JP2003520434A - ハードウェアの経年数および用途に基づいて測定頻度を決定するための方法および装置 - Google Patents

ハードウェアの経年数および用途に基づいて測定頻度を決定するための方法および装置

Info

Publication number
JP2003520434A
JP2003520434A JP2001552441A JP2001552441A JP2003520434A JP 2003520434 A JP2003520434 A JP 2003520434A JP 2001552441 A JP2001552441 A JP 2001552441A JP 2001552441 A JP2001552441 A JP 2001552441A JP 2003520434 A JP2003520434 A JP 2003520434A
Authority
JP
Japan
Prior art keywords
processing
tool
measurement frequency
measurement
processing tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001552441A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003520434A5 (enExample
Inventor
デイビス，ブラッドリー・エム
エバンス，アレン・エル
クリスチャン，クレイグ・ダブリュ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of JP2003520434A publication Critical patent/JP2003520434A/ja
Publication of JP2003520434A5 publication Critical patent/JP2003520434A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • General Factory Administration (AREA)
  • Chemical Vapour Deposition (AREA)
JP2001552441A 2000-01-07 2000-09-06 ハードウェアの経年数および用途に基づいて測定頻度を決定するための方法および装置 Withdrawn JP2003520434A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/479,180 US6469518B1 (en) 2000-01-07 2000-01-07 Method and apparatus for determining measurement frequency based on hardware age and usage
US09/479,180 2000-01-07
PCT/US2000/024411 WO2001052319A1 (en) 2000-01-07 2000-09-06 Method and apparatus for determining measurement frequency based on hardware age and usage

Publications (2)

Publication Number Publication Date
JP2003520434A true JP2003520434A (ja) 2003-07-02
JP2003520434A5 JP2003520434A5 (enExample) 2007-10-25

Family

ID=23902975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001552441A Withdrawn JP2003520434A (ja) 2000-01-07 2000-09-06 ハードウェアの経年数および用途に基づいて測定頻度を決定するための方法および装置

Country Status (5)

Country Link
US (1) US6469518B1 (enExample)
EP (1) EP1245041A1 (enExample)
JP (1) JP2003520434A (enExample)
KR (1) KR100708426B1 (enExample)
WO (1) WO2001052319A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150107659A (ko) * 2014-03-13 2015-09-23 도쿄엘렉트론가부시키가이샤 제어 장치, 기판 처리 장치 및 기판 처리 시스템
WO2025205121A1 (ja) * 2024-03-29 2025-10-02 東京エレクトロン株式会社 基板処理装置、コンピュータプログラム及び情報処理方法

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US7069101B1 (en) 1999-07-29 2006-06-27 Applied Materials, Inc. Computer integrated manufacturing techniques
JP2002076087A (ja) * 2000-08-31 2002-03-15 Mitsubishi Electric Corp 抜き取り検査管理システム
US20020046001A1 (en) * 2000-10-16 2002-04-18 Applied Materials, Inc. Method, computer readable medium and apparatus for accessing a defect knowledge library of a defect source identification system
US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US7101799B2 (en) 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US6913938B2 (en) 2001-06-19 2005-07-05 Applied Materials, Inc. Feedback control of plasma-enhanced chemical vapor deposition processes
US6910947B2 (en) 2001-06-19 2005-06-28 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7698012B2 (en) * 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US7201936B2 (en) 2001-06-19 2007-04-10 Applied Materials, Inc. Method of feedback control of sub-atmospheric chemical vapor deposition processes
US7337019B2 (en) 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
US6984198B2 (en) 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
US6831555B1 (en) * 2002-03-05 2004-12-14 Advanced Micro Devices, Inc. Method and apparatus for dynamically monitoring system components in an advanced process control (APC) framework
US7225047B2 (en) 2002-03-19 2007-05-29 Applied Materials, Inc. Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
JP2005535130A (ja) 2002-08-01 2005-11-17 アプライド マテリアルズ インコーポレイテッド 最新のプロセス制御システム内で誤って表された計測データを取り扱う方法、システム、および媒体
CN1720490B (zh) 2002-11-15 2010-12-08 应用材料有限公司 用于控制具有多变量输入参数的制造工艺的方法和系统
US7333871B2 (en) 2003-01-21 2008-02-19 Applied Materials, Inc. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
US7205228B2 (en) 2003-06-03 2007-04-17 Applied Materials, Inc. Selective metal encapsulation schemes
US7354332B2 (en) 2003-08-04 2008-04-08 Applied Materials, Inc. Technique for process-qualifying a semiconductor manufacturing tool using metrology data
US7356377B2 (en) 2004-01-29 2008-04-08 Applied Materials, Inc. System, method, and medium for monitoring performance of an advanced process control system
US6961626B1 (en) 2004-05-28 2005-11-01 Applied Materials, Inc Dynamic offset and feedback threshold
US7096085B2 (en) 2004-05-28 2006-08-22 Applied Materials Process control by distinguishing a white noise component of a process variance
US7069098B2 (en) * 2004-08-02 2006-06-27 Advanced Micro Devices, Inc. Method and system for prioritizing material to clear exception conditions
US7296103B1 (en) 2004-10-05 2007-11-13 Advanced Micro Devices, Inc. Method and system for dynamically selecting wafer lots for metrology processing
US7076321B2 (en) * 2004-10-05 2006-07-11 Advanced Micro Devices, Inc. Method and system for dynamically adjusting metrology sampling based upon available metrology capacity
TWI423361B (zh) * 2008-09-25 2014-01-11 United Microelectronics Corp 抽樣檢驗方法
US8260708B2 (en) 2009-04-17 2012-09-04 Empire Technology Development Llc Usage metering based upon hardware aging
WO2012015433A1 (en) 2010-07-30 2012-02-02 Empire Technology Development, Llc. Aging-based usage metering of components
CN104995841B (zh) 2013-01-06 2018-02-09 英派尔科技开发有限公司 基于老化的泄漏能量减小方法和系统
CN115273611B (zh) * 2022-08-23 2023-08-11 盐城师范学院 一种基于大数据的实践教学管理系统及方法

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JPS55150221A (en) * 1979-05-10 1980-11-22 Toshiba Corp Semiconductor fabricating process control system
US4795260A (en) * 1987-05-15 1989-01-03 Therma-Wave, Inc. Apparatus for locating and testing areas of interest on a workpiece
US5117377A (en) * 1988-10-05 1992-05-26 Finman Paul F Adaptive control electromagnetic signal analyzer
US5274434A (en) 1990-04-02 1993-12-28 Hitachi, Ltd. Method and apparatus for inspecting foreign particles on real time basis in semiconductor mass production line
JPH04355914A (ja) * 1991-02-06 1992-12-09 Olympus Optical Co Ltd リソグラフィー装置
US5410495A (en) * 1993-07-20 1995-04-25 Texas Instruments Incorporated Apparatus, systems, and methods for diagnosing anomalous mass flow controller operation
US5546312A (en) * 1993-09-20 1996-08-13 Texas Instruments Incorporated Use of spatial models for simultaneous control of various non-uniformity metrics
US5408405A (en) * 1993-09-20 1995-04-18 Texas Instruments Incorporated Multi-variable statistical process controller for discrete manufacturing
US5751582A (en) * 1995-09-25 1998-05-12 Texas Instruments Incorporated Controlling process modules using site models and monitor wafer control
JP3699776B2 (ja) 1996-04-02 2005-09-28 株式会社日立製作所 電子部品の製造方法
US5958148A (en) * 1996-07-26 1999-09-28 Speedfam-Ipec Corporation Method for cleaning workpiece surfaces and monitoring probes during workpiece processing
US6130414A (en) * 1998-08-19 2000-10-10 Advanced Micro Devices, Inc. Systems and methods for controlling semiconductor processing tools using measured current flow to the tool

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150107659A (ko) * 2014-03-13 2015-09-23 도쿄엘렉트론가부시키가이샤 제어 장치, 기판 처리 장치 및 기판 처리 시스템
JP2015176903A (ja) * 2014-03-13 2015-10-05 東京エレクトロン株式会社 制御装置、基板処理装置及び基板処理システム
KR101868669B1 (ko) * 2014-03-13 2018-06-18 도쿄엘렉트론가부시키가이샤 제어 장치, 기판 처리 장치 및 기판 처리 시스템
WO2025205121A1 (ja) * 2024-03-29 2025-10-02 東京エレクトロン株式会社 基板処理装置、コンピュータプログラム及び情報処理方法

Also Published As

Publication number Publication date
WO2001052319A1 (en) 2001-07-19
KR100708426B1 (ko) 2007-04-18
EP1245041A1 (en) 2002-10-02
US6469518B1 (en) 2002-10-22
KR20020063301A (ko) 2002-08-01

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