JP2003317066A - Ic module and ic module mounted body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reuse an IC module mounted body even if it is returned before being used and to prevent illegal use. <P>SOLUTION: The IC module mounted body is equipped with a base material 11 including a main body part 11a which has an IC chip 12 where individual information can be recorded on one surface and a connection terminal 14, capable of sending and receiving the individual information recorded in the IC chip 12 by coming into contact with a terminal device, on the other surface and a separable part 11b which is connected to the main body part 11a through a cutting expected wire 11c and a conduction part 13 which is formed straddling the cutting expected wire 11c and electrically connects specified terminals to each other. Before the separable part 11b is separated from the main body part 11a and when the specified terminals are electrically connected to each other, the IC chip 12 and terminal device are unable to send and receive information and after the separable part 11b is separated form the main body part 11a and when the specified terminals are not electrically connected, the IC chip 12 and terminal device are able to send and receive information. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC module and an IC module mounting body for breaking off an IC module peripheral portion formed so as to be breakable and connecting the small piece portion to a mobile phone or the like for use. It is a thing.

[0002]

2. Description of the Related Art In a contact type IC card, a peripheral portion of an IC module (SIM; Subscriber Ide) is used.
2. Description of the Related Art There is a so-called SIM card in which an information module is formed so that it can be broken off, and that part is cut off and inserted into a mobile phone or the like for use. This SI
The M card contains GSM (Global Systemf).
or Mobile Communication) and the like define the shape and position of the broken-off portion (SIM), electrical characteristics during use, and the like. The SIM card is used to register the remaining amount of money according to the purchase amount and reduce the remaining amount of money each time it is used, or to use the SIM to register individual information and use the telephone based on the individual information. There is a postpaid type that manages the charges and pays the telephone charges at a later date. In such a conventional SIM card, provisional issuance of common information and the like is performed in advance, and balance information, individual information, and the like are registered by additional issuance processing at the time of delivery to the customer. In addition, in a system using such a SIM card,
After performing the issuing process including the registration of balance information and individual information, important information (name, I
Reissue (reuse) to delete or change (D number etc.),
Most systems do not allow it for security reasons.

[0003]

However, there are cases where the SIM card recipient (purchaser) desires to return the unused SIM card for some reason. in this case,
Since it is considered that the usage contract has been concluded at the time of delivery of the SIM card, once the card is delivered, the recipient (purchaser) is obliged to pay, and therefore the return is allowed even if it is unused. It seems not necessary. However, if the payment obligation is generated even though it is unused, the purchaser's dissatisfaction is so great that it cannot be accepted in practice. However, once the issuing process is completed,
As mentioned above, since the SIM card cannot be reissued (reused), the returned SIM card must be discarded, which is very uneconomical.

Further, in the conventional SIM card, as described above, the issuing process is performed at the time of delivery, and after the issuing process,
It is ready for use. Therefore, even if the SIM is not broken off, if it is accessed according to a predetermined protocol, there is a possibility that a predetermined operation will be performed regardless of whether or not the device is a target device (for example, a mobile phone). . For this reason, a malicious user, such as connecting the SIM to the reader / writer without tearing it off, after illegally using it, demanded that the prepaid fee be returned as "unused because it has not been broken yet". Alternatively, when refusing to pay the postpaid fee or the like, it is difficult to prove whether or not the person actually intends to use the service, which may cause trouble.

The present application is provided with means for detecting breakage of the SIM, and at the time of delivery, provisional card issuing processing (remaining money information, individual information, and other information necessary for use is included but can be deleted and changed, and , Can not be actually used,
Or, perform a state in which the content of use is significantly restricted)
The problem is to be solved by formal issuing processing when the breaking of the IM is detected.

A breakage detecting means is provided in a part of the IC card, and if breakage is detected by this means,
A non-contact type IC card which can be used is known (Japanese Patent No. 3137235, Japanese Patent Laid-Open No. 11-07348).
No. 3). However, the IC cards described in these publications are all premised on the non-contact type, which is different from the present application premised on the contact type.

Further, the IC card described in the publication has a new breaking portion for detection by the breaking detecting means, and the user has to perform the work of breaking the portion. However, in the present application, since the SIM for breaking and using the SIM is provided with the break detecting means, the SIM can be used in the same manner as the conventional SIM card without imposing a new work burden on the user.

Further, in the IC card described in the official gazette, it is necessary to form the breakage detecting means inside the card at the time of manufacturing the card, and the manufacturing process becomes more complicated than in the past, so that the IC card is formed integrally with the contact type IC module. After that, the planned break line on the IC module side and the planned break line on the card side are aligned and mounted, which is different from the present application in which the conventional manufacturing apparatus can be used to perform the same manufacturing process. .

In addition, the IC card of the present application has the same appearance as the conventional IC card, and the shape and position of the SIM can be determined according to the conventional standard. Is available.

An object of the present invention is to provide an IC module and an IC module mounting body which can be reused even if they are returned before use and which can prevent illegal use. .

[0011]

The present invention solves the above-mentioned problems by the following means for solving the problems. It should be noted that, for ease of understanding, reference numerals corresponding to the embodiments of the present invention will be given and described, but the present invention is not limited thereto. In order to solve the problems, the invention of claim 1 has an IC chip (12) capable of recording individual information on one surface,
On the other surface, the IC chip (1
Connection terminal (1) that can send and receive individual information recorded in 2)
4) and a main body (11a), and the main body (11a)
a base material (11) including a separable portion (11b) connected to a) via a planned cutting line (11c);
In the main body part (11a) and the separable part (11b) of 1),
Before the separable part (11b) is separated from the main body part (11a), the conductive part (13) is formed so as to straddle the planned cutting line (11c) and allows conduction between predetermined terminals. When the predetermined terminals can be electrically connected to each other, it is impossible to exchange information between the IC chip (12) and the terminal device, and the separable part (11b) is connected to the main body part (11).
The IC module is characterized in that it is possible to exchange information between the IC chip (12) and the terminal device after the separation from a) and when the predetermined terminals cannot be electrically connected.

The invention according to claim 2 is the IC according to claim 1.
In the module, the predetermined terminal is a terminal provided on the IC chip (12).
It is a C module.

The invention of claim 3 is the IC according to claim 1.
In the module, the predetermined terminal is an unused terminal (C4, C8) of the connection terminals (14) that is not used for exchanging information with the terminal device.
It is a C module.

The invention of claim 4 is from claim 1 to claim 3.
I having the IC module according to any one of
It is a C module mounting body, and is connected to a separation arrangement part (51) for disposing the separable part (11b) of the base material (11) and the separation arrangement part (51) via a planned separation line (51c). And a main body arranging portion (52) for arranging the main body portion (11a) of the base material (11).
Before 2) is separated from the separation arrangement part (51) and the predetermined terminals are electrically connected, information transfer between the IC chip (12) and the terminal device is impossible, and the main body is The arrangement portion (52) is the separation arrangement portion (51).
The IC module mounting body is characterized in that information can be exchanged between the IC chip (12) and the terminal device after the predetermined terminals are not electrically connected to each other after being separated from.

The invention of claim 5 is the IC of claim 4
In the module mounting body, the main body arrangement portion (52)
Is an IC characterized by being usable as a SIM
It is a module mounting body.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. (First Embodiment) FIG. 1 is a view showing a first embodiment of an IC module according to the present invention. FIG.
1B is a front view, and FIG. 1C is CC of FIG. 1A.
FIG. It should be noted that the same reference numerals are given to the portions that perform the same functions as those of the conventional example described above. IC module 1
0 is the base material 11, the IC chip 12, and the energization pattern 1
3 and the external connection terminal 14.

The base material 11 is a member that serves as a carrier for the IC module 10. The base material 11 of this embodiment is shown in FIG.
As shown in (B), an inversely convex main body portion 11a in which a protruding portion is combined below a rounded rectangular shape,
It is a base material in which the main body portion 11a is combined with a separable portion 11b having a horizontally long rectangular shape that is connected to the main body portion 11a via a planned separation line 11c. As will be described later, the planned separation line 11c is formed by half-cutting with a depth of about 30 μm, and the energization pattern 13 is formed across the planned separation line 11c. The base material 11 is required to have insulating properties, and for example, a glass epoxy base material is suitable. Its thickness is about t70 to 160 μm, and in particular, t1
The thickness of about 20 μm is preferable. A through hole (through hole) 11d is formed in the base material 11, and the back surface of the external connection terminal 14 is exposed.

The IC chip 12 is a back surface of the base material 11 (see FIG.
(C) upper surface). IC chip 12
The balance information and individual information are stored, and it is also possible to input and store the user's telephone number information (address information), mail information, etc. via the reader / writer of an external device such as a mobile phone. Is. Also, depending on the configuration of the ROM and CPU, a function that determines the validity of the password input from the external device and whether the application to be used is within the contract range, and determines whether the device can be used or used. It is also possible to have. IC chip 12
Are connected to the energization pattern 13 and the external connection terminals 14 via wires 15. This wire 15 is Φ25
It is a μm gold wire. The IC chip 12 is the wire 1
5 and 5 are sealed with an insulating epoxy resin 16 to protect them from impacts and the like. IC chip 1
2 indicates that when a predetermined power supply and signal input procedure (activation procedure) specified by ISO7816 / 3 is performed on the external connection terminal 14, a weak current is applied to the energization pattern 13 connected via the wire 15. Applying a sink voltage or a weak voltage to compare the voltage value and current value when the energization pattern 13 is a closed circuit, or measure, compare, and judge capacitance, impedance, etc. It is determined whether the pattern 13 remains a closed circuit.

The energizing pattern 13 is formed on the back surface of the base material 11 (the upper surface of FIG. 1C). Energization pattern 13
Is formed on the main body portion 11a and the separable portion 11b, straddling the planned separation line 11c. Energization pattern 13
The end portion 13a is connected to the IC chip 12 via the wire 15 and the connection portion is energized.
The energization pattern 13 is a copper foil (t1
5 to 100 μm, usually t35 μm) is formed by etching into a predetermined pattern.

The external connection terminal 14 is a terminal for contacting an external device to exchange information, and is the main body 1 of the base material 11.
It is formed on the surface (the lower surface of FIG. 1C) of the rounded and horizontally long rectangular portion of 1a. The external connection terminal 14 is shown in FIG.
As shown in (B), the inside is divided into eight areas C1 to C8 defined by ISO7816 / 2. The external connection terminal 14 is a copper foil (t15 to 1) attached to the base material 11.
It is formed by etching about 00 μm, usually t35 μm) into a predetermined pattern, and performing nickel plating about t1 to 5 μm and gold plating about t0.1 to 5 μm on it. As a result, the surface of the external connection terminal 14 is prevented from being oxidized and its durability is improved.

FIG. 2 shows a first SIM card according to the present invention.
It is a figure which shows embodiment. SIM card 50 is SIM
The holding unit 51 and the SIM unit 52 are provided. The size of the SIM card 50 is 78.6 mm (width) x 54.0 mm
(Length) × 0.8 mm (thickness), which is the same size as a conventional SIM card. In addition, the SIM part also follows the standard,
It is located at the same position as before. SIM card 50
In consideration of heat resistance, strength, rigidity, etc., among materials such as nylon, cellulose diacetate, cellulose triacetate, vinyl chloride, polystyrene, polyethylene, polypropylene, polyester, polyimide, polycarbonate, etc., paper, impregnated paper etc. It can be composed of a single material or a combination of materials selected appropriately from The SIM holding unit 51 holds the SIM unit 52 in a separable manner. The SIM holding part 51 is punched, and the SIM part 52 is formed inside the punching part 51a. Further, at the connecting portion 51b between the punched portions, the planned cut line 51c (see FIG. 2) is formed by perforation processing, punching processing, half-cut processing or the like so that the SIM section 52 can be easily removed. (Indicated by a dotted line) is formed. In addition, the SIM holding portion 51 includes a separable portion 11b of the base material 11 of the IC module 10.
Are arranged. In addition, the planned cut line 1 for the base material 11
1c is arranged so as to overlap the planned separation line 51c of the SIM holding unit 51. The SIM unit 52 uses the SIM
This is a part that is detached from the holding part 51 and used as a SIM. In the SIM part 52, the main body part 11 a of the base material 11 of the IC module 10 is arranged.

(Manufacturing Method) FIG. 3 is a view showing a method for manufacturing an IC module according to the present invention, and FIG. 4 is a back view showing a COT. First, the SIM card 50 is a COT (Ch) that is an intermediate processed body for manufacturing an IC module.
ip On Tape) is manufactured, and module pieces are punched out in the card mounting process, and the punched IC
It is manufactured by embedding the module in a card. The COT normally has two IC modules 10 arranged side by side in the width direction as shown in FIG. 4, but in FIG. 3, one IC module is described for easy understanding.

First, a through hole 11d is opened at a predetermined position of the tape-shaped glass epoxy base material 11 (punching step # 101).

Through hole 1 in punching step # 101
On the base material 11 on which 1d is formed, copper foils 18 are pasted on both front and back surfaces (copper foil pasting step # 102), and a predetermined pattern is formed by etching (etching step # 10).
3). Thereby, the external connection terminals 14 (C1 to C1
C8) is formed, and the conducting pattern 13 is formed on the back surface. Further, the surface is plated with nickel and gold.

The IC chip 12 is mounted on the rear surface of the base material 11 on which the external connection terminals 14 and the like are formed in the etching step # 103 via an adhesive agent, and the adhesive agent is cured at a high temperature (die bonding). Process # 104).

In the die bonding process # 104, I
Through hole 11 is provided for substrate 11 on which C chip 12 is mounted.
Pass the wire 15 through d, and on the back surface of the external connection terminal 14,
Wire bonding is directly performed to bring the IC chip 12 and the external connection terminal 14 into conduction. In addition, the energization pattern 13
Then, wire 15 is directly wire-bonded to the IC
The chip 12 and the energization pattern 13 are electrically connected (wire bonding step # 105).

The IC chip 12 and the wires 15 are sealed (for example, transfer molding method, potting method, printing method, etc.) with the insulating epoxy resin 16 on the base material 11 which is wire-bonded in the wire bonding step # 105. (Molding process # 106),
COT is completed.

FIG. 5 is a diagram showing a method of manufacturing a SIM card according to the present invention. C produced as described above
The OT is inspected for each module piece, and punch holes or markings are made for identifying defective products. After that, the card mounting process of the IC module 10 (#
In 107), the good / defective IC module 10 is discriminated, and the good IC module 10 is punched into individual pieces. Then, the punched IC module 10 is
The SIM card is completed by embedding it in a card in which the outer shape of the SIM part 52 has been punched out and the IC module embedding recess has been cut and formed via an adhesive.

(How to use) The SIM card deliverer must use the SI
When the M card is delivered, only temporary issue processing is performed. Temporary issuance means that the information necessary for use such as balance information and individual information is recorded in the memory of the chip, but it can be erased and changed later and cannot be actually used, or the contents of use are significantly To be in a restricted state. The SIM card recipient uses it like a normal SIM card. That is, the SIM part 52 is cut off from the SIM card 50 and inserted into the slot of the mobile phone for use.

(Operation Method) FIG. 6 is a flowchart for explaining the operation of the SIM card of the first embodiment, focusing on the operation of the IC chip. The IC chip 12 operates as follows. The IC chip 12 records the remaining balance information or individual information that has been input, and performs a temporary issuing process (step (hereinafter referred to as “S”) 101). IC chip 12
When the operation command signal (activation procedure) is received (S10)
2) It is determined whether or not the energization pattern 13 remains a closed circuit depending on whether or not a weak current is applied to the energization pattern 13 to energize it (S103). At this time, when it is determined that the closed circuit state is not maintained without energization, the IC chip 12 officially issues (S104) and starts a predetermined process (S105).

According to this embodiment, the SIM card is handed over to the recipient in the temporary issue state, and the recipient receives the SIM card.
When the SIM unit 52 is broken off from the card 50, the SIM can be used for the first time. By doing so, the act of breaking off the SIM can be regarded as an indication of intention to start use. Therefore, even after issuing (provisionally issuing at the time of SIM card delivery), it can be guaranteed that it is unused before the SIM is broken off (before official issuance), and if it is returned for some reason, No problem will occur even if collected. Also, SIM card recipients can
Since it is considered that the act of breaking off M is an intention to use it, it is unlikely that the user would like to return the SIM card after that, and trouble is unlikely to occur.

Further, the collected SIM card internal data can be erased and reissued for a new user to be used again. In this case, the seller and the original user can operate without any disadvantage. can do.

Further, even if a malicious user tries to illegally use a reader / writer or the like without breaking the chip, the chip does not accept the unbroken card as an official card, which is safe. Is kept high.

Furthermore, the SIM card 50 does not purposely have a break-away portion at a specific place of the card, and this is a SIM card of the existing technology, that is, a break-in portion (SIM) of the card which is intended for break-use. Since it is also used as the SIM card, it does not impose a new work burden on the user and can be used in exactly the same manner as the conventional SIM card.

(Second Embodiment) FIG. 7 shows the I according to the present invention.
8 is a diagram showing a second embodiment of the C module, and FIG.
7A is a rear view, FIG. 7B is a front view, and FIG. 7C is a cross-sectional view taken along line CC of FIG. 7A. In addition, in each of the following embodiments, the same reference numerals are given to the portions that perform the same functions as those of the above-described first embodiment, and the overlapping description will be appropriately omitted. In the IC module 10 of this embodiment, the energization pattern 13 is formed on the surface (the surface on which the external connection terminals 14 are formed) (FIG. 7B). A through hole 11e is opened in the base material 11 on the back side of the energization pattern 13 to expose the back surface of the energization pattern 13, and a gold wire 15 is wire-bonded to the back surface.

According to the present embodiment, the same effect as that of the first embodiment can be obtained, that is, it can be guaranteed that the SIM is unused before the SIM is broken off. If it is collected, no problem will occur even if it is collected. Furthermore, in the case of the embodiment, since the energization pattern 13 and the external connection terminal 14 are formed only on the surface of the base material 11, it suffices to attach the copper foil only to one surface, and the manufacturing process (the copper foil in the first embodiment). The attaching step # 102) can be simplified.

(Third Embodiment) FIG. 8 shows the I according to the present invention.
9 is a diagram showing a third embodiment of the C module, and FIG.
8A is a back view, FIG. 8B is a front view, and FIG. 8C is a cross-sectional view taken along line CC of FIG. 8A. In the IC module 10 of this embodiment, the energization pattern 13 is connected to the (C4) terminal and the (C8) terminal of the external connection terminal 14. This (C4) terminal and (C8) terminal are ISO7816 / 2
It is a terminal defined as an unused area in. In an external device (such as a mobile phone) that uses the SIM equipped with the IC module 10 of the present embodiment, it is determined whether or not a current is passed between the (C4) terminal and the (C8) terminal to establish conduction. When there is no continuity, a formal issue is performed and a predetermined process is started. On the other hand, if there is continuity, the process ends.

According to this embodiment, the same effect as that of the first embodiment can be obtained. In addition, according to the present embodiment, since the energization pattern 13 and the external connection terminal 14 are formed only on the surface of the base material 11, it suffices to attach the copper foil only to one surface, and also the energization pattern 13 and the external connection terminal. 1
Since it is not necessary to perform wire bonding for the connection of No. 4, the manufacturing process can be further simplified.

(Fourth Embodiment) FIG. 9 shows S according to the present invention.
9 is a plan view showing a fourth embodiment of the IM mounting body, FIG.
9A shows a state before the SIM is separated, and FIG.
Shows the state after the SIM is disconnected. As shown in FIG. 9A, in the SIM mounting body 50 of the present embodiment, the SIM holding portion 51 and the SIM portion 52 are vertically arranged and connected. SI
The M module 52 mounts the IC module 10. The IC module 10 of the present embodiment is exemplified by the type having the energization pattern 13 on the back surface (of the first embodiment). The planned separation line 11c of the IC module 10 is arranged so as to overlap the planned separation line 51c for separating the SIM holding unit 51 and the SIM unit 52. When using the SIM, as shown in FIG. 9B, the SIM unit 52 is separated from the SIM holding unit 51 and used. Simultaneously with this disconnection, the energization pattern 13 of the IC module 10 is also disconnected.

According to this embodiment, the same effect as that of the first embodiment can be obtained. In addition, IC module 1
0 may be mounted not only on the card but also on the SIM mounting body as in the present embodiment.

(Modifications) The present invention is not limited to the embodiments described above, and various modifications and changes can be made, which are also within the scope of equivalents of the present invention. For example, the first
In the embodiment and the second embodiment, the base material 11 has been described by exemplifying the reverse convex shape protruding downward, but the shape is not limited to such a shape. That is, SIM
It suffices to have a portion that is cut at the same time when the SIM portion is removed from the card, and that portion may be formed above the SIM portion or in the left-right direction. Further, in the fourth embodiment described above, the IC module 10 is exemplified by the type having the energization pattern 13 on the back surface.
It may be of a type having 3 on the surface (the second and third embodiments described above). In the present invention, the "information cannot be transferred" includes not only the state in which the information cannot be transferred at all but also the case where the transfer of the information is significantly restricted.

[0042]

EXAMPLES The present invention will now be described in more detail with reference to examples, but the present invention is not limited to these examples. Here, in particular, the case of the first embodiment will be described as an example. As the tape-shaped base material 11, a glass epoxy base material (t110 μm) manufactured by Risho Kogyo, a double-sided conductive foil (t35 μm) and nickel plating (t2.0 μm) are used.
m) and gold plated (t 0.1 μm) are used. Further, as the contact type IC chip 12, an IC chip manufactured by Infineon Technologies (size: 6.0 ×
5.0 mm × t200 μm) is used. For these, the IC chip 12 is mounted on the base material 11 via the insulating epoxy resin adhesive using a die bonder or a wire bonder, and heated at 120 ° C. for 15 minutes to cure the adhesive. Then, the base material 11 heated to 120 ° C. is wire-bonded together with ultrasonic waves, and the (C1), (C2), (C3), (C5), and (C7) terminals which are ISO standard terminals are connected to the I terminal.
A predetermined pad of the C chip is connected with a Φ25 μm gold wire. Furthermore, the end portion 13a of the energization pattern 13 and the IC
A predetermined pad of the chip is connected with a gold wire of Φ25 μm. In addition, in the separable part 11b of the base material 11, 4 × 2 m
Half cut with a depth of about 30 μm is performed from both sides so that the area of about m can be broken off, and the planned cut line 1
1c is formed. This broken portion is a portion that remains on the SIM card when the SIM is broken. However,
Half-cutting is not performed on the energizing pattern or is performed at about 10 μm so that the wiring does not break under normal handling conditions other than the breaking operation. Then I
The COT is completed when the C chip 12 and the wire 15 are sealed with an insulating epoxy resin and then heated at 150 ° C. for 3 hours to be thermally cured.

Next, the card side (78.6 mm (width) x 5)
For 4.0 mm (length) x 0.8 mm (thickness), punch out at a predetermined position so that the SIM part 52 can be easily broken while breaking the separable part 11b of the base material 11 along the planned cutting line 11c. Processing is performed, and half-cutting is performed from one side to the connection portion between the inside of the break and the outside, and the recessed portion for embedding the IC module is formed by cutting with a cutter blade. COT has a thickness of 50, which is obtained by blending a thermosetting component made of polyamide with a thermoplastic component such as synthetic rubber.
Laminate the adhesive tape of μm, and put it at 120 ℃ 5
Second, it is pasted on a COT with a load of 80 N per module in advance, punched out into a predetermined piece size, and then mounted so that it does not shift into the concave part of the card, and hot pressed (180 ℃ 5
80N) is applied and fixed by embedding.

The SIM card thus completed is
When the breaking operation is actually performed, the breaking operation is easily performed, and at the same time, a part of the energization pattern 13 connected to the IC chip 12 (I
The part formed on the opposite side of the C chip 12) was cut together, and a predetermined function (the energization pattern was broken at the same time as the breaking) was confirmed.

[0045]

As described in detail above, the present invention has the following effects. (1) Since the SIM card holder is able to use the SIM for the first time when the SIM part 52 is broken off,
The act of tearing off the SIM can be regarded as an indication of intention to start use. Therefore, it can be guaranteed that the SIM is unused before it is broken off, and no problem will occur even if the SIM is returned when it is returned for some reason.

(2) The collected SIM card internal data can be erased and reissued for a new user so that it can be used again. In this case, the seller and the original user can operate without any disadvantage. can do.

(3) Even if a malicious user tries to illegally use a reader / writer without breaking it, the chip does not accept the unbroken card as a formal card, so it is safe. Highly maintained.

(4) The SIM card 50 does not purposely have a breaking portion at a specific place of the card,
Since this is also used as the SIM card of the existing technology, that is, the part of the card (SIM) that is supposed to be used for breaking, it does not impose a new work burden on the user and is completely different from the conventional SIM card. It can be used as well.

(5) If the conductive pattern 13 and the external connection terminals 14 are formed only on the surface of the base material 11 as in the second embodiment, the copper foil may be attached to only one surface, The process can be simplified.

(6) As in the third embodiment, the conductive pattern 13 is formed on the surface of the base material 11 (C4) of the external connection terminal 14.
If the terminal and the (C8) terminal are formed so as to be connected to each other, it is not necessary to perform wire bonding, so that the manufacturing process can be further simplified.

[Brief description of drawings]

FIG. 1 is a diagram showing a first embodiment of an IC module according to the present invention.

FIG. 2 is a diagram showing a first embodiment of a SIM card according to the present invention.

FIG. 3 is a diagram showing an IC module manufacturing method according to the present invention.

FIG. 4 is a back view showing a COT.

FIG. 5 is a diagram showing a method of manufacturing a SIM card according to the present invention.

FIG. 6 is a flowchart for explaining the operation of the SIM card of the first embodiment, focusing on the operation of the IC chip.

FIG. 7 is a diagram showing a second embodiment of an IC module according to the present invention.

FIG. 8 is a diagram showing a third embodiment of an IC module according to the present invention.

FIG. 9 is a plan view showing a fourth embodiment of the SIM mounting body according to the present invention.

[Explanation of symbols]

10 IC module 11 Base material 11a main body 11b Separable part 11c Planned separation line 12 IC chip 13 energizing patterns 14 External connection terminal 15 wires 50 SIM card 51 SIM holding unit 51c Planned separation line 52 SIM section

Claims (5)

[Claims] 1. An IC capable of recording individual information on one surface
The chip has a chip, and on the other side, the I
A base material including a main body having a connection terminal capable of transmitting and receiving individual information recorded on the C chip, and a separable portion connected to the main body via a planned cutting line, and a main body of the base and The separable part includes a conducting part formed across the planned cutting line and capable of conducting between predetermined terminals, the separable part before being separated from the main body part, and between the predetermined terminals. , The information cannot be exchanged between the IC chip and the terminal device, and the separable part is separated from the main body part, and the predetermined terminals cannot be electrically connected. An IC module capable of exchanging information between the IC chip and the terminal device. 2. The IC module according to claim 1, wherein the predetermined terminal is a terminal provided on the IC chip. 3. The IC module according to claim 1, wherein the predetermined terminal is an unused terminal that is not used for exchanging information with the terminal device among the connection terminals. 4. Any one of claims 1 to 3
Item 6. An IC module mounting body on which the IC module according to paragraph (1) is mounted, comprising: a separation arrangement portion for disposing a separable portion of the base material, and the separation arrangement portion connected to the separation arrangement portion via a planned separation line. A main body arranging portion for arranging a main body portion, the IC before the main body arranging portion is separated from the separation arranging portion, and when the predetermined terminals can be electrically connected.
If information cannot be exchanged between the chip and the terminal device, the main body arranging portion is separated from the separation arranging portion, and the predetermined terminals cannot be electrically connected, the IC
An IC module mounted body capable of exchanging information between a chip and the terminal device. 5. The IC module mounting body according to claim 4, wherein the main body placement section can be used as a SIM.