KR100734531B1 - Ｆｄｃ 반도체 제조 프로세스로부터 트레이스 데이터 리포트들을 요구하는 방법 및 반도체 제조 프로세싱 시스템 - Google Patents

Ｆｄｃ 반도체 제조 프로세스로부터 트레이스 데이터 리포트들을 요구하는 방법 및 반도체 제조 프로세싱 시스템 Download PDF

Info

Publication number
KR100734531B1
KR100734531B1 KR1020027008330A KR20027008330A KR100734531B1 KR 100734531 B1 KR100734531 B1 KR 100734531B1 KR 1020027008330 A KR1020027008330 A KR 1020027008330A KR 20027008330 A KR20027008330 A KR 20027008330A KR 100734531 B1 KR100734531 B1 KR 100734531B1
Authority
KR
South Korea
Prior art keywords
report
data
trace data
request
trace
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020027008330A
Other languages
English (en)
Korean (ko)
Other versions
KR20020063270A (ko
Inventor
코스에피도주니어
콘보이마이클알.
헨드릭스브라이스에이.
Original Assignee
어드밴스드 마이크로 디바이시즈, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어드밴스드 마이크로 디바이시즈, 인코포레이티드 filed Critical 어드밴스드 마이크로 디바이시즈, 인코포레이티드
Publication of KR20020063270A publication Critical patent/KR20020063270A/ko
Application granted granted Critical
Publication of KR100734531B1 publication Critical patent/KR100734531B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • General Factory Administration (AREA)
  • Debugging And Monitoring (AREA)
KR1020027008330A 2000-01-07 2000-09-20 Ｆｄｃ 반도체 제조 프로세스로부터 트레이스 데이터 리포트들을 요구하는 방법 및 반도체 제조 프로세싱 시스템 Expired - Fee Related KR100734531B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/479,852 2000-01-07
US09/479,852 US6871112B1 (en) 2000-01-07 2000-01-07 Method for requesting trace data reports from FDC semiconductor fabrication processes

Publications (2)

Publication Number Publication Date
KR20020063270A KR20020063270A (ko) 2002-08-01
KR100734531B1 true KR100734531B1 (ko) 2007-07-04

Family

ID=23905702

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027008330A Expired - Fee Related KR100734531B1 (ko) 2000-01-07 2000-09-20 Ｆｄｃ 반도체 제조 프로세스로부터 트레이스 데이터 리포트들을 요구하는 방법 및 반도체 제조 프로세싱 시스템

Country Status (5)

Country Link
US (1) US6871112B1 (enExample)
EP (1) EP1245042A2 (enExample)
JP (1) JP2003520435A (enExample)
KR (1) KR100734531B1 (enExample)
WO (1) WO2001052320A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230162280A (ko) 2022-05-20 2023-11-28 (주)미소정보기술 전 과정을 모듈화하여 연결한 워크플로우가 구비된 fdc 시스템 및 그 처리방법
US12468233B2 (en) 2021-01-13 2025-11-11 Canon Kabushiki Kaisha Control apparatus, system, lithography apparatus, article manufacturing method, control method, and non-transitory storage medium

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9785140B2 (en) * 2000-02-01 2017-10-10 Peer Intellectual Property Inc. Multi-protocol multi-client equipment server
EP1266304A1 (en) * 2000-03-02 2002-12-18 MMC Webreporter Systems.Com INC. System and method for creating a book of reports over a computer network
US7200671B1 (en) * 2000-08-23 2007-04-03 Mks Instruments, Inc. Method and apparatus for monitoring host to tool communications
JP3957475B2 (ja) * 2001-05-18 2007-08-15 東京エレクトロン株式会社 基板処理装置
US8180587B2 (en) * 2002-03-08 2012-05-15 Globalfoundries Inc. System for brokering fault detection data
US8359494B2 (en) 2002-12-18 2013-01-22 Globalfoundries Inc. Parallel fault detection
US7213478B2 (en) * 2003-02-18 2007-05-08 Tokyo Electron Limited Method for automatic configuration of processing system
US20050021037A1 (en) * 2003-05-29 2005-01-27 Mccombs Daniel L. Image-guided navigated precision reamers
CN101556930B (zh) * 2003-08-25 2013-04-10 陶-梅特里克斯公司 用于评估半导体元件与晶片制造的技术
US7730434B2 (en) * 2003-08-25 2010-06-01 Tau-Metrix, Inc. Contactless technique for evaluating a fabrication of a wafer
US7110918B2 (en) 2003-11-05 2006-09-19 Shoplogix Inc. Self-contained system and method for remotely monitoring machines
EP1695272A4 (en) * 2003-11-05 2009-05-06 Shoplogix Inc AUTONOMOUS SYSTEM AND METHOD OF TESTING MACHINES
US8112400B2 (en) * 2003-12-23 2012-02-07 Texas Instruments Incorporated Method for collecting data from semiconductor equipment
US7146237B2 (en) * 2004-04-07 2006-12-05 Mks Instruments, Inc. Controller and method to mediate data collection from smart sensors for fab applications
US7680556B2 (en) 2004-11-15 2010-03-16 Tech Semiconductor Singapore Pte. Ltd. Method for data collection during manufacturing processes
US7787477B2 (en) * 2005-07-11 2010-08-31 Mks Instruments, Inc. Address-transparent device and method
KR100702843B1 (ko) * 2005-08-12 2007-04-03 삼성전자주식회사 로트가변 배치처리가 가능한 반도체 제조설비 및 그로트가변 배치처리방법
JP5177958B2 (ja) * 2006-03-31 2013-04-10 Ｈｏｙａ株式会社 処理データ管理システム、磁気ディスク製造装置用の処理システム、および、磁気ディスク製造装置のデータ管理方法
US20070240122A1 (en) * 2006-04-05 2007-10-11 Chiahong Chen Method, system and program storage device for providing request trace data in a user mode device interface
JP2008077286A (ja) * 2006-09-20 2008-04-03 Dainippon Screen Mfg Co Ltd 産業プロセス評価装置、産業プロセス評価方法及び産業プロセス評価プログラム
US8572160B2 (en) * 2007-03-12 2013-10-29 Citrix Systems, Inc. Systems and methods for script injection
US9021140B2 (en) * 2007-03-12 2015-04-28 Citrix Systems, Inc. Systems and methods for error detection
US20080228863A1 (en) * 2007-03-12 2008-09-18 Timothy Mackey Systems and Methods for End-User Experience Monitoring Using A Script
PL2381649T3 (pl) 2007-05-07 2015-02-27 Vorne Ind Inc Sposób i system do rozszerzania możliwości urządzeń wbudowanych z wykorzystaniem klientów sieciowych
WO2014007081A1 (ja) * 2012-07-04 2014-01-09 株式会社日立国際電気 基板処理システム、基板処理装置及びデータ処理方法並びに記憶媒体
US12332630B2 (en) * 2019-08-26 2025-06-17 Tokyo Electron Limited Information processing apparatus and substrate processing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100207468B1 (ko) 1996-03-07 1999-07-15 윤종용 웨이퍼의 결함분석 시스템

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5413883A (en) 1977-07-04 1979-02-01 Hitachi Ltd Abnormalness detector of automatic controller
JPS6248850A (ja) 1985-08-28 1987-03-03 Hitachi Eng Co Ltd 公衆回線結合リモ−ト障害デ−タ収集装置
US4861419A (en) * 1987-08-04 1989-08-29 Texas Instruments Incorporated Apparatus and method for production process diagnosis using dynamic time warping
JPH0322064A (ja) 1989-06-19 1991-01-30 Nec Corp 計算機通信システム
US5121335A (en) * 1990-02-09 1992-06-09 Hughes Aircraft Company Method and apparatus for verifying microcircuit fabrication procedure
DE4113556C3 (de) * 1990-04-26 2000-02-24 Mazda Motor Produktionseinrichtung zum Steuern von Produktionsvorgängen und Produktionssteuerverfahren für Produktionsvorgänge
US5196997A (en) * 1991-01-22 1993-03-23 International Business Machines Corporation Method and apparatus for quality measure driven process control
JPH0793233A (ja) 1993-09-20 1995-04-07 Fujitsu Ltd ファームウェア・トレースデータ取得方式
US5625816A (en) 1994-04-05 1997-04-29 Advanced Micro Devices, Inc. Method and system for generating product performance history
US5576629A (en) * 1994-10-24 1996-11-19 Fourth State Technology, Inc. Plasma monitoring and control method and system
US5751581A (en) 1995-11-13 1998-05-12 Advanced Micro Devices Material movement server
JP3699776B2 (ja) * 1996-04-02 2005-09-28 株式会社日立製作所 電子部品の製造方法
TWI249760B (en) * 1996-07-31 2006-02-21 Canon Kk Remote maintenance system
US5859964A (en) * 1996-10-25 1999-01-12 Advanced Micro Devices, Inc. System and method for performing real time data acquisition, process modeling and fault detection of wafer fabrication processes
JPH11119992A (ja) 1997-10-09 1999-04-30 Nec Eng Ltd ファームウェアのトレース制御装置
EP0932195A1 (en) 1997-12-30 1999-07-28 International Business Machines Corporation Method and system for semiconductor wafer fabrication process real-time in-situ supervision
JP4603131B2 (ja) * 1999-06-28 2010-12-22 株式会社ハイニックスセミコンダクター 半導体製造システムの工程レシピ再設定装置及び工程レシピ再設定方法
US6577323B1 (en) * 1999-07-01 2003-06-10 Honeywell Inc. Multivariable process trend display and methods regarding same
US6697691B1 (en) * 2000-01-03 2004-02-24 Advanced Micro Devices, Inc. Method and apparatus for fault model analysis in manufacturing tools
US6465263B1 (en) * 2000-01-04 2002-10-15 Advanced Micro Devices, Inc. Method and apparatus for implementing corrected species by monitoring specific state parameters

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100207468B1 (ko) 1996-03-07 1999-07-15 윤종용 웨이퍼의 결함분석 시스템

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12468233B2 (en) 2021-01-13 2025-11-11 Canon Kabushiki Kaisha Control apparatus, system, lithography apparatus, article manufacturing method, control method, and non-transitory storage medium
KR20230162280A (ko) 2022-05-20 2023-11-28 (주)미소정보기술 전 과정을 모듈화하여 연결한 워크플로우가 구비된 fdc 시스템 및 그 처리방법

Also Published As

Publication number Publication date
EP1245042A2 (en) 2002-10-02
KR20020063270A (ko) 2002-08-01
JP2003520435A (ja) 2003-07-02
WO2001052320A3 (en) 2002-01-17
WO2001052320A2 (en) 2001-07-19
US6871112B1 (en) 2005-03-22

Similar Documents

Publication Publication Date Title
KR100734531B1 (ko) Ｆｄｃ 반도체 제조 프로세스로부터 트레이스 데이터 리포트들을 요구하는 방법 및 반도체 제조 프로세싱 시스템
KR100747126B1 (ko) 웨이퍼 제조 제어
JP4928541B2 (ja) 統計的に繰返し可能な応答時間を有する多用途半導体製造コントローラ
EP1373997B1 (en) Method and apparatus for controlling a tool using a baseline control script
US6831555B1 (en) Method and apparatus for dynamically monitoring system components in an advanced process control (APC) framework
US6955928B1 (en) Closed loop residual gas analyzer process control technique
US7558687B1 (en) Method and apparatus for dynamic adjustment of a sensor sampling rate
US6480854B1 (en) Method and apparatus for increasing database availability
US6790686B1 (en) Method and apparatus for integrating dispatch and process control actions
US7197370B1 (en) Method and apparatus for dynamic adjustment of an active sensor list
EP1415126B1 (en) Method and apparatus for integrating multiple process controllers
CN100449551C (zh) 软件媒介式控制架构
JP2005515623A6 (ja) 自動生産システム
US12341041B2 (en) Automated OCAP interfacing system and method
TWI397830B (zh) 具有統計上可重複之回應時間的通用半導體製造控制器

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20130603

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20140605

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20150602

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20160627

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20160627