JP2004083932A5 - - Google Patents
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- Publication number
- JP2004083932A5 JP2004083932A5 JP2002242726A JP2002242726A JP2004083932A5 JP 2004083932 A5 JP2004083932 A5 JP 2004083932A5 JP 2002242726 A JP2002242726 A JP 2002242726A JP 2002242726 A JP2002242726 A JP 2002242726A JP 2004083932 A5 JP2004083932 A5 JP 2004083932A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- substrate holder
- electrolytic
- contact
- counter electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims 17
- 230000005684 electric field Effects 0.000 claims 2
- 239000003792 electrolyte Substances 0.000 claims 2
- 239000012811 non-conductive material Substances 0.000 claims 2
- 239000011148 porous material Substances 0.000 claims 2
- 239000008151 electrolyte solution Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002242726A JP2004083932A (ja) | 2002-08-22 | 2002-08-22 | 電解処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002242726A JP2004083932A (ja) | 2002-08-22 | 2002-08-22 | 電解処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004083932A JP2004083932A (ja) | 2004-03-18 |
| JP2004083932A5 true JP2004083932A5 (de) | 2005-08-25 |
Family
ID=32051681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002242726A Withdrawn JP2004083932A (ja) | 2002-08-22 | 2002-08-22 | 電解処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004083932A (de) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008121062A (ja) * | 2006-11-10 | 2008-05-29 | Ebara Corp | めっき装置及びめっき方法 |
| US9221081B1 (en) | 2011-08-01 | 2015-12-29 | Novellus Systems, Inc. | Automated cleaning of wafer plating assembly |
| US10066311B2 (en) | 2011-08-15 | 2018-09-04 | Lam Research Corporation | Multi-contact lipseals and associated electroplating methods |
| US9228270B2 (en) | 2011-08-15 | 2016-01-05 | Novellus Systems, Inc. | Lipseals and contact elements for semiconductor electroplating apparatuses |
| US9988734B2 (en) | 2011-08-15 | 2018-06-05 | Lam Research Corporation | Lipseals and contact elements for semiconductor electroplating apparatuses |
| KR102112881B1 (ko) | 2012-03-28 | 2020-05-19 | 노벨러스 시스템즈, 인코포레이티드 | 전자도금 기판 홀더들을 세정하기 위한 방법들 및 장치들 |
| TWI609100B (zh) | 2012-03-30 | 2017-12-21 | 諾發系統有限公司 | 使用反向電流除鍍以清洗電鍍基板夾持具 |
| US10416092B2 (en) | 2013-02-15 | 2019-09-17 | Lam Research Corporation | Remote detection of plating on wafer holding apparatus |
| US9746427B2 (en) | 2013-02-15 | 2017-08-29 | Novellus Systems, Inc. | Detection of plating on wafer holding apparatus |
| US10211056B2 (en) | 2014-04-25 | 2019-02-19 | Mitsubishi Electric Corporation | Semiconductor device manufacturing method |
| US10053793B2 (en) | 2015-07-09 | 2018-08-21 | Lam Research Corporation | Integrated elastomeric lipseal and cup bottom for reducing wafer sticking |
| JP7059172B2 (ja) * | 2018-12-21 | 2022-04-25 | 株式会社荏原製作所 | 基板ホルダのシールから液体を除去するための方法 |
| JP7074937B1 (ja) * | 2021-06-04 | 2022-05-24 | 株式会社荏原製作所 | めっき装置 |
| CN114308527B (zh) * | 2021-11-09 | 2023-06-02 | 天芯互联科技有限公司 | 一种填胶装置及其填胶方法 |
-
2002
- 2002-08-22 JP JP2002242726A patent/JP2004083932A/ja not_active Withdrawn
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