JP2003529207A - 半導体にコンタクトを自己ドーピングするための方法および装置 - Google Patents

半導体にコンタクトを自己ドーピングするための方法および装置

Info

Publication number
JP2003529207A
JP2003529207A JP2001542393A JP2001542393A JP2003529207A JP 2003529207 A JP2003529207 A JP 2003529207A JP 2001542393 A JP2001542393 A JP 2001542393A JP 2001542393 A JP2001542393 A JP 2001542393A JP 2003529207 A JP2003529207 A JP 2003529207A
Authority
JP
Japan
Prior art keywords
dopant
semiconductor
temperature
silver
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001542393A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003529207A5 (OSRAM
Inventor
メイエール,ダニエル・エル
デイヴィス,フバート・ピイ
ガルシア,ルース・エイ
ジェサップ,ジョイス・エイ
Original Assignee
エバラ・ソーラー・インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エバラ・ソーラー・インコーポレーテッド filed Critical エバラ・ソーラー・インコーポレーテッド
Publication of JP2003529207A publication Critical patent/JP2003529207A/ja
Publication of JP2003529207A5 publication Critical patent/JP2003529207A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/121The active layers comprising only Group IV materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/228Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a liquid phase, e.g. alloy diffusion processes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00Individual photovoltaic cells, e.g. solar cells
    • H10F10/10Individual photovoltaic cells, e.g. solar cells having potential barriers
    • H10F10/14Photovoltaic cells having only PN homojunction potential barriers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/10Semiconductor bodies
    • H10F77/12Active materials
    • H10F77/122Active materials comprising only Group IV materials
    • H10F77/1223Active materials comprising only Group IV materials characterised by the dopants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/20Electrodes
    • H10F77/206Electrodes for devices having potential barriers
    • H10F77/211Electrodes for devices having potential barriers for photovoltaic cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Photovoltaic Devices (AREA)
JP2001542393A 1999-11-23 2000-11-22 半導体にコンタクトを自己ドーピングするための方法および装置 Pending JP2003529207A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US16735899P 1999-11-23 1999-11-23
US60/167,358 1999-11-23
US09/538,034 US6632730B1 (en) 1999-11-23 2000-03-29 Method for self-doping contacts to a semiconductor
US09/538,034 2000-03-29
PCT/US2000/032257 WO2001041221A1 (en) 1999-11-23 2000-11-22 Method and apparatus for self-doping contacts to a semiconductor

Publications (2)

Publication Number Publication Date
JP2003529207A true JP2003529207A (ja) 2003-09-30
JP2003529207A5 JP2003529207A5 (OSRAM) 2005-12-22

Family

ID=26863088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001542393A Pending JP2003529207A (ja) 1999-11-23 2000-11-22 半導体にコンタクトを自己ドーピングするための方法および装置

Country Status (10)

Country Link
US (4) US6632730B1 (OSRAM)
EP (1) EP1234342A1 (OSRAM)
JP (1) JP2003529207A (OSRAM)
KR (1) KR20020066327A (OSRAM)
CN (1) CN1260830C (OSRAM)
AU (1) AU780960B2 (OSRAM)
BR (1) BR0015803A (OSRAM)
CA (1) CA2392342C (OSRAM)
MX (1) MXPA02005186A (OSRAM)
WO (1) WO2001041221A1 (OSRAM)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008513976A (ja) * 2004-09-15 2008-05-01 フラウンホッファー−ゲゼルシャフト ツァー フェーデルング デア アンゲバンテン フォルシュング エー ファー 半導体層の再結晶化及びドーピングを同時に行うための方法並びにこの方法によって製造される半導体層構造
JPWO2008078771A1 (ja) * 2006-12-26 2010-04-30 京セラ株式会社 太陽電池素子及び太陽電池素子の製造方法
WO2012077567A1 (ja) * 2010-12-06 2012-06-14 信越化学工業株式会社 太陽電池及び太陽電池モジュール
US9224888B2 (en) 2010-12-06 2015-12-29 Shin-Etsu Chemical Co., Ltd. Solar cell and solar-cell module

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7384677B2 (en) * 1998-06-22 2008-06-10 Target Technology Company, Llc Metal alloys for the reflective or semi-reflective layer of an optical storage medium
US7314657B2 (en) * 2000-07-21 2008-01-01 Target Technology Company, Llc Metal alloys for the reflective or the semi-reflective layer of an optical storage medium
US6852384B2 (en) * 1998-06-22 2005-02-08 Han H. Nee Metal alloys for the reflective or the semi-reflective layer of an optical storage medium
US7045187B2 (en) * 1998-06-22 2006-05-16 Nee Han H Metal alloys for the reflective or the semi-reflective layer of an optical storage medium
US7374805B2 (en) * 2000-07-21 2008-05-20 Target Technology Company, Llc Metal alloys for the reflective or the semi-reflective layer of an optical storage medium
US7316837B2 (en) * 2000-07-21 2008-01-08 Target Technology Company, Llc Metal alloys for the reflective or the semi-reflective layer of an optical storage medium
US7314659B2 (en) * 2000-07-21 2008-01-01 Target Technology Company, Llc Metal alloys for the reflective or semi-reflective layer of an optical storage medium
WO2004066354A2 (en) * 2003-01-16 2004-08-05 Target Technology Company, Llc Photo-voltaic cells including solar cells incorporating silver-alloy reflective and/or transparent conductive surfaces
TWI368819B (en) * 2003-04-18 2012-07-21 Target Technology Co Llc Metal alloys for the reflective or the semi-reflective layer of an optical storage medium
US8664525B2 (en) * 2003-05-07 2014-03-04 Imec Germanium solar cell and method for the production thereof
US7964789B2 (en) * 2003-05-07 2011-06-21 Imec Germanium solar cell and method for the production thereof
US7960645B2 (en) * 2003-05-07 2011-06-14 Imec Germanium solar cell and method for the production thereof
US7170001B2 (en) * 2003-06-26 2007-01-30 Advent Solar, Inc. Fabrication of back-contacted silicon solar cells using thermomigration to create conductive vias
US7649141B2 (en) * 2003-06-30 2010-01-19 Advent Solar, Inc. Emitter wrap-through back contact solar cells on thin silicon wafers
JP2005135942A (ja) * 2003-10-28 2005-05-26 Canon Inc 電極配設方法
US20050172996A1 (en) 2004-02-05 2005-08-11 Advent Solar, Inc. Contact fabrication of emitter wrap-through back contact silicon solar cells
US20060060238A1 (en) * 2004-02-05 2006-03-23 Advent Solar, Inc. Process and fabrication methods for emitter wrap through back contact solar cells
US7144751B2 (en) * 2004-02-05 2006-12-05 Advent Solar, Inc. Back-contact solar cells and methods for fabrication
US7335555B2 (en) * 2004-02-05 2008-02-26 Advent Solar, Inc. Buried-contact solar cells with self-doping contacts
US20060039973A1 (en) * 2004-08-19 2006-02-23 Mary Aldritt Effervescent composition including water soluble dietary fiber
JP4846219B2 (ja) * 2004-09-24 2011-12-28 シャープ株式会社 結晶シリコン太陽電池の製造方法
US20060102228A1 (en) * 2004-11-12 2006-05-18 Ferro Corporation Method of making solar cell contacts
US7790574B2 (en) 2004-12-20 2010-09-07 Georgia Tech Research Corporation Boron diffusion in silicon devices
GB2424312B (en) * 2005-03-14 2010-03-03 Denso Corp Method of forming an ohmic contact in wide band semiconductor
US8093491B2 (en) * 2005-06-03 2012-01-10 Ferro Corporation Lead free solar cell contacts
US7824579B2 (en) * 2005-06-07 2010-11-02 E. I. Du Pont De Nemours And Company Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof
US7771623B2 (en) * 2005-06-07 2010-08-10 E.I. du Pont de Nemours and Company Dupont (UK) Limited Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof
US20070014963A1 (en) * 2005-07-12 2007-01-18 Nee Han H Metal alloys for the reflective layer of an optical storage medium
US7718092B2 (en) * 2005-10-11 2010-05-18 E.I. Du Pont De Nemours And Company Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof
EP1988773B1 (en) * 2006-02-28 2014-04-23 Basf Se Antimicrobial compounds
US8076570B2 (en) 2006-03-20 2011-12-13 Ferro Corporation Aluminum-boron solar cell contacts
US8575474B2 (en) * 2006-03-20 2013-11-05 Heracus Precious Metals North America Conshohocken LLC Solar cell contacts containing aluminum and at least one of boron, titanium, nickel, tin, silver, gallium, zinc, indium and copper
US8203433B2 (en) * 2006-05-04 2012-06-19 Intermec Ip Corp. Method for commissioning an RFID network
US20080111206A1 (en) * 2006-11-10 2008-05-15 Evergreen Solar, Inc. Substrate with Two Sided Doping and Method of Producing the Same
CA2568136C (en) * 2006-11-30 2008-07-29 Tenxc Wireless Inc. Butler matrix implementation
US8608972B2 (en) * 2006-12-05 2013-12-17 Nano Terra Inc. Method for patterning a surface
US20080152835A1 (en) * 2006-12-05 2008-06-26 Nano Terra Inc. Method for Patterning a Surface
WO2008080160A1 (en) * 2006-12-22 2008-07-03 Advent Solar, Inc. Interconnect technologies for back contact solar cells and modules
US20080264332A1 (en) * 2007-04-25 2008-10-30 Fareed Sepehry-Fard Method, system, and apparatus for doping and for multi-chamber high-throughput solid-phase epitaxy deposition process
CN101663711B (zh) * 2007-04-25 2013-02-27 费罗公司 含银和镍或银和镍合金的厚膜导体配方及由其制成的太阳能电池
TWI449183B (zh) 2007-06-13 2014-08-11 Schott Solar Ag 半導體元件及製造金屬半導體接點之方法
US8309844B2 (en) * 2007-08-29 2012-11-13 Ferro Corporation Thick film pastes for fire through applications in solar cells
JP5629210B2 (ja) * 2007-08-31 2014-11-19 ヘレウス プレシャス メタルズ ノース アメリカ コンショホーケン エルエルシー 太陽電池用層状コンタクト構造
WO2009064870A2 (en) * 2007-11-13 2009-05-22 Advent Solar, Inc. Selective emitter and texture processes for back contact solar cells
US20090239363A1 (en) * 2008-03-24 2009-09-24 Honeywell International, Inc. Methods for forming doped regions in semiconductor substrates using non-contact printing processes and dopant-comprising inks for forming such doped regions using non-contact printing processes
US20100012172A1 (en) * 2008-04-29 2010-01-21 Advent Solar, Inc. Photovoltaic Modules Manufactured Using Monolithic Module Assembly Techniques
US8207444B2 (en) * 2008-07-01 2012-06-26 Sunpower Corporation Front contact solar cell with formed electrically conducting layers on the front side and backside
US20100035422A1 (en) * 2008-08-06 2010-02-11 Honeywell International, Inc. Methods for forming doped regions in a semiconductor material
US8053867B2 (en) * 2008-08-20 2011-11-08 Honeywell International Inc. Phosphorous-comprising dopants and methods for forming phosphorous-doped regions in semiconductor substrates using phosphorous-comprising dopants
US20100186811A1 (en) * 2008-08-26 2010-07-29 Sixtron Advanced Materials, Inc. Silicon Carbonitride Antireflective Coating
US7951696B2 (en) * 2008-09-30 2011-05-31 Honeywell International Inc. Methods for simultaneously forming N-type and P-type doped regions using non-contact printing processes
US7820532B2 (en) * 2008-12-29 2010-10-26 Honeywell International Inc. Methods for simultaneously forming doped regions having different conductivity-determining type element profiles
US8518170B2 (en) * 2008-12-29 2013-08-27 Honeywell International Inc. Boron-comprising inks for forming boron-doped regions in semiconductor substrates using non-contact printing processes and methods for fabricating such boron-comprising inks
US20100224243A1 (en) * 2009-03-05 2010-09-09 Applied Materials, Inc. Adhesion between azo and ag for the back contact in tandem junction cell by metal alloy
US20100132775A1 (en) * 2009-03-05 2010-06-03 Applied Materials, Inc. Adhesion between azo and ag for the back contact in tandem junction cell by metal alloy
KR101145928B1 (ko) * 2009-03-11 2012-05-15 엘지전자 주식회사 태양 전지 및 태양 전지의 제조 방법
US8324089B2 (en) * 2009-07-23 2012-12-04 Honeywell International Inc. Compositions for forming doped regions in semiconductor substrates, methods for fabricating such compositions, and methods for forming doped regions using such compositions
KR20110024639A (ko) * 2009-09-02 2011-03-09 엘지이노텍 주식회사 도펀트 확산용액, 및 이의 용도
US20110132444A1 (en) 2010-01-08 2011-06-09 Meier Daniel L Solar cell including sputtered reflective layer and method of manufacture thereof
US8241945B2 (en) * 2010-02-08 2012-08-14 Suniva, Inc. Solar cells and methods of fabrication thereof
KR101032740B1 (ko) * 2010-10-05 2011-05-06 에프알앤디건설(주) 교량의 교좌장치
WO2012083191A2 (en) * 2010-12-16 2012-06-21 The Regents Of The University Of Michigan Silicon-based solar cell with eutectic composition
US9362015B2 (en) 2010-12-16 2016-06-07 The Regents Of The University Of Michigan Silicon-based solar cell with eutectic composition
US8629294B2 (en) 2011-08-25 2014-01-14 Honeywell International Inc. Borate esters, boron-comprising dopants, and methods of fabricating boron-comprising dopants
US8975170B2 (en) 2011-10-24 2015-03-10 Honeywell International Inc. Dopant ink compositions for forming doped regions in semiconductor substrates, and methods for fabricating dopant ink compositions
TWM512217U (zh) 2013-06-20 2015-11-11 Plant PV 太陽能電池
USD706224S1 (en) * 2013-08-01 2014-06-03 Ebara Corporation Electrical contact for use in a plating apparatus
US20160224935A1 (en) * 2014-07-08 2016-08-04 Rick Burnett Shipper and Carrier Interaction Optimization Platform
US9559642B2 (en) 2015-01-02 2017-01-31 Logitech Europe, S.A. Audio delivery system having an improved efficiency and extended operation time between recharges or battery replacements
US10550291B2 (en) 2015-08-25 2020-02-04 Hitachi Chemical Co., Ltd. Core-shell, oxidation-resistant, electrically conducting particles for low temperature conductive applications
WO2017035102A1 (en) 2015-08-26 2017-03-02 Plant Pv, Inc Silver-bismuth non-contact metallization pastes for silicon solar cells
US10696851B2 (en) 2015-11-24 2020-06-30 Hitachi Chemical Co., Ltd. Print-on pastes for modifying material properties of metal particle layers
CN115274912B (zh) * 2022-08-01 2024-01-30 中国电子科技集团公司第四十四研究所 高空间分辨率的x射线探测器单元、探测器及其制作方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2998334A (en) 1958-03-07 1961-08-29 Transitron Electronic Corp Method of making transistors
US3159215A (en) * 1958-09-23 1964-12-01 California Research Corp Assisted petroleum recovery by selective combustion in multi-bedded reservoirs
AU419791B2 (en) 1968-06-20 1971-12-15 Matsushita Electric Industrial Co., Ltd Method of making a switching element
NL7013227A (OSRAM) * 1970-09-08 1972-03-10 Philips Nv
GB1416964A (en) 1973-07-09 1975-12-10 Akimov J S Contact between an electrode metal and a semiconductor
US4184897A (en) * 1978-09-21 1980-01-22 General Electric Company Droplet migration doping using carrier droplets
US4159215A (en) * 1978-09-21 1979-06-26 General Electric Company Droplet migration doping using reactive carriers and dopants
US4207670A (en) * 1978-09-28 1980-06-17 General Electric Company Method for making a solid state neuron
US4163983A (en) * 1978-09-28 1979-08-07 General Electric Company Solid state neuron
US4198247A (en) * 1978-12-07 1980-04-15 General Electric Company Sealant films for materials having high intrinsic vapor pressure
DE2939541A1 (de) 1979-09-28 1981-04-16 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von halbleitereigenschaften aufweisendem, mit antimon hochdotiertem silicium
JPS59189679A (ja) * 1983-04-13 1984-10-27 Hitachi Ltd ダイオ−ド
JPS6249676A (ja) 1985-08-29 1987-03-04 Sharp Corp 太陽電池
US5258624A (en) 1988-05-27 1993-11-02 U.S. Philips Corp. Transferred electron effect device
DE3901042A1 (de) 1989-01-14 1990-07-26 Nukem Gmbh Verfahren und vorrichtung zur herstellung eines halbleiter-schichtsystems
JPH0919118A (ja) 1995-06-28 1997-01-17 Toshiba Corp くし形回転電機の回転子の製造方法
US5641362A (en) 1995-11-22 1997-06-24 Ebara Solar, Inc. Structure and fabrication process for an aluminum alloy junction self-aligned back contact silicon solar cell
JPH09191118A (ja) 1996-01-11 1997-07-22 Shin Etsu Chem Co Ltd 太陽電池の製造方法
US6180869B1 (en) 1997-05-06 2001-01-30 Ebara Solar, Inc. Method and apparatus for self-doping negative and positive electrodes for silicon solar cells and other devices

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008513976A (ja) * 2004-09-15 2008-05-01 フラウンホッファー−ゲゼルシャフト ツァー フェーデルング デア アンゲバンテン フォルシュング エー ファー 半導体層の再結晶化及びドーピングを同時に行うための方法並びにこの方法によって製造される半導体層構造
JPWO2008078771A1 (ja) * 2006-12-26 2010-04-30 京セラ株式会社 太陽電池素子及び太陽電池素子の製造方法
US9093590B2 (en) 2006-12-26 2015-07-28 Kyocera Corporation Solar cell and solar cell manufacturing method
WO2012077567A1 (ja) * 2010-12-06 2012-06-14 信越化学工業株式会社 太陽電池及び太陽電池モジュール
US9224888B2 (en) 2010-12-06 2015-12-29 Shin-Etsu Chemical Co., Ltd. Solar cell and solar-cell module
US9887312B2 (en) 2010-12-06 2018-02-06 Shin-Etsu Chemical Co., Ltd. Solar cell and solar-cell module

Also Published As

Publication number Publication date
CA2392342C (en) 2011-01-04
AU780960B2 (en) 2005-04-28
CN1415119A (zh) 2003-04-30
CA2392342A1 (en) 2001-06-07
US6664631B2 (en) 2003-12-16
CN1260830C (zh) 2006-06-21
BR0015803A (pt) 2002-08-13
KR20020066327A (ko) 2002-08-14
WO2001041221A1 (en) 2001-06-07
US20030008485A1 (en) 2003-01-09
AU1798301A (en) 2001-06-12
US20030003693A1 (en) 2003-01-02
US6737340B2 (en) 2004-05-18
MXPA02005186A (es) 2004-05-05
US6703295B2 (en) 2004-03-09
EP1234342A1 (en) 2002-08-28
US20030203603A1 (en) 2003-10-30
US6632730B1 (en) 2003-10-14

Similar Documents

Publication Publication Date Title
JP2003529207A (ja) 半導体にコンタクトを自己ドーピングするための方法および装置
US6180869B1 (en) Method and apparatus for self-doping negative and positive electrodes for silicon solar cells and other devices
CN102282650B (zh) 背面结太阳能电池
WO1987007766A1 (en) Drive through doping process for manufacturing low back surface recombination solar cells
AU3853489A (en) An improved method of fabricating contacts for solar cells
US20160190364A1 (en) Seed layer for solar cell conductive contact
US20140338743A1 (en) Solar cell and method for preparing the same
US9431552B2 (en) Metallization paste for solar cells
Meier et al. Self-doping contacts to silicon using silver coated with a dopant source [for solar cells]
AU766063B2 (en) Method and apparatus for self-doping negative and positive electrodes for silicon solar cells and other devices
Jessup et al. 3,767.482 A isois A-/1979 Chang et T while so doing dopant atoms are incorporated into the is oss A-s/1979 Cline et al. re-grown silicon lattice. Once the temperature drops below isso A* i/1980 Anthony et al. the silver-silicon eutectic temperature the silicon which has
Meier et al. Self-Doping Silver Contacts for Silicon Solar Cells
Addo et al. Doped self-aligned metallization for solar cells
MXPA99010119A (en) Method and apparatus for self-doping negative and positive electrodes for silicon solar cells and other devices
HK1032294A (en) Method and apparatus for self-doping negative and positive electrodes for silicon solar cells and other diveces

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040726

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040726

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20040628

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20040902

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070403

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20070731