JP2003332739A - Multilayered printed wiring board and method of manufacturing multilayered printed wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multilayered printed wiring board that can increase the arranging density of through holes and, at the same time, can be reduced in thickness. <P>SOLUTION: Since through holes 36 are formed by packing metal layers 32 and 34 in the non-through holes 26 of an insulating layer 20 forming a core substrate 30, the strength of the substrate 30 is improved and the thickness of the substrate 30 can be reduced. Consequently, the thickness of the multilayered wiring board can be reduced and the thermal conductivity of the wiring board can be improved. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board that can be used as a package substrate on which electronic parts such as IC chips are mounted, and more particularly to a multilayer printed wiring board and a multilayer printed wiring formed by building up an interlayer resin insulation layer on a core substrate. It also relates to a method for manufacturing a plate.

[0002]

2. Description of the Related Art Conventionally, build-up multilayer printed wiring boards have been manufactured, for example, by the method disclosed in JP-A-9-130050. That is, the interlayer resin insulation layer is laminated on the core substrate having the through holes, and the circuit pattern is formed on the interlayer resin insulation layer. By repeating this, a build-up multilayer printed wiring board is obtained.

[0003]

In order to use an IC chip of a higher frequency than the IC chip of about 1 GHz currently used, it is necessary to mitigate the shortage of power supply. In particular, if the supply of power to the IC chip is insufficient at the time of initial startup, malfunctions and system errors are likely to occur. Therefore, it is necessary to increase the number of conductor circuits for transmitting power. However,
At present, when forming a through hole for establishing electrical conduction between the front and back sides of a core substrate, a through hole is drilled. With a drill, the minimum diameter is about 300 μm, and the number of through holes formed per unit area is also limited in consideration of alignment and the like.

As an alternative technique, a method of forming a through hole with a drill was examined. Since the laser forms a through hole smaller than that of a drill, it is possible to increase the number of through holes formed per unit area. However, it may not be possible to fill a hole filling resin or the like into the through holes with a small through hole in order to form a conductive layer by plating or the like for electrical continuity or to maintain the flatness of the core substrate. did.

It was also estimated that the core substrate had a thickness of about 1.0 mm, which is a possible situation, and the substrate thickness was reduced to 0.6 mm or less. The conductor itself had no strength, and warpage occurred, which caused positional displacement or disconnection of the conductor layer. In particular, it is not possible to reduce warpage due to thermal history when forming a buildup. for that reason,
Although it is possible to open the substrate with a laser by reducing the thickness of the substrate, it was not possible to put it into practical use because the substrate itself has no strength.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a multilayer printed wiring board and a multilayer printed wiring board capable of increasing the arrangement density of through holes and reducing the thickness. It is to provide a method for manufacturing a plate.

[0007]

In order to solve the above-mentioned problems, in the multilayer printed wiring board according to claim 1, the interlayer resin insulation layer and the conductor circuit are built up on the core substrate whose through holes are filled with metal. What is done is a technical feature.

According to a second aspect of the present invention, in a multilayer printed wiring board formed by building up an interlayer resin insulation layer and a conductor circuit on a core substrate, the core substrate has a non-through hole, and the non-through hole has two types. A technical feature is that a through hole is formed by being filled with the above metal, and the core substrate is built up on one side or both sides.

According to a third aspect of the present invention, in the multilayer printed wiring board, an IC chip is connected to a surface layer via solder bumps, and a connection terminal to an external substrate is mounted on a back surface thereof. It is a technical feature.

According to a fourth aspect of the present invention, the multilayer printed wiring board is built up on one side of a core board, and an IC chip is connected to a surface layer of the buildup via solder bumps, and the core board on the back side of the IC board is connected. A technical feature is that a connection terminal to an external substrate is mounted on the surface layer of the.

A fifth aspect of the invention is characterized in that the two or more kinds of metals are at least an electroless plating film and an electrolytic plating film.

A sixth aspect of the present invention is at least the following (A) to
A method for manufacturing a multilayer printed wiring board, characterized by comprising the step (D): (A) One side of the insulating layer of a single-sided copper-clad laminate obtained by laminating a metal foil on one side of the insulating layer with a laser. A step of forming a non-through hole reaching the metal foil; (B) a step of filling the non-through hole of the insulating layer with a metal to form a through hole and forming a conductor layer on the non-laminated surface of the metal foil. (C) a step of etching the conductor layer and the metal foil to form a conductor circuit and using the insulating layer as a core substrate; (D) a step of forming a build-up layer on one side or both sides of the core substrate.

A seventh aspect is at least the following (A) to
A method for manufacturing a multilayer printed wiring board, which comprises the step (E): (A) A metal foil on one side of a double-sided copper-clad laminate obtained by laminating metal foils on both sides of an insulating layer, A step of forming a formal mask; (B) a step of forming a non-through hole reaching the metal foil on the back surface with a laser in the insulating layer using the conformal mask; (C) a metal in the non-through hole of the insulating layer And forming a through hole and forming a conductor layer on the conformal mask surface; (D) etching the conductor layer and the metal foil to form a conductor circuit, and forming the insulating layer on the core substrate. And (E) a step of forming a buildup layer on one side or both sides of the core substrate.

A method for manufacturing a multilayer printed wiring board, comprising at least steps (A) to (D): (A) Double-sided copper obtained by laminating metal foils on both sides of an insulating layer. A step of forming a non-through hole from the metal foil on one surface of the stretched laminated plate directly to the metal foil on the back surface by laser; (B) forming a through hole by filling the non-through hole of the insulating layer with a metal; A step of forming a conductor layer on the opening surface of the metal foil; (C) a step of etching the conductor layer and the metal foil to form a conductor circuit and using the insulating layer as a core substrate; (D) of the core substrate The process of forming a build-up layer on one side or both sides.

A ninth aspect of the invention is characterized in that the metal filled in the non-through hole is at least an electroless plating film or an electrolytic plating film.

A tenth aspect of the invention is characterized in that, before or after the step (A), a step of thinning the metal foil in advance by light etching is performed.

In the method for manufacturing a multilayer printed wiring board according to any one of claims 1 and 2, and the method for manufacturing a multilayer printed wiring board according to claims 6, 7, and 8, a core is formed by filling a metal layer in a through hole. The strength of the board can be secured,
The warp and the like are eliminated, the core substrate can be made thinner, and the thickness of the entire multilayer printed wiring board can be reduced. As a result, the connection distance between the IC chip and the external terminal can be shortened, so that the loop inductance is reduced and the electrical characteristics are improved. Further, as described above, the core substrate can be made thin, and the non-through hole reaching the metal layer can be formed in the insulating layer. Therefore, the depth of the through hole formed by the laser is smaller than that of the conventional core substrate. Less than half. Therefore, it is possible to easily form a fine non-through hole with a laser and to form a through hole having a small diameter, so that the degree of integration of the multilayer printed wiring board can be increased. Since the number of holes per unit area increases, the number that can be used as a power source increases. Therefore, the power supply amount is increased, and malfunction is prevented. The non-through holes may be tapered or linear.

In the multilayer printed wiring board, it is preferable that an IC chip is connected to the surface layer via solder bumps and a connection terminal to an external substrate is mounted on the back surface thereof. Thereby, it can be used as a package substrate and can be made thinner than before. for that reason,
It can be housed in a thinner housing.

The multilayer printed wiring board is built up on one side on a core board, and an IC chip is connected to the surface layer of the buildup via solder bumps. It is desirable that the connection terminal with the board is mounted. Since build-up allows high density and integrated bumps to be formed, and has strength as a copper clad laminate as a core substrate, peeling between the PGA / BGA which is an external terminal and the external substrate Can be prevented.

In the multilayer printed wiring board according to the fifth aspect and the method for manufacturing the multilayer printed wiring board according to the ninth aspect, the electroless plated film is formed on the lower layer and the electrolytic plated film is formed on the upper layer. The strength of the core substrate can be increased by forming the filled metal layer into two layers, an electroless plating film and an electrolytic plating film. By the electroless plating, the adhesion with the metal foil is improved, and even if stress is applied to the core, the core is not peeled off. Therefore, electrical connectivity and reliability are also improved.

In the method for manufacturing a multilayer printed wiring board according to the ninth aspect of the present invention, by etching the metal foil in advance, it is possible to prevent undercut and metal foil residue when forming a circuit. As a result, the conductor circuit can be formed with a narrow pitch.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. First Embodiment First, the structure of the multilayer printed wiring board according to the first embodiment of the present invention will be described with reference to FIG. 6 showing a sectional view. As shown in FIG. 6, in the multilayer printed wiring board 10, the conductor circuit 36b is formed on the front surface of the core substrate 30, and the conductor circuit 28a is formed on the back surface thereof.
Interlayer resin insulation layers 50, 50 are formed on b, 28. A via hole 60 and a conductor circuit 58 are provided in the interlayer resin insulation layers 50, 50. Interlayer resin insulation layers 150, 1 are formed on the interlayer resin insulation layers 50, 50.
50 are formed. The interlayer resin insulation layers 150, 15
At 0, a via hole 160 and a conductor circuit (not shown) are arranged. Solder resists 70, 70 are formed on the interlayer resin insulation layers 150, 150. The solder bumps 76U are formed in the via holes 160 on the upper surface and the via holes 160 on the lower surface through the openings 71 of the solder resist 70. BGA76D is formed on the.

FIG. 7 shows a state in which the IC chip 90 is mounted on the multilayer printed wiring board 10 and mounted on the daughter board 94. Bump 9 of IC chip 90
2 via the solder bump 76U, and the daughter board 9
No. 4 bump 96 is connected via BGA 76D.

In the present embodiment, since the non-through holes 26 of the insulating layer 20 forming the core substrate 30 are filled with the metal layers 32 and 34 to form the through holes 36, the strength of the core substrate 30 is increased and the core substrate 30 is improved. It becomes possible to form 30 thinly, the thickness of the multilayer printed wiring board can be reduced, and the thermal conductivity can be improved. Further, since the thickness of the multilayer printed wiring board 10 can be reduced, the connection distance between the IC chip 90 and the daughter board (external terminal) 94 can be shortened, so that the loop inductance is reduced and the electrical characteristics are improved.

In this embodiment, the insulating layer 2 of the core substrate 30 is used.
A non-through hole 26 reaching the metal layer 28 is formed at 0 by laser processing, and is filled with plating to form a through hole 36. Here, since the non-through hole 26 reaching the metal layer 28 may be formed, the depth of the through hole formed by the laser can be made smaller than that in the conventional core substrate. Therefore, it is possible to easily form a fine non-through hole with a laser and to form a through hole having a small diameter, so that the degree of integration of the multilayer printed wiring board can be increased.

Subsequently, a method of manufacturing the multilayer printed wiring board described above with reference to FIG. 6 will be described with reference to FIGS. (1) A single-sided copper clad plate 20A in which a copper foil 28 having a thickness of 5 to 40 μm is laminated on the upper surface of a substrate (insulating layer) 20 made of a resin having a thickness of 0.05 to 0.2 mm is used as a starting material (FIG. 1).
(A)). Here, the insulating layer 20 is made by dipping epoxy, BT (bismaleimide triazine), polyimide, or olefin in glass cloth or aramid cloth, and resin having no core material such as glass cloth or aramid cloth. Alternatively, a resin film laminated with a reinforcing resin layer can be used. Here, single-sided copper clad board 2
The 0 A copper foil 28 may be thinned in advance by light etching. Here, copper foil is used, but instead of this,
The metal foil can also be formed by sputtering, electroless plating or the like.

(2) Thereafter, a non-through hole 26 having an opening diameter of 50 to 250 μm reaching the pattern of the copper foil 28 is formed in the insulating layer 20 by a CO ₂ laser, a YAG laser or an excimer laser (FIG. 1 (B)). . In this embodiment, since the insulating layer 20 has a thin thickness of 0.2 to 0.4 mm, it is possible to make fine holes with a laser.

(3) After the desmear treatment, a palladium catalyst is applied and immersed in an electroless plating solution to obtain the core substrate 3
Electroless plating film 32 having a uniform thickness of 1 to 5 μm on the surface of 0
Are deposited (FIG. 1 (C)). Although electroless plating is used here, a metal film of copper, nickel, or the like can be formed by sputtering. Sputtering is disadvantageous in terms of cost, but has the advantage that it can improve the adhesion to the resin.

(4) Subsequently, the substrate 20 is immersed in an electroless plating solution, and an electric current is passed through the electroless plated film 32 to form an electrolytic plated film 34. At this time, the electrolytic plating film 34 is filled so as to make the surface of the substrate 20 flat (FIG. 2A).

(5) Then, the electroless plating film 32 and the electrolytic plating film 34 on the upper surface are etched to form the through hole 3
The land 36a and the conductor circuit 36b of No. 6 are formed, and at the same time, the copper foil 28 is etched to form the conductor circuit 28a, thereby completing the core substrate 30 (FIG. 2B).

Although the electrolytic plating film 34 is formed on the electroless plating film 32 in this example, the electroless plating film 32 is formed.
A resist is formed on the surface of the land 36 to form an electroless plating film 32 in a predetermined pattern, the resist is removed, and the electroless plating film 32 under the resist is peeled off.
It is also possible to form a and the conductor circuit 36b.

(6) A roughened surface (not shown) may be formed on the surfaces of the conductor circuit 36b, the land 36a, and the conductor circuit 28a with an etching solution containing a cupric complex and an organic acid. In that case, Sn substitution may be performed as needed.

(7) A thermosetting resin 50α made of epoxy, BT, polyimide, olefin, etc. is applied to the surface of the core substrate 30 and dried (prebaked) (FIG. 2).
(C)).

(8) Next, CO _{2 is applied to the} interlayer resin insulation layer 50.
Laser, YAG laser, or excimer laser is used to open the conductor circuit 36b and the conductor circuit 28a with an opening diameter of 100 to 25.
After forming the non-through hole 51 of 0 μm, it is heated to form the interlayer resin insulating layer 50 having the non-through hole 51 (FIG. 3).
(A)). As the resin forming the interlayer resin insulating layer, the same resin as the insulating layer 20 described above may be used, or a different resin may be used. In addition to the thermosetting resin, a mixture of a thermosetting resin and a thermoplastic resin can be used, and a filler such as silicon or resin can be mixed. Here, the soluble filler is mixed,
The surface of the interlayer resin insulation layer can be roughened by dissolving the filler with a chemical solution. Although the resin is applied here, a film similar to the insulating layer 20 or a B stage film may be pressure-bonded.

(9) After roughening treatment with an acid or an oxidizing agent, a palladium catalyst is applied and immersed in an electroless plating solution to uniformly coat the surface of the interlayer resin insulation layer 50 with a thickness of 1 to 5 μm.
The electroless plated film 52 is deposited (FIG. 3 (B)).

(10) Subsequently, a plating resist 54 having a predetermined pattern is formed on the surface of the electroless plating film 52 (see FIG. 3).
(C)).

(11) Then, an electrolytic plating film 56 is formed on the non-formed portion of the resist 54 (FIG. 4 (A)).

(12) Next, after removing the resist 54 by peeling and etching, the electroless plating film 52 under the plating resist is dissolved and removed, and the thickness of the electroless plating 52 and the electrolytic copper plating film 56 is 18 μm ( A conductor circuit 58 and a via hole 60 of 10 to 30 μm) are obtained (FIG. 4 (B)).
Then, a roughening layer (not shown) is provided on the surfaces of the conductor circuit 58 and the via hole 60.

(13) Further, the above steps (7) to (12) are repeated to form the interlayer resin insulation layer 150 having the conductor circuit 158 and the via hole 160 on the interlayer resin insulation layer 50 (FIG. 4). (C)).

(14) Solder bumps are formed on the above-mentioned multilayer printed wiring board. After applying the solder resist composition to a thickness of 20 μm on both sides of the substrate and performing a drying process, a 5 mm-thick photomask film (not shown) on which a circular pattern (mask pattern) is drawn is brought into close contact. And place
It is exposed to ultraviolet rays and developed. Then, heat treatment is further performed to form a solder resist layer (thickness 20 μm) 70 having an opening 71 of a solder pad portion (including a via hole and a land portion thereof) (FIG. 5A).

(15) After that, nickel chloride 2.3 × 10
^{-1 mol / l} , sodium hypophosphite 2.8 × 10 ^{−1 mol / l} , sodium citrate 1.6 × 10 ^{−1 mol / l} , pH = 4.
The nickel plating layer 73 having a thickness of 5 μm is formed in the opening 71 by immersing in the electroless nickel plating solution of No. 5 for 20 minutes. Further, the substrate was replaced with potassium gold cyanide 7.6 × 10.
^{-3 mol / l} , ammonium chloride 1.9 x 10 ^{-1 mol / l} , sodium citrate 1.2 x 10 ^{-1 mol / l} , sodium hypophosphite 1.7
The electroless gold plating solution of × 10 ^{-1 mol / l} was immersed in the electroless gold plating solution at 80 ° C. for 7.5 minutes to give a thickness of 0.
A gold plating layer 74 of 03 μm is formed (FIG. 5 (B)).

(16) Then, the opening 71 of the solder resist layer 70 is filled with solder paste (not shown). Then, by reflowing the solder filled in the opening 71 at 200 ° C., solder bumps (solder body) 76U,
BGA is formed on the lower surface (see FIG. 6). Here, the BGA is formed on the lower surface, but a conductive connecting pin may be attached instead of this.

After the flux cleaning, the substrate having a router is cut into pieces of appropriate size, and a checker process for inspecting the printed wiring board for short circuits and disconnection is performed to obtain a desired printed wiring board.

[Second Embodiment] Next, a multilayer printed wiring board according to a second embodiment of the present invention will be described with reference to FIG. In the first embodiment described above with reference to FIG. 6, the interlayer resin insulation layers 50 are formed on both surfaces of the core substrate 30,
150 and via holes 60 and 160 were formed. On the other hand, in the second embodiment, the interlayer resin insulation layers 50 and 150 and the via holes 60 and 160 are formed on one surface of the core substrate. A solder resist layer 70 is provided on the lower surface side of the core substrate 30, and conductive connection pins 77 are attached to the conductor circuit 28a.

[Third Embodiment] A multilayer printed wiring board and a method for manufacturing the multilayer printed wiring board according to a third embodiment of the present invention will be described with reference to FIGS. 9 to 11. Figure 9
Shows a cross section of the multilayer printed wiring board of the third embodiment. The third embodiment is similar to the first embodiment.
However, the conductor circuit 36b of the core substrate 30 has a three-layer structure of the copper foil 29, the electroless plating film 32, and the electrolytic plating film 34.

Subsequently, a method of manufacturing the multilayer printed wiring board according to the third embodiment will be described with reference to FIGS. In the first embodiment, the core substrate is formed using the single-sided copper clad plate. On the other hand, in the third embodiment, as shown in FIG. 10A, the core substrate is manufactured using the copper clad laminate 20B having copper foils 28 and 29 laminated on both sides.

(1) That is, a double-sided copper clad board 20B in which copper foils 28 and 29 of 5 to 40 μm are laminated on both sides of a substrate (insulating layer) 20 made of a resin having a thickness of 0.05 to 0.2 mm
Is used as a starting material (FIG. 1A). Here, the insulating layer 20
Examples include glass cloth or aramid cloth, epoxy, BT (bismaleimide triazine), polyimide,
Other than those obtained by immersing olefin, a resin having no core material such as glass cloth and aramid cloth, or a resin film laminated with a reinforcing resin layer can be used. Here, the copper foils 28, 29 of the double-sided copper clad board 20B may be thinned in advance by light etching. Here, a copper foil is used, but instead of this, a metal foil can be formed by sputtering, electroless plating, or the like.

(2) First, an opening 29a is formed in the upper copper foil 29 by etching, and the copper foil 29 is used as a conformal mask (FIG. 10B).

(3) After that, a non-penetrating hole 26 having an opening diameter of 50 to 250 μm reaching the pattern of the back surface copper foil 28 on the insulating layer 20 through the opening 29a of the conformal mask 29 by a CO ₂ laser, a YAG laser or an excimer laser. Are formed (FIG. 10C). In this embodiment, since the insulating layer 20 has a thin thickness of 0.2 to 0.4 mm, it is possible to make fine holes with a laser.

(4) After the desmearing treatment, a palladium catalyst is applied and immersed in an electroless plating solution to form a core substrate 3
Electroless plating film 32 having a uniform thickness of 1 to 5 μm on the surface of 0
Are deposited (FIG. 11 (A)). Although electroless plating is used here, a metal film of copper, nickel, or the like can be formed by sputtering. Sputtering is disadvantageous in terms of cost, but has the advantage that it can improve the adhesion to the resin.

(5) Subsequently, the substrate 20 is immersed in an electroless plating solution, and an electric current is passed through the electroless plated film 32 to form an electrolytic plated film 34. At this time, the electrolytic plating film 34 is filled so as to flatten the surface of the substrate 20 (FIG. 11B).

(6) Then, the copper foil 29, the electroless plated film 32 and the electrolytic plated film 34 on the upper surface are etched to form the land 36a of the through hole 36 and the conductor circuit 36b, and at the same time, the copper foil 28 is etched. Conductor circuit 28a
To form the core substrate 30 (FIG. 11).
(C)).

Although the electrolytic plating film 34 is formed on the electroless plating film 32 here, the electroless plating film 32 is not formed.
A resist is formed on the surface of the land 36 to form an electroless plating film 32 in a predetermined pattern, the resist is removed, and the electroless plating film 32 under the resist is peeled off.
It is also possible to form a and the conductor circuit 36b.

(6) A roughened surface (not shown) is formed on the surfaces of the conductor circuit 36b, the land 36a, and the conductor circuit 28a with an etching solution containing a cupric complex and an organic acid.

[Fourth Embodiment] Next, a multilayer printed wiring board according to a fourth embodiment of the present invention will be described with reference to FIG. In the third embodiment described above with reference to FIG. 9, the interlayer resin insulation layers 5 are formed on both surfaces of the core substrate 30.
0, 150 and via holes 60, 160 were formed.
On the other hand, in the fourth embodiment, the interlayer resin insulation layers 50 and 150 and the via holes 60 and 160 are formed on one surface of the core substrate.
Are formed. The solder resist layer 70 is provided on the lower surface side of the core substrate 30, and the conductor circuit 28a is provided.
A conductive connection pin 77 is attached to the.

[Fifth Embodiment] Next, a method for manufacturing a multilayer printed wiring board according to a fifth embodiment of the present invention will be described. In the above-described third and fourth embodiments, an opening is formed by etching in the copper foil on one surface of the double-sided copper-clad laminate to form a conformal mask. On the other hand, the fifth
In the embodiment, a laser is used to directly form openings in the copper-clad laminate 20B on both sides shown in FIG. 13 (A). That is, by adjusting the laser intensity, as shown in FIG.
An opening (non-through hole) 26 penetrating through and reaching the copper foil 28 on the other surface (back surface) is formed in the resin layer 20. Subsequent steps are the first
-Because it is the same as the fourth embodiment, the description thereof will be omitted.

[Brief description of drawings]

FIG. 1 is a manufacturing process diagram of a multilayer printed wiring board according to a first embodiment of the present invention.

FIG. 2 is a manufacturing process diagram of the multilayer printed wiring board according to the first embodiment.

FIG. 3 is a manufacturing process diagram of the multilayer printed wiring board according to the first embodiment.

FIG. 4 is a manufacturing process diagram of the multilayer printed wiring board according to the first embodiment.

FIG. 5 is a manufacturing process diagram of the multilayer printed wiring board according to the first embodiment.

FIG. 6 is a cross section of the multilayer printed wiring board according to the first embodiment.

FIG. 7 shows an IC for the multilayer printed wiring board according to the first embodiment.
It is a cross section of a state where a chip is mounted and attached to a daughter board.

FIG. 8 is a sectional view of a multilayer printed wiring board according to a second embodiment.

FIG. 9 is a sectional view of a multilayer printed wiring board according to a third embodiment.

FIG. 10 is a manufacturing process diagram of the multilayer printed wiring board according to the third embodiment.

FIG. 11 is a manufacturing process diagram of the multilayer printed wiring board according to the third embodiment.

FIG. 12 is a sectional view of a multilayer printed wiring board according to a fourth embodiment.

FIG. 13 is a manufacturing process diagram for a multilayer printed wiring board according to the fifth embodiment.

[Explanation of symbols]

20A single sided copper plate 20B Double-sided copper clad board 20 insulating layer 26 Non-through hole 28 Copper foil 28a Conductor circuit 29 Copper foil 29a opening 30 core substrate 32 Electroless plating film 34 Electrolytic plating film 36 through hole 36a land 36b conductor circuit 50 interlayer resin insulation layer 58 Conductor circuit 60 via holes 70 Solder resist

Front page continuation (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 23/12 501 H05K 1/11 N H05K 1/11 3/00 N 3/00 3/06 A 3/06 3 / 42 620A 3/42 620 H01L 23/12 NF Term (Reference) 5E317 AA24 BB02 BB12 CC32 CC33 CC44 CC51 CD25 CD32 GG11 5E339 AB02 AC01 AD05 AE01 BC02 BD02 BD08 BD11 BE13 CD01 CG01 DD03 GG10 5E346 AA05 A15BB16A15AABBBBA15AABBBB A15A16BBA15 CC32 DD01 DD23 DD24 DD32 EE33 FF03 FF15 FF45 GG15 GG16 GG17 GG22 GG25 GG28 HH11 HH24

Claims (10)

[Claims] 1. A multilayer printed wiring board comprising a core substrate having a through hole filled with a metal, and an interlayer resin insulation layer and a conductor circuit built up on the core substrate. 2. A multilayer printed wiring board, comprising a core board and an interlayer resin insulation layer and a conductor circuit built up on the core board, wherein the core board has a non-through hole formed therein.
Filled with more than one kind of metal to form a through hole,
A multilayer printed wiring board, characterized in that the core substrate is built up on one side or both sides. 3. The multilayer printed wiring board, the surface layer,
The multilayer printed wiring board according to claim 1 or 2, wherein the IC chip is connected via a solder bump, and a connection terminal to an external substrate is mounted on the back surface of the IC chip. 4. The multilayer printed wiring board is built up on one side of a core substrate, and an IC chip is connected to a surface layer of the buildup via solder bumps.
The multilayer printed wiring board according to claim 1 or 2, wherein a connection terminal to an external substrate is mounted on the surface layer of the core substrate on the back surface thereof. 5. The multilayer printed wiring board according to claim 2, wherein the two or more kinds of metals are at least an electroless plating film and an electrolytic plating film. 6. A method for manufacturing a multilayer printed wiring board, comprising at least the following steps (A) to (D): (A) One-sided copper clad in which a metal foil is laminated on one side of an insulating layer A step of forming a non-through hole reaching the metal foil on one side with a laser in the insulating layer of the laminated plate; (B) forming a through hole by filling the non-through hole of the insulating layer with a metal; A step of forming a conductor layer on the non-laminated surface of the foil; (C) a step of etching the conductor layer and the metal foil to form a conductor circuit and using the insulating layer as a core substrate; (D) of the core substrate A step of forming a buildup layer on one side or both sides. 7. A method for manufacturing a multilayer printed wiring board comprising at least the following steps (A) to (E): (A) Double-sided copper clad in which a metal foil is laminated on both sides of an insulating layer Forming a conformal mask on the metal foil on one side of the laminated plate by etching; (B) forming a non-through hole to the metal foil on the back side by laser in the insulating layer using the conformal mask; (C) a step of forming a through hole by filling a non-through hole in the insulating layer with a metal, and forming a conductor layer on the conformal mask surface; (D) etching the conductor layer and the metal foil A step of forming a conductor circuit and using the insulating layer as a core substrate; (E) a step of forming a build-up layer on one side or both sides of the core substrate. 8. A method for producing a multilayer printed wiring board, comprising at least steps (A) to (D): (A) A double-sided copper-clad laminate in which metal foils are laminated on both sides of an insulating layer. A step of forming a non-through hole from the metal foil on one side to the metal foil on the back side directly with a laser; (B) filling the non-through hole of the insulating layer with a metal to form a through hole and A step of forming a conductor layer on the opening surface; (C) a step of etching the conductor layer and the metal foil to form a conductor circuit and using the insulating layer as a core substrate; (D) one or both sides of the core substrate Step of forming a build-up layer on. 9. The method for manufacturing a multilayer printed wiring board according to claim 6, wherein the metal with which the non-through holes are filled is at least an electroless plating film or an electrolytic plating film. 10. The method for manufacturing a multilayer printed wiring board according to claim 6 or 7, wherein before or after the step (A), a step of thinning the metal foil by light etching is performed in advance.