JP2004083932A5 - - Google Patents

Download PDF

Info

Publication number
JP2004083932A5
JP2004083932A5 JP2002242726A JP2002242726A JP2004083932A5 JP 2004083932 A5 JP2004083932 A5 JP 2004083932A5 JP 2002242726 A JP2002242726 A JP 2002242726A JP 2002242726 A JP2002242726 A JP 2002242726A JP 2004083932 A5 JP2004083932 A5 JP 2004083932A5
Authority
JP
Japan
Prior art keywords
substrate
substrate holder
electrolytic
contact
counter electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002242726A
Other languages
Japanese (ja)
Other versions
JP2004083932A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2002242726A priority Critical patent/JP2004083932A/en
Priority claimed from JP2002242726A external-priority patent/JP2004083932A/en
Publication of JP2004083932A publication Critical patent/JP2004083932A/en
Publication of JP2004083932A5 publication Critical patent/JP2004083932A5/ja
Withdrawn legal-status Critical Current

Links

Claims (6)

基板ホルダで保持し給電用接点に接触させて陽極または陰極の一方の電極となるようにした基板と、該基板に対峙する位置に配置した対極との間に電解液を満たして基板の電解処理を行う電解処理装置において、
前記基板ホルダで保持した基板と前記対極との間に配置され、基板の有効面積とほぼ同じ大きさの有効領域を有する電場補正体と、
前記基板ホルダと前記対極とを相対的に移動させる移動機構を有することを特徴とする電解処理装置。Electrolytic treatment of the substrate by filling the electrolytic solution between the substrate held by the substrate holder and brought into contact with the contact for power supply to become one of the anode or cathode and the counter electrode disposed at a position facing the substrate In the electrolytic treatment apparatus that performs
An electric field correction body disposed between the substrate held by the substrate holder and the counter electrode, and having an effective area of approximately the same size as the effective area of the substrate;
Electrolytic treatment apparatus characterized by having a moving mechanism for relatively moving the said counter electrode and said substrate holder. 前記移動機構は、基板ホルダと前記対極とを相対的に平行移動または上下移動の少なくとも一方を行わせるように構成されていることを特徴とする請求項１記載の電解処理装置。The electrolytic processing apparatus according to claim 1, wherein the moving mechanism is configured to cause at least one of a relative movement and a vertical movement of the substrate holder and the counter electrode. 前記電場補正体は、非導電性材料からなる中空円筒体、連続気孔構造を有するポーラス材料からなる構造体、非導電性材料に通孔をあけた遮蔽板、またはこれらの組合せからなることを特徴とする請求項１または２記載の電解処理装置。The electric field correction body is composed of a hollow cylindrical body made of a non-conductive material, a structure made of a porous material having a continuous pore structure, a shielding plate having a hole formed in the non-conductive material, or a combination thereof. The electrolytic treatment apparatus according to claim 1 or 2 . 前記給電用接点は、該基板ホルダで保持した基板のベベル部乃至端面で該基板と接触するように構成されていることを特徴とする請求項１乃至３のいずれかに記載の電解処理装置。The power supply contacts, the electrolytic processing apparatus according to any one of claims 1 to 3, characterized in that it is configured to contact the substrate at the bevel or edge surface of the substrate held by the substrate holder. 前記基板ホルダで保持した基板のベベル部乃至端面に圧接しシールして前記給電用接点を電解液から隔離するシール材を更に有することを特徴とする請求項１乃至４のいずれかに記載の電解処理装置。Electrolyte according to any one of claims 1 to 4, further comprising a sealing member that isolates the power supply contact from the electrolyte in pressure contact with the seal in the bevel or the end surface of the substrate held by the substrate holder Processing equipment. 前記基板ホルダは、該基板ホルダで保持した基板のそりを矯正するそり矯正機構を有することを特徴とする請求項１乃至５のいずれかに記載の電解処理装置。The substrate holder, electrolytic processing apparatus according to any one of claims 1 to 5, characterized in that it has a warp correcting mechanism for correcting the warp of the substrate held by the substrate holder.
JP2002242726A 2002-08-22 2002-08-22 Electrolytic treatment apparatus Withdrawn JP2004083932A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002242726A JP2004083932A (en) 2002-08-22 2002-08-22 Electrolytic treatment apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002242726A JP2004083932A (en) 2002-08-22 2002-08-22 Electrolytic treatment apparatus

Publications (2)

Publication Number Publication Date
JP2004083932A JP2004083932A (en) 2004-03-18
JP2004083932A5 true JP2004083932A5 (en) 2005-08-25

Family

ID=32051681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002242726A Withdrawn JP2004083932A (en) 2002-08-22 2002-08-22 Electrolytic treatment apparatus

Country Status (1)

Country Link
JP (1) JP2004083932A (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008121062A (en) * 2006-11-10 2008-05-29 Ebara Corp Plating device and plating method
US9221081B1 (en) 2011-08-01 2015-12-29 Novellus Systems, Inc. Automated cleaning of wafer plating assembly
US9228270B2 (en) * 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
US10066311B2 (en) 2011-08-15 2018-09-04 Lam Research Corporation Multi-contact lipseals and associated electroplating methods
US9988734B2 (en) 2011-08-15 2018-06-05 Lam Research Corporation Lipseals and contact elements for semiconductor electroplating apparatuses
SG11201406133WA (en) 2012-03-28 2014-10-30 Novellus Systems Inc Methods and apparatuses for cleaning electroplating substrate holders
KR102092416B1 (en) 2012-03-30 2020-03-24 노벨러스 시스템즈, 인코포레이티드 Cleaning electroplating substrate holders using reverse current deplating
US9746427B2 (en) 2013-02-15 2017-08-29 Novellus Systems, Inc. Detection of plating on wafer holding apparatus
US10416092B2 (en) 2013-02-15 2019-09-17 Lam Research Corporation Remote detection of plating on wafer holding apparatus
WO2015162786A1 (en) 2014-04-25 2015-10-29 三菱電機株式会社 Semiconductor device manufacturing method
US10053793B2 (en) 2015-07-09 2018-08-21 Lam Research Corporation Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
JP7059172B2 (en) * 2018-12-21 2022-04-25 株式会社荏原製作所 How to remove liquid from the board holder seal
WO2022254690A1 (en) * 2021-06-04 2022-12-08 株式会社荏原製作所 Plating device
CN114308527B (en) * 2021-11-09 2023-06-02 天芯互联科技有限公司 Glue filling device and glue filling method thereof

Similar Documents

Publication Publication Date Title
JP2004083932A5 (en)
EP1703001A3 (en) Electrolytic anode and method for electrolytically synthesizing fluorine-containing substance using the electrolytic anode
TW200618864A (en) Ion removal from particulate material using electrodeionization process and devices therefor
TW200741779A (en) Electric double layer capacitor
KR880001067A (en) Battery electrode assembly, frame and electrolytic cell
WO2007066372A3 (en) Electrolytic capacitors comprising means in the form of a multilayer polymeric sheet for the sorption of harmful substances
TWI266813B (en) Wet process performed with anode water containing oxidative substance and/or cathode water containing reductive substance in semiconductor device fabrication, and anode water and/or cathode water used in the wet process
BR102015032415B1 (en) apparatus for forming a metallic film and method for forming a metallic film
JP2008521507A5 (en)
DE3374950D1 (en) Cathode for the electrolytic production of hydrogen, and its use
WO2006078338A3 (en) Process and apparatus for cleaning and/or coating conductive metal surfaces using electro-plasma processing
JP2017088918A (en) Metal film formation device
GB2392441A (en) Electrolytic activation of fluids
PT988253E (en) ELECTRO-CHEMICAL TREATMENT OF IOES EXCHANGE MATERIAL
TW200644321A (en) An electrode having macropores and micropores therein
WO2005101972A3 (en) Integral separator for electrolytic capacitors
WO2015019152A3 (en) Film deposition device of metal film and film deposition method
JPS5638486A (en) Electrolytic tank for electrolyzing aqueous alkali chloride solution
RU2018100345A (en) ELECTROLYTIC DEVICE AND METHOD FOR WATER TREATMENT
CN100529161C (en) Propulsion-free long life cathode electric arc source device
KR101234390B1 (en) Electrokinetic remediation apparatus for anionic contaminant using sacrificial anode
TW200724733A (en) Roller type electrochemical reaction apparatus
WO2016035383A1 (en) Functional water-generating apparatus
CN114318366B (en) Electrolysis generating device
RU2007100597A (en) HOUSEHOLD DIAGRAPHIC ELECTROLYZER