JP2004101528A - 半導体力学量センサの製造方法 - Google Patents
半導体力学量センサの製造方法 Download PDFInfo
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- JP2004101528A JP2004101528A JP2003314030A JP2003314030A JP2004101528A JP 2004101528 A JP2004101528 A JP 2004101528A JP 2003314030 A JP2003314030 A JP 2003314030A JP 2003314030 A JP2003314030 A JP 2003314030A JP 2004101528 A JP2004101528 A JP 2004101528A
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- JP
- Japan
- Prior art keywords
- movable electrode
- mounting
- movable
- sensor
- glass plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends
Landscapes
- Gyroscopes (AREA)
- Pressure Sensors (AREA)
Abstract
【解決手段】 P型シリコン基板17の上方には、梁構造の可動電極24が所定間隔を隔てて配置され、加速度の作用に伴う可動電極24の変位から加速度が検出される。センサ製造の際には、昇華性物質であるナフタレン44をP型シリコン基板17と可動電極24との間を含むP型シリコン基板17上に配置し、ナフタレン44を固定する。この状態でダイシングカットやマウントやワイヤーボンディング等の実装を行う。このとき、可動電極24に対しダイシングカットの際の水流等やワイヤーボンディングの際の振動が加わったりハンドリングが行われるが、可動電極24がナフタレン44により動かないように固定されているので可動電極24の破損が回避される。そして、実装後にナフタレン44を気化する。
【選択図】 図1
Description
24…可動部としての可動電極、
44…保護材および固定部材としてのナフタレン、
47…保護材およびキャップ部材としてのガラス板。
Claims (2)
- 半導体基板と、前記半導体基板の上方に所定間隔を隔てて配置された梁構造の可動部とを備え、力学量の作用に伴う前記可動部の変位から力学量を検出するようにした半導体力学量センサの製造方法において、
前記可動部を保護する保護材として可動部の回りを覆うキャップ部材を用い、前記可動部を当該キャップ部材にて保護した状態でウェハ状態の前記半導体基板を各チップにダイシングして実装するようにしたものであって、
前記キャップ部材は樹脂であることを特徴とする半導体力学量センサの製造方法。 - 請求項1に記載の半導体力学量センサの製造方法において、前記半導体基板と前記キャップ部材との間には絶縁物が介在していることを特徴とする半導体力学量センサの製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003314030A JP3685193B2 (ja) | 2003-09-05 | 2003-09-05 | 半導体力学量センサの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003314030A JP3685193B2 (ja) | 2003-09-05 | 2003-09-05 | 半導体力学量センサの製造方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP371694A Division JP3612723B2 (ja) | 1994-01-18 | 1994-01-18 | 半導体力学量センサの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004101528A true JP2004101528A (ja) | 2004-04-02 |
JP3685193B2 JP3685193B2 (ja) | 2005-08-17 |
Family
ID=32290727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2003314030A Expired - Lifetime JP3685193B2 (ja) | 2003-09-05 | 2003-09-05 | 半導体力学量センサの製造方法 |
Country Status (1)
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JP (1) | JP3685193B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006052693B4 (de) * | 2005-11-18 | 2009-04-16 | Denso Corporation, Kariya | Verfahren zur Fertigung eines Halbleitersensors |
-
2003
- 2003-09-05 JP JP2003314030A patent/JP3685193B2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006052693B4 (de) * | 2005-11-18 | 2009-04-16 | Denso Corporation, Kariya | Verfahren zur Fertigung eines Halbleitersensors |
US7598118B2 (en) | 2005-11-18 | 2009-10-06 | Denso Corporation | Method of manufacturing semiconductor sensor |
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Publication number | Publication date |
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JP3685193B2 (ja) | 2005-08-17 |
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