JP4573025B2 - Method for manufacturing ceramic green sheet and method for manufacturing electronic component using ceramic green sheet - Google Patents

Description

  The present invention relates to a method for manufacturing an electronic component, particularly a so-called multilayer ceramic type formed by laminating ceramics, and a method for manufacturing a so-called ceramic green sheet used therefor. Specific examples of the multilayer electronic component described here include a multilayer ceramic capacitor, a multilayer ceramic inductor, an LC composite component incorporating these, an EMC-related component, and the like.

  In recent years, with the miniaturization and rapid spread of electronic devices such as mobile phones, there is a need for higher-density mounting and higher performance for electronic components used therefor. In particular, multilayer electronic components used as passive elements are required to be thinned, multi-layered, and evenly uniform in order to meet such requirements. Is required.

  A conventional manufacturing method used for manufacturing the above-described multilayer electronic component, for example, a multilayer ceramic capacitor in which an electrode is formed, and disclosed in, for example, Patent Document 1 or Patent Document 2 as a technique that can meet these requirements. There is a so-called metal-ceramic integrated firing technique. Here, this metal-ceramic integrated firing technique will be briefly described. In this technique, first, a plurality of electrodes are formed simultaneously on the surface of a so-called ceramic green sheet using a conductive paste made of metal powder and an organic binder.

  Subsequently, a plurality of simple ceramic green sheets, ceramic green sheets after electrode formation, and the like are laminated to obtain a ceramic laminate. These electrodes serve as internal electrodes of the finished multilayer electronic component. Furthermore, the said ceramic laminated body is pressurized in the thickness direction, and the adhesiveness between green sheets is improved. The laminated body that has been brought into close contact is cut and separated into a predetermined size, and further fired. A multilayer electronic component can be obtained by appropriately forming external electrodes on the outer surface of the obtained sintered body.

JP 2001-110661 A JP 2001-85264 A JP2002-184648 JP 2003-48303 A

  In recent years, the above-described multilayer electronic components are required to be further reduced in size and thickness, and it is necessary to further reduce the thickness of a dielectric layer such as ceramic sandwiched between internal electrodes. Therefore, it is required to perform the above-described process by making the ceramic green sheet, which is a material of the ceramic laminate, thinner. In order to meet these requirements, the thickness of the thinnest ceramic green sheet currently used is about 2 to 3 μm. The thickness of the electrodes printed on these ceramic green sheets is about 1.5 to 2.0 μm.

  The thickness, width, pattern shape, and the like of these ceramic green sheets and the electrodes formed on the surface thereof are almost determined at the time of formation, and it seems practically difficult to add a process of preparing them after formation. Conventionally, electrodes and the like have been formed by screen printing. However, in the screen printing method, the variation in thickness in the forming region is ± 10 to 20%, and the pattern width that can be formed is almost the limit value that can obtain 50 μm. I think that the. Further, as disclosed in Patent Document 3, there are irregularities such as mesh marks on the surface of the sheet formed by screen printing, the film thickness is more uniform and the surface flatness is higher. In order to obtain a high sheet, construction of a new forming method is demanded.

  As one of the countermeasures, using a ceramic slurry having photosensitivity or an electrode paste having photosensitivity, a sheet or layer having a desired thickness is formed, and exposure and development processing is performed on these to provide a highly accurate width, A technique for obtaining an electrode having a shape or the like has been proposed. According to this method, the pattern width can be made narrower, and the positional accuracy of pattern formation can be improved as compared with the printing method. However, when the layer to be exposed is formed by a printing method, the above-described unevenness of the layer surface exists, and the unevenness is maintained as it is even when a normal exposure development process is performed.

  Further, after the sheet or layer is formed, unevenness may be reduced by applying a mechanical method such as pressing to the sheet or the like, but this is not preferable because the process itself becomes redundant. As a method of forming a sheet or the like in which other irregularities are eliminated or reduced, there is a method using a coating coater or spin coating. However, since traces of blades and the like remain on the surface of the layer currently obtained by these coating methods, the thickness variation is ± 3 to 5%, and this value is maintained even after exposure and development processing. . For this reason, in order to manufacture an electronic component having better characteristics, further improvement in surface flatness or thickness variation is required.

  In addition, when an electrode layer is formed by applying a metal paste onto a substrate by screen printing or a coating coater, a phenomenon that the electrode edge portion is sagged or the straightness is deteriorated depending on conditions such as the viscosity of the metal paste. Arise. Further, it is conceivable that horns or blurs occur during the application of slurry or the like, causing short circuits or poor energization when assembled as electronic components. When the coating thickness is further reduced, there is a lower limit of the film thickness that can be formed depending on various conditions such as the viscosity, and it is difficult to reduce the dimensional variation in the thickness direction to several percent or less. End up. This phenomenon is also applicable when a ceramic green sheet is obtained using a ceramic slurry.

  Further, for example, a through electrode may be formed on a ceramic green sheet used when forming an inductor as an electronic component. In this case, it is desirable that the length of the through electrode (electrode thickness) is also accurately controlled in defining the electrical characteristics of the inductor. However, in the present situation, as disclosed in Patent Document 4, this electrode thickness conforms to the thickness of the ceramic green sheet, and it is a fact that the electrode thickness is controlled independently of the thickness of the ceramic green sheet. It was difficult.

  For example, when manufacturing an inductor or the like, it is required to pattern the electrode or the like into a complicated shape in the plane direction. According to the screen printing method, it seems that it is possible to cope with this complication to a certain degree of accuracy, but it seems difficult to cope with further improving the characteristics as an electronic component. Moreover, it seems that it is difficult to make the cross section of an electrode etc. into a desired shape as mentioned above.

  Further, for example, when manufacturing an inductor, it is considered preferable to use a ceramic green sheet having a pattern electrode and a through electrode in a single sheet from the viewpoint of stacking accuracy, element miniaturization, and the like. In this case, if the pattern electrode and the through electrode can be formed by forming partial unevenness on the insulating layer and filling the multistage recess with electrode paste, etc., the number of processes can be reduced, It is considered preferable for improving the characteristics. However, it has been impossible in the prior art to accurately form such irregularities.

  The present invention has been made in view of the above problems and the above background, and for ceramic green sheets and electrode layers, the surface flatness or thickness variation thereof is further reduced, and the sheet has desired irregularities. The object is to provide a method for manufacturing the layer. Another object of the present invention is to provide an electronic component having better electrical characteristics by reducing variation in electrical characteristics of the multilayer electronic component by providing the method.

  In order to solve the above problems, a sheet manufacturing method according to the present invention is a method for manufacturing a ceramic green sheet using exposure and development processing, and has a sheet-formed surface having a portion capable of transmitting light used for exposure processing. A step of adhering a photosensitive material containing a powder having a predetermined electrical property and capable of being exposed to light to the surface of the member having the surface of the member; The method includes a step of performing an exposure process on the photosensitive material by irradiating the photosensitive material from the back surface, and a step of performing a development process on the photosensitive material after the exposure process.

  In addition, it is preferable that the light amount in the above-described manufacturing method is different for each predetermined region through a mask having a different transmittance in a portion corresponding to the predetermined region. In the above-described manufacturing method, the different light amounts may include at least a light amount obtained by completely blocking light, a light amount obtained by totally transmitting light, and a light amount obtained by transmitting light at a predetermined ratio. preferable. In the above manufacturing method, the exposure process is preferably terminated when the thickness of the region where the photosensitive material is exposed by the amount of light obtained by transmitting light at a predetermined ratio reaches a predetermined thickness.

Further, in the above-described manufacturing method, it is preferable that a conductive material is filled in the recesses on the ceramic green sheet formed by performing the development process. Further, in the above-described manufacturing method, before the step of attaching the photosensitive material to the surface of the member, a step of forming a light shielding portion made of a material that cannot transmit light to a predetermined region of the surface of the member is performed. It is preferable. In the above manufacturing method, the member is preferably subjected to a mold release treatment for facilitating the peeling of the ceramic green sheet from the surface.
In order to solve the above problems, a sheet manufacturing method according to the present invention has predetermined electrical characteristics with respect to a surface of a member having a sheet-formed surface having a portion capable of transmitting light used for exposure processing. A photosensitive material containing a powder having a surface and capable of being exposed to light, and exposing the photosensitive material by irradiating the photosensitive material with different amounts of light for each predetermined region from the back surface of the member. And a step of performing a development process on the photosensitive material after the exposure process.
In the above-described manufacturing method, light is based on light rays, and it is preferable to obtain different amounts of light for each predetermined region by scanning the light rays. In this case, it is preferable that the light beam scan is performed under conditions corresponding to each predetermined region.

In addition, in order to solve the above-described problem, the multilayer electronic component manufacturing method according to the present invention includes stacking a plurality of ceramic green sheets including the ceramic green sheet formed by the above-described ceramic green sheet manufacturing method,
The laminated ceramic green sheets are pressed in the thickness direction to form a laminated body.

  According to the present invention, a layer formed by a conventional photosensitive material coating method such as coating coater or screen printing is processed by exposure and development to reduce variations in its position, shape and thickness. In addition, it is possible to form a complicated processed shape having irregularities. That is, a sheet for a multilayer electronic component having a more complicated layer structure and higher quality than the conventional one is formed only by adding the method (process) according to the present invention to the conventional mass production process. Is possible.

  Furthermore, according to the present invention, it is possible to simultaneously perform the formation of the pattern shape and the through hole and the control of the layer thickness. As a result, when forming a layer containing patterns, through holes, etc., it is possible to accurately form and process these shapes, thicknesses, etc., and a suitable laminated type closer to the desired shape compared to the conventional one It becomes possible to manufacture the sheet | seat for electronic components. Specifically, it is possible to form a sheet having a numerical value of about ± 2 to 3% or less as the thickness variation and about 30 μm as the pattern width that can be formed.

  Embodiments relating to a method for forming a sheet used to form an electronic component according to the present invention, a so-called ceramic green sheet, will be briefly described. In the present embodiment, first, for example, ultraviolet light or the like can be exposed to the above-described ultraviolet light or the like containing powder having desired electrical characteristics on the surface of the substrate that can transmit light used in the exposure processing described later. A layer made of a photosensitive material is formed. Subsequently, a mask having a predetermined pattern is arranged on the back surface of the substrate, and the photosensitive material on the substrate is irradiated with ultraviolet rays or the like through this mask.

  At that time, the exposure amount of the photosensitive material is controlled by controlling the exposure time, the ultraviolet intensity, and the like. The pattern on the mask is formed from a plurality of patterns having different transmittances. Thereafter, the exposed photosensitive material is subjected to a development treatment, and the substrate is peeled from the photosensitive material, whereby a ceramic green sheet having a desired shape, layer, and the like is obtained.

  In the embodiments described below, two patterns having different transmittances are shown. However, the present invention is not limited to this, and a mask having a further pattern having different transmittances may be used. . Although the photosensitive material can be exposed by ultraviolet rays or the like, the light to be used is not limited to ultraviolet rays as long as it is a combination of specific light and a material that can be exposed thereby. Examples of the desired electrical characteristics described above include conductivity, dielectric constant, resistance, and the like. Moreover, as a method of attaching the photosensitive material on the substrate, an application or printing method is exemplified, but the attachment method is not limited thereto. Moreover, as a base material, a light-transmissive PET film, for example, is exemplified. As the base material, a material having a release treatment applied to the surface thereof may be used for the purpose of facilitating peeling of a layer made of a photosensitive material formed on the base material. A member in which a plurality of light-transmitting layers is formed on a base material may be used as the base material. In addition, the mask is preferably in close contact with the back surface of the base material, but may be arranged with a gap from the back surface of the base material according to the exposure conditions and the like.

Moreover, in this Embodiment, the light used for the exposure process of the photosensitive material is patterned by passing through the mask arrange | positioned at the base-material back surface. However, the arrangement of the mask is not limited to the back surface of the base material, and the base material itself may be provided with a light shielding portion that exhibits the same effect as the mask. Moreover, you may arrange | position the light shielding layer which exhibits the effect | action equivalent to a mask on the base-material surface. That is, the effect of the present invention can be obtained in the same manner by arranging a configuration for patterning light on the surface of the photosensitive material on the substrate side. In addition, for example, a patterned light is formed by scanning a laser beam or the like in a pattern or using a planar light source that can be formed of a dot matrix such as a plasma display panel or an LED panel. It is good also as performing the exposure process of material. More specifically, when scanning with a laser beam or the like, the scanning time is changed according to the exposure range, the number of times is changed by overlapping scanning, or the intensity of the laser beam or the like. Is preferably changed. That is, it is preferable to perform the exposure operation under the laser beam scanning conditions corresponding to each area to be exposed. In this method, a pattern is directly drawn on a photosensitive substance using a laser beam, an electron beam, or the like, and research is being advanced in recent years as a technique to replace mask exposure. According to this method, it is possible to directly form a pattern on a workpiece based on design data or the like, and reduction of mask cost and improvement of exposure accuracy are expected. In the case of this method, by performing any one of the above-described changing operations or a combination thereof, it is possible to perform the exposure process with a different amount of light for each predetermined region.
Further, in the case of providing patterned light, an exposure operation is performed with a planar light source as a predetermined shape by turning on and off a plurality of light sources juxtaposed in a planar manner. By sequentially changing the predetermined shape and performing an exposure operation a plurality of times, it is possible to perform the exposure process with different amounts of light for each predetermined region.

As described in the embodiment, as a method of performing exposure using a different light amount depending on each region in the exposure process, when a simple light source and a mask are used, a configuration having a certain level of intensity such as a laser beam or the like is used. When pattern drawing is performed using, a pattern may be formed by a planar light source in which a plurality of light sources are juxtaposed. However, since the most widely used process that seems to be the most reliable process is a process using a mask, in the following examples, a case where a mask is used will be specifically exemplified.
FIG. 1 shows a layer forming method according to Example 1 of the present invention. FIG. 1 shows a cross-sectional structure when a layer or sheet in each step is cut in the thickness direction. The present embodiment is intended to form an insulating layer having a predetermined thickness and shape. In this embodiment, first, a photosensitive layer 3 containing powder having desired electrical characteristics is applied and formed on the upper surface of a base material 2 made of a light-transmitting PET film, for example (step 1). In the next step 2, the photosensitive layer 3 is exposed by irradiating light such as ultraviolet rays from the back surface of the substrate 2.

The present applicant controls the solidified thickness (exposure amount) from the surface of the light transmitting member (in this case, the base material 2) in the photosensitive layer 3 by controlling the intensity of ultraviolet rays, the irradiation time, and the like during the exposure process. It has been found in the present invention that it can be controlled. When confirming the controllability of the solidified thickness depending on the exposure amount, the mixing ratio of the ceramic powder in the slurry, the dispersibility of the powder, the average grain Various changes are made to the diameter, light transmittance of the powder itself, etc., and the thickness of the slurry that can be exposed under each condition is verified.
Usually, when it is intended to expose a substance in which ceramic powder or the like and a photosensitive binder are kneaded, it is known that light is scattered due to the presence of the ceramic powder or the like and the exposure end portion is blurred. For example, for each barium titanate powder having an average particle size of approximately 1.0 μm, 0.8 μm, 0.6 μm, 0.4 μm, and 0.2 μm, the applicant assigns this to a negative binder and a volume ratio of 1 / Using a mixture kneaded at a ratio of 1, the relationship between the irradiation time and the remaining film thickness after development was confirmed. As a result, if the remaining film thickness is several μm, specifically about 10 μm or less for each powder, the exposure time and the obtained sheet thickness have a first-order correlation, and the average film thickness value varies. Was found to be in the range of ± 0.5-2.0%. Furthermore, when trying to maintain the flatness of the sheet, it can be said that the smaller the particle size, the better. This depends on the thickness of the sheet to be obtained, and the particle size becomes an important factor particularly in a thin region. Specifically, when the sheet thickness is 5 μm or less, titanium having an average particle diameter of 0.8 μm or less, more preferably 0.2 μm or less is considered in consideration of the occurrence of irregularities (surface roughness) on the sheet surface due to powder particles. It is preferred to use barium acid powder. That is, a flat sheet can be obtained by using a slurry made of a powder having an average particle diameter of about 1/5 or less of the sheet thickness to be obtained, and a surface unevenness can be further obtained by using a slurry of 1/20 or less. It is considered that a sheet having a small arithmetic average roughness (Ra value) is obtained. Here, this exposure time can be reconsidered as an exposure amount including the light intensity, and the result shows that there is a first-order correlation between the exposure amount and the remaining film thickness. Therefore, when the ceramic powder and the photosensitive binder are used and the remaining thickness is about 5.0 μm which is the same as the electrode thickness, the sheet thickness and the flatness of the sheet surface can be accurately maintained. . In addition, although the specific examination result is described here about the case where the barium titanate powder inferior to the characteristic which permeate | transmits light is used, what is called the glass ceramic powder which is excellent in a light transmission characteristic simultaneously, the ferrite powder which has light absorption, or We are also studying metal powder. As a result, it is recognized that these powders have the same tendency as the barium titanate powder, although the required exposure amount is different. Therefore, when trying to control the remaining thickness after development by the exposure amount using a slurry as a kneaded product of metal or ceramic powder and a photosensitive binder, including examples of these various powders, the average of the powder used If the particle size is less than about 1.0 μm, the surface roughness can be reduced, thereby enabling suitable control to suppress variation in average film thickness. Further, it has been found by experiments other than the above-described example that the remaining thickness after development can be controlled in a region around 50 μm and in a region below it depending on conditions.
In the present embodiment, the exposure amount is controlled based on this discovery, and exposure to a predetermined thickness of the photosensitive layer 3 is performed. In this step, a mask 13 on which two types of electrode patterns having different ultraviolet transmittances are formed is brought into close contact with the back surface of the substrate 2, and the photosensitive layer 3 is irradiated with ultraviolet rays through the mask 13 to be sensitized. The layer 3 is exposed.

  The pattern 13a in the mask 13 is easily set so that the transmittance of ultraviolet rays is about 100%, which is the total transmittance, and the pattern 13b is set so that the transmittance of ultraviolet rays is about 50%, which is a predetermined ratio. Has been. Therefore, by performing exposure processing on the photosensitive layer 3 with an exposure amount at which the portion corresponding to the pattern 13a in the photosensitive layer 3 is exposed to the thickness t1, the portion corresponding to the pattern 13b is about 1/2 of the thickness t1. The exposure is performed up to a thickness t2. Further, in the photosensitive layer 3, the portion of the mask 13 corresponding to the pattern 13c that completely blocks ultraviolet rays is not subjected to the exposure process.

After the exposure process, the development process is performed to remove only the solidified part exposed in the photosensitive layer 3 and remove the other part. As shown in step 3, the concave part 4a and the through hole 4b are provided. An insulating (dielectric) layer 4 having a thickness is obtained. The recess 4a corresponds to the pattern 13b, and the through hole 4b corresponds to the pattern 13c. As will be described later, the base material 2 is removed from the sheet made of the base material 2 and the insulating layer 4 thus obtained as it is or after a further layer is formed thereon. The sheet from which the substrate 2 has been removed is laminated with other sheets obtained through the same or similar processes after filling the electrode material into the recesses 4a and the through holes 4b, and various processes are performed. After that, it becomes a multilayer electronic component such as an inductor.

  According to the present embodiment, it is possible to accurately control the thickness of the solidified portion and flatten the surface. In addition, this embodiment can be carried out only by adding exposure and development processes to the conventional coating process if the substrate 2 and the insulating layer 4 are light transmissive.

  In this embodiment, since the electrode shape and the like are defined by controlling the mask pattern and the exposure amount, any method may be used for applying the photosensitive layer. However, in order to reduce the amount removed by development processing, the thickness of the photosensitive layer 3 formed on the substrate 2 may be close to the size of the insulating layer to be finally obtained. preferable. In this case, various methods such as an existing method such as screen printing or coating using a blade can be applied as a method for forming the photosensitive layer 3. In addition, although the insulating layer 4 is directly formed on the base material 2, various light-transmitting layers can be formed between the insulating layer 4 and the base material 2. In this embodiment, the step of forming the insulating layer 4 is illustrated, but the electrode layer having irregularities may be formed by using the powder contained in the photosensitive material as a conductive material.

  FIG. 2 shows a cross-sectional structure when a layer or sheet in each step is cut in the thickness direction, similarly to the case of FIG. Hereinafter, also in other drawings, an outline of a cross-sectional structure of a sheet or the like in each step is shown. In this example, a through hole is formed in the insulating layer 4. Specifically, first, the photosensitive layer 3 is applied on the base material 2 made of a light-transmitting PET film, for example (step 1). In the next step 2, the mask 15 on which the desired electrode pattern 15b and the through-hole pattern 15c are independently formed is brought into intimate contact with the back surface of the substrate 2, and ultraviolet rays are irradiated from the rear side.

  At this time, the exposure amount is controlled so that the thickness of the solidified portion with respect to the photosensitive layer 3 is t1. The ultraviolet transmittance of the pattern 15b is set to be about 1/2 of the pattern 15a, and the solidified thickness of the portion corresponding to the internal electrode 4a is t2 of about 1/2 of t1. After the exposure processing, development processing is performed to remove only the solidified portion exposed in the photosensitive layer 3 and remove the other portions. As shown in Step 4, the through-hole 4b and the recess 4a are provided. An insulating (dielectric) layer 4 having a thickness is obtained.

  By carrying out the present invention, unnecessary portions such as sagging and horn of the material generated when the photosensitive material is applied and formed on the surface of the substrate can be easily removed by leaving these portions unexposed. Further, since there is no need to make a thin layer at the time of application of the photosensitive material, no blur or the like occurs. In addition, according to the present invention, the thickness of the remaining layer can be accurately controlled by controlling the exposure amount. For example, the thickness of the layer can be reduced to 0.5 μm or less, and the variation in the layer thickness is ± 2 to ± 2. It becomes possible to hold down to 3% or less. Furthermore, it is possible to make the edge part etc. in the pattern shape obtained by exposure and development processing into a favorable rectangle, and the variation in electric characteristics of electronic parts obtained by laminating these sheets is lower than the desired value. It becomes possible to hold down.

(Example of manufacturing an electronic component using the sheet according to the present invention)
Next, the process in the case of manufacturing an electronic component using the sheet | seat obtained by the sheet | seat formation method which concerns on this invention mentioned above is illustrated. 3 and 4 to be referred to when describing the steps described below show a state in which a sheet or a laminated state thereof is cut in a thickness direction and a cross section thereof is viewed from the side as in the above-described embodiment. Shall. FIG. 3 shows each step in manufacturing a multilayer ceramic inductor, and FIG. 4 illustrates a step in manufacturing an electronic component having a more complicated circuit configuration.

FIG. 3 shows an example of a manufacturing process in the case where a ceramic inductor is formed using the sheet having the insulating layer 4 obtained by the above-described first embodiment. In the manufacturing process, first, the electrode material 10 is filled into the recesses 4a and the through holes 4b in the insulating layer 4 formed on the substrate 2 by, for example, screen printing (step 1). Next, the base material 2 is peeled and removed from the insulating layer 4 having the internal electrode 10a and the through electrode 10b obtained by filling the electrode material 10 (step 2). A predetermined number (three in the figure) of the ceramic green sheets 16 for inductors incorporating the electrodes 10a and 10b thus obtained are laminated. (Step 3).

  The laminated sheets are pressed in the thickness direction, and each is pressure-bonded. The main part of the ceramic inductor is completed by obtaining this pressurizing and crimping process. In the present manufacturing process example, the electrode material 10 is filled in the recesses 4 a and the through holes 4 b so that the surface thereof is substantially flush with the surface of the protrusions of the insulating layer 4. Therefore, the thickness of the ceramic green sheet for inductor 16 obtained here is almost uniform in the entire region.

  For this reason, even if it crimps | bonds by a small load, the laminated body which maintains a favorable shaping | molding state is obtained. A desired multilayer ceramic inductor can be obtained by cutting such a laminate into a predetermined size and firing the laminate. By using the insulating layer 4 obtained by the present invention with less variation in surface flatness, shape accuracy, and thickness, a multilayer ceramic inductor with less variation in desired electrical characteristics than in the prior art is obtained. It becomes possible.

  The pattern electrode or the like obtained by the present invention has a rectangular shape with a suitable cross-sectional shape, and it is possible to obtain effects such as reducing variation in resistance of the inductor from a desired value and reducing DC resistance.

  Note that the sheet shown in step 1 of FIG. 3 may be formed by the further embodiment of the present invention shown in FIG. FIG. 5 shows the cross section of the sheet in the same manner as the above-described drawings, and the same reference numerals are used to describe the same configuration as the configuration shown in each embodiment described above in the drawing. In this embodiment, in step 1, the photosensitive layer 3 is formed on the upper surface of the base material 2 and the light shielding layer 5 made of an electrode material formed at a predetermined position on the base material 2. By applying the steps 2 and 3 shown in FIG. 1 (corresponding to steps 2 and 3 in FIG. 5) to the sheet in this state, a sheet having a recess 4a continuous with the light shielding layer 5 is obtained. In the mask 14 used in this embodiment, the pattern 14a is set so that the transmittance of ultraviolet rays is approximately 100%, which is the total transmittance, and the pattern 14b has a transmittance of ultraviolet rays at a predetermined ratio. It is set to be approximately 50%. By filling the recess 4a with the electrode material 10 by an arbitrary method, the internal electrode 10a continuous with the light shielding layer 5 (through electrode 10b) is formed. By peeling and removing the base material 2 from the sheet after the electrode material 10 is filled, the sheet shown in step 5 used for forming the inductor is obtained. According to this method, since the through electrode for interlayer connection having a high aspect ratio is formed in advance, it is considered that effects such as stable shape of the through electrode and reliable connection between the electrodes can be obtained.

  FIG. 4 shows a case where a multilayer electronic component having a more complicated circuit configuration is assumed and manufactured. In the drawing, the ceramic green sheet 18 is obtained by filling the insulating layer 4 obtained in Example 3 with an electrode material by screen printing or the like, and forming the internal electrode 10a and the through electrode 10b independently. The ceramic green sheet 19 is composed of an insulating layer 4c and an electrode 10c, and the ceramic green sheet 20 is composed of an insulating layer 4d and an electrode 10d. Here, the through electrode 10b is used to connect the internal electrodes 10c and 10d of the ceramic green sheets 19 and 20 disposed above and below the sheet. The internal electrode 10 a is insulated from the internal electrode 10 d of the lower sheet 20 and is connected to the internal electrode 10 c of the upper sheet 19. By using the sheet according to the present invention, an electronic component having such a configuration can be easily manufactured.

  The sheet 18 shown in FIG. 4 may be formed by the further embodiment of the present invention shown in FIG. FIG. 6 shows the cross section of the sheet in the same manner as the above-mentioned drawings, and the same reference numerals are used to describe the same components as those shown in the above-described embodiments. In this embodiment, in step 1, the photosensitive layer 3 is formed on the upper surface of the base material 2 and the light shielding layer 5 made of an electrode material formed at a predetermined position on the base material 2. By applying the steps 2 and 3 shown in FIG. 2 (corresponding to steps 2 and 3 in FIG. 6) to the sheet in this state, a sheet having a recess 4a is obtained. In the mask 16 used in this embodiment, the pattern 16a is set so that the transmittance of ultraviolet rays is approximately 100%, which is the total transmittance, and the pattern 16b has a transmittance of ultraviolet rays at a predetermined ratio. It is set to be approximately 50%. The internal electrode 10a is formed by filling the recess 4a with the electrode material 10 by an arbitrary method. By peeling and removing the base material 2 from the sheet after filling with the electrode material 10, the sheet shown in step 5 used for electronic component formation or the like is obtained. According to this method, since the through electrode for interlayer connection having a high aspect ratio is formed in advance, it is considered that effects such as stable shape of the through electrode and reliable connection between the electrodes can be obtained.

It is a figure which shows the schematic process of the manufacturing method of the ceramic green sheet which concerns on Example 1 of this invention. It is a figure which shows the schematic process of the manufacturing method of the ceramic green sheet which concerns on Example 2 of this invention. It is a figure which shows the outline of the process of manufacturing a multilayer ceramic inductor using the ceramic green sheet etc. which were obtained by this invention. It is a figure which shows the outline of the process of manufacturing the multilayer electronic component which has a more complicated circuit structure using the ceramic green sheet etc. which were obtained by this invention. It is a manufacturing method of the ceramic green sheet which concerns on the other Example of this invention, Comprising: It is a figure which shows the schematic process at the time of forming a light shielding layer previously. It is a manufacturing method of the ceramic green sheet which concerns on the other Example of this invention, Comprising: It is a figure which shows the schematic process at the time of forming a light shielding layer previously.

Explanation of symbols

2: base material, 3: photosensitive material, 4: insulating (dielectric) layer, 5: light shielding part, 13-16: mask, 10: electrode, 18-20: ceramic green sheet

Claims (9)

A method for producing a ceramic green sheet using exposure and development,
It includes a powder having a predetermined electric characteristic and / or magnetic characteristic with respect to the surface of a member having a sheet forming surface as a surface, which has a part that can transmit light used in the exposure process, and is exposed to the light. Depositing a possible photosensitive material thicker than a predetermined exposure thickness;
Through the mask having a plurality of regions including a region where the light transmittance is larger than 0% and smaller than 100%, the light is changed to a light amount different for each of the plurality of regions, and then the light is applied to the photosensitive material from the back surface of the member. Irradiating the photosensitive material, and performing the exposure process on the photosensitive material;
And the step of performing the development process on the photosensitive material after the exposure process, the exposure process is performed by the amount of light obtained from an area where the light transmittance is greater than 0% and less than 100%. The method is finished when the thickness of the region where the conductive material is exposed reaches the predetermined exposure thickness.   The plurality of regions include at least one of a region for obtaining a light amount obtained by completely blocking the light and a region for obtaining a light amount obtained by totally transmitting the light. Manufacturing method.   The manufacturing method according to claim 1, wherein a conductive material is filled in a concave portion on the ceramic green sheet formed by the development process.   Before the step of attaching the photosensitive material to the surface of the member, a step of forming a light shielding portion made of a material that cannot transmit the light with respect to a predetermined region of the surface of the member is performed. The manufacturing method according to any one of claims 1 to 3.   The manufacturing method according to any one of claims 1 to 3, wherein the member is subjected to a mold release treatment for facilitating the peeling of the ceramic green sheet from the surface thereof. The surface of a member having a portion that can transmit light used for exposure processing and having a sheet-formed surface as a surface contains powder having a predetermined electrical property and / or magnetic property, and can be exposed to the light. Attaching a photosensitive material thicker than the exposure thickness ,
Irradiating the photosensitive material as a different amount of light for each predetermined region from the back surface of the member, and performing the exposure process on the photosensitive material;
And a step of developing the photosensitive material after the exposure process,
The said light is based on a light ray, The said light ray is scanned when obtaining a different light quantity for every said predetermined area | region, The manufacturing method of the ceramic green sheet | seat characterized by the above-mentioned.   The manufacturing method according to claim 6, wherein the scanning of the light beam is performed under a condition corresponding to each of the predetermined regions. The surface of the member having the portion that can transmit light used for the exposure process and having the sheet-formed surface as a surface contains powder having a predetermined electrical property and / or magnetic property, and can be exposed by the light. Attaching a photosensitive material thicker than the exposure thickness ,
Irradiating the photosensitive material with a different amount of light for each predetermined region from the back surface of the member, and performing the exposure process on the photosensitive material;
And a step of developing the photosensitive material after the exposure process,
Manufacturing the ceramic green sheet, wherein the light is obtained from a plurality of light sources arranged in a patternable plane composed of a dot matrix, and different light amounts are obtained for each predetermined region by turning on and off the plurality of light sources. Method. A ceramic green sheet is produced by the method for producing a ceramic green sheet according to any one of claims 1 to 8 ,
Stacking a plurality of ceramic green sheets including the ceramic green sheets,
A method of manufacturing a multilayer electronic component, wherein the laminated ceramic green sheets are pressed in the thickness direction to form a laminate.

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