JP2004087533A - 半導体装置の製造方法およびそれに使用されるボンディング装置 - Google Patents

半導体装置の製造方法およびそれに使用されるボンディング装置 Download PDF

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Publication number
JP2004087533A
JP2004087533A JP2002242593A JP2002242593A JP2004087533A JP 2004087533 A JP2004087533 A JP 2004087533A JP 2002242593 A JP2002242593 A JP 2002242593A JP 2002242593 A JP2002242593 A JP 2002242593A JP 2004087533 A JP2004087533 A JP 2004087533A
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JP
Japan
Prior art keywords
bonding
chip
head
carrier
axis robot
Prior art date
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Pending
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JP2002242593A
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English (en)
Japanese (ja)
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JP2004087533A5 (enExample
Inventor
Ryuichi Takano
高野　隆一
Yukio Tani
谷　由貴夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Renesas Eastern Japan Semiconductor Inc
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Renesas Technology Corp
Hitachi Tokyo Electronics Co Ltd
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Application filed by Renesas Technology Corp, Hitachi Tokyo Electronics Co Ltd filed Critical Renesas Technology Corp
Priority to JP2002242593A priority Critical patent/JP2004087533A/ja
Publication of JP2004087533A publication Critical patent/JP2004087533A/ja
Publication of JP2004087533A5 publication Critical patent/JP2004087533A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Wire Bonding (AREA)
JP2002242593A 2002-08-22 2002-08-22 半導体装置の製造方法およびそれに使用されるボンディング装置 Pending JP2004087533A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002242593A JP2004087533A (ja) 2002-08-22 2002-08-22 半導体装置の製造方法およびそれに使用されるボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002242593A JP2004087533A (ja) 2002-08-22 2002-08-22 半導体装置の製造方法およびそれに使用されるボンディング装置

Publications (2)

Publication Number Publication Date
JP2004087533A true JP2004087533A (ja) 2004-03-18
JP2004087533A5 JP2004087533A5 (enExample) 2005-11-04

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ID=32051636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002242593A Pending JP2004087533A (ja) 2002-08-22 2002-08-22 半導体装置の製造方法およびそれに使用されるボンディング装置

Country Status (1)

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JP (1) JP2004087533A (enExample)

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