KR100708426B1 - 하드웨어 연령과 사용을 기반으로 측정빈도를 결정하기 위한 방법 및 장치 - Google Patents

하드웨어 연령과 사용을 기반으로 측정빈도를 결정하기 위한 방법 및 장치 Download PDF

Info

Publication number
KR100708426B1
KR100708426B1 KR1020027008824A KR20027008824A KR100708426B1 KR 100708426 B1 KR100708426 B1 KR 100708426B1 KR 1020027008824 A KR1020027008824 A KR 1020027008824A KR 20027008824 A KR20027008824 A KR 20027008824A KR 100708426 B1 KR100708426 B1 KR 100708426B1
Authority
KR
South Korea
Prior art keywords
frequency
measurement
tool
process tool
time period
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020027008824A
Other languages
English (en)
Korean (ko)
Other versions
KR20020063301A (ko
Inventor
데이비스브래들리엠.
에반스알렌엘.
크리스티안크라이그더블유.
Original Assignee
어드밴스드 마이크로 디바이시즈, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어드밴스드 마이크로 디바이시즈, 인코포레이티드 filed Critical 어드밴스드 마이크로 디바이시즈, 인코포레이티드
Publication of KR20020063301A publication Critical patent/KR20020063301A/ko
Application granted granted Critical
Publication of KR100708426B1 publication Critical patent/KR100708426B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • General Factory Administration (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020027008824A 2000-01-07 2000-09-06 하드웨어 연령과 사용을 기반으로 측정빈도를 결정하기 위한 방법 및 장치 Expired - Fee Related KR100708426B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/479,180 2000-01-07
US09/479,180 US6469518B1 (en) 2000-01-07 2000-01-07 Method and apparatus for determining measurement frequency based on hardware age and usage

Publications (2)

Publication Number Publication Date
KR20020063301A KR20020063301A (ko) 2002-08-01
KR100708426B1 true KR100708426B1 (ko) 2007-04-18

Family

ID=23902975

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027008824A Expired - Fee Related KR100708426B1 (ko) 2000-01-07 2000-09-06 하드웨어 연령과 사용을 기반으로 측정빈도를 결정하기 위한 방법 및 장치

Country Status (5)

Country Link
US (1) US6469518B1 (enExample)
EP (1) EP1245041A1 (enExample)
JP (1) JP2003520434A (enExample)
KR (1) KR100708426B1 (enExample)
WO (1) WO2001052319A1 (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7069101B1 (en) 1999-07-29 2006-06-27 Applied Materials, Inc. Computer integrated manufacturing techniques
JP2002076087A (ja) * 2000-08-31 2002-03-15 Mitsubishi Electric Corp 抜き取り検査管理システム
US20020046001A1 (en) * 2000-10-16 2002-04-18 Applied Materials, Inc. Method, computer readable medium and apparatus for accessing a defect knowledge library of a defect source identification system
US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US6913938B2 (en) 2001-06-19 2005-07-05 Applied Materials, Inc. Feedback control of plasma-enhanced chemical vapor deposition processes
US7101799B2 (en) 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US7201936B2 (en) 2001-06-19 2007-04-10 Applied Materials, Inc. Method of feedback control of sub-atmospheric chemical vapor deposition processes
US7698012B2 (en) * 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US6910947B2 (en) 2001-06-19 2005-06-28 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US7337019B2 (en) 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
US6984198B2 (en) 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
US6831555B1 (en) * 2002-03-05 2004-12-14 Advanced Micro Devices, Inc. Method and apparatus for dynamically monitoring system components in an advanced process control (APC) framework
US7225047B2 (en) 2002-03-19 2007-05-29 Applied Materials, Inc. Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
CN100351725C (zh) 2002-08-01 2007-11-28 应用材料有限公司 用于在先进工艺控制系统中处理歪曲的度量数据的方法、系统和介质
WO2004046835A2 (en) 2002-11-15 2004-06-03 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
US7333871B2 (en) 2003-01-21 2008-02-19 Applied Materials, Inc. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
US7205228B2 (en) 2003-06-03 2007-04-17 Applied Materials, Inc. Selective metal encapsulation schemes
US7354332B2 (en) 2003-08-04 2008-04-08 Applied Materials, Inc. Technique for process-qualifying a semiconductor manufacturing tool using metrology data
US7356377B2 (en) 2004-01-29 2008-04-08 Applied Materials, Inc. System, method, and medium for monitoring performance of an advanced process control system
US6961626B1 (en) 2004-05-28 2005-11-01 Applied Materials, Inc Dynamic offset and feedback threshold
US7096085B2 (en) 2004-05-28 2006-08-22 Applied Materials Process control by distinguishing a white noise component of a process variance
US7069098B2 (en) * 2004-08-02 2006-06-27 Advanced Micro Devices, Inc. Method and system for prioritizing material to clear exception conditions
US7296103B1 (en) 2004-10-05 2007-11-13 Advanced Micro Devices, Inc. Method and system for dynamically selecting wafer lots for metrology processing
US7076321B2 (en) * 2004-10-05 2006-07-11 Advanced Micro Devices, Inc. Method and system for dynamically adjusting metrology sampling based upon available metrology capacity
TWI423361B (zh) * 2008-09-25 2014-01-11 United Microelectronics Corp 抽樣檢驗方法
US8260708B2 (en) * 2009-04-17 2012-09-04 Empire Technology Development Llc Usage metering based upon hardware aging
US9513329B2 (en) 2010-07-30 2016-12-06 Empire Technology Development Llc Aging-based usage metering of components
US9520292B2 (en) 2013-01-06 2016-12-13 Empire Technology Development Llc Aging-based leakage energy reduction method and system
JP6211960B2 (ja) * 2014-03-13 2017-10-11 東京エレクトロン株式会社 制御装置、基板処理装置及び基板処理システム
CN115273611B (zh) * 2022-08-23 2023-08-11 盐城师范学院 一种基于大数据的实践教学管理系统及方法
WO2025205121A1 (ja) * 2024-03-29 2025-10-02 東京エレクトロン株式会社 基板処理装置、コンピュータプログラム及び情報処理方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55150221A (en) * 1979-05-10 1980-11-22 Toshiba Corp Semiconductor fabricating process control system
US6002989A (en) * 1996-04-02 1999-12-14 Hitachi, Ltd. System for quality control where inspection frequency of inspection apparatus is reset to minimize expected total loss based on derived frequency function and loss value

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4795260A (en) * 1987-05-15 1989-01-03 Therma-Wave, Inc. Apparatus for locating and testing areas of interest on a workpiece
US5117377A (en) * 1988-10-05 1992-05-26 Finman Paul F Adaptive control electromagnetic signal analyzer
US5274434A (en) 1990-04-02 1993-12-28 Hitachi, Ltd. Method and apparatus for inspecting foreign particles on real time basis in semiconductor mass production line
JPH04355914A (ja) * 1991-02-06 1992-12-09 Olympus Optical Co Ltd リソグラフィー装置
US5410495A (en) * 1993-07-20 1995-04-25 Texas Instruments Incorporated Apparatus, systems, and methods for diagnosing anomalous mass flow controller operation
US5546312A (en) * 1993-09-20 1996-08-13 Texas Instruments Incorporated Use of spatial models for simultaneous control of various non-uniformity metrics
US5408405A (en) * 1993-09-20 1995-04-18 Texas Instruments Incorporated Multi-variable statistical process controller for discrete manufacturing
US5751582A (en) * 1995-09-25 1998-05-12 Texas Instruments Incorporated Controlling process modules using site models and monitor wafer control
US5958148A (en) * 1996-07-26 1999-09-28 Speedfam-Ipec Corporation Method for cleaning workpiece surfaces and monitoring probes during workpiece processing
US6130414A (en) * 1998-08-19 2000-10-10 Advanced Micro Devices, Inc. Systems and methods for controlling semiconductor processing tools using measured current flow to the tool

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55150221A (en) * 1979-05-10 1980-11-22 Toshiba Corp Semiconductor fabricating process control system
US6002989A (en) * 1996-04-02 1999-12-14 Hitachi, Ltd. System for quality control where inspection frequency of inspection apparatus is reset to minimize expected total loss based on derived frequency function and loss value

Also Published As

Publication number Publication date
JP2003520434A (ja) 2003-07-02
US6469518B1 (en) 2002-10-22
KR20020063301A (ko) 2002-08-01
EP1245041A1 (en) 2002-10-02
WO2001052319A1 (en) 2001-07-19

Similar Documents

Publication Publication Date Title
KR100708426B1 (ko) 하드웨어 연령과 사용을 기반으로 측정빈도를 결정하기 위한 방법 및 장치
US8185230B2 (en) Method and apparatus for predicting device electrical parameters during fabrication
JP4615222B2 (ja) ライン末端データマイニングとプロセスツールデータマイニングとの相関
US6917849B1 (en) Method and apparatus for predicting electrical parameters using measured and predicted fabrication parameters
US6567718B1 (en) Method and apparatus for monitoring consumable performance
US7469195B2 (en) Integrated stepwise statistical process control in a plasma processing system
JP6598745B2 (ja) 半導体製造機器内の消耗部品の摩耗検出
US6650955B1 (en) Method and apparatus for determining a sampling plan based on process and equipment fingerprinting
JP5384009B2 (ja) 自動スループット制御システムおよびその操作法
US6687561B1 (en) Method and apparatus for determining a sampling plan based on defectivity
US20250054788A1 (en) Identification of and compensation for a failure in a heater array
US6665623B1 (en) Method and apparatus for optimizing downstream uniformity
KR101129715B1 (ko) 진행중인 계측 작업을 동적으로 제어하는 방법 및 시스템
US6821792B1 (en) Method and apparatus for determining a sampling plan based on process and equipment state information
JP4662711B2 (ja) 製造フローのスケジュール作成方法および製造システム
Tan et al. Maintenance scheduling of plasma etching chamber in wafer fabrication for high-yield etching process
US6732007B1 (en) Method and apparatus for implementing dynamic qualification recipes
US6868353B1 (en) Method and apparatus for determining wafer quality profiles
JP2000150608A (ja) 半導体製造方法
US7337091B1 (en) Method and apparatus for coordinating fault detection settings and process control changes
US20250022740A1 (en) System for monitoring performance of electrostatic chucks in substrate processing systems
US6922595B1 (en) Selecting control algorithms based on business rules
Jiang et al. Process control for quality improvement

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20130320

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20140320

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20160411

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20160411

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000