JP2004040103A5 - - Google Patents

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Publication number
JP2004040103A5
JP2004040103A5 JP2003186753A JP2003186753A JP2004040103A5 JP 2004040103 A5 JP2004040103 A5 JP 2004040103A5 JP 2003186753 A JP2003186753 A JP 2003186753A JP 2003186753 A JP2003186753 A JP 2003186753A JP 2004040103 A5 JP2004040103 A5 JP 2004040103A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003186753A
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JP2004040103A (ja
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Publication date
Priority claimed from US10/190,408 external-priority patent/US6952623B2/en
Application filed filed Critical
Publication of JP2004040103A publication Critical patent/JP2004040103A/ja
Publication of JP2004040103A5 publication Critical patent/JP2004040103A5/ja
Pending legal-status Critical Current

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JP2003186753A 2002-07-02 2003-06-30 ＦｅＲＡＭを用いた永久的チップＩＤ Pending JP2004040103A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/190,408 US6952623B2 (en) 2002-07-02 2002-07-02 Permanent chip ID using FeRAM

Publications (2)

Publication Number Publication Date
JP2004040103A JP2004040103A (ja) 2004-02-05
JP2004040103A5 true JP2004040103A5 (ja) 2006-08-03

Family

ID=29999875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003186753A Pending JP2004040103A (ja) 2002-07-02 2003-06-30 ＦｅＲＡＭを用いた永久的チップＩＤ

Country Status (4)

Country Link
US (1) US6952623B2 (ja)
JP (1) JP2004040103A (ja)
KR (1) KR20040004105A (ja)
DE (1) DE10318183A1 (ja)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7668702B2 (en) * 2002-07-19 2010-02-23 Applied Materials, Inc. Method, system and medium for controlling manufacturing process using adaptive models based on empirical data
US7496817B2 (en) * 2004-02-20 2009-02-24 Realtek Semiconductor Corp. Method for determining integrity of memory
US7149931B2 (en) * 2004-02-25 2006-12-12 Realtek Semiconductor Corp. Method and apparatus for providing fault tolerance to memory
US20050210205A1 (en) * 2004-03-17 2005-09-22 Chang-Lien Wu Method for employing memory with defective sections
DE102004047813A1 (de) 2004-09-29 2006-03-30 Infineon Technologies Ag Halbleiterbaustein mit einer Umlenkschaltung
CN101040290A (zh) * 2004-10-15 2007-09-19 应用材料股份有限公司 半导体组件的晶粒跟踪装置及其测试设备
US20060133607A1 (en) * 2004-12-22 2006-06-22 Seagate Technology Llc Apparatus and method for generating a secret key
JPWO2006134783A1 (ja) * 2005-06-15 2009-01-08 村田機械株式会社 巻き糸パッケージの巻取り管および巻き糸パッケージの管理装置
US7299388B2 (en) * 2005-07-07 2007-11-20 Infineon Technologies, Ag Method and apparatus for selectively accessing and configuring individual chips of a semi-conductor wafer
US20070162713A1 (en) * 2006-01-09 2007-07-12 Josef Schnell Memory having status register read function
JP2008159813A (ja) * 2006-12-22 2008-07-10 Sharp Corp 自らのチップ識別情報の読み取りを行える情報出力装置、チップ識別情報記録部を有する半導体集積回路、およびチップ識別情報の読み出し方法
JP2009021398A (ja) * 2007-07-12 2009-01-29 Seiko Epson Corp 半導体チップ及び半導体チップへのプロセス・デバイス情報書き込み方法
US8242603B2 (en) * 2007-12-10 2012-08-14 Agere Systems Inc. Chip identification using top metal layer
US20090146144A1 (en) * 2007-12-10 2009-06-11 Broadcom Corporation Method and system supporting production of a semiconductor device using a plurality of fabrication processes
US8966660B2 (en) * 2008-08-07 2015-02-24 William Marsh Rice University Methods and systems of digital rights management for integrated circuits
US8170857B2 (en) * 2008-11-26 2012-05-01 International Business Machines Corporation In-situ design method and system for improved memory yield
US8059478B2 (en) * 2008-12-04 2011-11-15 Kovio, Inc. Low cost testing and sorting for integrated circuits
TWI560456B (en) * 2009-03-20 2016-12-01 Bravechips Microelectronics Method of parallel ic test and wafer containing same function dies under test and ic chips containing same function blocks under test
TW201519300A (zh) * 2013-11-08 2015-05-16 Advanced Semiconductor Eng 半導體製程
JP2015114814A (ja) * 2013-12-11 2015-06-22 株式会社デンソー 半導体装置の製品履歴管理方法
CN104678287B (zh) * 2015-01-30 2018-10-16 上海华岭集成电路技术股份有限公司 芯片uid映射写入方法
US9940486B2 (en) * 2015-02-23 2018-04-10 Cisco Technology, Inc. Detection of hardware tampering
US10237063B2 (en) * 2016-12-13 2019-03-19 Nxp B.V. Distributed cryptographic key insertion and key delivery
US10685918B2 (en) 2018-08-28 2020-06-16 Semiconductor Components Industries, Llc Process variation as die level traceability
CN114289339B (zh) * 2021-12-10 2023-09-26 郑州信大捷安信息技术股份有限公司 一种芯片自动化检测方法和装置
US20240331792A1 (en) * 2023-03-29 2024-10-03 Nanya Technology Corporation Memory test system and memory test method

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6053043A (ja) * 1983-09-02 1985-03-26 Toshiba Corp 半導体集積回路装置
JPH03269900A (ja) * 1990-03-19 1991-12-02 Sharp Corp 半導体集積回路
EP0457013A3 (en) * 1990-04-16 1992-03-04 National Semiconductor Corporation Ferroelectric capacitor test structure for chip die
US5254482A (en) * 1990-04-16 1993-10-19 National Semiconductor Corporation Ferroelectric capacitor test structure for chip die
JPH0682325B2 (ja) * 1990-05-29 1994-10-19 株式会社東芝 情報処理装置のテスト容易化回路
JPH08162862A (ja) * 1994-12-08 1996-06-21 Hitachi Ltd 差動増幅器のオフセット電圧測定方法およびそれを用いた半導体集積回路装置の製造方法、半導体集積回路装置
US6194738B1 (en) * 1996-06-13 2001-02-27 Micron Technology, Inc. Method and apparatus for storage of test results within an integrated circuit
US5862151A (en) * 1997-01-23 1999-01-19 Unisys Corporation Array self-test fault tolerant programmable threshold algorithm
US5915231A (en) * 1997-02-26 1999-06-22 Micron Technology, Inc. Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture
US5856923A (en) * 1997-03-24 1999-01-05 Micron Technology, Inc. Method for continuous, non lot-based integrated circuit manufacturing
US5907492A (en) * 1997-06-06 1999-05-25 Micron Technology, Inc. Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
US5764655A (en) * 1997-07-02 1998-06-09 International Business Machines Corporation Built in self test with memory
US6446017B1 (en) * 1997-08-21 2002-09-03 Micron Technology, Inc. Method and system for tracking manufacturing data for integrated circuit parts
US6085334A (en) * 1998-04-17 2000-07-04 Motorola, Inc. Method and apparatus for testing an integrated memory device
KR100333720B1 (ko) * 1998-06-30 2002-06-20 박종섭 강유전체메모리소자의리던던시회로
US6067262A (en) * 1998-12-11 2000-05-23 Lsi Logic Corporation Redundancy analysis for embedded memories with built-in self test and built-in self repair
JP3201368B2 (ja) * 1999-01-18 2001-08-20 日本電気株式会社 半導体集積回路及びそのテスト方法
US6161213A (en) * 1999-02-17 2000-12-12 Icid, Llc System for providing an integrated circuit with a unique identification
JP4183333B2 (ja) * 1999-03-23 2008-11-19 株式会社 沖マイクロデザイン 半導体集積回路およびその試験方法
US6456554B1 (en) * 1999-10-19 2002-09-24 Texas Instruments Incorporated Chip identifier and method of fabrication
JP2001208798A (ja) * 2000-01-26 2001-08-03 Mitsubishi Electric Corp 半導体回路のテスト方法および装置
JP3980827B2 (ja) * 2000-03-10 2007-09-26 株式会社ルネサステクノロジ 半導体集積回路装置および製造方法
JP2001291385A (ja) * 2000-04-05 2001-10-19 Nec Corp 半導体記憶装置並びにその試験装置および試験方法
JP3775716B2 (ja) * 2000-05-25 2006-05-17 シャープ株式会社 強誘電体型記憶装置およびそのテスト方法
DE10102432B4 (de) * 2001-01-19 2005-09-22 Infineon Technologies Ag Testschaltung zur analogen Messung von Bitleitungssignalen ferroelektrischer Speicherzellen
DE10127421C2 (de) * 2001-06-06 2003-06-05 Infineon Technologies Ag Verfahren zum Erkennen und zum Ersetzen von fehlerhaften Speicherzellen in einem Speicher
US20030018937A1 (en) * 2001-07-18 2003-01-23 Athavale Atul S. Method and apparatus for efficient self-test of voltage and current level testing
US6590799B1 (en) * 2002-05-29 2003-07-08 Agilent Technologies, Inc. On-chip charge distribution measurement circuit

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