JP3643783B2 - Substrate edge cleaning apparatus and substrate edge cleaning method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate such as a glass substrate for a liquid crystal, a glass substrate for a photomask, or a semiconductor wafer on which a thin film such as a photoresist coating solution, a photosensitive polyimide resin, or a color filter stain is formed. Substrate holding means for holding the substrate with the thin film formed on the surface and discharging the solvent to the edge of the substrate after forming the thin film to dissolve and remove the unnecessary thin film adhering to the edge of the substrate. A solvent nozzle that discharges the solvent onto at least one of the front and back surfaces of the edge of the substrate held by the means and dissolves the unnecessary thin film; and the dissolved material dissolved by the solvent is blown out of the edge of the substrate by gas blowing The present invention relates to a substrate edge cleaning apparatus and a substrate edge cleaning method including a gas nozzle that blows outward.
[0002]
[Prior art]
Conventionally, as the above-described substrate edge cleaning apparatus, there has been one disclosed in Japanese Patent Publication No. 3-78777. According to this conventional example, the first tube and the second tube are provided so as to face the upper surface and the lower surface of the peripheral edge of the substrate having a thin film formed on the surface, and between the first and second tubes. A third tube is provided in the gap and on the extension of the end of the substrate, and the solvent is supplied from the first and second tubes to the upper and lower surfaces of the peripheral edge of the substrate and the solvent and dissolved and removed. The unnecessary thin film can be sucked and discharged from the third tube.
[0003]
However, in the case of the above-described conventional example, although the opening ends of the first and second tubes and the opening end of the third tube are close to each other, the suction force cannot be sufficiently applied during exhaust, In the third tube, the turbulence of the air flow is generated, the solvent discharged from the first and second tubes is difficult to be discharged immediately, and it remains unexpectedly near the edge of the substrate. There is a drawback in that it adheres to the edge portion and penetrates into the coated surface of the photoresist to reduce the uniformity of the film thickness coated on the substrate.
[0004]
In order to eliminate such drawbacks, the applicant of the present application first has a substrate holding means for holding a substrate having a thin film formed on the surface, and a solvent on both sides of the edge of the substrate held by the substrate holding means. The solvent nozzle and the gas nozzle are integrated with the solvent nozzle that discharges the unnecessary thin film by discharging the gas and the gas nozzle that blows away the dissolved material dissolved by the solvent to the outside of the edge of the substrate by blowing the gas. Proposed a substrate edge cleaning apparatus configured to move relative to the substrate edge to clean the edge of the substrate (see Japanese Patent Application No. 3-357131).
[0005]
[Problems to be solved by the invention]
However, the proposed substrate edge cleaning apparatus is configured such that gas is blown out in a band form from a gas nozzle whose tip side is squeezed into a knife shape, and the pressure drops as the blown air hits the substrate surface. There is a drawback that the gas spreads greatly, it is difficult to apply gas to a desired location on the substrate surface at a desired pressure, and the uniformity of the film thickness of the thin film applied to the substrate surface is disturbed by the gas pressure. .
[0006]
The present invention has been made in view of such circumstances, and can accurately blow off a melt at a desired position on the surface of the substrate, and can improve the uniformity of the thickness of the thin film applied to the surface of the substrate. It is an object of the present invention to provide a substrate edge cleaning apparatus and a substrate edge cleaning method capable of cleaning the edge without disturbing.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, a substrate edge cleaning apparatus according to a first aspect of the present invention is a substrate holding means for holding a substrate having a thin edge formed thereon and having a linear edge, and the substrate. A solvent nozzle for discharging the solvent onto at least one of the front and back surfaces of the edge of the substrate held by the holding means and dissolving the unnecessary thin film; and the edge of the substrate by blowing the dissolved material dissolved in the solvent by gas blowing In the substrate edge cleaning apparatus comprising a gas nozzle that blows outward from the edge and an exhaust pipe that sucks the solvent and dissolved matter, a plurality of gas nozzles that spray the gas onto the surface of the substrate are provided, and the solvent A plurality of solvent nozzles are sprayed on the surface of the substrate in a spot shape, and the length of the plurality of solvent nozzles along the straight edge of the substrate is the length of the edge. And fixing the plurality of gas nozzles along the edge on the center side of the substrate with respect to the plurality of solvent nozzles. And a moving means for moving the fixing member with respect to the linear end edge in a direction along the linear end edge, and providing a solvent discharge portion of the solvent nozzle and a gas of the gas nozzle. The discharge part is provided on the fixing member in a state of being aligned on a straight line orthogonal to the linear edge, and the opening area of the gas discharge part is larger than the opening area of the solvent discharge part It is characterized by.
[0008]
A solvent pipe and a gas pipe may be provided in the fixing member, and the plurality of solvent nozzles may be connected to the solvent pipe, and the plurality of gas nozzles may be connected to the gas pipe.
[0010]
The substrate is a square substrate, the fixing member to which the solvent nozzle and the gas nozzle are fixed, and the fixing member relative to the linear edge in a direction along the linear edge. A moving means for moving to each other may be provided corresponding to each side of the square substrate.
[0011]
The exhaust pipe is provided with a portion having a predetermined length from the edge of the substrate to the substrate center side, and the discharge portion of the solvent nozzle and the discharge portion of the gas nozzle are connected to the predetermined length of the exhaust pipe. You may make it locate between this part and the said board | substrate.
[0012]
In order to achieve the above object, a substrate edge cleaning apparatus according to a fifth aspect of the present invention is a substrate holding means for holding a substrate having a thin edge formed thereon and having a linear edge, and the substrate. A solvent nozzle for discharging the solvent onto at least one of the front and back surfaces of the edge of the substrate held by the holding means and dissolving the unnecessary thin film; and the edge of the substrate by blowing the dissolved material dissolved in the solvent by gas blowing In a substrate edge cleaning apparatus comprising a gas nozzle that blows outward from the edge, a plurality of solvent nozzles that spray the solvent onto the surface of the substrate are provided, and the gas is sprayed onto the surface of the substrate in a spot shape More gas nozzles are provided than the number of solvent nozzles, and the plurality of solvent nozzles have a length along the straight edge of the substrate shorter than the length of the edge. The fixed member is fixed along the length direction along the edge, and the plurality of gas nozzles are arranged in the length direction along the edge on the center side of the substrate with respect to the plurality of solvent nozzles. And moving means for moving the fixing member in a direction along the linear end edge with respect to the linear end edge, and the array range of the plurality of gas nozzles includes the plurality of solvent nozzles. It is characterized by being larger than the arrangement range .
[0013]
The solvent nozzle may be provided at a corresponding position between the adjacent gas nozzles.
[0014]
In order to achieve the above object, a substrate edge cleaning apparatus according to a seventh aspect of the present invention is a substrate holding means for holding a substrate having a thin film formed on its surface and having a linear edge, and the substrate. A solvent nozzle for discharging the solvent onto at least one of the front and back surfaces of the edge of the substrate held by the holding means and dissolving the unnecessary thin film; and the edge of the substrate by blowing the dissolved material dissolved in the solvent by gas blowing In a substrate edge cleaning apparatus comprising a gas nozzle that blows outward from the edge, a plurality of solvent nozzles that spray the solvent onto the surface of the substrate are provided, and the gas is sprayed onto the surface of the substrate in a spot shape A plurality of gas nozzles are provided, the plurality of solvent nozzles are fixed in a direction along the linear edge, and the plurality of gas nozzles are the plurality of solvents. Fixed in a direction along the edge of the center of the substrate than the nozzle, and wherein providing the fixing member are disposed in a staggered manner to the solvent nozzle and the gas nozzle, arrangement range of the plurality of gas nozzles, It is larger than the arrangement range of the plurality of solvent nozzles .
[0016]
According to the present invention having the above configuration, since the gas is sprayed from the gas nozzle onto the surface of the substrate in a spot shape, the gas can be sprayed to a desired position on the surface of the substrate with a sufficient pressure, and the pressure drops as it hits the substrate surface. Less gas spread on the surface of the substrate, and it is possible to accurately blow off the melt at a desired position on the surface of the substrate, and at the edge of the substrate without disturbing the uniformity of the thickness of the thin film applied to the substrate surface. Since the edge can be cleaned, and a plurality of solvent nozzles that discharge the solvent in a spot shape to the substrate and gas nozzles that discharge the gas in a spot shape to the substrate are provided in the direction along the substrate edge, Each time the thin film is dissolved with the liquid from one solvent nozzle, the cleaning process consists of dissolution and removal, in which the dissolved substance is strongly removed with a spot-like gas and cleaned. The number of solvent nozzles can be repeated several times, and the cleaning is performed not only for dissolving the resist, but also for removing the dissolved material. In addition, since these nozzles are provided on one fixed member, it is possible to perform cleaning multiple times by one movement of the fixed member, and the cleaning efficiency is also improved in terms of time. The number of solvent nozzles and gas nozzles is very large in total, but the relative positional accuracy between the solvent discharge position and the gas discharge position is high, and the solvent nozzles and gas nozzles on the substrate have high relative accuracy. The position can be adjusted very easily, and the fixing member is smaller than the length of the edge of the board, so that not only the fixing member itself is small, but also the fixing member is moved. That the movement means also requires only small in size, it can contribute to the miniaturization of the entire apparatus.
[0017]
In addition, as a solvent to be used, when dissolving a photoresist coating solution, ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, diisobutyl ketone, ethyl acetate, butyl acetate, acetic acid-n-amyl, formic acid Esters such as methyl, ethyl propionate, dimethyl phthalate, and ethyl benzoate, aromatic hydrocarbons such as toluene, xylene, benzene, ethylbenzene, carbon tetrachloride, trichloroethylene, chloroform, 1,1,1- Halogenated hydrocarbons such as trichloroethane, monochlorobenzene, and chloronaphthalene; ethers such as tetrahydroblanc, diethyl ether, ethylene glycol monomethyl ether, and ethylene glycol monoethyl ether acetate; Or the like can be used Muamido and dimethyl sulfoxide. In addition, when dissolving the stain, hot water of 30 to 60 ° C., lower alcohols such as methanol, ethanol, and propanol, acetone, etc. can be used, and wetting with the substrate in these liquids In order to improve, a surfactant may be added.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is an overall schematic side view of a partially cutout substrate edge cleaning apparatus according to a first embodiment of the present invention, and FIG. 2 is an overall schematic plan view of a square substrate having a thin film formed on the surface by spin coating. Four solvent nozzles 3a for discharging the solvent to the edge of the surface of the square substrate 1 to dissolve the unnecessary thin film at each of the four locations around the substrate holding means 2 on which 1 is placed and held by vacuum suction; The four gas nozzles 4a for blowing off the solvent and the dissolved unnecessary thin film to the outside of the edge of the square substrate 1, and one for discharging the solvent to the edge of the back surface of the square substrate 1 to dissolve the unnecessary thin film Solvent nozzle 3b, one gas nozzle 4b for blowing off the solvent and the dissolved unnecessary thin film to the outside of the edge of the square substrate 1, and an exhaust pipe 5 for sucking the solvent and the dissolved unnecessary thin film. The substrate edge cleaning apparatus 6 is provided.
[0019]
A vacuum suction source 9 is connected to the exhaust pipe 5 via a connection tube 7 and a drain tank 8, and as shown in an enlarged sectional view of FIG. Upper and lower solvent nozzles 3a,..., 3b having a discharge portion S1 are attached.
[0020]
Also, an upper gas nozzle 4a... Having a needle-like discharge part S2 on the center side of the square substrate 1 and a pistol gas nozzle 4b closer to the solvent nozzles 3a. As shown in the plan view, on the surface side of the square substrate 1, the solvent is supplied in a spot shape from the solvent nozzle 3 a... To the edge thereof, and the gas is supplied in a spot shape from the gas nozzle 4 a. The dissolved material is blown off to the outside of the edge of the square substrate 1 by gas.
[0021]
The opening area of the needle-like discharge part S2 of the gas nozzle 4a is about twice the opening area of the needle-like discharge part S1 of the solvent nozzle 3a, and the solvent nozzle 3a and the gas nozzle 4a are They are arranged side by side so as to be located on the same straight line in the direction orthogonal to the edge of the square substrate 1.
[0022]
The solvent nozzles 3a, 3b, gas nozzles 4a, 4b and the exhaust pipe 5 are integrally attached to the nozzle block 10, and a pair of upper and lower guides attached to the fixed frame 12 is provided with a support arm 11 to which the nozzle block 10 is attached. 13 and 13 are provided so as to be movable along the edge of the square substrate 1.
[0023]
A motor bracket 15 provided with an electric motor 14 as a drive mechanism capable of forward and reverse rotation is erected at a position corresponding to one corner portion of the square substrate 1 held by the substrate holding means 2, and the electric motor 14. A drive pulley 16 is interlocked to the drive shaft.
[0024]
One idler pulley 17 is provided at a location corresponding to one corner of the square substrate 1 held by the substrate holding means 2, and two idle pulleys are provided at locations corresponding to the other three corners. Rolling pulleys 17 and 17 are provided, respectively, and a pair of wires 18 and 18 are wound around the driving pulley 16 and the idle pulleys 17..., And the support arm 11 is connected to each of predetermined four portions of the wires 18 and 18. The four nozzle blocks 10... Are reciprocated along the sides of the square substrate 1 by forward and reverse rotation of the electric motor 14 so that the edge of the square substrate 1 can be cleaned.
[0025]
With the above configuration, when the edge of the square substrate 1 is cleaned, first, the discharge of the gas from the gas nozzles 4a..., 4b and the exhaust from the exhaust pipe 5 are started, and then the movement of the nozzle block 10. Then, the solvent is supplied from the solvent nozzles 3a,... 3b as the nozzle block 10 comes to the end of the square substrate 1 with a sensor (not shown). Thereafter, the nozzle block 10 is reciprocated a set number of times, and the edge of the rectangular substrate 1 is cleaned by supplying the solvent and gas. After the cleaning process is completed, the nozzle block 10 is moved to the end of the rectangular substrate 1. The supply of the solvent from the solvent nozzles 3a,..., 3b is stopped as the sensor (not shown) detects that the nozzle block 10 is detached, and the gas nozzles 4a,. The discharge of the gas from 4b and the exhaust from the exhaust pipe 5 are stopped, and the cleaning process for the four edges of the square substrate 1 can be performed at once.
[0026]
(A) of FIG. 5 is a side view of the principal part which shows 2nd Embodiment of the board | substrate edge cleaning apparatus based on this invention, The difference from 1st Embodiment is as follows. That is, a portion having a predetermined length near the opening end 5a of the exhaust pipe 5 is configured to be equal in length in a direction parallel to the surface of the square substrate 1 and orthogonal to the substrate surface. Other configurations are the same as those of the first embodiment, and the description thereof is omitted by assigning the same reference numerals.
[0027]
FIG. 5B is a side view of the main part showing the third embodiment of the substrate edge cleaning apparatus according to the present invention. The difference from the second embodiment is as follows. A solvent nozzle 3a... For discharging the solvent only on the surface side of the square substrate 1 is inserted in a location near the opening end 5a of the exhaust pipe 5, and the solvent is discharged to the edge of the surface of the square substrate 1 to perform the cleaning process It is configured to be able to. Other configurations are the same as those of the second embodiment, and the description thereof is omitted by assigning the same reference numerals.
[0028]
FIG. 5C is a side view of the main part showing the fourth embodiment of the substrate edge cleaning apparatus according to the present invention. The differences from the third embodiment are as follows. Gas nozzles 4a are provided at positions closer to the opening end 5a of the exhaust pipe 5 than the solvent nozzles 3a. Other configurations are the same as those of the third embodiment, and the description thereof is omitted by assigning the same reference numerals.
[0029]
FIG. 6A is a plan view of an essential part showing the fifth embodiment of the substrate edge cleaning apparatus according to the present invention, and the differences from the first embodiment are as follows. In contrast to the four solvent nozzles 3a for supplying the solvent to the surface of the square substrate 1, eight gas nozzles 4a for supplying the gas are provided. Further, the opening area of the needle-like discharge part S2 of the gas nozzle 4a is configured to have a small diameter equal to the opening area of the needle-like discharge part S1 of the solvent nozzle 3a. Other configurations are the same as those of the first embodiment, and the description thereof is omitted by assigning the same reference numerals.
[0030]
FIG. 6B is a plan view of the main part showing the sixth embodiment of the substrate edge cleaning apparatus according to the present invention, and the differences from the first embodiment are as follows. Whereas there are four solvent nozzles 3a for supplying the solvent to the surface of the square substrate 1, five gas nozzles 4a for supplying gas are provided, and between the adjacent gas nozzles 4a, 4a, respectively. Solvent nozzles 3a are provided at corresponding positions. Further, the opening area of the needle-like discharge part S2 of the gas nozzle 4a is configured to have a small diameter equal to the opening area of the needle-like discharge part S1 of the solvent nozzle 3a. Other configurations are the same as those of the first embodiment, and the description thereof is omitted by assigning the same reference numerals.
[0031]
7 is a side view of an essential part showing a seventh embodiment of a substrate edge cleaning apparatus according to the present invention, FIG. 8 is a view taken along the line AA of FIG. 7, and FIG. 9 is an enlarged view of the essential part. There are the following differences from the first embodiment. A solvent pipe 20 and a gas pipe 21 are mounted in the casing body 19 in a horizontal posture. The solvent pipe 20 is connected to eight solvent nozzles 3 a... For supplying a solvent to the surface of the square substrate 1 and a solvent supply pipe 22, while the gas pipe 21 supplies gas to the surface of the square substrate 1. The eight gas nozzles 4a to be supplied and the gas supply pipe 23 are connected.
[0032]
The casing body 19 is detachably attached to the exhaust pipe 5 attached to the nozzle block 10, and eight solvent nozzles 3 b... For supplying a solvent to the back surface of the square substrate 1 are attached to the exhaust pipe 5. Yes.
[0033]
Further, a relay block 24 is attached to the nozzle block 10, and the relay block 24, the solvent supply pipe 22, the gas supply pipe 23, the intake pipe 25 connected to the exhaust pipe 5, and the solvent nozzle 3 b on the back side are connected. Each of the solvent supply pipes 26 is connected via a tube 27. Other configurations are the same as those of the first embodiment, and the description thereof is omitted by assigning the same reference numerals.
[0034]
According to the configuration of the seventh embodiment, since the solvent nozzles 3a and the gas nozzles 4a are integrally attached to the casing body 19, compared with the case where they are individually attached, the solvent discharge position and the gas There is an advantage that the positional accuracy relative to the discharge position can be increased.
[0035]
In the above-described embodiment, the substrate edge cleaning device is configured exclusively for the spin coating device for forming a thin film by using a photoresist coating solution or the like, and configured to improve the throughput. The substrate holding means of the spin coating apparatus may be combined with the substrate holding means 2 of the substrate edge cleaning apparatus.
[0036]
In the above embodiment, the solvent nozzles 3a, 3b, gas nozzles 4a, 4b, and the exhaust pipe 5 are provided corresponding to the four sides of the square substrate 1 held by the substrate holding means 2, respectively. As an invention, it is provided corresponding to only one side or two sides, combined with a structure in which the square substrate 1 is held and rotated, and the edge of the square substrate 1 is cleaned while rotating by 90 ° or 180 °. It may be configured to do.
[0037]
Moreover, in the said embodiment, although solvent nozzle 3a ..., 3b and gas nozzle 4a ..., 4b are provided so that it may wash | clean with respect to the edge of both the front and back of the square board | substrate 1, as front and back both sides as this invention It may be configured to be provided so as to clean any one of the edges. Moreover, you may comprise the discharge part of the gas nozzle 4b on the back side in the shape of a needle.
[0038]
Further, the present invention is not limited to the square substrate 1 and can also be applied to a substrate edge cleaning apparatus for cleaning a circular substrate.
[0039]
【The invention's effect】
As is apparent from the above description, according to the present invention, the gas from the gas nozzle is spotted on the substrate surface in order to blow off the unnecessary thin film dissolved by the solvent discharged from the solvent nozzle and the solvent to the outside of the edge of the substrate. The gas can be blown at a desired position on the substrate surface with sufficient pressure, the pressure drop when hitting the substrate surface is small, the gas spread on the substrate surface can be reduced, and the desired substrate surface In this position, the melted material can be accurately blown off, and the edge of the substrate can be cleaned without disturbing the uniformity of the thickness of the thin film applied to the substrate surface.
[Brief description of the drawings]
FIG. 1 is an overall schematic side view of a partly cutout of a substrate edge cleaning apparatus according to a first embodiment of the present invention.
FIG. 2 is an overall schematic plan view.
FIG. 3 is an enlarged side view of a main part.
FIG. 4 is a plan view of a main part.
5A is a side view of the main part of the substrate edge cleaning apparatus according to the second embodiment of the present invention, and FIG. 5B is the side view of the substrate edge cleaning apparatus according to the third embodiment of the present invention. The side view of the principal part, (c) is a side view of the principal part of the substrate edge cleaning apparatus according to the fourth embodiment of the present invention.
6A is a plan view of a main part of a substrate edge cleaning apparatus according to a fifth embodiment of the present invention, and FIG. 6B is a view of a substrate edge cleaning apparatus according to the sixth embodiment of the present invention. It is a top view of the principal part.
FIG. 7 is a side view of an essential part of a substrate edge cleaning apparatus according to a seventh embodiment of the present invention.
8 is a view taken along line AA in FIG.
FIG. 9 is an enlarged view of a main part.
[Tax of the sign]
DESCRIPTION OF SYMBOLS 1 ... Square substrate 2 ... Substrate holding means 3a, 3b ... Solvent nozzle 4a, 4b ... Exhaust pipe S2 ... Gas nozzle discharge part

Claims (7)

A solvent is discharged onto at least one of the substrate holding means for holding a substrate having a thin edge formed on its surface and having a linear edge, and the front and back surfaces of the edge of the substrate held by the substrate holding means. A substrate end provided with a solvent nozzle for dissolving the unnecessary thin film, a gas nozzle for blowing the dissolved material dissolved by the solvent outward from the edge of the substrate by gas blowing, and an exhaust pipe for sucking the solvent and the dissolved material In the edge cleaning device,
While providing a plurality of gas nozzles that spray the gas onto the surface of the substrate in a spot shape,
A plurality of solvent nozzles that spray the solvent onto the surface of the substrate in a spot shape,
Fixing the plurality of solvent nozzles along a length direction along the edge with respect to a fixing member whose length along the linear edge of the substrate is shorter than the length of the edge; Fixing the plurality of gas nozzles along a length direction along the edge on the center side of the substrate from the plurality of solvent nozzles;
A moving means for moving the fixing member in a direction along the linear edge with respect to the linear edge ;
The solvent discharge portion of the solvent nozzle and the gas discharge portion of the gas nozzle are provided on the fixed member in a state of being aligned on a straight line orthogonal to the linear edge, and the opening area of the gas discharge portion is A substrate edge cleaning apparatus having a larger opening area than the solvent discharge portion . The substrate edge cleaning apparatus according to claim 1,
A substrate edge cleaning apparatus, wherein a solvent pipe and a gas pipe are provided in the fixing member, the plurality of solvent nozzles are connected to the solvent pipe, and the plurality of gas nozzles are connected to the gas pipe, respectively. The substrate edge cleaning apparatus according to claim 1 or 2 ,
The substrate is a square substrate;
A fixing member in which the solvent nozzle and the gas nozzle are fixed, and a moving means for moving the fixing member relative to the linear edge in a direction along the linear edge. A substrate edge cleaning apparatus, which is provided corresponding to each side of a substrate. The substrate edge cleaning apparatus according to any one of claims 1 to 3 ,
For the exhaust pipe, a portion having a predetermined length reaching the substrate center side from the edge of the substrate is provided,
The substrate edge cleaning apparatus, wherein the discharge portion of the solvent nozzle and the discharge portion of the gas nozzle are positioned between the predetermined length portion of the exhaust pipe and the substrate. A solvent is discharged onto at least one of the substrate holding means for holding a substrate having a thin edge formed on its surface and having a linear edge, and the front and back surfaces of the edge of the substrate held by the substrate holding means. In a substrate edge cleaning apparatus comprising a solvent nozzle that dissolves an unnecessary thin film, and a gas nozzle that blows away a dissolved material dissolved by the solvent outward from the edge of the substrate by blowing a gas.
While providing a plurality of solvent nozzles that spray the solvent onto the surface of the substrate in a spot shape,
A number of gas nozzles that spray the gas onto the surface of the substrate in a spot shape are provided rather than the number of the solvent nozzles,
Fixing the plurality of solvent nozzles along a length direction along the edge with respect to a fixing member whose length along the linear edge of the substrate is shorter than the length of the edge; Fixing the plurality of gas nozzles along a length direction along the edge on the center side of the substrate with respect to the plurality of solvent nozzles;
A moving means for moving the fixing member in a direction along the linear edge with respect to the linear edge ;
The substrate edge cleaning apparatus , wherein an array range of the plurality of gas nozzles is larger than an array range of the plurality of solvent nozzles . The substrate edge cleaning apparatus according to claim 5 , wherein
The substrate edge cleaning apparatus, wherein the solvent nozzle is provided at a position corresponding to between the adjacent gas nozzles. A solvent is discharged onto at least one of the substrate holding means for holding a substrate having a thin edge formed on its surface and having a linear edge, and the front and back surfaces of the edge of the substrate held by the substrate holding means. In a substrate edge cleaning apparatus comprising a solvent nozzle that dissolves an unnecessary thin film, and a gas nozzle that blows away a dissolved material dissolved by the solvent outward from the edge of the substrate by blowing a gas.
While providing a plurality of solvent nozzles that spray the solvent onto the surface of the substrate in a spot shape,
A plurality of gas nozzles that spray the gas onto the surface of the substrate in a spot shape,
The plurality of solvent nozzles are fixed in a direction along the linear edge, and the plurality of gas nozzles are fixed in a direction along the edge on the center side of the substrate from the plurality of solvent nozzles, And the solvent nozzle and the gas nozzle provide a fixing member arranged in a staggered manner ,
The substrate edge cleaning apparatus , wherein an array range of the plurality of gas nozzles is larger than an array range of the plurality of solvent nozzles .

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