JP2004104259A5 - - Google Patents
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- JP2004104259A5 JP2004104259A5 JP2002260417A JP2002260417A JP2004104259A5 JP 2004104259 A5 JP2004104259 A5 JP 2004104259A5 JP 2002260417 A JP2002260417 A JP 2002260417A JP 2002260417 A JP2002260417 A JP 2002260417A JP 2004104259 A5 JP2004104259 A5 JP 2004104259A5
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- JP
- Japan
- Prior art keywords
- solid
- imaging device
- state imaging
- curved
- electrode pad
- Prior art date
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Claims (12)
電極パッドが湾曲されない方向に沿って配列されて成る
ことを特徴とする固体撮像素子。At least the imaging surface is curved into a cylindrical surface,
A solid-state imaging device, wherein the electrode pads are arranged along a direction in which the electrode pads are not curved.
ことを特徴とする請求項１記載の固体撮像素子。The solid-state imaging device according to claim 1, wherein the entire imaging chip having an imaging surface is curved in a cylindrical shape.
前記固体撮像素子を収容したパッケージとを有し、
前記固体撮像素子の電極パッドが湾曲されない方向に沿って配列され、該電極パッドと前記パッケージ側の電極パッドとが電気的に接続されて成る
ことを特徴とする固体撮像装置。A solid-state imaging device having at least an imaging surface curved into a cylindrical surface; and
A package containing the solid-state imaging device,
A solid-state imaging device, wherein the electrode pads of the solid-state imaging device are arranged along a direction in which the electrode pads are not curved, and the electrode pads and the electrode pads on the package side are electrically connected.
ことを特徴とする請求項３記載の固体撮像装置。The solid-state imaging device according to claim 3, wherein the entire imaging chip constituting the solid-state imaging device is curved in a cylindrical shape.
ことを特徴とする請求項３又は４記載の固体撮像装置。The solid-state imaging device according to claim 3, wherein the electrode pad on the solid-state imaging element side and the electrode pad on the package side are connected by wire bonding.
前記電極パッドがＴＡＢボンディングで外部接続されて成る
ことを特徴とする固体撮像装置。At least the imaging surface is curved in a cylindrical shape, and the electrode pad has a solid-state imaging device arranged along a direction in which the electrode pad is not curved,
The solid-state imaging device, wherein the electrode pad is externally connected by TAB bonding.
ことを特徴とする請求項６記載の固体撮像装置。The solid-state imaging device according to claim 6, wherein the solid-state imaging device is formed by bending an entire imaging chip having an imaging surface into a cylindrical surface.
前記電極パッドがバンプボンディングで外部接続されて成る
ことを特徴とする固体撮像装置。At least the imaging surface is curved in a cylindrical shape, and the electrode pad has a solid-state imaging device arranged along a direction in which the electrode pad is not curved,
The solid-state imaging device, wherein the electrode pad is externally connected by bump bonding.
ことを特徴とする請求項８記載の固体撮像装置。The solid-state imaging device according to claim 8 , wherein the solid-state imaging device is formed by bending an entire imaging chip having an imaging surface into a cylindrical surface.
ことを特徴とする固体撮像装置の製造方法。A method of manufacturing a solid-state imaging device.
前記固体撮像素子をパッケージに収容する工程と、Accommodating the solid-state imaging device in a package;
前記固体撮像素子の電極パッドと前記パッケージ側の電極パッドとを電気的に接続する工程とを有するElectrically connecting the electrode pad of the solid-state imaging device and the electrode pad on the package side.
ことを特徴とする固体撮像装置の製造方法。A method of manufacturing a solid-state imaging device.
前記電極パッドをＴＡＢボンディングで外部接続する工程とを有するAnd external connection of the electrode pads by TAB bonding.
ことを特徴とする固体撮像装置の製造方法。A method of manufacturing a solid-state imaging device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002260417A JP4178890B2 (en) | 2002-09-05 | 2002-09-05 | Solid-state imaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002260417A JP4178890B2 (en) | 2002-09-05 | 2002-09-05 | Solid-state imaging device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004104259A JP2004104259A (en) | 2004-04-02 |
| JP2004104259A5 true JP2004104259A5 (en) | 2005-11-04 |
| JP4178890B2 JP4178890B2 (en) | 2008-11-12 |
Family
ID=32261145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002260417A Expired - Fee Related JP4178890B2 (en) | 2002-09-05 | 2002-09-05 | Solid-state imaging device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4178890B2 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007189108A (en) * | 2006-01-13 | 2007-07-26 | Sony Corp | Solid-state imaging apparatus and method for assembling the solid-state imaging apparatus to lens barrel |
| JP4977378B2 (en) * | 2006-02-23 | 2012-07-18 | 山梨日本電気株式会社 | Magnetic sensor, rotation detection device, and position detection device |
| JP5724322B2 (en) | 2010-11-24 | 2015-05-27 | ソニー株式会社 | Method for manufacturing solid-state imaging device |
| JP5585663B2 (en) | 2010-12-28 | 2014-09-10 | コニカミノルタ株式会社 | Wide-angle lens, imaging optical device and digital equipment |
| JP5720304B2 (en) * | 2011-02-28 | 2015-05-20 | ソニー株式会社 | Solid-state imaging device and electronic device |
| JP5720306B2 (en) * | 2011-02-28 | 2015-05-20 | ソニー株式会社 | Manufacturing method of solid-state imaging device |
| JP5720305B2 (en) * | 2011-02-28 | 2015-05-20 | ソニー株式会社 | Solid-state imaging device manufacturing method, solid-state imaging device, and electronic apparatus |
| US8742325B1 (en) * | 2013-07-31 | 2014-06-03 | Google Inc. | Photodetector array on curved substrate |
| US10050071B2 (en) | 2013-12-09 | 2018-08-14 | Sony Semiconductor Solutions Corporation | Imaging unit, lens barrel, and portable terminal |
| JP2016103520A (en) * | 2014-11-27 | 2016-06-02 | 京セラ株式会社 | Electronic component mounting package and electronic device |
| WO2016098455A1 (en) * | 2014-12-17 | 2016-06-23 | 京セラ株式会社 | Package for mounting electronic component and electronic device |
| EP3301477A1 (en) * | 2016-10-03 | 2018-04-04 | Xenomatix NV | System for determining a distance to an object |
| EP3343246A1 (en) | 2016-12-30 | 2018-07-04 | Xenomatix NV | System for characterizing surroundings of a vehicle |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997010672A1 (en) * | 1995-09-11 | 1997-03-20 | Gatan, Inc. | Optically coupled large-format solid state imaging device |
| JP2809215B2 (en) * | 1996-09-26 | 1998-10-08 | 日本電気株式会社 | Solid-state imaging camera |
| JP4156154B2 (en) * | 1999-11-26 | 2008-09-24 | 富士フイルム株式会社 | Solid-state imaging device |
| DE10004891C2 (en) * | 2000-02-04 | 2002-10-31 | Astrium Gmbh | Focal area and detector for optoelectronic image recording systems, manufacturing process and optoelectronic image recording system |
| JP2001309244A (en) * | 2000-04-19 | 2001-11-02 | Canon Inc | Solid-state imaging apparatus and mounting method of the same |
| JP2002218293A (en) * | 2001-01-17 | 2002-08-02 | Canon Inc | Image pickup device |
| JP3896586B2 (en) * | 2001-12-20 | 2007-03-22 | ソニー株式会社 | Solid-state imaging device and solid-state imaging camera |
| JP3959711B2 (en) * | 2002-02-20 | 2007-08-15 | ソニー株式会社 | Solid-state imaging device and manufacturing method thereof |
-
2002
- 2002-09-05 JP JP2002260417A patent/JP4178890B2/en not_active Expired - Fee Related
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