp | 有機膜製造方法、有機elパネル |
| JP2008010233A (ja) * | 2006-06-28 | 2008-01-17 | Toppan Printing Co Ltd | 有機elパネル |
Also Published As
| Publication number | Publication date |
|---|---|
| US7453094B2 (en) | 2008-11-18 |
| CN1492722A (zh) | 2004-04-28 |
| CN100557850C (zh) | 2009-11-04 |
| US20040079950A1 (en) | 2004-04-29 |
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