JP2004095750A - Method for manufacturing laminated electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that the line width of a conductor pattern or the interval of the conductor pattern are wide at the time of forming the conductor pattern by screen printing, and that the conductor pattern can not be formed on a ceramic green film at the time of forming the conductor pattern by a thick film photolithography technology. <P>SOLUTION: Insulating materials with photosensitive agent is used on a supporting body, and hardening is carried out to form a first insulator layer. Then, a second insulator layer formed of a conductor pattern formed by a photo-lithography technology by using photosensitive conductive paste and the insulating materials with the photosensitive agent is laminated on the first insulator layer. Then, a third insulator layer is formed on those laminated bodies by using the insulating materials with the photosensitive agent. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a laminated electronic component in which an insulator layer and a conductor pattern are laminated, and a circuit element is formed in the laminate by the conductor pattern.
[0002]
[Prior art]
Examples of this type of laminated electronic component include a coil, a capacitor, a transformer, a common mode choke coil, a balun, a directional coupler, and a filter integrating a plurality of elements. For example, in a conventional laminated coil, an insulator layer and a conductor pattern are alternately laminated, and the conductor pattern between the insulator layers is connected to form a coil in the laminate. Both ends of the coil are drawn out to the end face of the laminate and connected to external electrodes provided on the end face of the laminate.
Such a laminated electronic component is formed by a so-called printing lamination method in which an insulator layer and a conductor pattern are sequentially printed, or a so-called sheet lamination method in which sheets on which a conductor pattern is printed are laminated.
[0003]
[Problems to be solved by the invention]
In recent years, electronic devices have been reduced in size, weight, and performance, and electronic components mounted on the electronic devices have also been desired to be reduced in size, weight, and performance.
In the conventional multilayer electronic component, since the conductor pattern is formed by screen printing, dripping and bleeding of the conductor paste at the time of printing and the presence of the mesh of the print mask greatly vary the shape of the conductor pattern. . Therefore, in the conventional multilayer electronic component, it is necessary to increase the interval between the conductor patterns and the line width of the conductor patterns, and it has not been possible to reduce the size, weight, and performance.
[0004]
In order to solve such a problem, a conductor pattern is formed by a thick-film photolithography technique using a photosensitive conductor paste. When the conductor pattern is formed by using a thick film photolithography technique using a photosensitive conductor paste, the line width of the conductor pattern and the interval between the conductor patterns can be made smaller than those obtained by screen printing.
However, in such a conventional multilayer electronic component, when a photosensitive conductor paste is applied to the surface of a ceramic green film serving as an insulator layer, a photosensitive agent in the photosensitive conductor paste is absorbed into the ceramic green film. For this reason, even when exposed to light, the conductive pattern was not cured into a predetermined pattern shape, and the conductive film was washed away by development, and a conductive pattern could not be formed on the surface of the ceramic green film.
[0005]
In order to solve such a problem, a conductor pattern is formed in advance on a polyethylene terephthalate film by a photolithography technique using a photosensitive conductor paste, and the conductor pattern on the polyethylene terephthalate film is converted into a ceramic to be an insulator layer. Transferring to a green film has been performed. However, in the conventional laminated electronic component formed in this manner, the conductor pattern is deformed or transferred due to the pressure applied when the conductor pattern on the polyethylene terephthalate film is transferred onto the ceramic green film serving as the insulator layer. In such a case, the position of the conductor pattern was displaced, and the definition of the conductor pattern could not be made sufficiently high. In addition, a step of transferring the conductor pattern onto the ceramic green film is required, and the number of manufacturing steps increases accordingly.
Further, as another method for solving the above-mentioned problem, a conductive pattern formed by forming a predetermined pattern on a baked substrate by a photolithographic technique using a photosensitive conductive paste, Insulator layers formed by photolithography using a conductive insulator paste and fired are stacked in a predetermined order, and finally the fired substrate is joined with a glass material or the like. . In the conventional multilayer electronic component formed in this manner, a conductor pattern can be formed on the insulator layer. However, in addition to firing each layer, the multilayer body is fired many times. However, when the lowermost substrate is thin, the substrate is cracked.
[0006]
The present invention provides a method for manufacturing a multilayer electronic component that can accurately form a high-definition conductor pattern without increasing the number of manufacturing steps, thereby contributing to miniaturization and high performance of the multilayer electronic component. The purpose is to:
[0007]
[Means for Solving the Problems]
The method for manufacturing a multilayer electronic component according to the present invention solves the above-mentioned problem by improving the method of forming a conductor pattern and an insulator layer. That is, the present invention provides a method for manufacturing a laminated electronic component in which an insulator layer and a conductor pattern are laminated and a circuit element is formed by the conductor pattern in the laminate, using an insulating material containing a photosensitive agent on a support, A step of forming a first insulator layer by performing a hardening treatment; a conductive pattern formed by a photolithography technique using a photosensitive conductive paste on the first insulator layer and an insulating material containing a photosensitive agent; A step of stacking the second insulator layer and a step of forming a third insulator layer on these laminates using an insulating material containing a photosensitive agent.
The present invention also provides a method for manufacturing a laminated electronic component in which an insulator layer and a conductor pattern are laminated, and a circuit element is formed by the conductor pattern in the laminate. Forming a body layer, forming a buffer layer using a photosensitive agent-containing insulating material on the first insulator layer, and forming a conductive pattern on the buffer layer using a photosensitive conductive paste by photolithography And a second insulator layer formed of an insulating material containing a photosensitive agent, and a step of forming a third insulator layer on the stacked body.
[0008]
Furthermore, in the present invention, the insulator layer and the conductor pattern are laminated, the conductor pattern between the insulator layers is connected via a conductor in a through hole of the insulator layer, and a circuit element is formed by the conductor pattern in the laminate. In a method for manufacturing a laminated electronic component, a step of forming a first insulator layer by performing a curing process using an insulating material containing a photosensitive agent on a support, and forming a photosensitive conductive material on the first insulator layer A step of stacking a conductor pattern formed by a photolithography technique using a paste and a second insulator layer formed of an insulating material containing a photosensitive agent, and using an insulating material containing a photosensitive agent on these laminates; Forming a third insulator layer by using the same.
Still further, according to the present invention, an insulator layer and a conductor pattern are laminated, and the conductor pattern between the insulator layers is connected via a conductor in a through hole of the insulator layer, and a circuit element is formed by the conductor pattern in the laminate. Forming a first insulator layer of an insulating ceramic material on a support, forming a buffer layer on the first insulator layer by using an insulating material containing a photosensitive agent. A forming step, a step of stacking a conductive pattern formed by a photolithographic technique using a photosensitive conductive paste on a buffer layer and a second insulator layer formed of an insulating material containing a photosensitive agent, and lamination thereof. Forming a third insulator layer on the body.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
In the method of manufacturing a multilayer electronic component of the present invention, first, at least one or more first insulator layers are formed on a support using an insulating ceramic material or an insulating material containing a photosensitive agent. When the first insulator layer is formed using an insulating material containing a photosensitive agent, the first insulator layer is cured by light or heat. Next, a conductor pattern formed by photolithography using a photosensitive conductive paste and a second insulator layer formed of an insulating material containing a photosensitive agent are stacked on the first insulator layer. At this time, before forming the insulator layer on the conductor pattern, the conductor pattern is exposed to a temperature range of 40000 ° C. sec. The heat treatment is performed under a condition of not more than ° C · sec. When the first insulator layer is formed of an insulating ceramic material, a buffer layer of 30 μm or more formed of an insulating material containing a photosensitive agent is provided on the first insulator layer. A conductor pattern and a second insulator layer are stacked on top. Further, at least one or more third insulator layers are formed on these laminates using an insulating ceramic material or an insulating material containing a photosensitive agent.
When the conductor pattern is formed in this manner, the width and the interval between the conductor patterns can be reduced to about 15 μm, and a higher definition than the conventional one can be formed on the insulator layer with higher precision. In the case where a buffer layer having a thickness of 30 μm or more formed of an insulating material containing a photosensitive agent is provided on the first insulating layer formed of an insulating ceramic material, the buffer layer is close to the first insulating layer. Although the diffusion of the photosensitive agent into the first insulator layer occurs in the portion, the diffusion of the photosensitive agent hardly occurs near the surface of the buffer layer. Therefore, the photosensitive agent contained in the conductor pattern and the insulator layer formed on the buffer layer does not diffuse into the insulating ceramic material. Further, when the conductor pattern is subjected to a heat treatment under the condition that the time (second) of exposure to the temperature region of the maximum heating temperature (° C.) × 100 ° C. or more is 40,000 ° C. or more and 60,000 ° C. or less. The strength of the conductor pattern is improved, and it is possible to prevent the conductor pattern from being deformed by the stress when the insulator layer is formed on the conductor pattern and from being washed away.
[0010]
【Example】
Hereinafter, an embodiment of a method of manufacturing a multilayer electronic component according to the present invention will be described with reference to FIGS.
FIG. 1 is an exploded perspective view of a multilayer electronic component according to a first embodiment of the method for manufacturing a multilayer electronic component of the present invention, and FIG. 2 is a diagram illustrating a first embodiment of the method of manufacturing a multilayer electronic component of the present invention. It is a perspective view which shows typically.
As a multilayer electronic component according to the first embodiment of the method for manufacturing a multilayer electronic component of the present invention, for example, as shown in FIG. 1, a conductor pattern for a coil having less than one turn is formed on insulator layers 11A and 11B. 14 is laminated with the insulator layers 12A to 12D, the insulator layers 13A and 13B are formed on these laminates, and a coil is formed in the laminate.
The insulator layers 11A and 11B and the insulator layers 13A and 13B are formed of an insulating ceramic such as a magnetic or dielectric material. Further, the insulator layers 12A to 12D are formed of an insulating ceramic such as a magnetic material or a dielectric material.
Conductor patterns 14 are formed on the surfaces of the insulator layers 11B, 12A, 12B, 12C, and 12D, respectively. In FIG. 1, the conductor pattern 14 is a coil conductor pattern having less than one turn, and the conductor pattern 14 between the insulator layers is spirally connected via conductors in through holes in the insulator layer to form a laminate. A coil is formed at the end.
One end of the conductor pattern 14 of the insulator layer 11B constituting one end of the coil is drawn out to the end face of the insulator layer 11B and connected to an external electrode formed on the end face of the laminate. The other end of the conductor pattern 14 of the insulator layer 12D constituting the other end of the coil is drawn out to the end face of the insulator layer 12D and connected to an external electrode formed on the end face of the laminate.
[0011]
Such a laminated electronic component is manufactured as follows. First, as shown in FIG. 2A, an insulating material containing a photosensitive agent is applied to the surface of the support 20 and dried, and then the entire surface is exposed to light (eg, ultraviolet light) or dried. By heating at a temperature higher than the temperature and lower than the degreasing temperature, the insulator layer 21 is formed on the support 20. The insulating material containing the photosensitive agent is formed into a paste by mixing the photosensitive agent into an insulating ceramic such as a magnetic substance or a dielectric substance, and has a uniform thickness using a method such as screen printing, spin coating, or a doctor blade. It is applied on the support 20 as shown. The insulator 21 is formed by repeating a plurality of layers (for example, the formation of an insulator layer having a thickness of 10 μm until the thickness becomes 150 μm to 200 μm) so that the insulator 21 has a predetermined thickness according to an element to be formed. 15 to 20 layers). Further, the support 20 may be of any type as long as it can support the insulator layer 21 and has strength enough to withstand transportation in a process described below. For example, the size is 60 mm × 50 mm, and the thickness is 60 mm × 50 mm. A film having an appropriate peel strength is attached to the surface of a substrate such as an alumina substrate having a thickness of 1 mm. As the film to be attached to the surface of the substrate, for example, a polyester film having a thickness of 210 μm with a silicon-based adhesive formed on the lower surface is used.
Next, as shown in FIG. 2B, a photosensitive conductive paste is applied to the entire surface of the insulator layer 21 and dried to form a photosensitive conductive film 24A on the insulator layer 21. The photosensitive conductive paste is formed by mixing a photosensitive material into a conductive material such as silver, an alloy of silver and palladium, copper, and nickel, and has a uniform thickness using a method such as screen printing, spin coating, or a doctor blade. It is applied on the insulator layer 21 in a thickness of, for example, 10 μm.
Further, a mask (for example, a glass dry plate) having a light-transmitting hole having a predetermined conductor pattern shape is brought into close contact with the surface of the photosensitive conductive film 24A, and light is irradiated through the mask to expose the photosensitive conductive film. The conductive film 24A is cured into a predetermined pattern shape. As this light beam, for example, ultraviolet light having an energy of 10 to 1000 mJ is used. By developing the photosensitive conductive film 24A using a developing solution, the unexposed portions are removed. Then, this is dried, and the time (second) of exposure to a temperature region of not less than the maximum temperature of heating (° C.) × 100 ° C. is 40,000 ° C. · s to 60,000 ° C. · s (for example, when the peak temperature is 144 ° C., By heating for 100 seconds at 466 seconds, the conductor pattern 24 is formed on the surface of the insulator layer 21 as shown in FIG. In FIG. 2, in order to manufacture a plurality of laminated electronic components at one time (so as to obtain a plurality of electronic components), a U-shaped coil of less than one-turn turns is formed on the surface of the insulator layer. Conductor pattern is formed.
Subsequently, a photosensitive material-containing insulating material is applied to the entire surface of the insulator layer 21 on which the conductor pattern 24 is formed, and dried to form a photosensitive insulator film on the insulator layer 21. The insulating material containing the photosensitive agent is formed into a paste by mixing the photosensitive agent into an insulating ceramic such as a magnetic substance or a dielectric substance, and has a uniform thickness using a method such as screen printing, spin coating, or a doctor blade. It is applied on the insulator layer 21 in a thickness of, for example, 10 μm. A mask (for example, a glass dry plate) having a light-shielding pattern that shields a portion to be a through hole is brought into close contact with the surface of the photosensitive insulator film, and a light beam (for example, ultraviolet light having an energy of 10 to 1000 mJ) is irradiated through the mask. Then, by developing with a developer, a portion to be a through hole of the photosensitive insulator film is removed. Then, this is dried, and the time (second) of exposure to a temperature region of not less than the maximum temperature of heating (° C.) × 100 ° C. is 40,000 ° C. · s to 60,000 ° C. · s (for example, when the peak temperature is 144 ° C., By heating for 466 seconds (exposure time to 100 ° C.), an insulator layer 12A having a through hole S is formed on the surface of the insulator layer 21 as shown in FIG. 2D.
Next, as shown in FIG. 2E, a photosensitive conductive paste is applied to the entire surface of the insulator layer 12A and dried to fill the through holes of the insulator layer 12A with a conductor. Then, a photosensitive conductive film 24B is formed on the insulator layer 12A. Further, the photosensitive conductive film 24B is exposed to a light beam (for example, ultraviolet light having an energy of 10 to 1000 mJ) through a mask having a light transmission hole having a predetermined conductor pattern shape, and is exposed to light, and developed with a developer. This removes the unexposed portions. Then, this is dried, and the time (second) of exposure to a temperature region of not less than the maximum temperature of heating (° C.) × 100 ° C. is 40,000 ° C. · s to 60,000 ° C. · s (for example, when the peak temperature is 144 ° C., By heating for 466 seconds (exposure time to 100 ° C.), the conductor pattern 24 is formed on the surface of the insulator layer 12A as shown in FIG. The conductor pattern 24 on the surface of the insulator layer 12A is connected to the conductor pattern on the surface of the insulator layer 21 via a conductor in a through hole of the insulator layer 12A.
2D to 2F are repeated a predetermined number of times to form a conductor pattern 24 on the insulator layer 22 as shown in FIG. The number of turns of the coil is formed.
Subsequently, as shown in FIG. 2H, an insulating material containing a photosensitive agent is applied to the entire surface of the insulator layer 22 and dried, and then the entire surface is exposed using a light beam (for example, ultraviolet light). Alternatively, by heating at a temperature higher than the drying temperature and lower than the degreasing temperature, the insulator layer 23 is formed on the insulator layer 22. The insulator layer 23 is formed by a plurality of layers (for example, by repeating the formation of an insulator layer having a thickness of 10 μm until the thickness becomes 350 μm) so that the insulator layer 23 has a predetermined thickness according to the element to be formed. Layer).
Then, these laminates are cut at a dotted line position shown in FIG. 2 (H) so as to have a predetermined shape, the shape is adjusted by barrel polishing, and the coil drawing ends are exposed and then degreased. Fired at ℃. After reshaping the fired body by barrel polishing and exposing the lead conductor, an external electrode is formed on the end face.
[0012]
FIG. 3 is an exploded perspective view of a multilayer electronic component according to a second embodiment of the method for manufacturing a multilayer electronic component of the present invention, and FIG. 4 is a diagram illustrating a second embodiment of the method of manufacturing a multilayer electronic component of the present invention. It is a perspective view which shows typically.
As a multilayer electronic component according to the second embodiment of the method for manufacturing a multilayer electronic component of the present invention, for example, as shown in FIG. 3, a buffer layer 36 is provided on insulator layers 31A and 31B, The coil conductor pattern 34 of less than one turn and the insulator layers 32A to 32D are stacked on the layer 36, and the insulator layers 33A and 33B are formed on these laminates, and a coil is formed in the laminate. .
Such a laminated electronic component is manufactured as follows. First, as shown in FIG. 4A, at least one or more insulating films 41 are formed on a support 40 using an insulating ceramic material such as a magnetic material or a dielectric material.
Next, as shown in FIG. 4B, an insulating material containing a photosensitive agent is applied to the entire surface of the insulator film 41 and dried, and then the entire surface is exposed to light using a light beam or a drying temperature. By heating at a higher temperature than the degreasing temperature, the buffer layer 36 is formed on the insulator film 41. The insulating material containing the photosensitive agent is formed into a paste by mixing the photosensitive agent into an insulating ceramic such as a magnetic substance or a dielectric substance, and has a uniform thickness using a method such as screen printing, spin coating, or a doctor blade. It is applied on the insulator film 41 as shown. By setting the thickness of the buffer layer 36 to 30 μm or more, regardless of the thickness of the insulator film 41, a conductor pattern could be formed on the buffer layer 36 in a later step. The thickness of the buffer layer 36 in FIG. 4 was set to 40 μm in order to sufficiently secure the stability of the characteristics.
Further, as shown in FIG. 4C, a photosensitive conductive paste is applied to the entire surface of the buffer layer 36 and dried to form a photosensitive conductive film 44A on the buffer layer 36. By irradiating and irradiating light on the surface of the photosensitive conductive film 44A through a mask having a light transmission hole having a predetermined conductor pattern shape, and developing the photosensitive conductive film 44A using a developing solution, The unexposed parts are removed. Then, this is dried, and the time (second) of exposure to a temperature region of not less than the maximum temperature of heating (° C.) × 100 ° C. is 40,000 ° C. · s to 60,000 ° C. · s (for example, when the peak temperature is 144 ° C., By heating for 466 seconds (exposure time to 100 ° C.), the conductor pattern 44 is formed on the surface of the buffer layer 36 as shown in FIG.
Subsequently, a photosensitive material-containing insulating material is applied to the entire surface of the buffer layer 36 on which the conductor pattern 44 is formed, and dried to form a photosensitive insulator film on the buffer layer 36. As the insulating material containing a photosensitive agent, a paste obtained by mixing a photosensitive agent into an insulating ceramic such as a magnetic substance or a dielectric substance is used. The photosensitive insulator film is exposed to light through a mask (for example, a glass dry plate) having a light-shielding pattern that shields a portion to be a through hole on the surface of the photosensitive insulator film, and is exposed to light. Portions of the film that will become through holes are removed. Then, this is dried, and the time (second) of exposure to a temperature region of not less than the maximum temperature of heating (° C.) × 100 ° C. is 40,000 ° C. · s to 60,000 ° C. · s (for example, when the peak temperature is 144 ° C., By heating for 466 seconds exposed to 100 ° C., an insulator layer 32A having a through hole S is formed as shown in FIG.
Next, as shown in FIG. 4 (F), a photosensitive conductive paste is applied to the entire surface of the insulator layer 32A and dried to fill the through holes in the insulator layer 32A with a conductor. Then, a photosensitive conductive film 44B is formed on the insulator layer 32A. By exposing the photosensitive conductive film 44B to light by irradiating it through a mask, and developing with a developer, unexposed portions are removed. Then, this is dried, and the time (second) of exposure to a temperature region of not less than the maximum temperature of heating (° C.) × 100 ° C. is 40,000 ° C. · s to 60,000 ° C. · s (for example, when the peak temperature is 144 ° C., By heating for 466 seconds (exposure time to 100 ° C.), the conductor pattern 44 is formed on the surface of the insulator layer 32A as shown in FIG. The conductor pattern 24 on the surface of the insulator layer 32A is connected to the conductor pattern on the surface of the insulator layer 31 via a conductor filled in a through hole of the insulator layer 32A.
Further, the steps of FIG. 4E to FIG. 4G are repeated a predetermined number of times to form a conductor pattern 44 on the insulator layer 42 as shown in FIG. A number of turns of the coil are formed.
Further, as shown in FIG. 4 (I), an insulating material containing a photosensitive agent is applied to the entire surface of the insulator layer 42 and dried, and then the whole is exposed using a light beam or the drying temperature. By heating at a higher temperature than the degreasing temperature, at least one insulator layer 43 is formed on the insulator layer 42.
Then, these laminates are cut at the positions indicated by the dotted lines shown in FIG. 4 (I) so as to have a predetermined shape, the shapes are adjusted by barrel polishing, and the coil drawing ends are exposed and then degreased. Fired at ℃. After reshaping the fired body by barrel polishing and exposing the lead conductor, an external electrode is formed on the end face.
In the multilayer electronic component formed in this manner, the same insulating ceramic without a photosensitive agent as in the related art can be used for the first insulator layer, so that the material cost can be reduced as compared with the above-described embodiment. Can be.
[0013]
FIG. 5 is an exploded perspective view of a multilayer electronic component according to a third embodiment of the method of manufacturing a multilayer electronic component of the present invention, and FIGS. 6 and 7 are third views of the method of manufacturing a multilayer electronic component of the present invention. It is a perspective view which shows an Example typically.
As a multilayer electronic component according to the third embodiment of the method for manufacturing a multilayer electronic component of the present invention, for example, as shown in FIG. 5, a buffer layer 56 is provided on insulator layers 51A and 51B, The insulator layers 52A to 52E and the coil conductor patterns 54A, 54B, 54, 55, 55A, and 55B are stacked on the layer 56, and the insulator layers 53A and 53B are formed on these laminates. There is one in which two coils that are electromagnetically coupled are formed.
The insulator layers 51A and 51B, the buffer layer 56, and the insulator layers 53A and 53B are formed of magnetic ceramic. Further, the insulator layers 52A to 52E are formed of an insulating ceramic.
Leading conductor patterns 54A and 54B are formed on the surface of the insulator layer 52A. A spiral conductor pattern 54 is formed on the surface of the insulator layer 52B. The conductor pattern 54 has an inner end connected to the conductor pattern 54A via a conductor in a through hole of the insulator layer 52B, and an outer end connected to the conductor pattern 54B via a conductor in a through hole of the insulator layer 52B. You.
A spiral conductive pattern 55 is formed on the surface of the insulator layer 52C. In addition, on the surface of the insulator layer 52D, lead conductor patterns 55A and 55B are formed. The conductor pattern 55A is connected to the inner end of the spiral conductor pattern 55. The conductor pattern 55B is connected to the outer end of the spiral conductor pattern 55. The lead conductor patterns 54A, 54B, 55A, and 55B are connected to external terminals provided on the laminate.
Such a laminated electronic component is used as a transformer or a common mode choke coil.
[0014]
Such a laminated electronic component is manufactured as follows. First, as shown in FIG. 6A, at least one or more insulating films 61 are formed on a support 60 using a magnetic insulating ceramic material. Note that the insulator film 61 is formed into a plurality of layers by repeating formation of an insulator film having a thickness of 6 μm until the thickness becomes 400 μm, for example, so that the insulator film 61 has a predetermined thickness according to the element to be formed. May be.
Next, as shown in FIG. 6B, an insulating material containing a photosensitive agent is applied to the entire surface of the insulator film 61 and dried, and then the entire surface is exposed to light using a light beam or a drying temperature. By heating at a temperature higher than the degreasing temperature, the buffer layer 56 is formed on the insulator film 61. As the insulating material containing a photosensitive agent, a paste obtained by mixing a photosensitive agent into a magnetic insulating ceramic is used.
Further, as shown in FIG. 6 (C), an insulating material containing a photosensitive agent is applied to the entire surface of the buffer layer 56 and dried, and then the entire surface is exposed to light using a light beam or the drying temperature is increased. By heating at a high temperature but lower than the degreasing temperature, the insulator layer 52A is formed on the buffer layer 56. As the insulating material containing a photosensitive agent, a paste obtained by mixing a photosensitive agent into an insulating ceramic such as a magnetic substance or a dielectric substance is used.
Subsequently, a photosensitive conductive paste is applied to the entire surface of the insulator layer 52A and dried to form a photosensitive conductive film, which is then exposed and developed to remove portions other than the portion serving as the conductive pattern. . Then, this is dried and heated under the condition that the time (second) of exposure to a temperature region of not less than the maximum temperature of heating (° C.) × 100 ° C. is 40,000 ° C. · s to 60,000 ° C. · s, thereby obtaining FIG. As shown in (), conductor patterns 54A and 54B are formed on the surface of the insulator layer 52A.
Next, an insulating material containing a photosensitive agent is applied to the entire surface of the insulator layer 52A on which the conductor patterns 54A and 54B are formed, exposed, developed, and dried, and then heated to a maximum temperature (° C.) × 100 ° C. or more. As shown in FIG. 6E, the insulating layer 52A has a through-hole S on the insulator layer 52A by heating under the condition that the time (second) of exposure to the temperature region of 40000 ° C. · sec to 60000 ° C. · sec. A body layer 52B is formed.
Further, a photosensitive conductive film is formed on the entire surface of the insulator layer 52B, exposed and developed, dried, and exposed to a temperature region of a maximum heating temperature (° C.) × 100 ° C. or more (seconds). 6) is heated under the conditions of 40000 ° C. · sec to 60000 ° C. · sec, so that the conductor pattern 54 is formed on the surface of the insulator layer 52B as shown in FIG. The conductor pattern 54 formed on the insulator layer 52B is formed in a spiral shape, and the inner end is connected to the conductor pattern 54A of the insulator layer 52A via the conductor in the through hole of the insulator layer 52B, and the outer end is connected to the conductor pattern 54A. The conductors are connected to the conductor patterns 54B of the insulator layer 52A via conductors in the through holes of the insulator layer 52B.
Subsequently, an insulating material containing a photosensitizer is applied to the entire surface of the insulator layer 52B on which the conductor pattern 54 is formed, and after drying, the entire surface is exposed to light using a light beam or a temperature higher than the drying temperature. By heating at a temperature lower than the degreasing temperature, an insulator layer 52C is formed on the insulator layer 52B as shown in FIG.
Subsequently, a photosensitive conductive film is formed on the entire surface of the insulator layer 52C, exposed and developed, dried, and exposed to a temperature region of a maximum heating temperature (° C.) × 100 ° C. or more. By heating at (second) 40,000 ° C.-second to 60,000 ° C.-second, the conductor pattern 55 is formed on the surface of the insulator layer 52C as shown in FIG. 7B. The conductor pattern 55 is formed in a spiral shape.
Next, an insulating material containing a photosensitive agent is applied to the entire surface of the insulator layer 52C on which the conductor pattern 55 is formed, exposed, developed, dried, and then heated to a maximum temperature (° C.) × 100 ° C. or more. By heating under the condition that the exposure time (second) to the region is 40,000 ° C. · sec to 60,000 ° C. · sec, as shown in FIG. 7C, the insulating layer having the through hole S on the insulating layer 52C 52D is formed.
Further, a photosensitive conductive film is formed on the entire surface of the insulator layer 52D, exposed and developed, dried, and exposed to a temperature region of a maximum heating temperature (° C.) × 100 ° C. or more (seconds). ) Is heated under the condition of 40000 ° C. · sec to 60000 ° C. · sec, so that the conductor patterns 55A and 55B are formed on the surface of the insulator layer 52D as shown in FIG. 7D. The conductor pattern 55A is connected to the inside end of the conductor pattern 55 of the insulator layer 52C via a conductor in a through hole of the insulator layer 52D. The conductor pattern 55B is connected to the outer end of the conductor pattern 55 of the insulator layer 52C via a conductor in a through hole of the insulator layer 52D.
Subsequently, an insulating material containing a photosensitive agent is applied to the entire surface of the insulator layer 52D on which the conductor patterns 55A and 55B are formed, and after drying, the entire surface is exposed to light using a light beam or a drying temperature. By heating at a lower temperature than the degreasing temperature, the insulator layer 52E is formed as shown in FIG.
Then, as shown in FIG. 7 (F), after forming at least one or more insulator layers 63 with a magnetic insulating ceramic material on the insulator layer 52E, these laminates are formed into a predetermined shape. The coil was cut at the position indicated by the dotted line, the shape was adjusted by barrel polishing, the exposed end of the coil was exposed, degreased, and fired at 800 to 900 ° C. After reshaping the fired body by barrel polishing and exposing the lead conductor, an external electrode is formed on the end face. The insulator film 63 is formed in a plurality of layers by repeating formation of an insulator film having a thickness of 6 μm until the thickness becomes 450 μm, for example, so that the insulator film 63 has a predetermined thickness in accordance with an element to be formed. May be.
[0015]
Although the embodiments of the method for manufacturing a multilayer electronic component according to the present invention have been described above, the present invention is not limited to these embodiments. For example, the insulating material containing the photosensitive agent and the photosensitive conductive paste may be either negative type or positive type. In the embodiment, the time (second) for exposing both the conductor pattern and the second insulator layer to a temperature region of not less than the maximum heating temperature (° C.) × 100 ° C. is from 40,000 ° C. · s to 60,000 ° C. · s. Although the case where the heating is performed is described in the above, the time (second) for exposing the conductor pattern to a temperature region of 100 ° C. or more of the maximum temperature of heating (° C.) × 40 ° C. · 60 ° C. · second is required. If this is the case, deformation and outflow of the conductor pattern can be prevented, and the second insulator layer does not need to be heated under these conditions.
In the first embodiment and the second embodiment, the conductor pattern can have various shapes such as a U-shape, an L-shape, a U-shape, and a spiral shape. Further, in the second embodiment, the insulator layers 33A and 33B may be formed of an insulating ceramic material containing no photosensitive agent. Furthermore, in the third embodiment, the combination of the materials of the first insulator layer, the second insulator layer, and the third insulator layer can be variously changed depending on the element to be formed. For example, the first insulator layer and the third insulator layer may be formed of a dielectric.
In the method of manufacturing a multilayer electronic component according to the present invention, the case of a coil, a transformer, and a common mode choke has been described in the embodiment. In addition, a directional coupler, a balun, a lumped filter, a distributed The present invention can also be applied to a multilayer composite electronic component in which a filter and various circuit elements are integrated to make it multifunctional.
[0016]
【The invention's effect】
As described above, the method for manufacturing a multilayer electronic component of the present invention comprises the steps of: using an insulating material containing a photosensitive agent on a support, performing a curing treatment to form a first insulator layer; A process in which a conductor pattern formed by a photolithographic technique using a photosensitive conductive paste and a second insulator layer formed of an insulating material containing a photosensitive agent are stacked on the insulator layer, and And a step of forming a third insulator layer using an insulating material containing a photosensitive agent, so that a high-definition conductor pattern can be accurately formed without increasing the number of manufacturing steps. Can contribute to miniaturization and high performance of
Further, in the method for manufacturing a multilayer electronic component of the present invention, a step of forming a first insulator layer on a support with an insulating ceramic material, using an insulating material containing a photosensitive agent on the first insulator layer. Forming a buffer layer by stacking, on the buffer layer, a conductor pattern formed by a photolithographic technique using a photosensitive conductive paste and a second insulator layer formed of an insulating material containing a photosensitive agent; and And a step of forming a third insulator layer on these laminates, so that a high-definition conductor pattern can be formed with high precision without increasing the number of manufacturing steps. , Can contribute to higher performance. Further, since an insulating ceramic containing no photosensitive agent can be used, the cost can be reduced.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of a multilayer electronic component according to a first embodiment of the method for manufacturing a multilayer electronic component of the present invention.
FIG. 2 is a perspective view schematically showing a first embodiment of the method for manufacturing a multilayer electronic component of the present invention.
FIG. 3 is an exploded perspective view of a multilayer electronic component according to a second embodiment of the method for manufacturing a multilayer electronic component of the present invention.
FIG. 4 is a perspective view schematically showing a second embodiment of the method for manufacturing a multilayer electronic component of the present invention.
FIG. 5 is an exploded perspective view of a multilayer electronic component according to a third embodiment of the method for manufacturing a multilayer electronic component of the present invention.
FIG. 6 is a perspective view schematically showing a third embodiment of the method for manufacturing a multilayer electronic component of the present invention.
FIG. 7 is a perspective view schematically showing a third embodiment of the method for manufacturing a multilayer electronic component of the present invention.
[Explanation of symbols]
11A, 11B First insulator layer
12A, 12B, 12C, 12D Second insulator layer
13A, 13B Third insulator layer
14 Conductor pattern

Claims (8)

In a method of manufacturing a laminated electronic component in which an insulator layer and a conductor pattern are laminated, and a circuit element is formed in the laminate by the conductor pattern,
A step of forming a first insulator layer by performing a curing treatment using an insulating material containing a photosensitive agent on the support, and forming the first insulator layer on the first insulator layer by photolithography using a photosensitive conductive paste; A step of stacking the conductor pattern and the second insulator layer formed of an insulating material containing a photosensitive agent, and forming a third insulator layer on the laminate by using an insulating material containing a photosensitive agent. A method for manufacturing a laminated electronic component, comprising a step of forming. In a method of manufacturing a laminated electronic component in which an insulator layer and a conductor pattern are laminated, and a circuit element is formed in the laminate by the conductor pattern,
A step of forming a first insulator layer of an insulating ceramic material on a support, a step of forming a buffer layer on the first insulator layer by using an insulating material containing a photosensitive agent, Stacking a conductor pattern formed by a photolithographic technique using a photosensitive conductive paste and a second insulator layer formed of an insulating material containing a photosensitive agent, and a third insulator formed on these laminates A method for manufacturing a multilayer electronic component, comprising a step of forming a layer. A laminated electronic device in which an insulator layer and a conductor pattern are laminated, a conductor pattern between the insulator layers is connected via a conductor in a through hole in the insulator layer, and a circuit element is formed in the laminate by the conductor pattern. In the method of manufacturing parts,
A step of forming a first insulator layer by performing a curing treatment using an insulating material containing a photosensitive agent on the support, and forming the first insulator layer on the first insulator layer by photolithography using a photosensitive conductive paste; A step of stacking the conductor pattern and the second insulator layer formed of an insulating material containing a photosensitive agent, and forming a third insulator layer on the laminate by using an insulating material containing a photosensitive agent. A method for manufacturing a laminated electronic component, comprising a step of forming. A laminated electronic device in which an insulator layer and a conductor pattern are laminated, a conductor pattern between the insulator layers is connected via a conductor in a through hole in the insulator layer, and a circuit element is formed in the laminate by the conductor pattern. In the method of manufacturing parts,
A step of forming a first insulator layer of an insulating ceramic material on a support, a step of forming a buffer layer on the first insulator layer by using an insulating material containing a photosensitive agent, Stacking a conductor pattern formed by a photolithographic technique using a photosensitive conductive paste and a second insulator layer formed of an insulating material containing a photosensitive agent, and a third insulator formed on these laminates A method for manufacturing a multilayer electronic component, comprising a step of forming a layer. The method for manufacturing a multilayer electronic component according to claim 1, wherein the conductive pattern is formed by applying a photosensitive conductive paste, exposing and developing the photosensitive conductive paste, and then performing a heat treatment. . After applying the photosensitive conductive paste, exposing and developing the photosensitive conductive paste, the conductive pattern is exposed to a temperature region of a maximum heating temperature (° C.) × 100 ° C. or more. The method for manufacturing a multilayer electronic component according to claim 1, wherein the method is performed by performing a heat treatment at a temperature of not more than a second. The method for manufacturing a multilayer electronic component according to claim 2, wherein the thickness of the buffer layer is 30 μm or more. The method according to claim 1, wherein the first and third insulator layers are formed of one of a dielectric and a magnetic material. 9.

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