JP2004079705A - 半導体集積回路装置およびその製造方法 - Google Patents
半導体集積回路装置およびその製造方法 Download PDFInfo
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- JP2004079705A JP2004079705A JP2002236535A JP2002236535A JP2004079705A JP 2004079705 A JP2004079705 A JP 2004079705A JP 2002236535 A JP2002236535 A JP 2002236535A JP 2002236535 A JP2002236535 A JP 2002236535A JP 2004079705 A JP2004079705 A JP 2004079705A
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- Static Random-Access Memory (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2002236535A JP2004079705A (ja) | 2002-08-14 | 2002-08-14 | 半導体集積回路装置およびその製造方法 |
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JP2002236535A JP2004079705A (ja) | 2002-08-14 | 2002-08-14 | 半導体集積回路装置およびその製造方法 |
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JP2004079705A true JP2004079705A (ja) | 2004-03-11 |
JP2004079705A5 JP2004079705A5 (enrdf_load_stackoverflow) | 2005-11-04 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008042092A (ja) * | 2006-08-09 | 2008-02-21 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
JP2008536334A (ja) * | 2005-04-15 | 2008-09-04 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 改善されたセル安定性及び性能のためのハイブリッド・バルク−soi6t−sramセル |
JP2014165371A (ja) * | 2013-02-26 | 2014-09-08 | Asahi Kasei Electronics Co Ltd | 半導体装置の製造方法及び半導体装置 |
US9064732B2 (en) | 2012-08-31 | 2015-06-23 | Samsung Electronics Co., Ltd. | Semiconductor device including work function control film patterns and method for fabricating the same |
JP5857225B2 (ja) * | 2011-03-25 | 2016-02-10 | パナソニックIpマネジメント株式会社 | 半導体装置 |
JP2020064265A (ja) * | 2018-10-19 | 2020-04-23 | キヤノン株式会社 | 表示装置および電子機器 |
KR20200090968A (ko) * | 2008-10-24 | 2020-07-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
-
2002
- 2002-08-14 JP JP2002236535A patent/JP2004079705A/ja active Pending
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008536334A (ja) * | 2005-04-15 | 2008-09-04 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 改善されたセル安定性及び性能のためのハイブリッド・バルク−soi6t−sramセル |
US8264045B2 (en) | 2006-08-09 | 2012-09-11 | Panasonic Corporation | Semiconductor device including a SRAM section and a logic circuit section |
JP2008042092A (ja) * | 2006-08-09 | 2008-02-21 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
KR102469154B1 (ko) | 2008-10-24 | 2022-11-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
US12009434B2 (en) | 2008-10-24 | 2024-06-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including transistors and method for manufacturing the same |
US11563124B2 (en) | 2008-10-24 | 2023-01-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including flip-flop circuit which includes transistors |
KR20200090968A (ko) * | 2008-10-24 | 2020-07-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
KR102251817B1 (ko) | 2008-10-24 | 2021-05-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
KR20210054029A (ko) * | 2008-10-24 | 2021-05-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
KR102378956B1 (ko) | 2008-10-24 | 2022-03-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
KR20220041242A (ko) * | 2008-10-24 | 2022-03-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
JP5857225B2 (ja) * | 2011-03-25 | 2016-02-10 | パナソニックIpマネジメント株式会社 | 半導体装置 |
US9064732B2 (en) | 2012-08-31 | 2015-06-23 | Samsung Electronics Co., Ltd. | Semiconductor device including work function control film patterns and method for fabricating the same |
JP2014165371A (ja) * | 2013-02-26 | 2014-09-08 | Asahi Kasei Electronics Co Ltd | 半導体装置の製造方法及び半導体装置 |
JP7145032B2 (ja) | 2018-10-19 | 2022-09-30 | キヤノン株式会社 | 表示装置および電子機器 |
JP2020064265A (ja) * | 2018-10-19 | 2020-04-23 | キヤノン株式会社 | 表示装置および電子機器 |
US12119410B2 (en) | 2018-10-19 | 2024-10-15 | Canon Kabushiki Kaisha | Display device and electronic device |
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