JP2002198244A - Method of manufacturing common mode choke coil - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem even if a conductor pattern can be formed by a printing device, narrowing of linewidth of the conductor pattern or variance of shape cannot be reduced, and even though the narrowing linewidth thereof or the variance of shape can be reduced, a conductor layer for forming the conductor pattern an expensive device is necessary. SOLUTION: A pair of spiral coils are formed opposite to each other between first and second insulation substrates, with an insulator layer being interposed, by using a photosensitive conductive paste. The insulator layer, in which a through-hole is made to connect the spiral coil with a lead electrode, is formed of an insulation material containing a photosensitive material. Therefore, narrowing of linewidth or the variance of the shape of the conductive pattern can be reduced, without using an expensive device, so that the characteristics of the conductive pattern can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a common mode choke coil in which a pair of spiral coils are opposed to each other via an insulating layer.

[0002]

2. Description of the Related Art In the field of common mode choke coils, common mode choke coils that do not use windings have been put to practical use in order to meet the demand for miniaturization and thinning. As these common mode choke coils,
For example, an insulator layer and a conductor pattern are alternately laminated to form a pair of spiral coils in the laminate, and the pair of coils are opposed to each other via the insulator layer to form a pair of coils. Some are magnetically coupled. Such a common mode choke coil is manufactured by a printing method or a sheet method.

[0003]

With this kind of common mode choke coil, further miniaturization and thinning have been desired with the miniaturization of electronic equipment. However, in such a common mode choke coil, when a conductive pattern is formed by printing, even if an attempt is made to make the conductive pattern thinner for miniaturization and thinning, the conductive pattern is bleeding due to bleeding of the conductive paste when the conductive pattern is printed. Could not be formed to have a line width of several tens μm or less. Also,
Since the printing accuracy is not sufficient, the shape of the conductor pattern is displaced by several tens of μm from the design value, or the position of the conductor pattern on the insulating layer is displaced. In a common mode choke coil of this type, when the relative position of a pair of coils is shifted, the magnetic coupling between the pair of coils is weakened, and the shape of the pair of coils varies due to variations in the shape of the conductor pattern. In this case, the inductance and impedance of the pair of coils differ, and in any case, the characteristics of the common mode choke coil deteriorate. Also, in such a common mode choke coil, when an insulating layer having a through hole is formed by printing, the shape of the through hole cannot be reduced due to bleeding of the insulating paste when printing the insulating layer. In addition, since the printing accuracy was not sufficient, the position was easily shifted. In addition, when an insulator layer having a through hole is formed of an insulator sheet having a conductor pattern formed on the surface thereof, the relative positions of the conductor patterns of the upper and lower layers are likely to shift due to lamination misalignment when the sheets are laminated. There was a problem.

In order to solve such a problem, a common mode choke coil is manufactured by a thin film method. However, when a conductor pattern is formed by a thin film method (such as a sputtering method), magnetic coupling between a pair of coils can be strengthened, but the film thickness cannot be increased, and only a few μm can be obtained at most. Therefore, the DC resistance increases and the signal attenuation increases.
In order to reduce the DC resistance, it is necessary to increase the film thickness, and it is general to form a conductor plating on the conductor pattern. Therefore, when the common mode choke coil is manufactured by the thin film method, the number of steps increases. Also,
If a common mode choke coil is to be manufactured by a thin film method, an expensive apparatus is required to form a conductor layer for forming a conductor pattern, and a resist is required to form a conductor pattern and an insulator layer. A coating step and a resist stripping step were required.

Therefore, in the conventional method of manufacturing a common mode choke coil, a conductor pattern can be formed by a general printing apparatus, but it is not possible to reduce the line width of the conductor pattern and to reduce the variation in shape. Although it is possible to reduce the line width of the pattern and reduce the variation in shape, there is a problem that an expensive apparatus is required to form a conductor layer for forming a conductor pattern.

The present invention provides a method for manufacturing a common mode choke coil which can reduce the line width of a conductor pattern and reduce variations in shape without using an expensive device, thereby improving characteristics. The purpose is to provide.

[0007]

A method of manufacturing a common mode choke coil according to the present invention comprises changing a material for forming a pair of spiral coils and a material for an insulator layer in which a through hole is formed. Thus, the above-mentioned problem is solved. That is, a pair of spiral wound coils are opposed between a first insulating substrate and a second insulating substrate with an insulating layer interposed therebetween, and a common mode choke coil in which external terminals are provided in a body in which these are integrated. In the manufacturing method, a pair of spirally wound coils is formed using a photosensitive conductive paste, and an insulating layer in which a through hole for connecting the spirally wound coil and an extraction electrode is formed is an insulating material containing a photosensitive material. Is formed. Further, the method for manufacturing a common mode choke coil according to the present invention includes the step of forming one of the extraction electrodes of the first spiral coil and the second spiral coil using a photosensitive conductive paste on the surface of the first insulating substrate. A first step of forming one lead electrode, forming a first insulator layer on a first insulating substrate using an insulating material containing a photosensitive material, and forming a first insulating layer on the first insulating substrate;
A second step of forming a through-hole at a position corresponding to the end of one of the extraction electrodes of the spiral coil and the end of the one of the extraction electrodes of the second spiral coil, a first insulator layer Forming a first spiral coil using a photosensitive conductive paste on the surface of the first coil, and connecting one of the extraction electrodes of the first spiral coil to the first spiral coil;
Using an insulating material containing a photosensitive material on the first insulator layer, the second
A fourth step of forming an insulator layer at a position corresponding to an end of one of the extraction electrodes of the second spiral coil on the second insulator layer; and a second insulating step. Fifth step of forming a second spiral coil on the surface of the body layer by using a photosensitive conductive paste, and connecting one lead electrode of the second spiral coil to the second spiral coil Is provided.

Further, in the method of manufacturing a common mode choke coil according to the present invention, both of the lead electrodes of the first spiral coil and the second spiral coil are formed on the surface of the first insulating substrate by using a photosensitive conductive paste. Forming a first insulating layer on a first insulating substrate by using an insulating material containing a photosensitive material, and forming a first insulating layer on the first insulating substrate. A second step of forming through holes at positions corresponding to the ends of both extraction electrodes of the spiral coil and the ends of both extraction electrodes of the second spiral coil;
Forming a first spiral coil on the surface of the insulator layer using a photosensitive conductive paste, and connecting a lead electrode of the first spiral coil to the first spiral coil; ,
Using an insulating material containing a photosensitive material on the first insulator layer, the second
A fourth step of forming a through hole at a position corresponding to an end of a lead electrode of a second spiral coil on the second insulator layer, and a second insulator layer Forming a second spiral coil using a photosensitive conductive paste on the surface of the second coil, and connecting the second spiral coil to a lead electrode of the second spiral coil.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A common mode choke coil according to the present invention has a thick conductive film of a photosensitive conductive paste printed on the entire surface of an insulating substrate, and is connected to at least one lead electrode of a first spiral coil by photolithography. Second
At least one lead electrode of the spirally wound coil is formed, a photosensitive conductive paste is thickly printed on the entire surface of the insulator layer, and a pair of spirally wound coils is formed by photolithography. Accordingly spiral coil, several μm in line width tolerance can to 100μm or less, and the thickness can be more than 20 [mu] m. In addition, since a pair of spirally wound coil extraction electrodes is formed on the insulating substrate, the number of layers can be reduced, and the number of man-hours is not required.
In addition, the insulating layer in which the through-hole for connecting the spiral coil and the extraction electrode is formed by printing a thick film of an insulating material containing a photosensitive material on the entire surface of the insulating substrate or the insulating layer, and using a photolithography technique. Formed by Thereby, the diameter of the through hole can be reduced to 100 μm or less.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for manufacturing a common mode choke coil according to the present invention will be described below with reference to the drawings. FIG.
FIG. 2 is an exploded perspective view of a common mode choke coil manufactured by the first embodiment of the method for manufacturing a common mode choke coil of the present invention. FIG. 2 is a common mode choke manufactured by the method of manufacturing a common mode choke coil of the present invention. FIG. 3 is a perspective view of the coil, and FIG. 3 is an equivalent circuit diagram of the common mode choke coil. In FIG. 1, 11 and 15 are insulating substrates, 12, 13 and 14 are insulator layers, and 16 and 17 are spiral coils. On the surface of the insulating substrate 11, a lead electrode 16A forming one end of the spiral coil 16 and a lead electrode 17 forming one end of the spiral coil 17 are provided.
A is formed. One end of the extraction electrode 16A and one end of the extraction electrode 17A are extracted to the same end surface of the insulating substrate 11. A spiral coil 16 is formed on the surface of the insulator layer 12 formed on the insulating substrate 11, and the inner end thereof is formed through a through hole provided in the insulator layer 12 to form the other end of the lead electrode 16 </ b> A. Connected to the end. The outer end 16B of the spiral coil 16 (that is, the lead electrode constituting the other end of the spiral coil 16) is
2 is pulled out. At this time, the spiral coil 16
Is drawn out to a position facing the surface on which the lead-out electrode 16A is drawn out. On this insulator layer 12, an insulator layer 13 is formed. The surface of the insulator layer 13 has a spiral coil 1
7 is formed. At this time, the spiral coil 17 has a portion excluding an inner end and an outer end so that the winding direction is the same as the winding direction of the spiral coil 16. 16 are formed in parallel. The inner end of the spiral coil 17 is connected to the other end of the extraction electrode 17A via through holes provided in the insulator layer 12 and the insulator layer 13. Further, the outer end 17 </ b> B of the spiral coil 17 (that is, the extraction electrode that constitutes the other end of the spiral coil 17) is extended to the end surface of the insulator layer 13. At this time, the outer end 17 of the spiral coil 17
B is drawn out to a position facing the surface on which the lead-out electrode 17A is drawn out. An insulator layer 14 is formed on the insulator layer 13, and the insulator layer 1
An insulating substrate 15 is formed on 4.

As shown in FIG. 2, external terminals 21, 22, 23 and 24 are provided on the main body in which these are integrated.
The external terminal 21 is connected to a lead electrode 16A constituting one end of the spiral coil 16, and the external terminal 22 is connected to the outer end 16B of the spiral coil 16. Also,
The external terminal 23 is connected to a lead electrode 17A constituting one end of the spiral coil 17, and the external terminal 24 is connected to an outer end 17B of the spiral coil 17.

In the common mode choke coil formed as described above, as shown in FIG. 3, a coil L1 is formed by the spiral coil 16 and the lead electrode 16A, and the spiral coil 17 and the lead electrode 17A are formed by the coil L1. The coil L2 is formed. The coil L1 and the coil L2 are formed of the spiral coil 16 and the spiral coil 17 in the same winding direction.
Since they face each other in parallel with each other through 3, the common mode noise is canceled. Further, since the coil L1 and the coil L2 are formed to have the same line width and the same number of turns, they have the same inductance and the same impedance.

This common mode choke coil is manufactured as follows. First, a photosensitive conductive paste is printed on the entire surface of a previously baked insulating substrate, dried, and then exposed to ultraviolet light or the like so that only a portion serving as an extraction electrode remains. 4 is removed, and these are baked to obtain FIG.
(A) As shown in FIG.
And the extraction electrode 47A are formed. Normally, a plurality of common mode choke coil extraction electrodes are formed on the surface of the insulating substrate so that a plurality of common mode choke coils can be manufactured at one time. Only the common mode choke coil is shown. Next, a paste made of an insulating material containing a photosensitive material is printed on the entire surface of the insulating substrate on which the extraction electrode 46A and the extraction electrode 47A are formed, dried, exposed to ultraviolet light or the like, and developed through. By removing the portions to be holes and firing them, FIG.
An insulator layer 4 having through holes 42A and 42B at positions corresponding to the other ends of the respective lead electrodes as shown in FIG.
2 are formed. The other end of the lead electrode 46A is exposed at the bottom of the through hole 42A, and the other end of the lead electrode 47A is exposed at the bottom of the through hole 42B. further,
A photosensitive conductive paste is printed on the entire surface of the insulator layer, and after drying, the film is exposed to ultraviolet light or the like so that a portion to be a spiral coil and a portion of a through hole remain, and the spiral coil is formed by development. By removing portions other than the portion and the through-hole portion and firing them, FIG.
As shown in (C), the spiral coil 46 is formed on the surface of the insulator layer 42.
Is formed. When the photosensitive conductive paste is applied to the entire surface of the insulator layer 42, the spiral conductive coil 46 fills the through holes with the photosensitive conductive paste and is connected to the lead electrode 46A. Next, the spiral coil 46
Is printed on the entire surface of the insulator layer 42 on which is formed a paste of an insulating material containing a photosensitive material and dried,
Exposure with ultraviolet light or the like, removal of portions that become through holes by development, and baking of
Insulator layer 43 having a through hole 43B is formed still in a position corresponding to the other end of the extraction electrode which is not connected with the flat coil like. This through hole 43
The conductor filled in the through hole 42B of the insulator layer 42 is exposed on the bottom surface of B. Further, a photosensitive conductive paste is printed on the entire surface of the insulator layer, dried, and then exposed to ultraviolet light or the like so that a portion to be a spiral coil remains, and a portion other than a portion to be a spiral coil by development is exposed. By removing these portions and firing them, as shown in FIG. 4E, the winding direction of the coil 4
A spiral coil 47 is formed in the same direction as the winding direction of No. 6 so as to be parallel to the spiral coil 46. When the photosensitive conductive paste is applied to the entire surface of the insulator layer 43, the spiral conductive coil 47 fills the through holes with the photosensitive conductive paste, and the through-holes 42B of the insulator layer 42
Is connected to the lead-out electrode 47A via a conductor filled in the substrate. Further, after an insulator paste is printed on the entire surface of the insulator layer 43 on which the spiral coil 47 is formed, the insulator paste is fired to form the insulator layer 44 as shown in FIG. Next, on the upper surface of the insulator layer 44, an insulating substrate 45 preliminarily baked as shown in FIG. 4G is laminated, and the insulator layer 44 and the insulating substrate 45 are joined. The insulating layer 44 is bonded to the insulating substrate 45 by forming a bonding layer on at least one of the upper surface of the insulating layer 44 and the lower surface of the insulating substrate 45 using a ceramic such as glass, a synthetic resin, or the like. This is performed by bringing the upper surface of the insulator layer 44 into close contact with the lower surface of the insulating substrate 45. At this time, when ceramic is used as the material of the bonding layer, these laminates are fired,
When a synthetic resin is used as the material of the bonding layer, the resin is cured at a temperature lower than the firing temperature of the insulating substrate or the insulating layer. Then, external electrodes are formed at predetermined positions of the main body in which these are integrated. When the insulating layer 44 and the insulating substrate 45 are joined by hardening the resin, the external electrodes are formed by applying a conductive paste mixed with a synthetic resin to a predetermined position of the main body and then hardening the resin at a low temperature, Body layer 44
When the insulating substrate 45 is bonded to the insulating substrate 45 with a ceramic, the conductive paste is applied to a predetermined position of the main body and then baked, or the conductive paste mixed with the synthetic resin is applied to a predetermined position of the main body and then the synthetic resin is applied at a low temperature. To cure.

FIG. 5 is an exploded perspective view of a common mode choke coil manufactured according to the second embodiment of the method for manufacturing a common mode choke coil of the present invention. On the surface of the insulating substrate 51, extraction electrodes 57A constituting the extraction electrode 56A constituting one end of the spiral coil 56, the extraction electrode 56B constituting the other end of the spiral coil 56, one end of the spiral coil 57 And the spiral coil 57
Is formed as a lead electrode 57B which constitutes the other end of. One end of 56A and one end of 57A are drawn out to the same end surface of the insulating substrate 51, and one end of 56B and 57
One end of B is drawn out to an end face opposite to the end face from which one end of 56A and one end of 57A are drawn out. This insulating substrate 5
A spiral coil 56 is formed on the surface of the insulator layer 52 formed on the first coil 1. The spiral coil 56 has an inner end connected to the other end of the extraction electrode 56A via a through hole provided in the insulator layer 52, and an outer end provided with a through hole provided in the insulator layer 52. Is connected to the other end of the extraction electrode 56B. On this insulator layer 52, an insulator layer 53 is formed. A spiral coil 57 is formed on the surface of the insulator layer 53. At this time,
The spiral coil 57 has a portion excluding the inner end and the outer end parallel to the spiral coil 56 so that the winding direction is the same as the winding direction of the spiral coil 56. Is formed. The spiral coil 57 has an inner end connected to the other end of the extraction electrode 57A via a through hole provided in the insulator layer 52 and the insulator layer 53, and an outer end connected to the insulator layer 52. And the other end of the extraction electrode 57B via a through hole provided in the insulator layer 53. An insulator layer 54 is formed on the insulator layer 53,
Further, an insulating substrate 55 is formed on the insulator layer 54.

This common mode choke coil is manufactured as follows. First, a photosensitive conductive paste is printed on the entire surface of a previously baked insulating substrate, dried, exposed to ultraviolet light or the like, and the portions other than the portion serving as the extraction electrode are removed by development, and these are baked. Thus, the lead electrodes 66A, 66B, 47A, and 67B are formed on the surface of the insulating substrate 61 as shown in FIG. FIG. 6 shows only one common mode choke coil as in FIG. 4 for ease of explanation. next,
A paste made of an insulating material containing a photosensitive material is printed on the entire surface of the insulating substrate on which the extraction electrodes 66A, 66B, 67A, 67B are formed, dried, exposed to ultraviolet light or the like, and developed through holes. 6B, the insulator layer 62 having through holes 62A, 62B, 62C, and 62D at positions corresponding to the other ends of the extraction electrodes is formed as shown in FIG. 6B. It is formed. The other end of the extraction electrode 66A is provided on the bottom surface of the through hole 62A, the other end of the extraction electrode 66B is provided on the bottom surface of the through hole 62B, and the other end of the extraction electrode 67A is provided on the bottom surface of the through hole 62C.
The extraction electrode 67B is exposed on the bottom surface of the 2D. Further, a photosensitive conductive paste is printed on the entire surface of the insulator layer, dried, exposed to ultraviolet light or the like, and portions other than a portion to be a spiral coil and a portion of a through hole are removed by development. Is baked to form a spiral coil 6 on the surface of the insulator layer 62 as shown in FIG.
6 are formed. The spiral coil 66 includes the insulating layer 62.
When the photosensitive conductive paste is applied to the entire surface of the substrate, the photosensitive conductive paste is filled in the through holes and connected to the extraction electrodes 66A and 66B. Next, the insulator layer 62 on which the spiral coil 66 is formed is formed.
By printing a paste made of an insulating material containing a photosensitive material on the entire surface of the substrate, drying the paste, exposing it to ultraviolet light or the like, removing portions that become through holes by development, and baking these, FIG. An insulator layer 63 having through holes 63C and 63D is formed at a position corresponding to the other end of the extraction electrode not yet connected to the spiral coil as in (D). A conductor filled in a through hole 62C of the insulator layer 62 is provided on the bottom surface of the through hole 63B, and a through hole 6C of the insulator layer 62 is provided on the bottom surface of the through hole 63D.
The conductors filled in 2D are respectively exposed. Furthermore, a photosensitive conductive paste is printed on the entire surface of the insulator layer,
After being dried, it is exposed to ultraviolet light or the like, and the portions other than the portion that becomes the spiral coil are removed by development, and these portions are baked, so that the surface of the insulator layer 63 is formed as shown in FIG. The winding direction is the same as the winding direction of the spirally wound coil 66, and the spirally wound coil 67 is formed flat with the spirally wound coil 66. The spiral coil 67 is made of the insulating layer 6.
When the photosensitive conductive paste is applied to the entire surface of the insulating layer 62, the photosensitive conductive paste is filled in the through-holes, and the inner end is connected to the lead electrode 67 A via the conductor filled in the through-hole 62 C of the insulator layer 62. And the outer end is connected to the extraction electrode 67B via a conductor filled in the through hole 62D of the insulator layer 62. Furthermore,
After printing an insulator paste on the entire surface of the insulator layer 63 on which the spiral coil 67 is formed, baking is performed as shown in FIG.
An insulator layer 64 is formed as shown in FIG. Next, on the upper surface of the insulator layer 64, an insulating substrate 65 preliminarily baked as shown in FIG.
Are joined. Then, external electrodes are formed at predetermined positions of the main body in which these are integrated.

Although the embodiments of the method for manufacturing a common mode choke coil according to the present invention have been described above, the present invention is not limited to these embodiments. For example, the position where the pair of spiral coils is pulled out can be variously changed according to the number of turns. In the first and second embodiments, an insulating layer having through holes is printed with an insulating material containing a photosensitive material on the entire surface of the insulating substrate or the insulating layer, which is dried, exposed, and developed. Although what was formed by baking was described, an insulating layer having at least a through hole, an insulating sheet containing a photosensitive material was laminated on an insulating substrate or an insulating layer, pressed, and dried, exposed, developed,
It may be formed by firing.

[0017]

As described above, according to the method of manufacturing a common mode choke coil of the present invention, a pair of spiral coils is formed by printing a photosensitive conductive paste in a thick film on the entire surface of an insulating substrate or an insulating layer. , Which is formed by drying, exposing and developing, so that the line width of the conductor can be narrower than that by the conventional printing method, and the conductor thickness can be thicker than that by the conventional thin film method, and The accuracy of forming a pair of spiral coils is improved, and the accuracy of their relative positions can be improved. Further, in the method for manufacturing a common mode choke coil according to the present invention, the insulator layer in which the through hole is formed is formed of an insulating material containing a photosensitive material, and the insulator layer is formed by drying, exposing, and developing. Therefore, the shape and processing accuracy of the through hole can be improved as compared with the case where the through hole is formed by printing. Therefore, the method for manufacturing a common mode choke coil according to the present invention can reduce the line width of the conductor pattern and reduce the variation in shape without using an expensive device, thereby improving the characteristics. . Further, the method of manufacturing a common mode choke coil according to the present invention, when the insulating layer in which the through-hole is formed is formed of an insulating sheet containing a photosensitive material, compared with the case where the insulating layer is formed by printing, The thickness can be made uniform.
Furthermore, the method for manufacturing a common mode choke coil of the present invention does not use a resist, so that a step of applying a resist and a step of removing the resist are not required. Furthermore, in the method for manufacturing a common mode choke coil according to the present invention, the extraction electrode of the first spiral coil and the extraction electrode of the second spiral coil are formed in the same layer.
The size can be reduced and the number of steps can be reduced.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a common mode choke coil manufactured according to a first embodiment of a method for manufacturing a common mode choke coil of the present invention.

FIG. 2 is a perspective view of a common mode choke coil manufactured by the method for manufacturing a common mode choke coil according to the present invention.

FIG. 3 is an equivalent circuit diagram of a common mode choke coil.

FIG. 4 is a top view showing a first embodiment of the method of manufacturing a common mode choke coil according to the present invention.

FIG. 5 is an exploded perspective view of a common mode choke coil manufactured according to a second embodiment of the method for manufacturing a common mode choke coil of the present invention.

FIG. 6 is a top view showing a second embodiment of the method of manufacturing a common mode choke coil according to the present invention.

[Explanation of symbols]

 11, 15 insulating substrate 12, 13, 14 insulating layer

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Shuichi Ishida 828 Hinohara, Tamagawa-mura, Higashi-gun, Hiki-gun, Saitama Prefecture Inside the Tamagawa Plant, Toko Co., Ltd. Tamagawa Factory Co., Ltd. F-term (reference) 5E062 DD04 5E070 AA01 AB02 AB10 CB02 CB13 CB17 EA01

Claims (7)

[Claims] A first insulating substrate and a second insulating substrate,
In a method of manufacturing a common mode choke coil in which a pair of spiral coils are formed facing each other with an insulator layer interposed therebetween and an external terminal is provided on a body obtained by integrating the spiral coils, A common mode, wherein an insulator layer formed using a photosensitive conductive paste and having a through hole for connecting the spiral coil and the extraction electrode is formed of an insulating material containing a photosensitive material. Manufacturing method of choke coil. 2. A method according to claim 1, further comprising the step of:
In a method of manufacturing a common mode choke coil in which a pair of spiral coils are formed to face each other with an insulator layer interposed therebetween and an external terminal is provided on a main body in which the coils are integrated, a surface of a first insulating substrate is exposed to light. A first step of forming one lead electrode of the first spiral coil and one lead electrode of the second spiral coil using the conductive paste;
Forming a first insulating layer on the first insulating substrate by using an insulating material containing a photosensitive material; And a second step of forming a through hole at a position corresponding to the end of one of the extraction electrodes of the second spiral coil. A third step of forming one spiral coil and connecting one of the extraction electrodes of the first spiral coil to the first spiral coil; a photosensitive material on the first insulator layer Second using insulating material containing
A fourth step of forming an insulator layer at a position corresponding to an end of one of the extraction electrodes of the second spiral coil on the second insulator layer; and A second spiral coil is formed on the surface of the second insulator layer using a photosensitive conductive paste, and one of the extraction electrodes of the second spiral coil is connected to the second spiral coil. The fifth
A method for manufacturing a common mode choke coil, comprising the steps of: 3. The method according to claim 1, wherein the first insulating substrate and the second insulating substrate are
In a method of manufacturing a common mode choke coil in which a pair of spirally wound coils are formed so as to face each other with an insulator layer interposed therebetween and an external terminal is provided on a main body in which these are integrated, the entire surface of the first insulating substrate is A photosensitive conductive paste is applied, dried, exposed, and developed, so that one lead electrode of a first spiral coil and one lead of a second spiral coil are drawn on the surface of the first substrate. A first step of forming an electrode, applying an insulating material containing a photosensitive material on the first insulating substrate, drying, exposing, and developing the same to form an end of one of the extraction electrodes of the first spiral coil; Forming a first insulator layer having a through hole at a position corresponding to an end of one of the extraction electrodes of the second spiral coil, and a surface of the first insulator layer Apply a photosensitive conductive paste to the whole, dry and expose A first spiral coil is formed on the surface of the first insulator layer by light and development, and one of the extraction electrodes of the first spiral coil is connected to the first spiral coil. A third step of applying an insulating material containing a photosensitive material on the first insulator layer, drying, exposing, and developing the same to form an end of one of the lead electrodes of the second spiral coil; The second having a through hole at the position corresponding to
A fourth step of forming an insulator layer, and applying a photosensitive conductive paste to the entire surface of the second insulator layer, and drying, exposing, and developing the paste. A fifth step of forming a second spiral coil on the surface and connecting one of the extraction electrodes of the second spiral coil to the second spiral coil; Manufacturing method of common mode choke coil. 4. The method according to claim 1, wherein the first insulating substrate and the second insulating substrate are
In a method of manufacturing a common mode choke coil in which a pair of spirally wound coils are formed so as to face each other with an insulator layer interposed therebetween and an external terminal is provided on a main body in which these are integrated, the entire surface of the first insulating substrate is A photosensitive conductive paste is applied, dried, exposed, and developed to form one of an extraction electrode of the first spiral coil and one of the second spiral coil on the surface of the first insulating substrate. A first step of forming a lead electrode, an insulating sheet containing a photosensitive material is laminated on the first insulating substrate, pressure-bonded, dried, exposed, and developed to draw out one of the first spiral coils. A second step of forming a first insulator layer having a through hole at a position corresponding to an end of the electrode and an end of one of the extraction electrodes of the second spiral coil; Apply photosensitive conductive paste to the entire surface of the layer, This is dried, exposed, and developed to form a first spiral coil on the surface of the first insulator layer, and one extraction electrode of the first spiral coil and the first spiral coil are formed. A third step of connecting a spiral coil, laminating and pressing an insulating sheet containing a photosensitive material on the first insulator layer, and drying, exposing and developing the insulating sheet, thereby forming one of the second spiral coils; A fourth step of forming a second insulator layer having a through hole at a position corresponding to the end of the lead electrode, and applying a photosensitive conductive paste to the entire surface of the second insulator layer. Is dried, exposed, and developed to form a second spiral coil on the surface of the second insulator layer, and one lead electrode of the second spiral coil and the second spiral coil are formed.
5. A method for manufacturing a common mode choke coil, comprising: a fifth step of connecting a spiral coil. 5. A method according to claim 1, further comprising the step of:
In a method of manufacturing a common mode choke coil in which a pair of spiral coils are formed to face each other with an insulator layer interposed therebetween and an external terminal is provided on a body in which the coils are integrated, a surface of the first insulating substrate is exposed to light. A first step of forming both extraction electrodes of the first spiral coil and both extraction electrodes of the second spiral coil using the conductive paste;
A first insulator layer is formed on the first insulating substrate using an insulating material containing a photosensitive material, and ends of both lead electrodes of the first spiral coil of the first insulator layer are formed. And a second step of forming a through hole at a position corresponding to both ends of the extraction electrode of the second spiral coil, and a second step using a photosensitive conductive paste on the surface of the first insulator layer. A third step of forming the first spiral coil and connecting the extraction electrode of the first spiral coil to the first spiral coil; a photosensitive material containing a photosensitive material on the first insulator layer; Forming a second insulator layer using an insulating material, and forming a through hole in the second insulator layer at a position corresponding to the end of the lead electrode of the second spiral coil; Forming a second spiral coil using a photosensitive conductive paste on the surface of the second insulator layer; Common mode method for manufacturing a choke coil, characterized in that it comprises a fifth step of connecting the winding form spiral coils of the extraction electrode and the second coil not. 6. A method according to claim 1, further comprising the step of:
In a method of manufacturing a common mode choke coil in which a pair of spirally wound coils are formed so as to face each other with an insulator layer interposed therebetween and an external terminal is provided on a main body in which these are integrated, the entire surface of the first insulating substrate is A photosensitive conductive paste is applied, dried, exposed, and developed, so that both the extraction electrode of the first spiral coil and both the second spiral coil are formed on the surface of the first insulating substrate. A first step of forming a lead electrode, applying an insulating material containing a photosensitive material on the first insulating substrate, drying, exposing, and developing the lead material of both the lead electrodes of the first spiral coil. Forming a first insulator layer having a through hole at a position corresponding to an end portion and an end portion of both lead electrodes of the second spiral coil;
Step, a photosensitive conductive paste is applied to the entire surface of the first insulator layer, and is dried, exposed, and developed to form a first spiral coil on the surface of the first insulator layer. A third step of forming and connecting the extraction electrode of the first spiral coil and the first spiral coil, applying an insulating material containing a photosensitive material on the first insulator layer, Drying, exposure,
A fourth step of developing to form a second insulator layer having through holes at positions corresponding to both ends of the lead electrode of the second spiral coil, and the second insulator layer Apply a photosensitive conductive paste to the entire surface of the
By exposing and developing, a second spiral coil is formed on the surface of the second insulator layer, and the extraction electrode of the second spiral coil is connected to the second spiral coil. A method for manufacturing a common mode choke coil, comprising a fifth step. 7. A method according to claim 1, wherein the first insulating substrate and the second insulating substrate are
A pair of spirally wound coils are opposed to each other with an insulating layer
With a built-in body and external terminals
A photosensitive conductive paste applied to the entire surface of the first insulating substrate.
This is dried, exposed and developed to obtain the first
On both sides of the first spirally wound coil on the surface of the edge substrate
Forming the extraction electrodes for both the pole and the second spiral coil
A first step of removing photosensitive material on the first insulating substrate.
Laminate and crimp the edge sheet, dry, expose and develop
The ends of both extraction electrodes of the first spiral coil and the
Corresponds to the ends of both extraction electrodes of two spiral coils
The first insulator layer having a through hole at the position
A second step of performing photosensitivity on the entire surface of the first insulator layer.
Apply conductive paste, dry, expose and develop
A first spiral coil on the surface of the first insulator layer.
Forming an extraction electrode of the first spiral coil and the extraction electrode.
A third step of connecting the first spiral coil;
Laminate the insulation sheet containing the photosensitive material on the insulator layer, press-bond,
This is dried, exposed and developed to form the second spiral coil.
At the positions corresponding to the ends of both extraction electrodes,
A fourth step of forming a second insulator layer having
A photosensitive conductive paste is applied to the entire surface of the second insulator layer.
Cloth, and drying, exposing and developing the second
Forming a second spiral coil on the surface of the insulator layer to form the second coil;
2 spiral electrodes and the second spiral coil
A fifth step of connecting the coil is provided.
Manufacturing method of common mode choke coil.