JP2004095750A5 - - Google Patents

Claims (7)

In a method for manufacturing a laminated electronic component in which an insulator layer and a conductor pattern are laminated, and a circuit element is formed by the conductor pattern in the laminate,
A step of forming a first insulator layer by applying a curing treatment using an insulating material containing a photosensitive agent on the support, and a photoconductive technique using a photosensitive conductive paste on the first insulator layer. A conductive layer and a second insulator layer formed of an insulating material containing a photosensitive agent, and a third insulating layer formed on the laminate using an insulating material containing a photosensitive agent. A method of manufacturing a multilayer electronic component, comprising the step of forming. In a method for manufacturing a laminated electronic component in which an insulator layer and a conductor pattern are laminated, and a circuit element is formed by the conductor pattern in the laminate,
Forming a first insulator layer of an insulating ceramic material on a support, forming a buffer layer on the first insulator layer using an insulating material containing a photosensitive agent, and forming a buffer layer on the buffer layer; A step of stacking a conductive pattern formed by a photolithography technique using a photosensitive conductive paste and a second insulator layer formed of an insulating material containing a photosensitive agent, and a third insulator on the laminate A method of manufacturing a multilayer electronic component, comprising a step of forming a layer.   The circuit element according to claim 1 or 2, wherein a predetermined conductor pattern between the insulator layers is connected through a conductor in a through hole of the insulator layer, and the conductor element is formed in the laminate. The manufacturing method of the multilayer electronic component of description.   The method for manufacturing a multilayer electronic component according to any one of claims 1 to 3, wherein the conductive pattern is formed by applying a photosensitive conductive paste, exposing and developing the conductive paste, and then performing a heat treatment. .   The conductive pattern is coated with a photosensitive conductive paste, exposed to light, developed, and then exposed to a temperature range of a maximum heating temperature (° C.) × 100 ° C. or more (seconds) 40000 ° C. · second or more, 60000 The method for manufacturing a multilayer electronic component according to any one of claims 1 to 3, wherein the multilayer electronic component is formed by performing a heat treatment under the condition of ° C or less.   The method for manufacturing a multilayer electronic component according to claim 2, wherein the buffer layer has a thickness of 30 μm or more.   The method for manufacturing a multilayer electronic component according to any one of claims 1 to 6, wherein the first insulator layer and the third insulator layer are formed of either a dielectric or a magnetic material.