JP2003501842A - 電子アセンブリのためのヒート・シンク・クリップ - Google Patents

電子アセンブリのためのヒート・シンク・クリップ

Info

Publication number
JP2003501842A
JP2003501842A JP2001502631A JP2001502631A JP2003501842A JP 2003501842 A JP2003501842 A JP 2003501842A JP 2001502631 A JP2001502631 A JP 2001502631A JP 2001502631 A JP2001502631 A JP 2001502631A JP 2003501842 A JP2003501842 A JP 2003501842A
Authority
JP
Japan
Prior art keywords
fastener
shaft
heat sink
cover
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2001502631A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003501842A5 (enExample
Inventor
マクレガー，マイク
クロッカー，マイケル・ティ
ウォング，トーマス
デビソン，ピーター
コンスタッド，ロルフ・エイ
ジョーンズ，デイビッド・エイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of JP2003501842A publication Critical patent/JP2003501842A/ja
Publication of JP2003501842A5 publication Critical patent/JP2003501842A5/ja
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1429—Housings for circuits carrying a CPU and adapted to receive expansion cards
    • H05K7/1431—Retention mechanisms for CPU modules
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/42—Independent, headed, aperture pass-through fastener
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/75—Joints and connections having a joining piece extending through aligned openings in plural members

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
JP2001502631A 1999-06-10 2000-06-02 電子アセンブリのためのヒート・シンク・クリップ Ceased JP2003501842A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/330,242 1999-06-10
US09/330,242 US6101096A (en) 1999-06-10 1999-06-10 Heat sink clip for an electronic assembly
PCT/US2000/015438 WO2000078110A1 (en) 1999-06-10 2000-06-02 A heat sink clip for an electronic assembly

Publications (2)

Publication Number Publication Date
JP2003501842A true JP2003501842A (ja) 2003-01-14
JP2003501842A5 JP2003501842A5 (enExample) 2007-07-26

Family

ID=23288904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001502631A Ceased JP2003501842A (ja) 1999-06-10 2000-06-02 電子アセンブリのためのヒート・シンク・クリップ

Country Status (8)

Country Link
US (1) US6101096A (enExample)
JP (1) JP2003501842A (enExample)
KR (1) KR100437246B1 (enExample)
CN (1) CN1177518C (enExample)
AU (1) AU5322600A (enExample)
MX (1) MXPA01012703A (enExample)
MY (1) MY117229A (enExample)
WO (1) WO2000078110A1 (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5749851A (en) * 1995-03-02 1998-05-12 Scimed Life Systems, Inc. Stent installation method using balloon catheter having stepped compliance curve
US6585534B2 (en) * 1998-08-20 2003-07-01 Intel Corporation Retention mechanism for an electrical assembly
US6301113B1 (en) * 1999-05-07 2001-10-09 Psc Computer Products, Inc. Retainer clip for heat sink for electronic components
US6413119B1 (en) * 1999-06-14 2002-07-02 Delphi Technologies, Inc. Filtered electrical connector
US6570764B2 (en) * 1999-12-29 2003-05-27 Intel Corporation Low thermal resistance interface for attachment of thermal materials to a processor die
US6426466B1 (en) * 2000-02-09 2002-07-30 International Business Machines Corporation Peripheral power board structure
US20030175091A1 (en) * 2000-03-10 2003-09-18 Aukzemas Thomas V. Floating captive screw
TW460109U (en) * 2000-03-15 2001-10-11 Foxconn Prec Components Co Ltd Cooling device
US6515862B1 (en) * 2000-03-31 2003-02-04 Intel Corporation Heat sink assembly for an integrated circuit
US6542366B2 (en) * 2000-12-28 2003-04-01 Gateway, Inc. Circuit board support
DE10129788B4 (de) * 2001-06-20 2005-11-10 Siemens Ag Kunststoffrahmen zur Montage eines elektronischen Starkstrom-Steuergeräts
US6477053B1 (en) * 2001-07-17 2002-11-05 Tyco Telecommunications (Us) Inc. Heat sink and electronic assembly including same
US20030131970A1 (en) * 2002-01-17 2003-07-17 Carter Daniel P. Heat sinks and method of formation
US6829143B2 (en) * 2002-09-20 2004-12-07 Intel Corporation Heatsink retention apparatus
US7242583B2 (en) * 2002-12-16 2007-07-10 Paricon Technologies, Corporation System for loading a heat sink mechanism independently of clamping load on electrical device
TWM243893U (en) * 2002-12-20 2004-09-11 Hon Hai Prec Ind Co Ltd Heat sink clip
JP4173014B2 (ja) * 2003-01-17 2008-10-29 富士通株式会社 ヒートシンク及び電子機器の冷却装置及び電子機器
US7344345B2 (en) 2004-05-27 2008-03-18 Southco, Inc. Captive shoulder nut having spring tie-down
US7239520B2 (en) * 2004-12-29 2007-07-03 Hewlett-Packard Development Company, L.P. Self-locking fastener adapted to secure a heat sink to a frame
US7342796B2 (en) * 2005-06-03 2008-03-11 Southco, Inc. Captive shoulder nut assembly
US20070023879A1 (en) * 2005-07-29 2007-02-01 Vinayak Pandey Single unit heat sink, voltage regulator, and package solution for an integrated circuit
TW201032029A (en) * 2009-02-24 2010-09-01 Acbel Polytech Inc Detachable heat dissipating package structure for intermediate bus converter (IBC)
USD673922S1 (en) * 2011-04-21 2013-01-08 Kabushiki Kaisha Toshiba Portion of a substrate for an electronic circuit
USD673921S1 (en) * 2011-04-21 2013-01-08 Kabushiki Kaisha Toshiba Portion of a substrate for an electronic circuit
US8971038B2 (en) * 2012-05-22 2015-03-03 Lear Corporation Coldplate for use in an electric vehicle (EV) or a hybrid-electric vehicle (HEV)
US10003113B1 (en) * 2016-12-19 2018-06-19 Ford Global Technologies, Llc Fastening assembly and method
KR102181106B1 (ko) * 2019-02-22 2020-11-20 (주)엠지에이치코리아 기판과 케이스의 결합구조

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56129749U (enExample) * 1980-03-04 1981-10-02
JPH0126140Y2 (enExample) * 1981-12-04 1989-08-04
JPH0361400U (enExample) * 1989-10-21 1991-06-17
JPH07322278A (ja) * 1994-05-27 1995-12-08 Matsushita Electric Ind Co Ltd 保持具の係止構造
JPH08264690A (ja) * 1995-03-16 1996-10-11 Internatl Business Mach Corp <Ibm> チップ・パッケージのヒート・シンク・アセンブリおよび方法
JP2000120598A (ja) * 1998-10-14 2000-04-25 Matsushita Electric Ind Co Ltd 冷却ファンの取付装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4674910A (en) * 1982-07-14 1987-06-23 Kitagawa Industries Co., Ltd. Securing unit
US4566660A (en) * 1983-01-20 1986-01-28 National Molding Corporation Cradle clip
JPS607798A (ja) * 1983-06-28 1985-01-16 北川工業株式会社 固定具
JPH0429123Y2 (enExample) * 1987-12-02 1992-07-15
US5419606A (en) * 1993-12-27 1995-05-30 Ford Motor Company Trim panel attaching pin with water seal
FR2729045B1 (fr) * 1994-12-29 1997-01-24 Bull Sa Procede et dispositif de fixation de deux elements tels qu'un radiateur de circuit integre a une carte de circuits imprimes
US5608611A (en) * 1995-10-03 1997-03-04 United Technologies Automotive, Inc./Ford Motor Company Vehicle electronic module with integral mounting and grounding means
US5730210A (en) * 1997-02-24 1998-03-24 Silicon Integrated Systems Corporation Heat sink having an assembling device
US5947191A (en) * 1997-05-07 1999-09-07 International Business Machines Electronics module heat sink with quick mounting pins
TW335187U (en) * 1997-05-24 1998-06-21 Hon Hai Prec Ind Co Ltd Fastening device for CPU assembly
US5883783A (en) * 1997-07-15 1999-03-16 Intel Corporation GT clip design for an electronic packaging assembly
US5969947A (en) * 1997-12-17 1999-10-19 International Business Machines Corporation Integral design features for heatsink attach for electronic packages
US5973399A (en) * 1998-02-17 1999-10-26 Intel Corporation Tamper resistant attach mechanism between plastic cover and thermal plate assembly for processor cartridges

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56129749U (enExample) * 1980-03-04 1981-10-02
JPH0126140Y2 (enExample) * 1981-12-04 1989-08-04
JPH0361400U (enExample) * 1989-10-21 1991-06-17
JPH07322278A (ja) * 1994-05-27 1995-12-08 Matsushita Electric Ind Co Ltd 保持具の係止構造
JPH08264690A (ja) * 1995-03-16 1996-10-11 Internatl Business Mach Corp <Ibm> チップ・パッケージのヒート・シンク・アセンブリおよび方法
JP2000120598A (ja) * 1998-10-14 2000-04-25 Matsushita Electric Ind Co Ltd 冷却ファンの取付装置

Also Published As

Publication number Publication date
CN1177518C (zh) 2004-11-24
WO2000078110A1 (en) 2000-12-21
AU5322600A (en) 2001-01-02
CN1356018A (zh) 2002-06-26
MY117229A (en) 2004-05-31
MXPA01012703A (es) 2002-11-04
KR100437246B1 (ko) 2004-06-23
US6101096A (en) 2000-08-08
KR20020021122A (ko) 2002-03-18

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