JP2004008876A - Apparatus for washing rim part of substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a washing apparatus for dissolving and removing a rim part of a square substrate and an unnecessary part of a thin film from the end face of the substrate even if the washing margin of the rim part of the square substrate is wide and even if the thin film on the square substrate is hard to remove. <P>SOLUTION: A plurality of solvent jetting nozzles 18 are arranged in parallel along the rim of a square substrate 1 held by a substrate holding means for dissolving a portion of a thin film on a square substrate 1 in a prescribed width from the rim of the substrate by jetting a solvent from the discharge ports while being moved in the direction parallel to the rim of the substrate and the jetting nozzles 18 are disposed at a second position corresponding to the vicinity of the rim of the square substrate other than a first position corresponding to the boundary of the part of the surface of the square substrate to be coated with the thin film and the part from which the thin film is removed. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a photoresist formed on a surface of a rectangular substrate by cleaning an edge portion of a rectangular substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, and a ceramic substrate for manufacturing a thermal head with a solvent. The present invention relates to an apparatus for cleaning an edge of a substrate, which dissolves and removes a thin film of a photosensitive polyimide resin, a colorant for a color filter, or the like by a predetermined width from the edge of the rectangular substrate.
[0002]
[Prior art]
As an apparatus for cleaning the edge portion of this type of substrate, there is one disclosed in, for example, Japanese Patent No. 2708337. The substrate edge cleaning apparatus disclosed in the same publication includes substrate holding means for mounting and holding a rectangular substrate having a thin film formed on the surface, and a solvent on a surface of an edge portion of the rectangular substrate held by the substrate holding means. Means for discharging the unnecessary portion of the thin film by discharging the thin film unnecessary portion dissolved by the solvent discharged from the solvent discharging means to the outside of the edge of the rectangular substrate by discharging the gas A gas nozzle for blowing off, a suction member for sucking and discharging a solvent discharged from the solvent discharging means and a dissolved matter of the thin film unnecessary portion blown off by a gas discharged from the gas nozzle, the solvent discharging means, the gas nozzle and the suction member of the rectangular substrate. It is provided with moving means for relatively moving along the edge. The solvent discharging means is provided with a plurality of discharge ports along the edge of the rectangular substrate, and the solvent discharging means is relatively moved along the edge of the rectangular substrate placed and held on the substrate holding means. While moving, the solvent is discharged from each of the plurality of discharge ports of the solvent discharging means to the surface of the rectangular substrate to dissolve the unnecessary portion of the thin film at the edge of the rectangular substrate.
[0003]
FIG. 8A is a partially enlarged cross-sectional view showing a state in which a resist film 2 is formed on the surface of a rectangular substrate 1, and FIG. 8B shows a state in which the above-described substrate edge cleaning apparatus is used. FIG. 4 is a partially enlarged cross-sectional view showing a state after the edge of the rectangular substrate 1 has been cleaned. As shown in FIG. 8B, the unnecessary resist 2a on the end face and the edge of the rectangular substrate 1 is dissolved and removed by the cleaning process of the edge of the rectangular substrate 1 as shown in FIG.
[0004]
[Problems to be solved by the invention]
By the way, recently, there is a resist (such as a color resist) which is difficult to remove from the substrate by cleaning because the width of cleaning (indicated by the symbol w in FIG. 8B) of the edge portion of the rectangular substrate is widened. If a resist having a wider cleaning width or a resist that is difficult to remove is used, the conventional substrate edge cleaning apparatus described above reduces the degree of cleaning of the substrate edge and deteriorates the degree of cleaning of the substrate edge. Problem.
[0005]
The present invention has been made in view of the above circumstances, and even when a cleaning width of an edge portion of a rectangular substrate is widened, a thin film formed on the surface of the rectangular substrate is difficult to remove by cleaning. Even in this case, an object of the present invention is to provide an apparatus for cleaning an edge of a substrate which can dissolve and remove unnecessary portions of a thin film from the edge and the end face of the rectangular substrate.
[0006]
[Means for Solving the Problems]
According to the first aspect of the present invention, there is provided a substrate holding means for holding a rectangular substrate having a thin film formed on a surface thereof, and an edge of the rectangular substrate held by the substrate holding means facing the edge of the rectangular substrate. A plurality of discharge ports arranged in parallel in the direction, solvent discharging means for dissolving the thin film on the surface of the rectangular substrate by a solvent discharged from each of the discharge ports by a predetermined width from the edge of the rectangular substrate, A solvent removing means for removing, from an edge of the rectangular substrate, a dissolved substance of a thin film dissolved by a solvent discharged from a discharge port of the solvent discharging means; and a rectangular substrate comprising the solvent discharging means and the dissolved substance removing means. A moving means for relatively moving the solvent in a direction parallel to the edge thereof, wherein the plurality of discharge ports of the solvent discharging means are orthogonal to the edge of the rectangular substrate. Overlap in the direction of In order to avoid such a situation, in addition to the first position corresponding to the boundary portion between the thin film deposition portion and the thin film removal portion on the surface of the rectangular substrate, it is disposed at least in the second position corresponding to the vicinity of the edge of the rectangular substrate. It is characterized by.
[0007]
According to a second aspect of the present invention, in the cleaning apparatus according to the first aspect, the discharge ports of the solvent discharging unit are arranged at a plurality of positions between the first position and the second position. I do.
[0008]
According to a third aspect of the present invention, in the cleaning apparatus according to the second aspect, distances of discharge ports arranged at a plurality of positions between the first position and the second position from an edge of the rectangular substrate. Are characterized by gradually changing in a direction along the edge of the rectangular substrate.
[0009]
In the apparatus for cleaning the edge of a substrate according to the first aspect of the present invention, the solvent discharging means and the dissolved substance removing means relatively move in a direction parallel to the edge of the rectangular substrate held by the substrate holding means. While the solvent is discharged from each outlet of the solvent discharging means, the thin film on the surface of the rectangular substrate is dissolved by the solvent, and the dissolved substance of the thin film is removed from the edge of the rectangular substrate by the dissolved substance removing means. Is done. At this time, of the plurality of discharge ports of the solvent discharge means arranged in parallel in the direction along the edge of the rectangular substrate, the first one corresponding to the boundary between the thin film deposition portion and the thin film removal portion on the surface of the rectangular substrate. Unnecessary portions of the thin film are dissolved by a predetermined width from the edge of the rectangular substrate in the same manner as in the related art, by the solvent discharged from the discharge port arranged at the position. On the other hand, the solvent discharged from the discharge port disposed at the second position corresponding to the vicinity of the edge of the rectangular substrate mainly dissolves the end face of the rectangular substrate and the thin film unnecessary portion in the vicinity thereof. Therefore, the unnecessary portion of the thin film is surely dissolved and removed not only from the edge of the rectangular substrate but also from the end face. Further, since the plurality of discharge ports of the solvent discharge means are arranged so as not to overlap in the direction orthogonal to the edge of the rectangular substrate, unnecessary portions of the thin film are efficiently dissolved and removed.
[0010]
In the cleaning apparatus according to the second and third aspects of the present invention, the unnecessary portion of the thin film within a predetermined cleaning width is reliably dissolved and removed from the edge of the rectangular substrate.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a preferred embodiment of the present invention will be described with reference to FIGS.
[0012]
1 to 3 show an example of an embodiment of the present invention. FIG. 1 is a front view of a main part showing a schematic configuration of a cleaning apparatus for cleaning an edge portion of a substrate, and FIG. 2 is a schematic plan view thereof. FIG. 3 is a partially enlarged cross-sectional view thereof. This edge cleaning device adsorbs a lower surface of a rectangular substrate 1 (hereinafter, referred to as “substrate 1”) having a thin film, for example, a photoresist thin film formed on a surface thereof, and holds the substrate 1 in a horizontal posture. A plate 10 is provided, and the substrate mounting plate 10 is supported by an elevating mechanism (not shown) so as to be vertically movable. An edge cleaning unit 12 is provided for each of the four edges of the substrate 1. Each edge cleaning unit 12 is supported by a horizontal moving mechanism (not shown) so as to be reciprocally movable in the direction indicated by an arrow in FIG. 2 along each edge of the substrate 1.
[0013]
As shown in FIG. 3, the edge cleaning unit 12 fixes the nozzle head 16 to the mounting block 14 and attaches the nozzle head 16 to each of the upper and lower edges of the substrate 1 held on the substrate mounting plate 10. A plurality of solvent ejection nozzles 18 and a plurality of gas ejection nozzles 20 are attached so that the ejection ports face each other. The plurality of solvent ejection nozzles 18 and the plurality of gas ejection nozzles 20 are directed along the edge E of the substrate 1 as shown in FIG. 4 in a partial plan view viewed in the direction indicated by the arrow A in FIG. And in parallel with the edge E of the substrate 1.
[0014]
One group of the plurality of solvent discharge nozzles 18 has a first portion corresponding to a boundary portion between an unnecessary portion of the thin film to be removed from the edge of the substrate 1 and a thin film deposition portion to be left on the substrate 1. , And another group of solvent discharge nozzles 18 is disposed at a second position P2 corresponding to the vicinity of the edge E of the substrate 1. From the discharge ports of these solvent discharge nozzles 18, an organic solvent for dissolving the photoresist forming the thin film on the substrate 1 is discharged almost vertically toward the edge of the substrate 1. Then, the thin film on the substrate 1 is dissolved by a predetermined width from the edge E of the substrate 1 by the solvent discharged from the solvent discharge nozzle 18. When the material for forming the thin film on the substrate 1 is a dye, an alkaline solution or the like is blown out from the solvent discharge nozzle 18.
[0015]
The gas ejection nozzles 20 are provided for each of the solvent ejection nozzles 18, and each ejection port is attached to be inclined so that the solvent ejected from the solvent ejection nozzle 18 faces a position near the substrate 1. . A nitrogen gas, clean air, or the like is ejected from the gas ejection nozzle 20, and a dissolved substance of a thin film dissolved by the solvent ejected from the solvent ejection nozzle 18 is moved from the position of the solvent ejection nozzle 18 by the ejection pressure of the gas. This also prevents the melt from entering the inside of the substrate 1, and removes these dissolved substances from the edge of the substrate 1 in combination with the suction by the suction port 22 described later.
[0016]
In addition, the mounting block 14 is formed with an intake port 22 so as to open to face the end surface of the substrate 1, and an exhaust chamber 24 communicating with the intake port 22 is formed inside the mounting block 14. . An exhaust pipe 26 communicates with the exhaust chamber 24, and the exhaust pipe 26 is connected to a vacuum suction source (not shown). Then, the inside of the exhaust chamber 24 is vacuum-sucked through the exhaust pipe 26, thereby being dissolved by the solvent discharged from the solvent discharge nozzle 18 and pushed outward from the edge of the substrate 1 by the gas ejected from the gas ejection nozzle 20. The melted thin film is sucked into the exhaust chamber 24 through the intake port 22 and discharged from the exhaust chamber 24 through the exhaust pipe 26.
[0017]
In the edge cleaning apparatus having the above-described configuration, the edge cleaning is performed on the substrate 1 held by the substrate mounting plate 10 in a direction parallel to the edge of the substrate 1 as shown in FIG. While the unit 12 is moving, the solvent is discharged from the discharge ports of the plurality of solvent discharge nozzles 18 of the edge cleaning unit 12, and the solvent dissolves the thin film on the edge of the substrate 1 and dissolves the thin film. The object is sucked in by suction from the intake port 22, and is pushed out of the edge of the substrate 1 by the gas ejected from the gas ejection nozzle 20 to be removed from the edge of the substrate 1. Then, the melt of the thin film removed from the edge of the substrate 1 is sucked into the exhaust chamber 24 through the intake port 22 of the mounting block 14 together with the solvent and gas, and passes through the exhaust pipe 26 from inside the exhaust chamber 24. Is discharged.
[0018]
At this time, the unnecessary portion of the thin film is dissolved by a predetermined width from the edge E of the substrate 1 by the solvent discharged from the solvent discharging nozzle 18 arranged at the first position P1 of the plurality of solvent discharging nozzles 18. Can be On the other hand, the solvent discharged from the solvent discharge nozzle 18 disposed at the second position P2 mainly dissolves the end face of the substrate 1 and unnecessary portions of the thin film in the vicinity thereof. As described above, the solvent is discharged from the solvent discharge nozzles 18 disposed at the first position P1 and the second position P2 at different distances from the edge E of the substrate 1, so that the cleaning width is increased. In addition, even if the thin film is difficult to dissolve, the unnecessary portion of the thin film can be surely dissolved and removed not only from the edge of the substrate 1 but also from the end face.
[0019]
FIGS. 5A to 5E are partial plan views showing examples of the arrangement of the solvent discharge nozzles 18 different from those shown in FIG.
[0020]
In FIG. 5A, a plurality of solvent ejection nozzles 18 are arranged at a first position P1, and one solvent ejection nozzle 18 is arranged at a second position P2, and are arranged at a first position P1. The distance between the last one of the solvent discharge nozzles 18 (shown at the bottom in FIG. 5) and the solvent discharge nozzle 18 arranged at the second position P2 from the edge E of the substrate 1 An example in which a plurality of solvent discharge nozzles 18 are arranged so that the distance gradually changes in a direction along the edge E of the substrate 1 is shown. FIG. 5B shows the edge of the substrate 1 between the last one of the solvent ejection nozzles 18 arranged at the first position P1 and the solvent ejection nozzle 18 arranged at the second position P2. An example is shown in which a plurality of solvent discharge nozzles 18 are linearly arranged such that the distance from E gradually changes by an equal distance in the direction along the edge E of the substrate 1. Further, in this example, the gas ejection nozzle 20 installed corresponding to the solvent ejection nozzle 18 arranged at a position other than the first position P1 is positioned on a horizontal plane in a direction orthogonal to the edge E of the substrate 1. Leaning.
[0021]
FIG. 5C shows that the plurality of solvent discharge nozzles 18 located at the center in the direction along the edge E of the substrate 1 are arranged at the first position P1, and along the edge E of the substrate 1. The two solvent ejection nozzles 18 located at both ends in the same direction are arranged at the second position P2, and the two solvent ejection nozzles 18 arranged at the first position P1 are located at both ends and the second position P2. A plurality of solvent discharge nozzles 18 are arranged between the substrate 1 and the solvent discharge nozzles 18 such that the distance from the edge E of the substrate 1 gradually changes by an equal distance in a direction along the edge E of the substrate 1. An example of linear arrangement is shown. Also in this example, the gas ejection nozzles 20 installed corresponding to the solvent ejection nozzles 18 arranged at positions other than the first position P1 are positioned in a horizontal plane with respect to a direction orthogonal to the edge E of the substrate 1. Leaning.
[0022]
FIG. 5D shows an example in which a plurality of solvent discharge nozzles 18 are alternately arranged at a first position P1 and a second position P2. Further, in this example, the gas discharge nozzle 20 is provided only for the solvent discharge nozzle 18 arranged at the first position P1. In FIG. 5E, a plurality of solvent ejection nozzles 18 are arranged at a first position P1, and one solvent ejection nozzle 18 is arranged at a second position P2, and are arranged at a first position P1. Of the solvent discharge nozzles 18 arranged at the first position P1 between the adjacent solvent discharge nozzles 18 and the second position. The distance from the edge E of the substrate 1 to the solvent discharge nozzle 18 arranged at P2 is changed so that the distance from the edge E of the substrate 1 gradually changes by an equal distance in the direction along the edge E of the substrate 1 (the edge E of the substrate 1). An example is shown in which a plurality of solvent ejection nozzles 18 are arranged (in a direction inclined with respect to). Also in this example, the gas discharge nozzle 20 is provided only for the solvent discharge nozzle 18 arranged at the first position P1.
[0023]
In any of the above-described examples, the solvent discharge nozzles 18 are arranged so as not to overlap in a direction orthogonal to the edge of the substrate 1. When the solvent ejection nozzle 18 is arranged as shown in FIG. 4 or FIG. 5D, the solvent ejection nozzle 18 arranged at the first position P1 and the solvent ejection nozzle 18 arranged at the second position P2. The discharge flow rate of the solvent between the solvent discharge nozzle 18 and the solvent discharge nozzle 18 may be changed.
[0024]
Next, as shown in a schematic plan view in FIG. 6, a pair of edge cleaning units 12a and 12b are installed for each of four edges of the substrate 1, and the pair of edge cleaning units 12a and 12b are integrally formed. , Can be reciprocated along the edges of the substrate 1 in the directions indicated by arrows. With such a configuration, the following effects can be obtained.
[0025]
The rectangular substrate to be cleaned by the edge cleaning device tends to become larger year by year, but if the processing tact remains the same even if the substrate becomes larger, the cleaning time becomes the same. The moving speed of the washing unit must be increased. When the moving speed of the edge cleaning unit is increased, the discharge flow rate of the solvent per unit area of the edge of the substrate is reduced, and therefore, the cleaning degree of the edge of the substrate is reduced. In this case, it is conceivable to increase the size of the edge cleaning unit.However, in this case, the exhaust efficiency from the edge cleaning unit changes, and the mist of the solvent cannot be completely removed by the exhaust. May enter and adhere to the inner portion of the substrate 1 to cause defective products. On the other hand, as shown in FIG. 6, when a pair of edge cleaning units 12a and 12b is provided for each of four edges of the substrate 1, even if the moving speed of the edge cleaning unit is increased, the substrate 1 The discharge flow rate of the solvent per unit area of the edge portion can be increased, and the exhaust efficiency does not change, so that occurrence of the above-described failure can be prevented.
[0026]
In addition, when it is desired to use two types of solvents, and only one edge cleaning unit is installed at one edge of the rectangular substrate, prepare a separate piping system for each type of solvent. Therefore, every time the type of the solvent is changed, the pipe system must be connected to the nozzle head, or the solvent must be replaced in a cabinet in which the solvent tank is installed. When exchanging the solvent in the cabinet, much of the solvent is discarded due to the replacement of the solvent, and the solvent replacement takes time. On the other hand, as shown in FIG. 6, when a pair of edge cleaning units 12a and 12b is installed for every four edges of the substrate 1, the solvent used for each of the edge cleaning units 12a and 12b is used. Is determined, one of the pair of edge cleaning units 12a and 12b can be selected and used according to the type of the solvent. Therefore, the above-described problem can be solved.
[0027]
Also, as shown in FIG. 6, when a pair of edge cleaning units 12a and 12b is provided for every four edges of the substrate 1, one of the edge cleaning units 12a and 12b is provided as shown in FIG. In the edge cleaning unit 12a, the solvent discharge nozzle 18 may be disposed at the first position P1, and in the other edge cleaning unit 12b, the solvent discharge nozzle 18 may be disposed at the second position P2. In this case, the solvent discharge nozzle 18 (edge cleaning unit 12a) at a position P1 far from the substrate edge E is effective in improving the cleanliness of the upper surface of the substrate, and at a position P2 near the edge E. With the solvent discharge nozzle 18 (edge cleaning unit 12b), the end face of the substrate 1 can be cleaned well, and good cleaning results can be obtained as a whole.
[0028]
In the above-described embodiment, the edge cleaning unit 12 is provided for each of the four edges of the substrate 1, and each edge cleaning unit 12 is reciprocated along each edge of the substrate 1. Although the configuration is such that the edge cleaning unit 12 is fixed, the substrate 1 (substrate mounting plate 10) may be linearly moved in a horizontal plane with respect to the edge cleaning unit 12, Only one or two edge cleaning units 12 are installed, and the substrate 1 (substrate mounting plate 10) is rotated by 90 ° about a vertical axis to sequentially wash each edge of the substrate 1. It may be configured. In the above-described embodiment, the solvent is discharged to both the upper and lower surfaces of the substrate 1. However, the solvent is discharged to only one of the upper edge or the lower edge of the substrate 1, It may be configured such that the solvent flows around to the other surface side.
[0029]
【The invention's effect】
By using the apparatus for cleaning the edge of a substrate according to any one of the first to third aspects of the present invention, even if the cleaning width of the edge of the rectangular substrate is widened, the thin film formed on the surface of the rectangular substrate can be removed. Even if it is difficult to remove by washing, unnecessary portions of the thin film can be dissolved and removed from the edge and the end face of the rectangular substrate, and particularly, the degree of cleaning of the end face of the rectangular substrate can be improved.
[Brief description of the drawings]
FIG. 1 is an essential part front view showing an example of an embodiment of the present invention and showing a schematic configuration of an apparatus for cleaning an edge portion of a substrate.
FIG. 2 is a schematic plan view of the cleaning device shown in FIG.
FIG. 3 is a partially enlarged sectional view of the cleaning device shown in FIG. 1;
FIG. 4 is a partial plan view of the cleaning apparatus shown in FIG. 1 as viewed in a direction indicated by an arrow A in FIG.
FIG. 5 is a partial plan view showing an example of disposition of a solvent discharge nozzle different from that shown in FIG. 4;
FIG. 6 is a schematic plan view of an apparatus for cleaning an edge portion of a substrate according to another embodiment of the present invention.
7 is a partial plan view of the cleaning apparatus shown in FIG. 6 as viewed in a direction corresponding to a direction indicated by an arrow A in FIG.
8A is a partially enlarged cross-sectional view showing a state in which a resist film is formed on the surface of a rectangular substrate, and FIG. 8B is an enlarged view of the edge of the rectangular substrate using a substrate edge cleaning apparatus. FIG. 7 is a partially enlarged cross-sectional view showing a state after a cleaning process is performed on an edge.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Square substrate 10 Substrate mounting plate 12, 12a, 12b Edge cleaning unit 14 Mounting block 16 Nozzle head 18 Solvent ejection nozzle 20 Gas ejection nozzle 22 Inlet 24 Exhaust chamber 26 Exhaust pipe E Edge of square substrate P1 First Position P2 second position

Claims (3)

Substrate holding means for holding a rectangular substrate having a thin film formed on its surface,
The rectangular substrate has a plurality of discharge ports arranged in parallel in the direction along the edge of the rectangular substrate facing the edge of the rectangular substrate held by the substrate holding means, and the rectangular substrate is formed by a solvent discharged from each of the discharge ports. Solvent discharging means for dissolving the thin film on the surface of the rectangular substrate by a predetermined width from the edge of the rectangular substrate,
Dissolved substance removing means for removing the dissolved substance of the thin film dissolved by the solvent discharged from the discharge port of the solvent discharging means from the edge of the rectangular substrate,
A moving means for relatively moving the solvent discharging means and the dissolved substance removing means with respect to the rectangular substrate in a direction parallel to the edge thereof,
In an apparatus for cleaning an edge portion of a substrate having
The first outlet corresponding to the boundary portion between the thin film deposition portion and the thin film removal portion on the surface of the rectangular substrate so that the plurality of discharge ports of the solvent discharging means do not overlap in a direction orthogonal to the edge of the rectangular substrate. An apparatus for cleaning an edge of a substrate, wherein the apparatus is disposed at least in a second position corresponding to a vicinity of an edge of the rectangular substrate in addition to the position. 2. The apparatus for cleaning an edge of a substrate according to claim 1, wherein the discharge ports of the solvent discharge means are arranged at a plurality of positions between the first position and the second position. The distance from the edge of the rectangular substrate of the discharge ports arranged at a plurality of positions between the first position and the second position gradually changes in a direction along the edge of the rectangular substrate. 3. The apparatus for cleaning an edge of a substrate according to claim 2.

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