JP2004087650A - Electronic part mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic part mounting apparatus which is capable of mounting various kinds of electronic parts, increasing its mounting speed, and saving the resources. <P>SOLUTION: A first mounting head 21 and a second mounting head 31 are provided in the electronic part mounting apparatus 1, the first mounting head 21 is moved horizontally by a moving mechanism 22, and the second mounting head 31 is moved horizontally by a moving mechanism 32. The first mounting head 21 receives the electronic part from a part cassette 23, which arranges and holds the electronic parts on a tape member, and mounts it on a board 9. The second mounting head 31 is fitted with a case where a plurality of electronic parts are kept, receives the electronic part fed from the case, and mounts it on the board 9. By this setup, various kinds of the electronic parts can be mounted by the first mounting head 21, and the electronic parts can be mounted at a high speed by the second mounting head 31. A purpose of saving the resources can be realized through the supply of electronic parts by the use of the case. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a technique for mounting electronic components on a substrate.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, when an electronic component (particularly, a small rectangular parallelepiped electronic component) is mounted on a printed wiring board (hereinafter, referred to as a “substrate”), the electronic component is attached to a solder applied to the substrate by a suction nozzle. A device that attaches by suction is used. In many cases in such a mounting device, electronic components are supplied in a state of being arranged on a tape member (hereinafter, referred to as “tape supply”), and the electronic components are taken out from the tape member and held by a suction nozzle. .
[0003]
On the other hand, since tape members used for supplying electronic components are disposable, in recent years, for the purpose of saving resources, a large number of electronic components are stored in a plastic container, and each electronic component is stored in a container. Attention has been paid to a method of supplying an electronic component using a device provided with a take-out mechanism (hereinafter, referred to as “bulk supply”).
[0004]
[Problems to be solved by the invention]
By the way, since the types of electronic components that can be supplied by bulk supply are limited, a technique for coexisting tape supply and bulk supply in one mounting device is important. When the tape supply and the bulk supply are simply made to coexist, a bulk supply mechanism is added to a conventional mechanism for supplying an electronic component to a suction nozzle. In such a mounting device, the electronic components are taken out one by one from the tape or the container and arranged at a predetermined supply position, and the suction nozzle repeatedly moves between the mounting position on the substrate and the supply position. Therefore, even if bulk supply is used, the mounting speed of the apparatus (the number of mountable electronic components per unit time) does not improve as compared with the case where only tape supply is used.
[0005]
The present invention has been made in view of the above problems, and has as its object to improve a mounting speed of a mounting device by utilizing a feature of bulk supply in which a large number of electronic components are stored in a container.
[0006]
[Means for Solving the Problems]
The invention according to claim 1 is an electronic component mounting apparatus for mounting an electronic component on a substrate, comprising: a supply unit that holds a plurality of electronic components on a tape member; A first mounting mechanism for mounting, a second mounting mechanism on which a container accommodating a plurality of electronic components is mounted, and mounting the electronic components from the container on a substrate, and the first mounting mechanism and the second A moving mechanism for relatively moving the mounting mechanism.
[0007]
According to a second aspect of the present invention, in the electronic component mounting apparatus according to the first aspect, the moving mechanism separates the first mounting mechanism and the second mounting mechanism from each other along a main surface of the substrate. Moving.
[0008]
The invention according to claim 3 is the electronic component mounting apparatus according to claim 1 or 2, wherein the first mounting mechanism receives and holds the electronic component from a plurality of supply units. And the second mounting mechanism has a plurality of second holding portions for holding electronic components from a plurality of containers.
[0009]
According to a fourth aspect of the present invention, there is provided an electronic component mounting apparatus for mounting an electronic component on a substrate, wherein a supply unit that holds a plurality of electronic components on a tape member and a container that stores the plurality of electronic components are mounted. A mounting mechanism for mounting the electronic component from the container on the substrate, and moving the mounting mechanism between the substrate and the supply unit to cause the mounting mechanism to mount the electronic component from the supply unit on the substrate. A moving mechanism.
[0010]
The invention according to claim 5 is the electronic component mounting device according to claim 4, wherein the mounting mechanism has a plurality of holding units that hold electronic components from a plurality of containers.
[0011]
The invention according to claim 6 is an electronic component mounting apparatus for mounting an electronic component on a substrate, wherein a mounting mechanism for mounting a plurality of electronic components on the substrate and mounting the electronic components from the container on the substrate is provided. And a moving mechanism for moving the mounting mechanism with respect to the fixed substrate.
[0012]
According to a seventh aspect of the present invention, there is provided the electronic component mounting apparatus according to the sixth aspect, wherein a container accommodating a plurality of electronic components is attached, and another electronic component from the container is attached to a substrate. The apparatus further includes a mechanism, and another moving mechanism that moves the another mounting mechanism with respect to the fixed substrate.
[0013]
The invention according to claim 8 is the electronic component mounting device according to claim 6 or 7, wherein the mounting mechanism has a plurality of holding units that hold electronic components from a plurality of containers.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a perspective view showing an electronic component mounting apparatus 1 according to a first embodiment of the present invention. The electronic component mounting device 1 is a device for mounting fine electronic components on the solder paste applied on the printed wiring board 9. In the following description, the X, Y, and Z directions shown in FIG. 1 are appropriately referred to, and the surface viewed from the (−Y) side in the (+ Y) direction is referred to as the front.
[0015]
The electronic component mounting apparatus 1 has a set of guide rails 11 extending on the base 10 in the X direction, and the substrate 9 is transported in the (+ X) direction by a belt provided along the guide rails 11. On the (−X) side of the guide rail 11, a printing device for printing solder on the substrate 9 is arranged, and the substrate 9 is passed from the printing device to the guide rail 11. On the (+ X) side of the guide rail 11, there is provided a multi-functional mounting device for mounting relatively large electronic components such as QFP (Quad Flat Package) and CSP (Chip Size Package) on the solder on the substrate 9 on the substrate 9. The board 9 which is arranged and discharged from the guide rail 11 is transferred to the multi-function mounting device.
[0016]
Above the guide rail 11, the first mounting head 21 and the second mounting head 31 are arranged so as to be arranged in the X direction, and the first mounting head 21 is moved in the XY plane by the moving mechanism 22 (that is, the main surface of the substrate 9). ), And the second mounting head 31 can be moved in the XY plane by the moving mechanism 32. Both moving mechanisms 22 and 32 are respectively fixed to the frame 12 on the base 10 and move the mounting head by a biaxial linear motor.
[0017]
On the (+ Y) side of the first mounting head 21, a large number of component cassettes 23 are arranged and mounted in the X direction. Each of the component cassettes 23 has a reel 81 on which a tape member for arranging and holding a plurality of electronic components is wound, and the electronic components are taken out one by one from the tape member fed from the reel 81 and placed at a predetermined supply position. .
[0018]
FIG. 2 is an enlarged front view showing a lower portion of the first mounting head 21. The first mounting head 21 has a plurality of suction nozzles 211 arranged in the X direction, and each suction nozzle 211 has a suction port at the tip. Each suction nozzle 211 is connected to an elevating mechanism 212 and a rotating mechanism 213 within the first mounting head 21, and can be individually moved up and down and rotated. When the electronic components are mounted on the substrate 9 by the first mounting head 21, first, the first mounting head 21 is moved to the component cassette 23 side by the moving mechanism 22, and is taken out from the plurality of component cassettes 23. The plurality of suction nozzles 211 are located above the plurality of electronic components. Then, the suction nozzle 211 is lowered by the elevating mechanism 212 to start suction suction, and the suction nozzle 211 is raised to hold the electronic component.
[0019]
A recognition camera (not shown) is provided on the base 10, and the first mounting head 21 that has sucked a plurality of electronic components moves onto the recognition camera to move the electronic components sucked by the suction nozzles 211. The orientation is detected. Each rotation mechanism 213 of the first mounting head 21 rotates the suction nozzle 211 based on the detection result, and adjusts the attitude of the electronic component. Thereafter, the first mounting head 21 moves toward the substrate 9 by the moving mechanism 22, and individually lowers the suction nozzles 211 and releases the suction, thereby sequentially mounting a plurality of electronic components on the solder on the substrate 9. .
[0020]
On the other hand, as shown in FIG. 1, the second mounting head 31 has a plurality of mounting units 311 arranged in the X direction. FIG. 3 is a side view of one mounting unit 311. A container 312 for storing a large number of electronic components is attached to the mounting unit 311, and the electronic components from the container 312 are aligned by the alignment mechanism 41 and guided to the supply path 42. A suction nozzle 43 is provided at the tip of the supply path 42.
[0021]
The suction nozzle 43 is moved up and down by the rotation of the rotating member 44, and the rotating member 44 is driven by turning on / off the electromagnetic solenoid 45. When the suction nozzle 43 rises, the electronic component from the supply path 42 is sucked at the tip of the suction nozzle 43, and when the suction nozzle 43 moves down, one electronic component is fed from the mounting unit 311. Further, a rotation mechanism 46 is connected to the suction nozzle 43 so that the direction of the electronic component pushed downward can be changed.
[0022]
When the electronic component is mounted on the substrate 9 by the second mounting head 31, first, the moving mechanism 32 is set such that the suction nozzle 43 of any of the mounting units 311 is positioned directly above the mounting position on the substrate 9. As a result, the second mounting head 31 moves. Then, when the suction nozzle 43 is lowered to release the suction, the electronic component is mounted on the substrate 9. The above operations are sequentially performed on the plurality of mounting units 311 of the second mounting head 31, whereby a plurality of electronic components are sequentially mounted on the board 9.
[0023]
As shown in FIG. 1, in the electronic component mounting apparatus 1, the first mounting head 21 and the second mounting head 31 can be individually moved and controlled, and the substrate 9 transported on the guide rail 11 first has The mounting of the electronic component by the second mounting head 31 is performed, and then the mounting of the electronic component by the first mounting head 21 is performed. Here, in the second mounting head 31, since the mechanism relating to mounting moves together with the container 312, the operation of the suction nozzle going to pick up the electronic component is unnecessary. Therefore, the electronic component can be mounted at a high speed by the second mounting head 31. In addition, since the container 312 can be reused, the cost required for mounting can be reduced and resources can be saved.
[0024]
On the other hand, in the electronic component mounting apparatus 1, the first mounting head 21 can mount electronic components by conventional tape supply. Therefore, it is possible to mount electronic components that cannot be mounted by the mounting unit 311 (that is, electronic components that are difficult to be supplied by bulk supply). As a result, in the electronic component mounting apparatus 1, the mounting speed is improved and resources are saved while maintaining the types of mountable electronic components as compared with the conventional electronic component mounting apparatus that only supplies tapes.
[0025]
Further, in the electronic component mounting apparatus 1, the first mounting head 21 and the second mounting head 31 move independently of each other by the moving mechanisms 22 and 32, so that mounting by the first mounting head 21 and the second mounting head 31 is not performed. Can be done in parallel. Further, the first mounting head 21 has a plurality of suction nozzles 211 for receiving and holding electronic components from the plurality of component cassettes 23, and the second mounting head 31 has a plurality of receiving nozzles for receiving and holding electronic components from the plurality of containers 312. Since the suction nozzle 43 is provided, the mounting speed (the number of mounted electronic components per unit time) can be maintained high even when the mounting head moves at a low speed.
[0026]
FIG. 4 is a perspective view showing an electronic component mounting apparatus 1 according to the second embodiment of the present invention. The electronic component mounting apparatus 1 according to the second embodiment is provided with only one mounting head 31a. The mounting head 31a is the same as the second mounting head 31 according to the first embodiment except that the orientation of the mounting unit 311 is different, and is moved in the XY plane by the moving mechanism 32.
[0027]
A plurality of component cassettes 23 similar to those in the first embodiment are arranged in the X direction on the (+ Y) side of the mounting head 31a, and suction nozzles 43 of the mounting unit 311 for electronic components taken out from the component cassettes 23. (See FIG. 3) can be accessed. Further, in the mounting unit 311, ON / OFF of feeding of the electronic component is controlled, and the suction nozzle 43 of the mounting unit 311 can suction and suck the electronic component from the component cassette 23.
[0028]
When the electronic component is mounted by the electronic component mounting apparatus 1, the electronic component from the container 312 is supplied to the suction nozzle 43 in the mounting unit 311 of the mounting head 31 a, and the substrate 9 transported on the guide rail 11. Is mounted on the electronic component. Thereafter, the supply of the electronic components from the container 312 to the suction nozzle 43 is stopped, the mounting head 31a accesses the component cassette 23, and the suction nozzle 43 sucks and holds the electronic component from the component cassette 23. The mounting head 31a is moved above the recognition camera (not shown) by the moving mechanism 32, and is moved above the substrate 9 after the posture of the electronic component is adjusted by the rotating mechanism 46 (see FIG. 3). Then, the electronic components are mounted on the substrate 9 by lowering the suction nozzle 43 and releasing the suction suction.
[0029]
As described above, in the electronic component mounting apparatus 1 according to the second embodiment, the mounting unit 311 for mounting electronic components by bulk supply is moved between the component cassette 23 and the substrate 9, and the electronic components are supplied by tape supply. The mounting head 31a mounts the component. Thus, an apparatus for mounting electronic components by bulk supply and tape supply can be configured without providing a mounting head for tape supply, and the manufacturing cost of the electronic component mounting apparatus 1 can be reduced. Further, similarly to the first embodiment, many types of electronic components can be mounted, and mounting speed is improved and resource saving is realized by bulk supply.
[0030]
In the bulk supply, since the supply and mounting of the electronic components to the suction nozzle 43 can be performed at a high speed, it is preferable that the electronic components in which a large number of the same type are mounted on the substrate 9 be the bulk supply.
[0031]
FIG. 5 is a perspective view showing an electronic component mounting apparatus 1 according to a third embodiment of the present invention. In the electronic component mounting apparatus 1 according to the third embodiment, two second mounting heads 31 (hereinafter, referred to as “mounting heads 31”) according to the first embodiment are arranged in the X direction, and the tape is supplied. The first mounting head 21 for mounting the electronic component is omitted. Each mounting head 31 is individually moved by the moving mechanism 32 in parallel with the main surface of the substrate 9. Other configurations are the same as those of the first embodiment, and are denoted by the same reference numerals.
[0032]
In the electronic component mounting apparatus 1, since a mounting unit 311 group for storing a plurality of electronic components in the container 312 (see FIG. 3) is provided in each mounting head 31, the electronic components in the plurality of containers 312 can be quickly supplied by bulk supply. The ink is supplied to the plurality of suction nozzles 43 and is mounted at a high speed by the mounting head 31 as in the first embodiment. At this time, the board 9 is fixed on the guide rail 11 in order to prevent the detached electronic component from being detached. Furthermore, in the electronic component mounting apparatus 1, since two mounting heads 31 are provided, even a large number of electronic components can be mounted quickly by bulk supply.
[0033]
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications are possible.
[0034]
For example, the board 9 on which the electronic components are mounted is not limited to a plate-shaped printed wiring board formed of phenol resin or glass epoxy resin, but may be a film-shaped wiring board or a wiring board formed of ceramic. . Further, in the above embodiment, the electronic component is mounted on the solder, but the device configuration can also be used when the electronic component is mounted on another conductive adhesive material.
[0035]
The movement of the mounting head with respect to the substrate 9 in the first and second embodiments may be relative, for example, the substrate 9 may move with respect to the mounting head.
[0036]
Further, the number of mounting heads 31 in the third embodiment may be appropriately changed according to the number of electronic components to be mounted and the number of types, and may be only one or three or more. .
[0037]
【The invention's effect】
According to the present invention, various electronic components can be mounted, and the mounting speed can be improved.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting apparatus according to a first embodiment. FIG. 2 is an enlarged front view showing a lower portion of a first mounting head. FIG. 3 is a side view of one mounting unit. FIG. 5 is a perspective view of an electronic component mounting apparatus according to a second embodiment. FIG. 5 is a perspective view of an electronic component mounting apparatus according to a third embodiment.
DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 9 Substrate 21 First mounting head 22, 32 Moving mechanism 23 Component cassette 31 Second mounting head 31a Mounting head 43, 211 Suction nozzle 312 Container

Claims (8)

An electronic component mounting device for mounting an electronic component on a substrate,
A supply unit for holding a plurality of electronic components on a tape member,
A first mounting mechanism that receives an electronic component from the supply unit and mounts the electronic component on a substrate;
A second mounting mechanism to which a container accommodating a plurality of electronic components is attached and which mounts electronic components from the container on a substrate;
A moving mechanism for relatively moving the first mounting mechanism and the second mounting mechanism with respect to a substrate;
An electronic component mounting apparatus comprising: The electronic component mounting device according to claim 1,
The electronic component mounting apparatus, wherein the moving mechanism moves the first mounting mechanism and the second mounting mechanism independently of each other along a main surface of the substrate. The electronic component mounting device according to claim 1 or 2,
The first mounting mechanism has a plurality of first holding units that receive and hold electronic components from a plurality of supply units,
The electronic component mounting device, wherein the second mounting mechanism has a plurality of second holding units that hold electronic components from a plurality of containers. An electronic component mounting device for mounting an electronic component on a substrate,
A supply unit for holding a plurality of electronic components on a tape member,
A mounting mechanism for mounting the electronic component from the container while a container accommodating a plurality of electronic components is mounted on the substrate,
By moving the mounting mechanism between the substrate and the supply unit, a moving mechanism for mounting the electronic component from the supply unit to the substrate to the mounting mechanism,
An electronic component mounting apparatus comprising: The electronic component mounting device according to claim 4,
An electronic component mounting device, wherein the mounting mechanism has a plurality of holding units that hold electronic components from a plurality of containers. An electronic component mounting device for mounting an electronic component on a substrate,
A mounting mechanism for mounting the electronic component from the container while a container accommodating a plurality of electronic components is mounted on the substrate,
A moving mechanism for moving the mounting mechanism with respect to the fixed substrate,
An electronic component mounting apparatus comprising: The electronic component mounting device according to claim 6,
Another mounting mechanism for mounting a container accommodating a plurality of electronic components and mounting an electronic component from the container on a substrate;
Another moving mechanism for moving the another mounting mechanism with respect to the fixed substrate;
An electronic component mounting device, further comprising: The electronic component mounting device according to claim 6 or 7,
An electronic component mounting device, wherein the mounting mechanism has a plurality of holding units that hold electronic components from a plurality of containers.

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