JP4579774B2 - Manufacturing method of multilayer electronic component - Google Patents

Description

  The present invention relates to a method for manufacturing a laminated electronic component in which an insulating layer and a conductor pattern are laminated and a circuit element is formed by the conductor pattern in the laminate.

In the field of inductors (coils), in order to meet the demand for miniaturization, multilayer electronic components that do not use windings have been put into practical use, but further miniaturization and thinning are required. As a method of manufacturing a multilayer electronic component incorporating these coils, a printing lamination method in which an insulator paste and a conductor paste are alternately printed to form a laminate, and a ceramic green sheet having a coil conductor pattern formed on the surface is used. A laminated body is formed by laminating a plurality of sheets, and a sheet laminating method in which conductor patterns for coils are connected via conductors in through holes formed in a ceramic green sheet, and a thick film photolithography technique on a fired substrate, Three methods of forming a laminate using a thin film technique (for example, see Patent Document 1) are known.
JP-A-8-316080

In the printing laminating method, since the insulating paste and the conductor paste are repeatedly printed, the flatness of the printed surface deteriorates as the number of layers increases, and the coil conductor pattern with a line width of less than 50 μm is formed. It could not be formed stably. Also, the line width of the coil conductor pattern becomes unstable due to printing blur and sagging, and a multilayer electronic component smaller than 0603 size (0.6 × 0.3 × 0.3 mm) is manufactured. Was difficult.
In the sheet lamination method, the flatness of the ceramic green sheet, which is the printed surface of the coil conductor pattern, is good, so the line width of the coil conductor pattern can be made narrower than in the case of the printing lamination method. In order to form a conductor pattern, it was necessary to make the line width 40 μm or more. Further, when the line width of the coil conductor pattern is reduced, the through hole diameter is also reduced, the conductor filling in the through hole is likely to be insufficient, and disconnection is likely to occur. Furthermore, it is necessary to eliminate the stacking deviation of the ceramic green sheets, and there is a problem that a step is generated between the position where the coil conductor pattern is formed and the position where the coil conductor pattern is not formed. As in the case, it was difficult to manufacture a multilayer electronic component smaller than 0603 size (0.6 × 0.3 × 0.3 mm).

In the method of forming a laminate using a thin film technique on a fired substrate, the line width of the coil conductor pattern can be reduced to 10 μm or less, but the number of insulator layers and conductor patterns cannot be increased. In a multilayer electronic component smaller than 0603 size (0.6 × 0.3 × 0.3 mm), a predetermined inductance value could not be obtained. In addition, even when a predetermined inductance value is obtained in a multilayer electronic component smaller than 0603 size (0.6 × 0.3 × 0.3 mm), the line width of the coil conductor pattern is reduced. There is a problem that the conductor pattern for the coil cannot be increased in thickness, the conductor resistance increases, and the Q value of the coil decreases.
In the method of forming a laminated body on a fired substrate using a thick film photolithography technique, the laminated body is formed on a thick fired substrate, so that predetermined characteristics cannot be obtained due to the height restriction of the product. In addition, since the insulator layer and the conductor pattern are stacked on the fired substrate while firing one layer at a time, there is a problem that distortion occurs in the product.
Thus, in the conventional method for manufacturing a multilayer electronic component, the 0402 size (0.4 × 0.2 × 0.2 mm), which is smaller than the 0603 size (0.6 × 0.3 × 0.3 mm). Such a multilayer electronic component could not be stably manufactured. In addition, even if it is possible to manufacture a small multilayer electronic component such as 0402 size (0.4 × 0.2 × 0.2 mm) although it is unstable, deterioration of characteristics such as inductance value and coil Q value can be avoided. There wasn't.
Furthermore, in order to solve the problems in forming a laminate using a thick film photolithography technique on a fired substrate, an insulator layer and a conductor pattern are laminated using a photosensitive insulator paste and a photosensitive conductive paste. To be considered. However, when the photosensitive insulator paste and the photopolymerizable binder resin constituting the photosensitive conductive paste are made the same system, a photosensitive conductive film containing silver is formed on the photosensitive insulator film and exposed. When developed, a silver residue is generated in an unexposed portion where the silver film should originally be removed by development, and when this residue is removed, the conductor pattern for the coil is disconnected or lost. .

  In addition to high-definition coil conductor patterns and high-definition minute-diameter through holes, the present invention stably forms small multilayer electronic components by forming coil conductor patterns and through-holes with high positional accuracy. Provided is a method for manufacturing a multilayer electronic component that can be manufactured in an automated manner.

The method for producing a multilayer electronic component according to the present invention solves the above-mentioned problems by using different systems for the photopolymerization-curable binder resin constituting the photosensitive insulator paste and the photosensitive conductive paste. That is, the present invention relates to an acrylic binder having photopolymerization curability on a support in a method for manufacturing a laminated electronic component in which an insulating layer and a conductor pattern are laminated, and a circuit element is formed by the conductor pattern in the laminate. A step of forming a first photosensitive insulator film by exposure and development using a photosensitive insulator paste containing a resin, a cellulose-based photopolymerization-curing property on the first photosensitive insulator film Using a conductive conductive paste containing a binder resin, exposure and development using a conductive pattern formed by exposure and development, and a photosensitive insulator paste containing an acrylic binder resin having photopolymerization curability. A step of stacking the second photosensitive insulator film formed by applying, and an acrylic binder resin having photopolymerization curability on the laminate. Comprising the step of forming a third photosensitive insulating film using a light insulating paste.
The present invention also provides a method for manufacturing a laminated electronic component in which an insulator layer and a conductor pattern are laminated, and a circuit element is formed by the conductor pattern in the laminate, and the photosensitive insulator paste and the photosensitive conductive material are formed on the support. A coil element is formed in a laminate by laminating an insulator layer and a conductor pattern using a paste. After the laminate is divided into individual products, external terminals are formed, and the insulator layer and the conductor pattern are formed on the support. Is a step of forming a photosensitive insulator film containing an acrylic binder resin having photopolymerization curability, exposing and developing, and a cellulose binder having photopolymerization curability on the photosensitive insulator film. A photosensitive conductive paste containing resin is applied to form a photosensitive conductive film on the entire surface or a predetermined portion of the photosensitive insulator film, and then exposed and developed to form a coil conductor pattern on the photosensitive insulator film. Forming a coil conductor pattern by applying a photosensitive insulator paste containing a photopolymerizable curable acrylic binder resin on the photosensitive insulator film on which the coil conductor pattern is formed. Forming a photosensitive insulator film on the entire surface or a predetermined portion of the photosensitive insulator film, exposing and developing to form through holes for connecting the upper and lower coil conductor patterns to the photosensitive insulator film; and Fill the through-hole with a photosensitive conductive paste containing a photopolymerizable curable cellulose-based binder resin, and apply a photopolymerizable curable cellulose-based binder resin on the photosensitive insulator film in which the through-hole is formed. The photosensitive conductive paste contained is applied to form a photosensitive conductive film on the entire surface or a predetermined portion of the photosensitive insulator film, and then exposed and developed to form a lower coil conductor Comprising forming a connected conductive patterns for coil and turns.

The method for producing a multilayer electronic component of the present invention uses a photosensitive insulator paste containing a photopolymerizable and curable acrylic binder resin on a support, and is exposed to light and developed to produce a first photosensitive insulator. A conductive pattern formed by performing exposure and development using a photosensitive conductive paste containing a cellulose-based binder resin having photopolymerization curability on the first photosensitive insulator film, and a step of forming a film; A step of stacking a second photosensitive insulator film formed by exposure and development using a photosensitive insulator paste containing an acrylic binder resin having photopolymerization curability; and on these laminates And a step of forming a third photosensitive insulator film using a photosensitive insulator paste containing an acrylic binder resin having photopolymerization curability, so that a high-definition coil conductor pattern is provided. High-definition, small-diameter through-holes can be stably formed, and coil conductor patterns and through-holes can be formed with high positional accuracy, making it a compact stack without degrading characteristics. The mold electronic component can be manufactured stably.
Further, in the method for manufacturing a multilayer electronic component of the present invention, a coil element is formed in the laminate by laminating an insulator layer and a conductor pattern using a photosensitive insulator paste and a photosensitive conductive paste on a support. A photosensitive insulator containing an acrylic binder resin having photopolymerization curability, wherein the step of forming external terminals after dividing the laminate into individual products and laminating the insulator layer and the conductor pattern on the support Steps of forming a film, exposing and developing, applying a photosensitive conductive paste containing a photo-curing curable cellulose-based binder resin on the photosensitive insulator film, and coating the entire surface or a predetermined portion of the photosensitive insulator film Forming a photosensitive conductive film, exposing and developing to form a coil conductor pattern on the photosensitive insulator film, and having photopolymerization curability on the photosensitive insulator film on which the coil conductor pattern is formed Acry A photosensitive insulator film containing a binder resin is applied to form a photosensitive insulator film on the entire surface or a predetermined part of the conductive insulator film on which a coil conductor pattern is formed. The step of forming a through hole for connecting the upper and lower coil conductor patterns to the insulator film, and filling the through hole with a photosensitive conductive paste containing a cellulose-based binder resin having photopolymerization curability, A photosensitive conductive film containing a photo-curing curable cellulose binder resin is applied onto the photosensitive insulator film in which the through holes are formed, and the photosensitive conductive film is applied to the entire surface or a predetermined portion of the photosensitive insulator film. It has a step of forming, exposing and developing to form a coil conductor pattern connected to a lower coil conductor pattern, so that a high-definition coil conductor It is possible to stably form turns and high-definition through-holes with a small diameter, and it is possible to form conductor patterns for coils and through-holes with high positional accuracy. Electronic components can be manufactured stably.

  In the method for producing a multilayer electronic component of the present invention, first, a photosensitive insulating paste containing an acrylic binder resin having photopolymerization curability is applied on a support, exposed to light, and developed to obtain a first photosensitive property. An insulator film is formed. Next, a photosensitive conductive paste containing a cellulose-based binder resin having photopolymerization curability is applied on the first photosensitive insulator film, and the entire surface of the first photosensitive insulator film or a predetermined surface is applied. A photosensitive conductive film is formed on the portion, and exposed and developed to form a coil conductor pattern on the first photosensitive insulator film. Subsequently, a photosensitive insulator paste containing an acrylic binder resin having photopolymerization curability is applied onto the first photosensitive insulator film on which the coil conductor pattern is formed, so that the first photosensitive insulator is coated. A second photosensitive insulator film is formed on the entire surface of the film or a predetermined portion of the surface, and exposed and developed to form a through hole. Further, the through hole of the second photosensitive insulator film is filled with a photosensitive conductive paste containing a photo-curing curable cellulose binder resin, and the second photosensitive insulator film is photo-cured and cured. A photosensitive conductive paste containing a cellulose-based binder resin having a property is applied to form a photosensitive conductive film on the entire surface of the second photosensitive insulator film or a predetermined portion of the surface, and then exposed and developed to form a lower layer. A coil conductor pattern connected to the coil conductor pattern is formed. In this way, a predetermined number of conductor patterns and second photosensitive insulator films are stacked on the first photosensitive insulator film, and an acrylic binder resin having photopolymerization curability on these laminates. The coil element is formed in the laminated body by applying the photosensitive insulator paste containing, thereby forming the third photosensitive insulator film. And after dividing this laminated body into individual products, external terminals are formed.

  Therefore, in the method for manufacturing a multilayer electronic component of the present invention, the coil conductor pattern is formed by a photolithography technique using a photosensitive conductive paste containing a cellulose-based binder resin having photopolymerization curability, and the insulator layer is formed. Since it is formed by photolithography using a photosensitive insulator paste containing an acrylic binder resin having photopolymerization curability, the coil conductor pattern has a line width of 30 μm or less and a through hole diameter of 50 μm or less. In addition, the variation in the line width of the coil conductor pattern can be reduced to several μm or less. Moreover, since the photosensitive conductive paste and the photopolymerization curable binder resin constituting the photosensitive insulator paste are different systems, the coil conductor pattern on the photosensitive insulator film can be stably formed without development residue. it can. Furthermore, since the binder resin contained in the photosensitive insulator film constituting the laminate is acrylic, it can be thermally decomposed at 600 ° C. or lower, and the binder resin does not remain in the laminate, so that a printing lamination method or sheet can be used. Firing can be performed in the same manner as in the lamination method.

A method for manufacturing a multilayer electronic component according to the present invention will be described below with reference to FIGS.
FIG. 1 is an exploded perspective view of a multilayer electronic component according to an embodiment of the multilayer electronic component manufacturing method of the present invention, and FIG. 2 is a diagram of the multilayer electronic component according to the embodiment of the multilayer electronic component manufacturing method of the present invention. It is a perspective view.
Examples of the multilayer electronic component according to the embodiment of the multilayer electronic component manufacturing method of the present invention include a coil conductor pattern 12A to 12E and an insulator on an insulator layer 11A as shown in FIGS. There are layers in which the layers 11B to 11E are stacked, an insulating layer 11F is formed on the stacked body, and a coil is formed in the stacked body.
The insulator layers 11A to 11F are formed of insulator ceramics such as glass ceramics, dielectric ceramics, and magnetic ceramics.
Conductor patterns 12A to 12E are formed on the surfaces of the insulators 11A to 11E, respectively. The conductor patterns 12A to 12E are made of a metal material such as silver, silver, gold, gold, copper, or copper. FIG. 1 shows a coil conductor pattern of less than one turn. Conductor patterns 12A to 12E between insulator layers are spirally connected via conductors in through holes in the insulator layer, and a coil is formed in the laminate. It is formed. As the material of the coil conductor pattern, it is necessary to select a metal material suitable for the firing conditions of the ceramics constituting the insulator layer. However, if the conductor resistance of the conductor pattern is high, the Q value of the coil is lowered. Therefore, a metal material having a low conductor resistance is desirable.
One end of the conductor pattern 12A on the insulator layer 11A constituting one end of the coil is drawn to the end face of the insulator layer 11A and connected to the external terminal 23 formed on the end face of the laminate. Further, the other end of the conductor pattern 12E on the insulator layer 11E constituting the other end of the coil is drawn out to the end face of the insulator layer 11E and connected to the external terminal 24 formed on the end face of the laminate.

  Such a multilayer electronic component is manufactured as follows. First, as shown in FIG. 3 (A), a photosensitive insulator paste containing an acrylic binder resin having photopolymerization curability is applied to a predetermined thickness on the surface of the support 30 and dried. A photosensitive insulator film 31 </ b> A is formed on the support 30 by exposing and developing using light (for example, ultraviolet rays). The support 30 can be a metal plate, a ceramic plate, a flexible film, or the like. However, the product needs to be peeled off from the support after the laminate is formed, so that it is determined in consideration of peelability. It is desirable to perform mold release processing as necessary. In addition, in order to improve the accuracy of the formation position of the conductor pattern and the through hole, it is desirable to include an optical alignment marker at the time of exposure. In FIG. 3, a polyethylene terephthalate (PET) 30A having an adhesive layer on the surface opposite to the surface on which the laminate is formed is optically aligned on a stainless steel plate having two holes (not shown) for optical alignment at the time of exposure. The support 30 was affixed while avoiding the holes. A photosensitive insulator paste is formed into a paste by mixing photo-curing curable acrylic binder resin with insulator ceramics such as glass ceramics, dielectric ceramics, and magnetic ceramics. It is applied onto polyethylene terephthalate (PET) 30A. In FIG. 3, glass ceramics are used as insulator ceramics. The photosensitive insulator paste is dried at about 80 ° C. for 10 minutes, but is not limited to batch processing using a box dryer, and may be determined in consideration of workability such as in-line infrared drying. . Although there is a method of forming the insulator film with a non-photosensitive insulator paste without being limited to the photosensitive insulator paste, the photosensitive insulator paste and the photosensitive conductive paste used in the subsequent process are photopolymerized and cured. Further, since it shrinks due to thermosetting, a shrinkage difference occurs between the non-photosensitive insulator film, and cracks or peeling occurs between the non-photosensitive insulator film and the photosensitive insulator film or conductor pattern to be formed thereafter during degreasing. Moreover, as a coating method on the support, a screen printing method, a roll coater method, a bar coater method, or the like can be used. However, it is into a through-hole formed in the photosensitive insulator film in the subsequent step. The coating was performed in accordance with the screen printing method because of the conductor filling property. Here, the photosensitive insulator film 31A is formed by exposing and developing the photosensitive insulator film 31A, though it is not necessary to form a through hole. This is because the coating film thickness of the photosensitive conductive film and the photosensitive insulator film formed on the upper portion is not stable. As a method of reducing the adhesiveness, there is a method of performing heat curing in addition to photocuring. However, when heat curing is used in combination, the laminate shrinks during the laminate formation process due to heat shrinkage and is laminated from the support. This causes the problem that the body peels off. In addition, when a photosensitive conductive film is formed on the upper portion, a photocured unreacted portion of the photosensitive insulator film remains, and when the photosensitive conductive paste for forming the photosensitive conductive film is printed, In addition to the reaction between the solvent contained in the photosensitive conductive paste and the light uncured part, the unreacted part is dissolved in the solvent contained in the photosensitive conductive paste, and a silver residue is formed during exposure and development of the photosensitive conductive film. There is a problem that occurs. In order to prevent this, the photosensitive insulator film is exposed and developed as described above. The photosensitive insulator film 31A is desirably formed in two or more layers in order to prevent the chemical solution in the plating step when forming the external terminals later from entering the laminate.

  Next, as shown in FIG. 3 (B), a predetermined photosensitive conductive paste containing a cellulose-based binder resin having photopolymerization curability is formed on the entire surface of the photosensitive insulator film 31A or a portion to be a product on the surface. 3 to form a photosensitive conductive film 32, dried at about 80 ° C. for 10 minutes, and then exposed and developed to expose the photosensitive conductive film 32 as shown in FIG. A coil conductor pattern 32A having an external terminal lead portion is formed on the surface of the insulator film 31A. A photosensitive conductive paste is formed into a paste form by mixing a photopolymerizable cellulose-based binder resin into silver, silver-based, gold-based, gold-based, copper- or copper-based metal powder. It is applied on 31A. In FIG. 3, as the metal powder constituting the photosensitive conductive paste, a powder containing silver is used in consideration of the firing temperature of the insulator ceramic and the conductor resistance of the coil conductor pattern. Here, when the photosensitive conductive paste is applied on the photosensitive insulator film, the binder resin of the photosensitive insulator film is dissolved in the solvent contained in the photosensitive conductive paste. At this time, when the binder resin contained in the photosensitive conductive paste and the binder resin contained in the photosensitive insulator film are in the same series, the binder in which the photosensitive insulator film is dissolved when the applied photosensitive conductive paste is dried. The binder resin contained in the resin and the photosensitive conductive paste undergoes a heat curing reaction, which makes it difficult to remove the unexposed conductive film when developing the exposed photosensitive conductive film. A silver residue is generated. Therefore, there is a problem that the insulating property of the laminated body is deteriorated due to the silver residue or a short circuit is caused between the conductor patterns. This silver residue can be suppressed by performing the drying conditions of the applied photosensitive conductive paste at a lower temperature and in a shorter time, but the adhesive strength of the photosensitive conductive film is stronger when drying at a lower temperature and in a shorter time. There is a problem in that the exposure mask and the photosensitive conductive film are stuck to each other during exposure through an exposure mask such as a glass dry plate. In order to prevent the exposure mask and the photosensitive conductive film from sticking, it is possible to perform so-called off-contact exposure in which the exposure mask and the photosensitive conductive film are not in contact, but in this case, a conductor pattern formed by exposure and development There is a problem that the accuracy of. Further, when development is performed until the silver residue is removed, the binder resin in the conductive film that should remain is attacked by the developer, and the conductive film for the coil is disconnected due to peeling or loss of the conductive film. There is a problem. In order to solve these problems, in the present invention, photopolymerization curability is formed on a photosensitive insulator film formed of a photosensitive insulator paste containing an acrylic photosensitive binder resin having photopolymerization curability. A photosensitive conductive film is formed with a photosensitive conductive paste containing a cellulose-based photosensitive binder resin having a, and exposed and developed to form a coil conductor pattern.

Further, as shown in FIG. 3D, an acrylic binder resin having photopolymerization curability is contained in the entire surface of the photosensitive insulator film on which the coil conductor pattern is formed or a portion of the surface to be a product. A photosensitive insulator paste is applied to a predetermined thickness to form a photosensitive insulator film 31B, and after drying, the photosensitive insulator film 31B is exposed and developed, as shown in FIG. Through holes H are formed in the photosensitive insulator film 31B. At the bottom surface of the through hole H, the end portion of the coil conductor pattern 32A is exposed. At this time, by exposing the binder resin contained in the coil conductor pattern and the binder resin contained in the photosensitive insulator paste to different systems, it is exposed to the bottom surface of the through hole H formed in the photosensitive insulator film 31B. It is possible to prevent the residue of the insulator from being generated on the end portion of the coil conductor pattern 32A. Thereby, the reliability of the connection between the coil conductor patterns can be improved.
Subsequently, a photosensitive conductive paste containing a cellulosic binder resin having photopolymerization curability is filled into the through hole H of the photosensitive insulator film 31B, and as shown in FIG. A photosensitive conductive film 32 containing a photo-curing curable cellulose-based binder resin is applied to a predetermined thickness on the entire surface of the insulator film or a portion to be a product on the surface to form a photosensitive conductive film 32 and dried. Thereafter, the photosensitive conductive film 32 is exposed and developed to form a coil conductor pattern 32B on the surface of the photosensitive insulator film 31B, as shown in FIG. One end of the coil conductor pattern 32B is connected to the coil conductor pattern 32A by a conductor in the through hole of the photosensitive insulator film 31B. At this time, the film thickness at the position corresponding to the through hole of the photosensitive conductive film 32 is thicker than the other part by the depth of the through hole and exceeds the film thickness that can be exposed. The photosensitive conductor in the vicinity of the bottom of the substrate is half-exposed or unexposed. However, after filling the through hole with the photosensitive conductive paste, by adding a step of exposing the through hole portion, the upper part of the photosensitive conductor filled in the through hole is photopolymerized and cured. The polymerized and hardened portion becomes a resist of the photosensitive conductor filled in the through hole, and it is possible to prevent dissolution of the half-exposed or unexposed binder resin contained in the filled photosensitive conductor by the developer, and the coil conductor The reliability of connection between patterns can be improved.

In this manner, the coil conductor pattern 12E was formed on the photosensitive insulator film 31A by stacking the coil conductor patterns and the photosensitive insulator film for the number of layers necessary to obtain a predetermined inductance value. The laminate is formed by applying a photosensitive insulator paste containing an acrylic binder resin having photopolymerization curability on the photosensitive insulator film to form a photosensitive insulator film that becomes the exterior insulator layer 11F. A coil element is formed. Here, although there is a method of forming the exterior insulator layer with a non-photosensitive insulator paste, the photosensitive conductive film constituting the coil conductor pattern 12E and the non-photosensitive insulator film constituting the insulator layer 11E are not. Due to the shrinkage difference from the photosensitive insulator paste, cracks and peeling occur between the exterior insulator layer, the coil conductor pattern 12E, and the insulator layer 11E during degreasing. In addition, if the insulation layer for the exterior is thin or has a pinhole, the chemical solution for plating the external terminal enters the element body and the characteristics deteriorate, so it is necessary to form two or more layers. desirable. In the case where two or more exterior insulator layers are formed, the adhesiveness of the photosensitive insulator film can be reduced by exposing and developing after forming the first photosensitive insulator film.
As shown in FIG. 4, the laminate formed on the support is cut by a cutting machine or the like at the dotted line, and is divided into individual products, peeled off from the support 30, and degreased under predetermined conditions. After performing, this is baked and an external terminal is formed. The external terminals are peeled off from the support 30, and a conductive paste containing silver is applied to the fired fired body, dried and fired, and then plated with nickel and tin to ensure solder mountability.

  In this way, when the multilayer electronic component is manufactured by the method of manufacturing the multilayer electronic component of the present invention, the 0402 size (0.4 × 0.2 × 0.2 mm), 03015 size (0.3 × 0.15 × 0.15 mm), and 0201 size (0.2 × 0.1 × 0.1 mm) could be stably produced. When the characteristics of a 0402 size (0.4 × 0.2 × 0.2 mm) multilayer electronic component manufactured by the multilayer electronic component manufacturing method of the present invention were measured, the characteristics shown in FIG. 5 were obtained. It was. In FIG. 5, 51 is the Q value for the frequency with an inductance value of 1 nH, 52 is the Q value for the frequency with an inductance value of 5.6 nH, and 53 is the Q value for the frequency with an inductance value of 8.2 nH. Show.

  As mentioned above, although the Example of the manufacturing method of the multilayer electronic component of this invention was described, this invention is not limited to this Example. For example, as shown in FIG. 4, the external terminal is cut at the dotted line portion to divide each product, peel off from the support, apply a conductive paste containing silver to this, degrease, and fire. May be formed.

It is a disassembled perspective view of the multilayer electronic component which concerns on the Example of the manufacturing method of the multilayer electronic component of this invention. It is a perspective view of the multilayer electronic component which concerns on the Example of the manufacturing method of the multilayer electronic component of this invention. It is manufacturing process explanatory drawing which shows typically the Example of the manufacturing method of the multilayer electronic component of this invention. It is explanatory drawing which illustrates typically the process of isolate | separating the laminated body of the manufacturing method of the multilayer electronic component of this invention into each product. It is a characteristic view of the multilayer electronic component manufactured by the manufacturing method of the multilayer electronic component of this invention.

Explanation of symbols

11A-11F Insulator layer 12A-12E Conductor pattern

Claims (2)

In a method for manufacturing a laminated electronic component in which an insulator layer and a conductor pattern are laminated, and a circuit element is formed by the conductor pattern in the laminate,
Using a photosensitive insulator paste containing an acrylic binder resin having photopolymerization curability on a support, exposing and developing to form a first photosensitive insulator film;
A conductive pattern formed by exposing and developing a photosensitive conductive paste containing a cellulose-based binder resin having photopolymerization curability on the first photosensitive insulator film, and having photopolymerization curability. A step in which a photosensitive insulator paste containing an acrylic binder resin is used, and a second photosensitive insulator film formed by exposure and development is stacked; and
A laminate type comprising a step of forming a third photosensitive insulator film on the laminate using a photosensitive insulator paste containing an acrylic binder resin having photopolymerization curability. Manufacturing method of electronic components. In a method for manufacturing a laminated electronic component in which an insulator layer and a conductor pattern are laminated, and a circuit element is formed by the conductor pattern in the laminate,
A coil element is formed in a laminate by laminating an insulator layer and a conductor pattern using a photosensitive insulator paste and a photosensitive conductive paste on a support, and forming the external terminals after dividing the laminate into individual products. And
Laminating an insulator layer and a conductor pattern on the support,
Forming a photosensitive insulator film containing an acrylic binder resin having photopolymerization curability, exposing and developing;
On the photosensitive insulator film, a photosensitive conductive paste containing a cellulose-based binder resin having photopolymerization curability is applied to form a photosensitive conductive film on the entire surface or a predetermined portion of the photosensitive insulator film, and then exposed. And developing to form a coil conductor pattern on the photosensitive insulator film,
Photosensitive insulation having a coil conductor pattern formed by applying a photosensitive insulator paste containing a photopolymerization-curable acrylic binder resin on the photosensitive insulator film having the coil conductor pattern formed thereon Forming a photosensitive insulator film on the entire surface or a predetermined portion of the body film, exposing and developing to form through holes for connecting the upper and lower coil conductor patterns to the photosensitive insulator film; and
The through-hole is filled with a photosensitive conductive paste containing a photo-polymerizable curable cellulose-based binder resin, and the photo-curing curable cellulose-based binder is formed on the photosensitive insulator film in which the through-hole is formed. A coil conductive conductor coated with a conductive conductive paste containing a resin to form a photosensitive conductive film on the entire surface or a predetermined portion of the photosensitive insulator film, and then exposed and developed to be connected to the lower coil conductor pattern. A method of manufacturing a multilayer electronic component, comprising a step of forming a pattern.

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