JP2004025301A - ハンダを基板上に小出しする方法と装置 - Google Patents

ハンダを基板上に小出しする方法と装置 Download PDF

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Publication number
JP2004025301A
JP2004025301A JP2003057944A JP2003057944A JP2004025301A JP 2004025301 A JP2004025301 A JP 2004025301A JP 2003057944 A JP2003057944 A JP 2003057944A JP 2003057944 A JP2003057944 A JP 2003057944A JP 2004025301 A JP2004025301 A JP 2004025301A
Authority
JP
Japan
Prior art keywords
solder
substrate
mixing chamber
soldering wire
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003057944A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004025301A5 (enExample
Inventor
Guido Suter
シュテール，グイド
Christoph Tschudin
チュディン　クリストフ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Switzerland AG
Original Assignee
Esec Trading AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Trading AG filed Critical Esec Trading AG
Publication of JP2004025301A publication Critical patent/JP2004025301A/ja
Publication of JP2004025301A5 publication Critical patent/JP2004025301A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/063—Solder feeding devices for wire feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2003057944A 2002-03-08 2003-03-05 ハンダを基板上に小出しする方法と装置 Pending JP2004025301A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02005422A EP1342525A1 (de) 2002-03-08 2002-03-08 Verfahren und Einrichtung zum Auftragen von Lot auf ein Substrat

Publications (2)

Publication Number Publication Date
JP2004025301A true JP2004025301A (ja) 2004-01-29
JP2004025301A5 JP2004025301A5 (enExample) 2006-05-18

Family

ID=27741159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003057944A Pending JP2004025301A (ja) 2002-03-08 2003-03-05 ハンダを基板上に小出しする方法と装置

Country Status (4)

Country Link
EP (1) EP1342525A1 (enExample)
JP (1) JP2004025301A (enExample)
AT (1) ATE340048T1 (enExample)
DE (1) DE50305098D1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6811074B2 (en) * 2002-03-08 2004-11-02 Esec Trading Sa Method and apparatus for dispensing solder on a substrate
JP2007294952A (ja) * 2006-04-21 2007-11-08 Internatl Business Mach Corp <Ibm> はんだを射出成形するための充填ヘッド

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024201352B4 (de) * 2024-02-14 2025-12-04 Volkswagen Aktiengesellschaft Schutzgas-Lötbrenner mit Spritzschutzmanschette

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3734550A1 (de) * 1987-10-13 1989-04-27 Franz Ummen Hochfrequenzbeheizter lotinjektor
US4934309A (en) * 1988-04-15 1990-06-19 International Business Machines Corporation Solder deposition system
DE3913143C2 (de) * 1989-04-21 1996-09-05 U T S Uhrentechnik Schwarzwald Löt- oder Schweißvorrichtung
EP0752294B1 (de) * 1995-07-01 2000-06-21 Esec Sa Verfahren und Einrichtung zum Austragen von flüssigem Lot
JPH09232746A (ja) * 1996-02-27 1997-09-05 Omron Corp 半田付け装置および半田付け方法
JP3590319B2 (ja) * 2000-03-10 2004-11-17 株式会社ジャパンユニックス ガス噴射式はんだ付け方法及び装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6811074B2 (en) * 2002-03-08 2004-11-02 Esec Trading Sa Method and apparatus for dispensing solder on a substrate
JP2007294952A (ja) * 2006-04-21 2007-11-08 Internatl Business Mach Corp <Ibm> はんだを射出成形するための充填ヘッド

Also Published As

Publication number Publication date
EP1342525A1 (de) 2003-09-10
DE50305098D1 (de) 2006-11-02
ATE340048T1 (de) 2006-10-15

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