JP2004079916A - 半導体ウエハダイシング用粘着シート - Google Patents

半導体ウエハダイシング用粘着シート Download PDF

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Publication number
JP2004079916A
JP2004079916A JP2002241140A JP2002241140A JP2004079916A JP 2004079916 A JP2004079916 A JP 2004079916A JP 2002241140 A JP2002241140 A JP 2002241140A JP 2002241140 A JP2002241140 A JP 2002241140A JP 2004079916 A JP2004079916 A JP 2004079916A
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JP
Japan
Prior art keywords
layer
mass
pressure
sensitive adhesive
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002241140A
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English (en)
Japanese (ja)
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JP2004079916A5 (enExample
Inventor
Takashi Yamashita
山下　　隆
Chu Ozawa
小沢　宙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kuraray Co Ltd
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Kuraray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Kuraray Co Ltd filed Critical Kuraray Co Ltd
Priority to JP2002241140A priority Critical patent/JP2004079916A/ja
Publication of JP2004079916A publication Critical patent/JP2004079916A/ja
Publication of JP2004079916A5 publication Critical patent/JP2004079916A5/ja
Pending legal-status Critical Current

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  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
JP2002241140A 2002-08-21 2002-08-21 半導体ウエハダイシング用粘着シート Pending JP2004079916A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002241140A JP2004079916A (ja) 2002-08-21 2002-08-21 半導体ウエハダイシング用粘着シート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002241140A JP2004079916A (ja) 2002-08-21 2002-08-21 半導体ウエハダイシング用粘着シート

Publications (2)

Publication Number Publication Date
JP2004079916A true JP2004079916A (ja) 2004-03-11
JP2004079916A5 JP2004079916A5 (enExample) 2005-04-28

Family

ID=32023727

Family Applications (1)

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JP2002241140A Pending JP2004079916A (ja) 2002-08-21 2002-08-21 半導体ウエハダイシング用粘着シート

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JP (1) JP2004079916A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005086070A (ja) * 2003-09-10 2005-03-31 Gunze Ltd ダイシングシート用基体フイルム
JP2006332207A (ja) * 2005-05-24 2006-12-07 Gunze Ltd ダイシング用基体フイルム
JP2008004679A (ja) * 2006-06-21 2008-01-10 Gunze Ltd ダイシング用基体フイルム
JP2008063492A (ja) * 2006-09-08 2008-03-21 Nitto Denko Corp ウエハ保持用粘着シート
JP2012094834A (ja) * 2010-09-13 2012-05-17 Sumitomo Bakelite Co Ltd ダイシングフィルム

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005086070A (ja) * 2003-09-10 2005-03-31 Gunze Ltd ダイシングシート用基体フイルム
JP2006332207A (ja) * 2005-05-24 2006-12-07 Gunze Ltd ダイシング用基体フイルム
JP2008004679A (ja) * 2006-06-21 2008-01-10 Gunze Ltd ダイシング用基体フイルム
JP2008063492A (ja) * 2006-09-08 2008-03-21 Nitto Denko Corp ウエハ保持用粘着シート
JP2012094834A (ja) * 2010-09-13 2012-05-17 Sumitomo Bakelite Co Ltd ダイシングフィルム

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