JP2004072106A - 可調整ペデスタル熱界面 - Google Patents

可調整ペデスタル熱界面 Download PDF

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Publication number
JP2004072106A
JP2004072106A JP2003281055A JP2003281055A JP2004072106A JP 2004072106 A JP2004072106 A JP 2004072106A JP 2003281055 A JP2003281055 A JP 2003281055A JP 2003281055 A JP2003281055 A JP 2003281055A JP 2004072106 A JP2004072106 A JP 2004072106A
Authority
JP
Japan
Prior art keywords
heat sink
pedestal
cavity
thin plate
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003281055A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004072106A5 (https=
Inventor
Brent A Boudreaux
ブレント・エイ・ブードレックス
Stacy Fraker
ステイシー・フレイカー
Eric C Peterson
エリック・シー・ペターソン
Christian L Belady
クリスチャン・エル・ベラディ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of JP2004072106A publication Critical patent/JP2004072106A/ja
Publication of JP2004072106A5 publication Critical patent/JP2004072106A5/ja
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/774—Pistons, e.g. spring-loaded members
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003281055A 2002-07-31 2003-07-28 可調整ペデスタル熱界面 Pending JP2004072106A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/209,981 US6695042B1 (en) 2002-07-31 2002-07-31 Adjustable pedestal thermal interface

Publications (2)

Publication Number Publication Date
JP2004072106A true JP2004072106A (ja) 2004-03-04
JP2004072106A5 JP2004072106A5 (https=) 2005-06-02

Family

ID=31187183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003281055A Pending JP2004072106A (ja) 2002-07-31 2003-07-28 可調整ペデスタル熱界面

Country Status (3)

Country Link
US (1) US6695042B1 (https=)
JP (1) JP2004072106A (https=)
TW (1) TWI272053B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7577001B2 (en) 2006-01-16 2009-08-18 Samsung Electronics Co., Ltd. Support structure of electronic device and hard disk drive comprising the same

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7288839B2 (en) * 2004-02-27 2007-10-30 International Business Machines Corporation Apparatus and methods for cooling semiconductor integrated circuit package structures
US7257001B2 (en) * 2004-04-23 2007-08-14 Shmuel Erez Device and method for fastener-free connection via a heat-shrinkable insert
FR2886809B1 (fr) * 2005-06-03 2007-08-10 Thales Sa Drain thermique pour carte electronique
US7277291B2 (en) * 2005-08-08 2007-10-02 Verifone Holdings, Inc. Thermal transfer device
US7905276B2 (en) * 2006-02-09 2011-03-15 Onscreen Technology, Inc. Method and apparatus for leak-proof mounting of a liquid cooling device on an integrated circuit
US20080173427A1 (en) * 2007-01-23 2008-07-24 Richard Schumacher Electronic component cooling
US20100008045A1 (en) * 2008-07-09 2010-01-14 Hong Fu Jin Precision Industry(Shenzhen) Co., Ltd Heat sink
US8018719B2 (en) * 2009-05-26 2011-09-13 International Business Machines Corporation Vapor chamber heat sink with cross member and protruding boss
WO2015012790A1 (en) * 2013-07-22 2015-01-29 Ge Intelligent Platforms, Inc. Square plug adjustable heat sinks and methods of fabricating the same
WO2015012792A1 (en) * 2013-07-22 2015-01-29 Ge Intelligent Platforms, Inc. Screw plug adjustable heat sinks and methods of fabricating the same
US9736966B1 (en) 2016-02-10 2017-08-15 International Business Machines Corporation Heat sink with integrated threaded lid
US10182514B2 (en) 2016-06-27 2019-01-15 International Business Machines Corporation Thermal interface material structures
CN106852073B (zh) * 2017-01-13 2019-06-07 奇鋐科技股份有限公司 散热模组
CN108260325B (zh) * 2017-12-04 2024-02-06 国网新疆电力公司吐鲁番供电公司 水冷散热装置
US11262815B2 (en) * 2019-11-01 2022-03-01 Hewlett Packard Enterprise Development Lp Heat sink system with broad compatibility capacity
US12080936B2 (en) 2021-04-01 2024-09-03 Hughes Network Systems, Llc Cavity resonance suppression using thermal pedestal arrangements in active electronically scanned array
EP4092720A1 (en) * 2021-05-20 2022-11-23 Aptiv Technologies Limited Heat sink
US20230320039A1 (en) * 2022-04-05 2023-10-05 Honeywell International Inc. Integrated heat spreader
US11908495B2 (en) 2022-04-21 2024-02-20 Western Digital Technologies, Inc. Electronic device with heat transfer pedestal having optimized interface surface and associated methods
EP4407675B1 (en) * 2023-01-25 2025-08-13 Aptiv Technologies AG An adjustable heat spreader for a heat sink

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2993153A (en) * 1958-09-25 1961-07-18 Westinghouse Electric Corp Seal
US3170098A (en) * 1963-03-15 1965-02-16 Westinghouse Electric Corp Compression contacted semiconductor devices
US3313987A (en) * 1964-04-22 1967-04-11 Int Rectifier Corp Compression bonded semiconductor device
DE1764795A1 (de) * 1968-01-12 1971-11-11 Siemens Ag Gleichrichteranordnung
DE2042333A1 (de) * 1970-08-26 1972-03-02 Siemens Ag Verfahren zum gasdichten Verschließen von Halbleiterbauelementen
JPH1070219A (ja) * 1996-08-27 1998-03-10 Fujitsu Ltd 実装モジュールの冷却装置
US6014315A (en) * 1998-09-08 2000-01-11 Chip Coolers, Inc. Heat sink assembly with multiple pressure capability
US5945736A (en) * 1998-09-28 1999-08-31 Chip Coolers, Inc. Heat sink assembly with snap-in cover plate having multiple pressure capability
US6021045A (en) * 1998-10-26 2000-02-01 Chip Coolers, Inc. Heat sink assembly with threaded collar and multiple pressure capability

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7577001B2 (en) 2006-01-16 2009-08-18 Samsung Electronics Co., Ltd. Support structure of electronic device and hard disk drive comprising the same

Also Published As

Publication number Publication date
US20040020634A1 (en) 2004-02-05
TW200402260A (en) 2004-02-01
US6695042B1 (en) 2004-02-24
TWI272053B (en) 2007-01-21

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