JP2003533026A - コンピュータトモグラフ用検出器 - Google Patents
コンピュータトモグラフ用検出器Info
- Publication number
- JP2003533026A JP2003533026A JP2001581346A JP2001581346A JP2003533026A JP 2003533026 A JP2003533026 A JP 2003533026A JP 2001581346 A JP2001581346 A JP 2001581346A JP 2001581346 A JP2001581346 A JP 2001581346A JP 2003533026 A JP2003533026 A JP 2003533026A
- Authority
- JP
- Japan
- Prior art keywords
- detector
- printed board
- substrate
- scintillator
- contact part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 238000002591 computed tomography Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 238000003491 array Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 206010011878 Deafness Diseases 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
- H01L27/14663—Indirect radiation imagers, e.g. using luminescent members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Measurement Of Radiation (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10021367A DE10021367C2 (de) | 2000-05-02 | 2000-05-02 | Detektor für Computertomographen |
| DE10021367.7 | 2000-05-02 | ||
| PCT/DE2001/001617 WO2001084629A2 (de) | 2000-05-02 | 2001-04-26 | Detektor für computertomographen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003533026A true JP2003533026A (ja) | 2003-11-05 |
Family
ID=7640540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001581346A Withdrawn JP2003533026A (ja) | 2000-05-02 | 2001-04-26 | コンピュータトモグラフ用検出器 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2003533026A (de) |
| DE (1) | DE10021367C2 (de) |
| IL (1) | IL147329A0 (de) |
| WO (1) | WO2001084629A2 (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004061478A1 (en) * | 2003-01-06 | 2004-07-22 | Koninklijke Philips Electronics N.V. | Radiation detector with shielded electronics for computed tomography |
| DE102005021991A1 (de) | 2005-05-09 | 2006-11-16 | Dr. Johannes Heidenhain Gmbh | Optoelektronische Anordnung und Verfahren zu deren Herstellung |
| CN111323082A (zh) * | 2020-03-20 | 2020-06-23 | 深圳市同创鑫电子有限公司 | 一种印刷电路板生产质量检测方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3787685A (en) * | 1972-05-30 | 1974-01-22 | Baird Atomic Inc | Zone grid assembly particularly for high resolution radioactivity distribution detection systems |
| US4338521A (en) * | 1980-05-09 | 1982-07-06 | General Electric Company | Modular radiation detector array and module |
| DE3503685A1 (de) * | 1985-02-04 | 1986-08-07 | Siemens AG, 1000 Berlin und 8000 München | Detektorsystem fuer einen computer-tomographen |
| US4845731A (en) * | 1985-06-05 | 1989-07-04 | Picker International | Radiation data acquistion |
| US5464984A (en) * | 1985-12-11 | 1995-11-07 | General Imaging Corporation | X-ray imaging system and solid state detector therefor |
| DE4442853A1 (de) * | 1994-12-01 | 1995-10-26 | Siemens Ag | Photodiodenarray |
| JPH11258351A (ja) * | 1998-03-12 | 1999-09-24 | Hitachi Medical Corp | 放射線検出器の製造方法 |
| DE19841423C1 (de) * | 1998-09-10 | 1999-12-30 | Siemens Ag | Strahlendetektor, insbesondere eines Computertomographen |
-
2000
- 2000-05-02 DE DE10021367A patent/DE10021367C2/de not_active Expired - Fee Related
-
2001
- 2001-04-26 JP JP2001581346A patent/JP2003533026A/ja not_active Withdrawn
- 2001-04-26 IL IL14732901A patent/IL147329A0/xx unknown
- 2001-04-26 WO PCT/DE2001/001617 patent/WO2001084629A2/de active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2001084629A3 (de) | 2002-05-23 |
| WO2001084629A2 (de) | 2001-11-08 |
| DE10021367A1 (de) | 2001-11-15 |
| DE10021367C2 (de) | 2002-06-20 |
| IL147329A0 (en) | 2002-08-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20080701 |