JP2004079649A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2004079649A5 JP2004079649A5 JP2002235425A JP2002235425A JP2004079649A5 JP 2004079649 A5 JP2004079649 A5 JP 2004079649A5 JP 2002235425 A JP2002235425 A JP 2002235425A JP 2002235425 A JP2002235425 A JP 2002235425A JP 2004079649 A5 JP2004079649 A5 JP 2004079649A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002235425A JP4039662B2 (ja) | 2002-08-13 | 2002-08-13 | 半導体基板又は素子の洗浄方法 |
EP03788086A EP1541667B1 (en) | 2002-08-13 | 2003-08-11 | Technique on ozone water for use in cleaning semiconductor substrate |
DE60321015T DE60321015D1 (de) | 2002-08-13 | 2003-08-11 | Verwendung von ozonwasser beim reinigen von halbleitersubstrat |
PCT/JP2003/010254 WO2004016723A1 (ja) | 2002-08-13 | 2003-08-11 | 半導体基板洗浄用オゾン水技術 |
AT03788086T ATE395406T1 (de) | 2002-08-13 | 2003-08-11 | Verwendung von ozonwasser beim reinigen von halbleitersubstrat |
US10/522,717 US7678200B2 (en) | 2002-08-13 | 2003-08-11 | Technique on ozone water for use in cleaning semiconductor substrate |
KR1020057002149A KR100737877B1 (ko) | 2002-08-13 | 2003-08-11 | 반도체기판 세정용 오존수 기술 |
TW092122070A TWI224526B (en) | 2002-08-13 | 2003-08-12 | Technique on ozone water for use in cleaning semiconductor substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002235425A JP4039662B2 (ja) | 2002-08-13 | 2002-08-13 | 半導体基板又は素子の洗浄方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004079649A JP2004079649A (ja) | 2004-03-11 |
JP2004079649A5 true JP2004079649A5 (ja) | 2005-09-29 |
JP4039662B2 JP4039662B2 (ja) | 2008-01-30 |
Family
ID=31884377
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002235425A Expired - Lifetime JP4039662B2 (ja) | 2002-08-13 | 2002-08-13 | 半導体基板又は素子の洗浄方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7678200B2 (ja) |
EP (1) | EP1541667B1 (ja) |
JP (1) | JP4039662B2 (ja) |
KR (1) | KR100737877B1 (ja) |
AT (1) | ATE395406T1 (ja) |
DE (1) | DE60321015D1 (ja) |
TW (1) | TWI224526B (ja) |
WO (1) | WO2004016723A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100349266C (zh) * | 2004-07-23 | 2007-11-14 | 王文 | 高效能臭氧水清洗半导体晶圆的系统及其方法 |
JP2006073747A (ja) | 2004-09-01 | 2006-03-16 | Sumco Corp | 半導体ウェーハの処理方法およびその装置 |
JP5638193B2 (ja) * | 2007-11-09 | 2014-12-10 | 倉敷紡績株式会社 | 洗浄方法および洗浄装置 |
CN101875048A (zh) * | 2010-06-30 | 2010-11-03 | 国电光伏(江苏)有限公司 | 一种去除硅片表面杂质的方法 |
KR101824785B1 (ko) | 2013-04-30 | 2018-02-01 | 오르가노 코포레이션 | 구리 노출 기판의 세정 방법 및 세정 시스템 |
JP6177381B2 (ja) * | 2016-05-10 | 2017-08-09 | ヤンマー産業株式会社 | ノズル |
SG11202011443TA (en) * | 2018-05-30 | 2020-12-30 | Mitsubishi Electric Corp | Membrane cleaning device and membrane cleaning method |
TW202112452A (zh) * | 2019-05-21 | 2021-04-01 | 日商東京威力科創股份有限公司 | 基板處理裝置及基板處理方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS645702A (en) * | 1987-06-29 | 1989-01-10 | Kobe Steel Ltd | Turning tool |
JPS6463685A (en) * | 1987-09-04 | 1989-03-09 | Toshiba Corp | Scroll compressor |
JPH0997440A (ja) * | 1995-09-29 | 1997-04-08 | Victor Co Of Japan Ltd | 光学情報記録再生装置 |
JPH10116809A (ja) * | 1996-10-11 | 1998-05-06 | Tadahiro Omi | 洗浄方法及び洗浄システム |
JPH1129795A (ja) * | 1997-07-08 | 1999-02-02 | Kurita Water Ind Ltd | 電子材料用洗浄水、その製造方法及び電子材料の洗浄方法 |
JPH11340182A (ja) * | 1998-05-25 | 1999-12-10 | Wako Pure Chem Ind Ltd | 半導体表面洗浄剤及び洗浄方法 |
DE19825063A1 (de) * | 1998-06-04 | 1999-12-09 | Astex Sorbios Gmbh | Verfahren zur Unterdrückung der Zerfallsgeschwindigkeit von Ozon in ultrareinem Wasser |
JP2000037671A (ja) * | 1998-07-24 | 2000-02-08 | Mitsubishi Electric Corp | 基板表面処理方法および装置 |
US6129849A (en) | 1998-10-23 | 2000-10-10 | Kansai Electric Power Co., Inc. | Process for accelerating reaction of ozone with AM catalyst |
JP2000147793A (ja) * | 1998-11-12 | 2000-05-26 | Mitsubishi Electric Corp | フォトレジスト膜除去方法およびそのための装置 |
JP3509091B2 (ja) * | 1998-12-10 | 2004-03-22 | 栗田工業株式会社 | オゾン含有超純水の供給装置 |
JP2000331977A (ja) * | 1999-05-20 | 2000-11-30 | Kurita Water Ind Ltd | 電子材料の洗浄方法 |
JP4354575B2 (ja) * | 1999-06-15 | 2009-10-28 | クロリンエンジニアズ株式会社 | オゾン含有浄化液及びレジスト除去方法 |
JP2001035827A (ja) * | 1999-07-16 | 2001-02-09 | Memc Kk | 高濃度オゾン水、同オゾン水の調製方法、および同オゾン水を使用した洗浄方法 |
JP3535820B2 (ja) * | 2000-10-06 | 2004-06-07 | エム・エフエスアイ株式会社 | 基板処理方法および基板処理装置 |
JP2002001243A (ja) * | 2000-06-23 | 2002-01-08 | Kurita Water Ind Ltd | 電子材料の洗浄方法 |
-
2002
- 2002-08-13 JP JP2002235425A patent/JP4039662B2/ja not_active Expired - Lifetime
-
2003
- 2003-08-11 KR KR1020057002149A patent/KR100737877B1/ko active IP Right Grant
- 2003-08-11 US US10/522,717 patent/US7678200B2/en active Active
- 2003-08-11 AT AT03788086T patent/ATE395406T1/de not_active IP Right Cessation
- 2003-08-11 EP EP03788086A patent/EP1541667B1/en not_active Expired - Lifetime
- 2003-08-11 WO PCT/JP2003/010254 patent/WO2004016723A1/ja active IP Right Grant
- 2003-08-11 DE DE60321015T patent/DE60321015D1/de not_active Expired - Lifetime
- 2003-08-12 TW TW092122070A patent/TWI224526B/zh not_active IP Right Cessation