JP2004104127A - マルチビット磁気メモリデバイス - Google Patents
マルチビット磁気メモリデバイス Download PDFInfo
- Publication number
- JP2004104127A JP2004104127A JP2003311058A JP2003311058A JP2004104127A JP 2004104127 A JP2004104127 A JP 2004104127A JP 2003311058 A JP2003311058 A JP 2003311058A JP 2003311058 A JP2003311058 A JP 2003311058A JP 2004104127 A JP2004104127 A JP 2004104127A
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- Prior art keywords
- conductor
- magnetic tunnel
- layer
- tunnel junction
- memory cell
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- 230000005291 magnetic effect Effects 0.000 title claims abstract description 135
- 239000004020 conductor Substances 0.000 claims abstract description 65
- 230000015654 memory Effects 0.000 claims abstract description 30
- 239000003302 ferromagnetic material Substances 0.000 claims abstract description 19
- 125000006850 spacer group Chemical group 0.000 claims abstract description 13
- 230000004888 barrier function Effects 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 10
- 230000000694 effects Effects 0.000 abstract 1
- 230000005415 magnetization Effects 0.000 description 53
- 239000013598 vector Substances 0.000 description 27
- 238000010586 diagram Methods 0.000 description 15
- 230000003071 parasitic effect Effects 0.000 description 8
- 230000009977 dual effect Effects 0.000 description 7
- 238000001514 detection method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000005290 antiferromagnetic effect Effects 0.000 description 5
- 239000003989 dielectric material Substances 0.000 description 5
- 230000005294 ferromagnetic effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000005641 tunneling Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910003321 CoFe Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- FQMNUIZEFUVPNU-UHFFFAOYSA-N cobalt iron Chemical compound [Fe].[Co].[Co] FQMNUIZEFUVPNU-UHFFFAOYSA-N 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 229910001004 magnetic alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000006403 short-term memory Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
- G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1673—Reading or sensing circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1675—Writing or programming circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5607—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using magnetic storage elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/71—Three dimensional array
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Hall/Mr Elements (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Semiconductor Memories (AREA)
Abstract
【解決手段】メモリセル8は、強磁性材料36で被覆された導体34と、該被覆された導体34の両側にある第1及び第2のスペーサ層16,24と、該第1のスペーサ層16上にある第1のデータ層12と、該第2のスペーサ層24上にある第2のデータ層22とを含む。
【選択図】図1
Description
10 第1の磁気トンネル接合
12 第1のデータ層
14 基準層
14a 上側部分
14b 下側部分
16 第1の絶縁性トンネル障壁
20 第2の磁気トンネル接合
22 第2のデータ層
24 第2の絶縁性トンネル障壁
30 第1の導体
32 第2の導体
34 第3の導体
Claims (10)
- メモリセル(8)であって、
強磁性材料(36)で被覆された導体(34)と、
該被覆された導体の両側に配設された第1及び第2のスペーサ層(16,24)と、
前記第1のスペーサ層(16)上に配設された第1のデータ層(12)と、
前記第2のスペーサ層(24)上に配設された第2のデータ層(22)と
を含む、メモリセル(8)。 - 前記導体(34)が完全に被覆される、請求項1に記載のメモリセル。
- 前記導体(34)の上面及び下面のみが被覆される、請求項1に記載のメモリセル。
- 前記被覆された導体(14)が軟磁性である、請求項1に記載のメモリセル。
- 前記第1及び第2のデータ層(12,22)の飽和保磁力が、前記被覆された導体(14)の飽和保磁力よりも大幅に高い、請求項1に記載のメモリセル。
- 前記第1及び第2のデータ層(12,22)が、前記導体(34)上の前記被覆(36)とは異なる強磁性材料から形成される、請求項1に記載のメモリセル。
- 前記スペーサ層(16,24)が絶縁性トンネル障壁であり、前記第1のデータ層及び前記第1のスペーサ層(12,16)及び前記被覆された導体(14a)が第1の磁気トンネル接合を形成し、前記第2のデータ層及び前記第2のスペーサ層(22,24)及び前記被覆された導体(14b)が第2の磁気トンネル接合を形成する、請求項1に記載のメモリセル。
- 前記メモリセルが少なくとも4つの検出可能な異なる論理状態を有する、請求項7に記載のメモリセル。
- 前記第1のデータ層(12)上に配設された第1の導体(30)と、前記第2のデータ層(22)上に配設された第2の導体(32)とを更に含み、前記被覆された導体(14)が前記第1及び第2の導体(30,32)と直交する、請求項7に記載のメモリセル。
- 請求項7に記載のメモリセルに対して読み出し動作を実行する方法であって、前記被覆された導体(14)に読み出し電流(IR)を供給し、前記第1及び第2の磁気トンネル接合に第1及び第2の電流(IS10,IS20)を流す、という各ステップを含む方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/235,011 US6577529B1 (en) | 2002-09-03 | 2002-09-03 | Multi-bit magnetic memory device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004104127A true JP2004104127A (ja) | 2004-04-02 |
JP2004104127A5 JP2004104127A5 (ja) | 2005-06-09 |
Family
ID=22883687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003311058A Pending JP2004104127A (ja) | 2002-09-03 | 2003-09-03 | マルチビット磁気メモリデバイス |
Country Status (6)
Country | Link |
---|---|
US (2) | US6577529B1 (ja) |
EP (1) | EP1398795A3 (ja) |
JP (1) | JP2004104127A (ja) |
KR (1) | KR101018015B1 (ja) |
CN (1) | CN100490005C (ja) |
TW (1) | TW200405333A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005311322A (ja) * | 2004-04-16 | 2005-11-04 | Sharp Corp | 共用接続を備える3次元クロスポイント型可変抵抗メモリアレイ |
JP2008097811A (ja) * | 2003-04-29 | 2008-04-24 | Samsung Electronics Co Ltd | 二重接合磁気メモリデバイスの読み出し方法および二重接合磁気メモリデバイスへの書き込み方法 |
JP2009111391A (ja) * | 2007-10-31 | 2009-05-21 | Qimonda Ag | 導電性クラッディング部を有する、ドープされた半導体ラインを含む集積回路 |
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DE19823826A1 (de) * | 1998-05-28 | 1999-12-02 | Burkhard Hillebrands | MRAM-Speicher sowie Verfahren zum Lesen/Schreiben digitaler Information in einen derartigen Speicher |
US6778421B2 (en) * | 2002-03-14 | 2004-08-17 | Hewlett-Packard Development Company, Lp. | Memory device array having a pair of magnetic bits sharing a common conductor line |
US6627932B1 (en) * | 2002-04-11 | 2003-09-30 | Micron Technology, Inc. | Magnetoresistive memory device |
AU2003243244A1 (en) * | 2002-05-16 | 2003-12-02 | Micron Technology, Inc. | STACKED 1T-nMEMORY CELL STRUCTURE |
US6940748B2 (en) * | 2002-05-16 | 2005-09-06 | Micron Technology, Inc. | Stacked 1T-nMTJ MRAM structure |
US7209378B2 (en) * | 2002-08-08 | 2007-04-24 | Micron Technology, Inc. | Columnar 1T-N memory cell structure |
US6882553B2 (en) * | 2002-08-08 | 2005-04-19 | Micron Technology Inc. | Stacked columnar resistive memory structure and its method of formation and operation |
US6836429B2 (en) * | 2002-12-07 | 2004-12-28 | Hewlett-Packard Development Company, L.P. | MRAM having two write conductors |
JP2004296859A (ja) * | 2003-03-27 | 2004-10-21 | Renesas Technology Corp | 磁気記録素子及び磁気記録素子の製造方法 |
US6958933B2 (en) * | 2003-07-07 | 2005-10-25 | Hewlett-Packard Development Company, L.P. | Memory cell strings |
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US7079436B2 (en) * | 2003-09-30 | 2006-07-18 | Hewlett-Packard Development Company, L.P. | Resistive cross point memory |
US7136300B2 (en) * | 2003-10-06 | 2006-11-14 | Hewlett-Packard Development Company, Lp. | Magnetic memory device including groups of series-connected memory elements |
US7166881B2 (en) * | 2003-10-13 | 2007-01-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multi-sensing level MRAM structures |
US7072209B2 (en) * | 2003-12-29 | 2006-07-04 | Micron Technology, Inc. | Magnetic memory having synthetic antiferromagnetic pinned layer |
US7023724B2 (en) * | 2004-01-10 | 2006-04-04 | Honeywell International Inc. | Pseudo tunnel junction |
US7268986B2 (en) * | 2004-03-31 | 2007-09-11 | Hitachi Global Storage Technologies Netherlands B.V. | Double tunnel junction using self-pinned center ferromagnet |
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US20060039183A1 (en) * | 2004-05-21 | 2006-02-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multi-sensing level MRAM structures |
US7105903B2 (en) * | 2004-11-18 | 2006-09-12 | Freescale Semiconductor, Inc. | Methods and structures for electrical communication with an overlying electrode for a semiconductor element |
JP4777807B2 (ja) * | 2006-03-29 | 2011-09-21 | エルピーダメモリ株式会社 | 積層メモリ |
KR100885184B1 (ko) * | 2007-01-30 | 2009-02-23 | 삼성전자주식회사 | 전기장 및 자기장에 의해 독립적으로 제어될 수 있는 저항특성을 갖는 메모리 장치 및 그 동작 방법 |
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CN111211135B (zh) * | 2020-01-16 | 2022-08-05 | 华中科技大学 | 一种非对称铁电隧穿结多值存储单元的调制方法 |
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-
2002
- 2002-09-03 US US10/235,011 patent/US6577529B1/en not_active Expired - Lifetime
-
2003
- 2003-01-23 US US10/349,685 patent/US6693825B1/en not_active Expired - Lifetime
- 2003-03-18 TW TW092105948A patent/TW200405333A/zh unknown
- 2003-06-03 CN CNB031384978A patent/CN100490005C/zh not_active Expired - Lifetime
- 2003-09-02 KR KR1020030061046A patent/KR101018015B1/ko active IP Right Grant
- 2003-09-02 EP EP03255480A patent/EP1398795A3/en not_active Withdrawn
- 2003-09-03 JP JP2003311058A patent/JP2004104127A/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008097811A (ja) * | 2003-04-29 | 2008-04-24 | Samsung Electronics Co Ltd | 二重接合磁気メモリデバイスの読み出し方法および二重接合磁気メモリデバイスへの書き込み方法 |
JP4660529B2 (ja) * | 2003-04-29 | 2011-03-30 | 三星電子株式会社 | 二重接合磁気メモリデバイスの読み出し方法および二重接合磁気メモリデバイスへの書き込み方法 |
JP2005311322A (ja) * | 2004-04-16 | 2005-11-04 | Sharp Corp | 共用接続を備える3次元クロスポイント型可変抵抗メモリアレイ |
JP2009111391A (ja) * | 2007-10-31 | 2009-05-21 | Qimonda Ag | 導電性クラッディング部を有する、ドープされた半導体ラインを含む集積回路 |
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Publication number | Publication date |
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US6577529B1 (en) | 2003-06-10 |
TW200405333A (en) | 2004-04-01 |
KR101018015B1 (ko) | 2011-03-02 |
CN1480946A (zh) | 2004-03-10 |
US6693825B1 (en) | 2004-02-17 |
EP1398795A3 (en) | 2005-04-27 |
KR20040020839A (ko) | 2004-03-09 |
EP1398795A2 (en) | 2004-03-17 |
CN100490005C (zh) | 2009-05-20 |
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