JP2004031813A - Multilayer wiring board and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a deterioration in insulation between wiring conductor layers in a multilayer wiring board wherein the wiring conductor layers are formed on a surface of a substrate and resin insulation layers are so formed as to cover the wiring conductor layers. <P>SOLUTION: The multilayer wiring board is such that the wiring conductor layers 2 are formed on the surface of the substrate 1 and the resin insulation layers 3 are so formed as to cover the wiring conductor layers 2. In the multilayer wiring board, a wiring conductor non-formation region 4 on the surface of the substrate 1 is recessed with respect to a region immediately beneath the wiring conductor layers 2. Due to this structure, passway between the wiring conductor layers 2 becomes longer, preventing a deterioration in insulation between the wiring conductor layers 2 and realizing a multilayer wiring board with a superior environment resistant reliability. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a multilayer wiring board used for a package for accommodating a semiconductor element for accommodating a hybrid integrated circuit or a semiconductor element, and a method for manufacturing the same.
[0002]
[Prior art]
2. Description of the Related Art In recent years, with the miniaturization and multifunctionality of electronic devices, semiconductor devices such as semiconductor integrated circuit elements used therein have been highly integrated and the number of input / output terminals has been increasing. For a wiring board on which such a semiconductor device is mounted and a wiring board used for testing the device, it is a matter of course that a high integration of a circuit is required, and an input / output caused by a mismatch of a thermal expansion coefficient is required. The stress applied to the wiring board, such as the stress on the terminal section and the contact pressure applied to the wiring board by the probe during the test, increases with the increase in the number of input / output terminals of the semiconductor device. Therefore, there is a demand for high strength so as to have sufficient strength as a support for supporting input / output terminals of a semiconductor device, a probe for testing, and the like. Therefore, a high-strength multilayer wiring board having an extremely fine wiring pattern is required.
[0003]
Due to the demand for higher integration and higher strength for such multilayer wiring boards, instead of multilayer printed wiring boards and build-up type multilayer wiring boards, the multilayer wiring boards consist of a thin insulating layer and a wiring conductor layer on a substrate made of ceramics. Attention has been focused on a ceramic thin-film hybrid multilayer wiring board having a thin-film multilayer wiring section formed thereon.
[0004]
Such a ceramic thin film hybrid multilayer wiring board is formed of a metal such as copper or aluminum on the upper surface of a ceramic multilayer wiring board including a metallized wiring layer made of molybdenum or tungsten and a ceramic insulating layer such as an aluminum oxide sintered body, Wiring conductor layer formed by adopting thin film forming technology such as plating method and vapor deposition method and photolithography technology, and resin insulating layer of thin film made of polyimide resin etc. formed by spin coating method and thermosetting treatment It is expected to be used as a multilayer wiring board that has a function as a high-strength support and has excellent circuit integration due to an extremely fine wiring pattern. I have.
[0005]
In the case where a resin insulating layer made of a polyimide resin or the like is formed by a spin coating method, a thermosetting treatment, or the like for such a thin-film multilayer wiring portion, it is necessary to divide the resin insulating layer into a desired thickness in a number of times. A resin insulating layer is formed by applying a precursor of a polyimide resin, and then performing a curing step of converting the precursor of the polyimide resin into a polyimide.
[0006]
However, such a method of forming a resin insulating layer has a problem that the manufacturing process is lengthened. Therefore, instead of this forming method, a plurality of insulating film layers made of a polyimide resin or the like are interposed between insulating films made of a bismaleimide triazine resin or the like. A method of forming a resin insulating layer formed by laminating via a conductive adhesive layer has been adopted.
[0007]
[Problems to be solved by the invention]
However, in such a ceramic thin-film hybrid multilayer wiring board, the wiring conductor layer and the surface of the substrate are more strongly bonded to each other by a chemical bond and a bonding by an anchor effect caused by the wiring conductor layer cutting into the unevenness of the substrate surface. When the conductor layer formed in the non-formation area of the wiring conductor layer on the surface of the substrate is removed by etching or the like, the residue of the conductor layer component remains in the non-formation area of the wiring conductor layer. When a resin insulating layer is formed and laminated on the wiring conductor layer and the region where the wiring conductor layer is not formed as it is, there is a problem that the insulation between the wiring conductors is apt to decrease.
[0008]
The present invention has been made in view of the above problems in the related art, and an object of the present invention is to effectively prevent a decrease in insulation between wiring conductor layers formed on the surface of a substrate by a simple method. Another object of the present invention is to provide a multilayer wiring board having excellent environmental resistance.
[0009]
Further, another object of the present invention is to provide a multilayer wiring board excellent in environmental resistance and reliability in which a decrease in insulation between wiring conductor layers formed on the surface of the board is effectively prevented by a simple method. An object of the present invention is to provide a method for manufacturing a multilayer wiring board.
[0010]
[Means for Solving the Problems]
The multilayer wiring board of the present invention is a multilayer wiring board in which a wiring conductor layer is formed on a surface of the substrate and a resin insulating layer is formed to cover the wiring conductor layer. The region where no layer is formed is recessed with respect to the region immediately below the wiring conductor layer.
[0011]
Further, in the multilayer wiring board of the present invention, in the above structure, the non-formation region is recessed at a depth of 0.1 to 10 μm with respect to a region immediately below the wiring conductor layer. is there.
[0012]
The first method for manufacturing a multilayer wiring board according to the present invention includes a step of forming a base conductor layer on the surface of the substrate, and a step of forming a resist layer having an opening of a pattern of the wiring conductor layer on the base conductor layer; Forming a main conductor layer on the underlying conductor layer exposed from the opening, removing the resist layer, and removing the underlying conductor layer exposed from the main conductor layer to form a wiring conductor layer A step of partially removing a region where the wiring conductor layer is not formed on the surface of the substrate so as to be depressed with respect to a region immediately below the wiring conductor layer; and thereafter, forming the wiring conductor layer on the surface of the substrate. And forming a resin insulating layer over the substrate.
[0013]
Further, according to a second method of manufacturing a multilayer wiring board of the present invention, a step of forming a base conductor layer on a surface of a substrate; a step of forming a main conductor layer on the base conductor layer; Forming a resist layer having a pattern of a wiring conductor layer, removing the main conductor layer and the base conductor layer exposed from the resist layer to form a wiring conductor layer, and forming the wiring conductor on the surface of the substrate. A step of partially removing the non-forming region of the layer to depress the region immediately below the wiring conductor layer, a step of removing the resist layer, and then covering the wiring conductor layer on the surface of the substrate. And forming a resin insulating layer by using the above method.
[0014]
According to the multilayer wiring board of the present invention, since the region where the wiring conductor layer is not formed on the surface of the substrate is recessed with respect to the region immediately below the wiring conductor layer, the path between the adjacent wiring conductor layers becomes longer. Thereby, the insulation between the wiring conductor layers does not decrease, and a multilayer wiring board having excellent environmental resistance and reliability can be realized.
[0015]
Further, according to the multilayer wiring board of the present invention, when the region where the wiring conductor layer is not formed is recessed at a depth of 0.1 to 10 μm with respect to the region immediately below the wiring conductor layer, the adjacent wiring conductor layer When the resin insulating layer is formed on the surface of the substrate over the non-formation area of the wiring conductor layer while the insulation property between the wiring conductor layers is not reduced by increasing the length of the path to a required length. The flatness of the resin insulation layer can be improved, the environmental resistance is excellent, and the connection reliability with the input / output terminals of the semiconductor device mounted on this multilayer wiring board is also excellent. A multilayer wiring board can be realized.
[0016]
According to the first method for manufacturing a multilayer wiring board of the present invention, a step of forming a base conductor layer on a surface of a substrate and a step of forming a resist layer having an opening of a pattern of the wiring conductor layer on the base conductor layer And forming a main conductor layer on the underlying conductor layer exposed from the opening of the resist layer, removing the resist layer, and removing the underlying conductor layer exposed from the main conductor layer to correspond to the pattern of the opening. A wiring conductor layer having a shape is formed, and a region where the wiring conductor layer is not formed is partially removed from the surface of the substrate so that the region where the wiring conductor layer is not formed is depressed with respect to a region immediately below the wiring conductor layer. A step of forming a resin insulating layer over the non-formation area of the wiring conductor layer by covering the wiring conductor layer after that, so that the non-formation area of the wiring conductor layer in the surface of the substrate is Partly removed from the side Therefore, the residue of the wiring conductor layer component generated on the surface of the substrate in the region where the wiring conductor layer is not formed is reliably removed, and the region immediately below the wiring conductor layer is recessed in the region where the wiring conductor layer is not formed. Is formed and the path between the adjacent wiring conductor layers is lengthened, whereby the insulation between the wiring conductor layers is not reduced, and a multilayer wiring board having excellent environmental resistance and reliability can be realized by a simple method. A method for manufacturing a multilayer wiring board can be provided.
[0017]
According to the second method for manufacturing a multilayer wiring board of the present invention, a step of forming a base conductor layer on a surface of a substrate, a step of forming a main conductor layer on the base conductor layer, and a step of forming a main conductor layer on the base conductor layer Forming a resist layer of a pattern of the wiring conductor layer, removing the main conductor layer and the base conductor layer exposed from the resist layer to form a wiring conductor layer, and forming a wiring conductor layer on the surface of the substrate; A step of partially removing the region to depress the non-formed area of the wiring conductor layer with respect to the area immediately below the wiring conductor layer, and a step of removing the resist layer, and thereafter, the wiring conductor layer is formed on the surface of the substrate. And forming a resin insulating layer over the wiring board by removing a part of the surface of the substrate where the wiring conductor layer is not formed from the front side, as in the first manufacturing method. On the surface of the substrate where the conductive layer is not formed The generated wiring conductor layer component is reliably removed, and a recess is formed in a region where the wiring conductor layer is not formed with respect to a region immediately below the wiring conductor layer, so that a path between the adjacent wiring conductor layers becomes longer. Thereby, the insulation between the wiring conductor layers does not decrease, and the dent in the non-formation region of the wiring conductor layer for preventing the insulation between the adjacent wiring conductor layers from decreasing is reduced by a smaller number of steps than the first manufacturing method. A method of manufacturing a multilayer wiring board which can be formed and has excellent environmental resistance can be provided.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the drawings.
[0019]
FIG. 1 is a sectional view showing an example of an embodiment of a multilayer wiring board according to the present invention, and FIG. 2 is an enlarged sectional view of a main part showing a recess in a region where a wiring conductor layer is not formed in the multilayer wiring board.
[0020]
In these figures, 1 is a substrate, 2 is a wiring conductor layer, 3 is a resin insulating layer, 4 is a region where no wiring conductor layer is formed, 5 is a recess, 6 is a base conductor layer as a part of the wiring conductor layer 2, 7 is a main conductor layer as a part of the wiring conductor layer 2, 8 is an insulating adhesive layer as a part of the resin insulation layer 3, 9 is an insulating film layer as a part of the resin insulation layer 3, and 10 is a multilayer. The wiring portion, 11 is a through hole, and 12 is a through conductor.
[0021]
The substrate 1, on the surface of which, in this example, the upper surface, is provided with a multilayer wiring portion 10 in which wiring conductor layers 2 and resin insulating layers 3 are alternately laminated in multiple layers, and a support member for supporting the multilayer wiring portion 10 is provided. Function as
[0022]
The substrate 1 is made of, for example, an aluminum oxide sintered body, a mullite sintered body, an oxide ceramic such as a glass ceramic, an aluminum nitride sintered body having an oxide film on its surface, a silicon carbide sintered body, or the like. Formed of an electrically insulating material such as non-oxide ceramics or glass ceramics. Thermosetting resins such as epoxy resin, bismaleimide triazine resin, thermosetting polyphenylene ether resin, and phenol resin; and thermoplastic resins such as polyimide resin, fluorine resin, polyphenylene ether resin, liquid crystal polymer resin, aramid resin, and polyethylene terephthalate. It may be formed of various organic insulating resin materials such as resin, a composite material obtained by combining inorganic insulating powder such as ceramics with an organic insulating resin, or an electric insulating material such as glass, quartz, and sapphire.
[0023]
For example, when it is formed of an aluminum oxide sintered body, a raw material powder such as alumina, silica, calcia, and magnesia is mixed with an appropriate organic solvent and a solvent to form a slurry, which is conventionally well known. A ceramic green sheet (ceramic green sheet) is formed by adopting the doctor blade method or the calendar roll method, and then the ceramic green sheet is subjected to an appropriate punching process to form a predetermined shape and, if necessary, a wiring. It is manufactured by printing and forming a conductor pattern serving as a conductor, laminating a predetermined number of layers, and firing at a high temperature (about 1600 ° C.). Alternatively, a raw material powder is prepared by adding and mixing an appropriate organic solvent and a solvent to a raw material powder such as alumina, and the raw material powder is formed into a predetermined shape by a press molding machine. C).
[0024]
When the substrate 1 is formed of glass ceramics, an organic binder, a plasticizer, a solvent, and the like are added to a mixture of glass and an inorganic filler (inorganic insulating powder) to form a slurry, and the glass is formed by a doctor blade method or the like. After forming the ceramic green sheet, a conductor pattern containing a powder of a low-resistance metal such as Cu, Ag, or Au was printed on the glass ceramic green sheet to form a conductor pattern, and then the conductor pattern was formed. It is manufactured by laminating a plurality of glass ceramic green sheets and firing at a temperature of 800 to 1000 ° C.
[0025]
As the glass ceramic green sheet, a mixture of a glass powder, an inorganic filler (ceramic powder), an organic binder, a plasticizer, an organic solvent, and the like is used.
[0026]
As the glass component, for example, SiO 2₂-B₂O₃System, SiO₂-B₂O₃-Al₂O₃System, SiO₂-B₂O₃-Al₂O₃-MO system (where M represents Ca, Sr, Mg, Ba or Zn), SiO₂-Al₂O₃-M¹OM²O type (however, M¹And M²Represent the same or different Ca, Sr, Mg, Ba or Zn), SiO₂-B₂O₃-Al₂O₃-M¹OM²O type (however, M¹And M²Is the same as above), SiO₂-B₂O₃-M³ ₂O type (however, M³Represents Li, Na or K), SiO₂-B₂O₃-Al₂O₃-M³ ₂O type (however, M³Is the same as described above), Pb-based glass, Bi-based glass and the like.
[0027]
As the inorganic filler, for example, Al₂O₃, SiO₂, ZrO₂Oxide of TiO2 and alkaline earth metal oxide, TiO₂Oxide of aluminum and alkaline earth metal oxide, Al₂O₃And SiO₂And complex oxides containing at least one selected from the group consisting of spinel, mullite, cordierite, and the like.
[0028]
In the multilayer wiring board of the present invention, a wiring conductor layer 2 is formed on the surface of the substrate 1 and a resin insulating layer 3 is formed to cover the wiring conductor layer 2. Of these, it is important that the non-formed region 4 of the wiring conductor layer is depressed with respect to the surface of the substrate 1 in a region immediately below the wiring conductor layer 2.
[0029]
As a result, the length of the route between the adjacent wiring conductor layers 2 passing through the surface of the substrate 1 becomes longer, so that the insulation between the wiring conductor layers 2 does not decrease, and the multilayer wiring board having excellent environmental resistance and reliability. This is because it can be realized.
[0030]
On the other hand, when the region 4 where the wiring conductor layer is not formed on the surface of the substrate 1 is not depressed with respect to the surface of the substrate 1 just below the wiring conductor layer 2, the area between the adjacent wiring conductor layers 2 Path becomes the shortest distance and becomes short, so that the insulation between the wiring conductor layers 2 tends to be easily reduced.
[0031]
In the multilayer wiring section 10, the wiring conductor layer 2 formed on the surface of the substrate 1 may be formed, for example, as follows.
[0032]
A base conductor layer 6 containing an active metal such as Ti, Cr or Mo, which plays a role of bonding with the surface, and Cu as a main conductor layer 7 is formed on the surface of the substrate 1 by a vacuum film forming method or electrolytic or electroless plating. Then, a resist layer having an opening of the pattern of the wiring conductor layer 2 is formed on the underlying conductor layer 6, and a vacuum film forming method or an electrolytic method is performed on the underlying conductor layer 6 exposed from the opening of the resist layer. Alternatively, the main conductor layer 7 is formed to a desired thickness by electroless plating, for example, by electrolytic Cu plating. After that, the resist layer is removed by using a stripping solution or the like, and the underlying conductive layer 6 which is protruded from the main conductive layer 7 and is exposed is removed by etching, blasting, polishing, or the like to form a wiring having a shape corresponding to the pattern of the opening of the resist layer. The conductor layer 2 is formed, and the region 4 where the wiring conductor layer is not formed in the surface of the substrate 1 is partially removed from the surface side by etching, blasting, polishing or the like to form a recess 5. Thereby, the residue of the wiring conductor layer 2, more specifically, the residue of the base conductor layer 6 generated in the non-forming region 4 of the wiring conductor layer can be reliably removed from the surface of the substrate 1, and the formation of the wiring conductor layer can be prevented. A recess is formed in the region 4 and a path between the adjacent wiring conductor layers 2 passing through the surface of the substrate 1 becomes longer, so that insulation between the wiring conductor layers 2 does not decrease and a desired pattern is provided. The wiring conductor layers 2 arranged at high density can be formed.
[0033]
At this time, if glass ceramics is adopted as the substrate 1, the insulating layer can be composed of glass ceramics having a low dielectric constant, and the wiring conductor layer 2 can be composed of a low-resistance metal such as Cu. This is advantageous because it can function as an excellent support. In particular, when the relative dielectric constant is 7 or less, excellent high-frequency characteristics can be obtained, which is more convenient.
[0034]
Further, assuming that the depth of the recess 5 in the region 4 where the wiring conductor layer is not formed and the region immediately below the wiring conductor layer 2 is 0.1 μm to 10 μm, the surface of the substrate 1 covers the wiring conductor layer 2 and When the resin insulation layer 3 is formed over the non-formation region 4, the residue of the wiring conductor layer 2 generated in the non-formation region 4 of the wiring conductor layer can be removed without impairing the flatness of the surface of the resin insulation layer 3. Since the length of the route between the adjacent wiring conductor layers 2 via the non-forming region 4 of the wiring conductor layer can be increased to a required length, it is possible to prevent a decrease in insulation between the wiring conductor layers 2. It is effective.
[0035]
When the depth of the recess 5 is less than 0.1 μm, the effect of removing the residue of the wiring conductor layer 2 component generated in the region 4 where the wiring conductor layer is not formed tends to be weak, and when the depth exceeds 10 μm, it is formed thereon. The flatness of the surface of the resin insulating layer 3 tends to decrease. In this case, the depth of the recess 5 can be easily controlled by using, for example, a mixed aqueous solution of hydrofluoric acid and nitric acid as an etchant when partially removing the surface of the substrate 1 from the surface side.
[0036]
The method for forming the recess 5 in the second method of manufacturing a multilayer wiring board according to the present invention is as follows. An active metal such as Ti, Cr or Mo serving as a joint with the surface and a main conductor are formed on the surface of the substrate 1. The underlying conductor layer 6 containing Cu as the layer 7 and the Cu layer as the main conductor layer 7 are formed by a vacuum film forming method. Alternatively, after the surface of the substrate 1 is roughened with an etching solution containing phosphoric acid or hydrofluoric acid, a surface treatment is performed with an active solution containing Pd, and the underlying conductor layer 6 is formed by electroless Cu plating. The main conductor layer 7 is formed by plating. Next, a resist layer having a pattern of the wiring conductor layer 2 is formed on the upper surface of the main conductor layer 7, and the main conductor layer 7 and the underlying conductor layer 6 which are protruded from the resist layer and exposed are removed by a method such as etching. The wiring conductor layer 2 is formed in the shape of the layer pattern, and the region 4 where the wiring conductor layer is not formed on the surface of the substrate 1 is etched from the surface side by a method such as etching with an etching solution containing phosphoric acid or hydrofluoric acid. When the area where the wiring conductor layer is not formed is recessed with respect to the surface of the substrate 1 in the area immediately below the wiring conductor layer 2, the wiring conductor layer 2 generated in the area where the wiring conductor layer is not formed, A wiring conductor capable of providing high-density wiring, which has a desired pattern and is capable of preventing a decrease in insulation between the wiring conductor layers 2, which can reliably remove mainly the residual components of the base conductor layer 6 together with part of the surface of the substrate 1. Layer 2 It can be formed with no steps.
[0037]
The resin insulating layer 3 of the multilayer wiring portion 10 is composed of an insulating film layer 9 and an insulating adhesive layer 8, and the insulating film layer 9 is made of a polyimide resin, a polyphenylene sulfide resin, a wholly aromatic polyester resin, a fluororesin, or the like. The insulating adhesive layer 8 is made of a polyamide imide resin, a polyimide siloxane resin, a bismaleimide triazine resin, an epoxy resin, or the like.
[0038]
The resin insulating layer 3 is prepared by first applying an insulating adhesive to an insulating film having a thickness of about 12.5 to 50 μm to a dry thickness of about 5 to 20 μm using a doctor blade method or the like, and drying the resin. The insulating film layer 9 is formed by stacking the insulating adhesive layer 8 on the upper surface of the substrate 1 or the lower resin insulating layer 3 so that the insulating adhesive layer 8 is disposed therebetween, and applying heat and pressure using a heating press device to bond the insulating film. You.
[0039]
In the resin insulating layer 3, a through hole 11 is formed at a predetermined position, penetrating the insulating film layer 9 and the insulating adhesive layer 8, and a through conductor 12 is formed in the through hole 11 by being formed. A connection path for electrically connecting each of the wiring conductor layers 2 positioned above and below the resin insulating layer 3 is formed.
[0040]
The through hole 11 is formed by removing a part of the insulating film layer 9 and the insulating adhesive layer 8 using a laser, for example. In particular, when the opening diameter of the through-hole 11 is small, it is desirable to form the through-hole 11 with an ultraviolet laser that can easily control the angle of the inner wall surface and smoothly process the inner wall surface of the through-hole 11.
[0041]
The through conductor 12 may be formed separately from the wiring conductor layer 2 disposed on the upper surface of each resin insulating layer 3. However, when these are formed at the same time, the number of steps can be reduced and the electrical connection reliability between the two can be reduced. It is also good in terms of properties.
[0042]
When the wiring conductor layer 2 and the through conductor 11 provided on the upper surface of each resin insulating layer 3 are integrally formed, a plating film having a desired thickness can be adjusted and formed respectively. It is preferable to form them mainly using an electrolytic plating method.
[0043]
The method of forming the wiring conductor layer 2 and the through conductor 11 disposed on the upper surface of each resin insulating layer 3 may be, for example, as follows. First, a base conductor layer 6 containing an active metal such as Ti, Cr, Mo or the like which plays a role of bonding with the resin insulating layer 3 and Cu as a main conductor is formed by a vacuum film forming method or a plating method. A resist layer having an opening of the pattern of the wiring conductor layer 2 is formed on the conductor layer 6, and a main conductor layer 7 is formed to a desired thickness by, for example, electrolytic Cu plating on the underlying conductor layer 6 exposed from the opening of the resist layer. I do. After that, the resist layer is removed by using a stripping solution or the like, and the underlying conductor layer 6 which is protruded from the main conductor layer 7 and is exposed is removed by etching or the like, and the wiring conductor layer 2 having a shape corresponding to the pattern of the opening in the resist layer is removed. To form
[0044]
The wiring conductor layer 2 formed on the surface of the uppermost layer of the resin insulating layer 3 which is the surface of the multilayer wiring section 10 has the following problems in terms of the mountability and environmental resistance of semiconductor devices and chip components to be mounted. When the main conductor layer 7 is made of a Cu layer, a Ni layer or an Au layer may be formed thereon.
[0045]
Thus, according to the multilayer wiring board of the present invention, electronic components such as semiconductor devices including semiconductor elements, chip components such as capacitance elements and resistors are mounted on the multilayer wiring portion 10 provided on the surface of the substrate 1. By mounting and mounting, and electrically connecting the respective electrodes of the semiconductor devices and electronic components to the wiring conductor layer 2, a semiconductor device, a hybrid integrated circuit device, or the like is obtained.
[0046]
The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.
[0047]
For example, in the example of the above-described embodiment, the method of controlling the depth of the recess 5 in the non-forming region 4 of the wiring conductor layer by using the etching liquid has been described. Alternatively, a method of controlling the removal amount by sand blasting, wet blasting, or mechanical removal means such as polishing or rubbing may be used.
[0048]
The multilayer wiring board of the present invention can be applied not only to a module board or the like constituting a hybrid integrated circuit device or the like but also to a semiconductor element housing package for housing a semiconductor element.
[0049]
【The invention's effect】
As described above, according to the multilayer wiring board of the present invention, since the region where the wiring conductor layer is not formed on the surface of the substrate is recessed with respect to the region immediately below the wiring conductor layer, the area between the adjacent wiring conductor layers is reduced. By increasing the length of the path, the insulation between the wiring conductor layers was not reduced, and a multilayer wiring board having excellent environmental resistance and reliability could be realized.
[0050]
Further, according to the multilayer wiring board of the present invention, when the region where the wiring conductor layer is not formed is recessed at a depth of 0.1 to 10 μm with respect to the region immediately below the wiring conductor layer, the adjacent wiring conductor layer When the resin insulating layer is formed on the surface of the substrate over the non-formation area of the wiring conductor layer while the insulation between the wiring conductor layers is not reduced by increasing the length of the path to the required length. The flatness of the resin insulation layer can be improved, the environmental resistance is excellent, and the connection reliability with the input / output terminals of the semiconductor device mounted on this multilayer wiring board is also excellent. A multilayer wiring board was realized.
[0051]
According to the first method for manufacturing a multilayer wiring board of the present invention, a step of forming a base conductor layer on a surface of a substrate and a step of forming a resist layer having an opening of a pattern of the wiring conductor layer on the base conductor layer And forming a main conductor layer on the underlying conductor layer exposed from the opening of the resist layer, removing the resist layer, and removing the underlying conductor layer exposed from the main conductor layer to correspond to the pattern of the opening. A wiring conductor layer having a shape is formed, and a region where the wiring conductor layer is not formed is partially removed from the surface of the substrate so that the region where the wiring conductor layer is not formed is depressed with respect to a region immediately below the wiring conductor layer. A step of forming a resin insulating layer over the non-formation area of the wiring conductor layer by covering the wiring conductor layer after that, so that the non-formation area of the wiring conductor layer in the surface of the substrate is Partly removed from the side Therefore, the residue of the wiring conductor layer component generated on the surface of the substrate in the region where the wiring conductor layer is not formed is reliably removed, and the region immediately below the wiring conductor layer is recessed in the region where the wiring conductor layer is not formed. Is formed and the path between the adjacent wiring conductor layers is lengthened, whereby the insulation between the wiring conductor layers is not reduced, and a multilayer wiring board having excellent environmental resistance and reliability can be realized by a simple method. A method for manufacturing a multilayer wiring board can be provided.
[0052]
According to the second method for manufacturing a multilayer wiring board of the present invention, a step of forming a base conductor layer on a surface of a substrate, a step of forming a main conductor layer on the base conductor layer, and a step of forming a main conductor layer on the base conductor layer Forming a resist layer of a pattern of the wiring conductor layer, removing the main conductor layer and the base conductor layer exposed from the resist layer to form a wiring conductor layer, and forming a wiring conductor layer on the surface of the substrate; A step of partially removing the region to depress the non-formed area of the wiring conductor layer with respect to the area immediately below the wiring conductor layer, and a step of removing the resist layer, and thereafter, the wiring conductor layer is formed on the surface of the substrate. And forming a resin insulating layer over the wiring board by removing a part of the surface of the substrate where the wiring conductor layer is not formed from the front side, as in the first manufacturing method. On the surface of the substrate where the conductive layer is not formed The generated wiring conductor layer components are reliably removed, and a dent is formed in a region where the wiring conductor layer is not formed with respect to a region immediately below the wiring conductor layer, so that a path between the adjacent wiring conductor layers becomes longer. Thereby, the insulation between the wiring conductor layers does not decrease, and the dent in the non-formation region of the wiring conductor layer for preventing the insulation between the adjacent wiring conductor layers from decreasing is reduced by a smaller number of steps than the first manufacturing method. A method of manufacturing a multilayer wiring board which can be formed and has excellent environmental resistance can be provided.
[Brief description of the drawings]
FIG. 1 is a sectional view showing an example of an embodiment of a multilayer wiring board of the present invention.
FIG. 2 is an enlarged sectional view of a main part showing a recess in a region where a wiring conductor layer is not formed in the multilayer wiring board shown in FIG. 1;
[Explanation of symbols]
1 ... substrate
2. Wiring conductor layer
3 ... Resin insulation layer
4... Area where no wiring conductor layer is formed
5 ... dent
6 Underlay conductor layer
7 ... Main conductor layer
8 ... Insulating adhesive layer
9 ... Insulating film layer
10 Multilayer wiring section
11 ... Through-hole
12 ... Through conductor

Claims (4)

On a surface of the substrate, a wiring conductor layer is formed, and in a multilayer wiring board in which a resin insulating layer is formed so as to cover the wiring conductor layer, an area where the wiring conductor layer is not formed on the surface of the substrate is A multilayer wiring board which is depressed with respect to a region immediately below a wiring conductor layer. 2. The multilayer wiring board according to claim 1, wherein the non-forming region is recessed at a depth of 0.1 to 10 [mu] m from a region immediately below the wiring conductor layer. Forming a base conductor layer on the surface of the substrate, forming a resist layer having an opening of the wiring conductor layer pattern on the base conductor layer, and forming a main conductor layer on the base conductor layer exposed from the opening Forming the resist layer, removing the base conductor layer exposed from the main conductor layer to form a wiring conductor layer, and forming a wiring conductor layer on the surface of the substrate. A step of forming a resin insulating layer on the surface of the substrate by covering the wiring conductor layer on the surface of the substrate, after which a part of the formation region is partially removed to make the area directly below the wiring conductor layer concave. A method for manufacturing a multilayer wiring board, comprising: Forming a base conductor layer on the surface of the substrate, forming a main conductor layer on the base conductor layer, forming a resist layer having a pattern of a wiring conductor layer on the main conductor layer; The main conductor layer and the base conductor layer exposed from the layer are removed to form a wiring conductor layer, and a part of the surface of the substrate where the wiring conductor layer is not formed is partially removed to remove the wiring conductor layer. A step of forming a resin insulating layer covering the wiring conductor layer on the surface of the substrate, and a step of recessing the area immediately below, removing the resist layer, and thereafter. Of manufacturing a multilayer wiring board.

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