JP2003520435A - Ｆｄｃ半導体製造プロセスからトレースデータ報告を要求する方法 - Google Patents

Ｆｄｃ半導体製造プロセスからトレースデータ報告を要求する方法

Info

Publication number
JP2003520435A
JP2003520435A JP2001552442A JP2001552442A JP2003520435A JP 2003520435 A JP2003520435 A JP 2003520435A JP 2001552442 A JP2001552442 A JP 2001552442A JP 2001552442 A JP2001552442 A JP 2001552442A JP 2003520435 A JP2003520435 A JP 2003520435A
Authority
JP
Japan
Prior art keywords
data
report
trace data
trace
request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001552442A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003520435A5 (enExample
Inventor
コス，エフィード，ジュニア
コンボイ，マイケル・アール
ヘンドリクス，ブライス・エイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of JP2003520435A publication Critical patent/JP2003520435A/ja
Publication of JP2003520435A5 publication Critical patent/JP2003520435A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • General Factory Administration (AREA)
  • Debugging And Monitoring (AREA)
JP2001552442A 2000-01-07 2000-09-20 Ｆｄｃ半導体製造プロセスからトレースデータ報告を要求する方法 Withdrawn JP2003520435A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/479,852 2000-01-07
US09/479,852 US6871112B1 (en) 2000-01-07 2000-01-07 Method for requesting trace data reports from FDC semiconductor fabrication processes
PCT/US2000/025736 WO2001052320A2 (en) 2000-01-07 2000-09-20 A method for requesting trace data reports from fault detection controlled semiconductor fabrication processes

Publications (2)

Publication Number Publication Date
JP2003520435A true JP2003520435A (ja) 2003-07-02
JP2003520435A5 JP2003520435A5 (enExample) 2007-10-25

Family

ID=23905702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001552442A Withdrawn JP2003520435A (ja) 2000-01-07 2000-09-20 Ｆｄｃ半導体製造プロセスからトレースデータ報告を要求する方法

Country Status (5)

Country Link
US (1) US6871112B1 (enExample)
EP (1) EP1245042A2 (enExample)
JP (1) JP2003520435A (enExample)
KR (1) KR100734531B1 (enExample)
WO (1) WO2001052320A2 (enExample)

Cited By (1)

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JPWO2014007081A1 (ja) * 2012-07-04 2016-06-02 株式会社日立国際電気 基板処理システム、基板処理装置及びデータ処理方法並びに記憶媒体

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US7200671B1 (en) * 2000-08-23 2007-04-03 Mks Instruments, Inc. Method and apparatus for monitoring host to tool communications
JP3957475B2 (ja) * 2001-05-18 2007-08-15 東京エレクトロン株式会社 基板処理装置
US8180587B2 (en) * 2002-03-08 2012-05-15 Globalfoundries Inc. System for brokering fault detection data
US8359494B2 (en) 2002-12-18 2013-01-22 Globalfoundries Inc. Parallel fault detection
US7213478B2 (en) * 2003-02-18 2007-05-08 Tokyo Electron Limited Method for automatic configuration of processing system
US20050021037A1 (en) * 2003-05-29 2005-01-27 Mccombs Daniel L. Image-guided navigated precision reamers
EP1665362A2 (en) 2003-08-25 2006-06-07 Tau-Metrix, Inc. Technique for evaluating a fabrication of a semiconductor component and wafer
CN101556930B (zh) * 2003-08-25 2013-04-10 陶-梅特里克斯公司 用于评估半导体元件与晶片制造的技术
US7110918B2 (en) 2003-11-05 2006-09-19 Shoplogix Inc. Self-contained system and method for remotely monitoring machines
WO2005045713A1 (en) * 2003-11-05 2005-05-19 Shoplogix, Inc. Self-contained system and method for remotely monitoring machines
US8112400B2 (en) * 2003-12-23 2012-02-07 Texas Instruments Incorporated Method for collecting data from semiconductor equipment
US7146237B2 (en) * 2004-04-07 2006-12-05 Mks Instruments, Inc. Controller and method to mediate data collection from smart sensors for fab applications
US7680556B2 (en) 2004-11-15 2010-03-16 Tech Semiconductor Singapore Pte. Ltd. Method for data collection during manufacturing processes
US7787477B2 (en) * 2005-07-11 2010-08-31 Mks Instruments, Inc. Address-transparent device and method
KR100702843B1 (ko) * 2005-08-12 2007-04-03 삼성전자주식회사 로트가변 배치처리가 가능한 반도체 제조설비 및 그로트가변 배치처리방법
JP5177958B2 (ja) * 2006-03-31 2013-04-10 Ｈｏｙａ株式会社 処理データ管理システム、磁気ディスク製造装置用の処理システム、および、磁気ディスク製造装置のデータ管理方法
US20070240122A1 (en) * 2006-04-05 2007-10-11 Chiahong Chen Method, system and program storage device for providing request trace data in a user mode device interface
JP2008077286A (ja) * 2006-09-20 2008-04-03 Dainippon Screen Mfg Co Ltd 産業プロセス評価装置、産業プロセス評価方法及び産業プロセス評価プログラム
US9021140B2 (en) * 2007-03-12 2015-04-28 Citrix Systems, Inc. Systems and methods for error detection
US8572160B2 (en) * 2007-03-12 2013-10-29 Citrix Systems, Inc. Systems and methods for script injection
US20080228863A1 (en) * 2007-03-12 2008-09-18 Timothy Mackey Systems and Methods for End-User Experience Monitoring Using A Script
EP2145452B1 (en) 2007-05-07 2011-08-03 Vorne Industries, Inc. Method and system for extending the capabilities of embedded devices through network clients
KR20220053603A (ko) * 2019-08-26 2022-04-29 도쿄엘렉트론가부시키가이샤 정보 처리 장치 및 기판 처리 방법
JP7575955B2 (ja) * 2021-01-13 2024-10-30 キヤノン株式会社 制御装置、システム、リソグラフィ装置、物品の製造方法、制御方法及びプログラム
KR20230162280A (ko) 2022-05-20 2023-11-28 (주)미소정보기술 전 과정을 모듈화하여 연결한 워크플로우가 구비된 fdc 시스템 및 그 처리방법

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JPH0793233A (ja) 1993-09-20 1995-04-07 Fujitsu Ltd ファームウェア・トレースデータ取得方式
US5625816A (en) 1994-04-05 1997-04-29 Advanced Micro Devices, Inc. Method and system for generating product performance history
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JP3699776B2 (ja) * 1996-04-02 2005-09-28 株式会社日立製作所 電子部品の製造方法
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US5859964A (en) * 1996-10-25 1999-01-12 Advanced Micro Devices, Inc. System and method for performing real time data acquisition, process modeling and fault detection of wafer fabrication processes
JPH11119992A (ja) 1997-10-09 1999-04-30 Nec Eng Ltd ファームウェアのトレース制御装置
EP0932195A1 (en) 1997-12-30 1999-07-28 International Business Machines Corporation Method and system for semiconductor wafer fabrication process real-time in-situ supervision
US6438441B1 (en) * 1999-06-28 2002-08-20 Hyundai Electronics Industries Co., Ltd. Semiconductor factory automation system and method for resetting process recipe by employing trace file
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014007081A1 (ja) * 2012-07-04 2016-06-02 株式会社日立国際電気 基板処理システム、基板処理装置及びデータ処理方法並びに記憶媒体

Also Published As

Publication number Publication date
US6871112B1 (en) 2005-03-22
KR100734531B1 (ko) 2007-07-04
WO2001052320A3 (en) 2002-01-17
EP1245042A2 (en) 2002-10-02
KR20020063270A (ko) 2002-08-01
WO2001052320A2 (en) 2001-07-19

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